JP2007062190A - Method for applying liquid object, manufacturing method of liquid jet head and liquid jet head - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an applying method of a liquid object capable of accurately applying the liquid object, a manufacturing method of a liquid jet head and the liquid jet head. <P>SOLUTION: When applying the liquid object 35 to an applied member 30 by making the liquid object 35 flow out of a nozzle 130, an induction film 120 is formed in an area of the applied member 30 where the liquid object 35 is applied, and the liquid object 35 is made contact with the induction film 120 by making the liquid object 35 flow out of the nozzle 130, and thereby, the liquid object 35 is applied at least to the induction film 120. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a liquid material application method for applying a liquid material such as an adhesive or a molding agent to a member to be applied, and in particular, a part of a pressure generating chamber communicating with a nozzle opening for injecting liquid is constituted by a diaphragm. The present invention also relates to a method of manufacturing a liquid jet head having a piezoelectric element in a region facing a pressure generation chamber of a diaphragm and the liquid jet head.

  As an ink jet recording head which is a typical example of a liquid ejecting head, for example, a flow path forming substrate in which a pressure generation chamber communicating with a nozzle opening is formed, and formed on one surface side of the flow path forming substrate. A piezoelectric element; a piezoelectric element holding part that is bonded to the piezoelectric element side of the flow path forming substrate and seals the piezoelectric element; and a reservoir part that constitutes a part of a reservoir that is a common ink chamber of the pressure generating chamber There is a configuration including a sealing substrate and a compliance substrate having a flexible portion that is bonded onto the sealing substrate via an adhesive and seals the opening of the reservoir portion (see, for example, Patent Document 1).

  Such a sealing substrate and the compliance substrate are bonded by applying an adhesive on the sealing substrate or the compliance substrate using a dispenser having a nozzle through which the adhesive flows out, and then bringing them into contact with each other. Yes.

  However, there is a problem that it is difficult to control the nozzle position of the dispenser, that is, the application position of the adhesive with high accuracy, and a control device that controls the nozzle position with high accuracy is expensive and expensive.

  Further, there is a problem that the accuracy of the application position of the adhesive is lowered depending on the state of the nozzle such as the adhesive having increased viscosity remaining on the nozzle of the dispenser or the bending of the nozzle.

  Such a problem exists not only in an ink jet recording head that ejects ink but also in a liquid ejecting head that ejects liquid. In addition, such a problem exists not only in the adhesive that bonds the components of the liquid ejecting head but also in a liquid material such as a molding agent.

Japanese Patent Application Laid-Open No. 2004-82722 (FIGS. 1, 8, and 9)

  In view of such circumstances, it is an object of the present invention to provide a liquid material coating method, a liquid jet head manufacturing method, and a liquid jet head that can apply a liquid material with high accuracy.

A first aspect of the present invention that solves the above problem is that an induction film is applied to a region of the member to be coated on which the liquid material is applied when the liquid material is caused to flow out of the nozzle and the liquid material is applied to the member to be coated. And applying the liquid material on at least the induction film by causing the liquid material to flow out of the nozzle and bringing the liquid material into contact with the induction film. It is in.
In the first aspect, since the liquid material can be applied onto the induction film simply by bringing the liquid material into contact with the induction film, the liquid material can be applied to a desired region. It is not necessary to align the nozzles with high precision, and it is possible to prevent the liquid material from being applied to an extra region.

According to a second aspect of the present invention, in the first aspect, when the liquid material is brought into contact with the induction film, the liquid material is brought into contact with the upper surface of the induction film before contacting the member to be coated. The liquid material coating method is characterized by the above.
In the second aspect, the liquid material can be applied on the induction film only by bringing the liquid material into contact with the upper surface of the induction film.

According to a third aspect of the present invention, there is provided the liquid material coating method according to the first or second aspect, wherein the induction film is formed with a thickness of 1 μm to 10 μm.
In the third aspect, when an adhesive is used as the liquid material, the thickness of the induction film is regulated to prevent the induction film from forming a step when the member to be coated and another member are bonded. Thus, adhesion failure between the two can be prevented.

According to a fourth aspect of the present invention, there is provided the liquid material application method according to any one of the first to third aspects, wherein a surface of the guide film on which the liquid material is applied has non-water repellency. .
In the fourth aspect, by making the upper surface of the induction film non-water-repellent, the liquid material can be easily and reliably applied onto the induction film.

According to a fifth aspect of the present invention, in any one of the first to fourth aspects, the induction film is formed by plating, sputtering, or printing.
In the fifth aspect, the induction film can be formed with high accuracy.

According to a sixth aspect of the present invention, in any one of the first to fifth aspects, the liquid material includes an adhesive or a molding agent.
In the sixth aspect, a liquid material made of an adhesive or a molding agent can be applied with high accuracy.

According to a seventh aspect of the present invention, there is provided a flow path formation provided with a pressure generating chamber that communicates with a nozzle opening that discharges droplets by pressure generating means, by the liquid material application method according to any one of the first to fifth aspects. A protective substrate having a reservoir portion that is bonded to a surface of the substrate opposite to the nozzle opening side and that constitutes a part of a reservoir that supplies liquid to each pressure generating chamber, penetrating in the thickness direction; and In the method of manufacturing a liquid ejecting head, an adhesive for adhering to a compliance substrate provided with a flexible portion having flexibility to seal the opening of the reservoir portion is applied on a protective substrate.
In the seventh aspect, since the adhesive can be applied on the protective substrate with high accuracy, it is possible to prevent the malfunction of the flexible portion when the adhesive flows out to the flexible portion, and the reservoir. Liquid leakage from the part can be prevented.

According to an eighth aspect of the present invention, there is provided a flow path forming substrate in which a pressure generating chamber communicating with a nozzle opening for discharging droplets is formed by pressure generating means, and a side opposite to the nozzle opening side of the flow path forming substrate. A protective substrate in which a reservoir portion that is bonded to the surface of the substrate and forms a part of a reservoir for supplying liquid to each pressure generating chamber is provided in the thickness direction, and is bonded to the protective substrate via an adhesive And a compliance substrate provided with a flexible portion having flexibility for sealing the opening of the reservoir portion, and adhesion provided with at least one of the adhesive between the protection substrate and the compliance substrate In the liquid ejecting head, an induction film is provided in the region.
In the eighth aspect, since the adhesive can be applied on the protective substrate with high accuracy, it is possible to prevent the malfunction of the flexible portion when the adhesive flows out to the flexible portion, and the reservoir. Liquid leakage from the part can be prevented.

According to a ninth aspect of the present invention, in the eighth aspect, a wiring film on which a driving circuit for driving the pressure generating unit is mounted is provided on the protective substrate, and the induction film is the wiring. The liquid ejecting head includes the same layer as the film.
In the ninth aspect, by making the induction film the same layer as the wiring film, the manufacturing process can be simplified and the cost can be reduced.

Hereinafter, the present invention will be described in detail based on embodiments.
(Embodiment 1)
FIG. 1 is an exploded perspective view of an ink jet recording head according to Embodiment 1 of the present invention, and FIG. 2 is a plan view of the ink jet recording head and a sectional view taken along line AA ′.

  As shown in the figure, the flow path forming substrate 10 is made of a silicon single crystal substrate having a plane orientation (110) in the present embodiment, and one surface thereof is made of silicon dioxide previously formed by thermal oxidation, and has a thickness of 0.5. An elastic film 50 of ˜2 μm is formed.

  This flow path forming substrate 10 is provided with pressure generating chambers 12 partitioned by a plurality of partition walls 11 by anisotropic etching from the other side, and each pressure generating chamber 12 is disposed on the outer side in the longitudinal direction. A communication portion 13 constituting a part of the reservoir 100 serving as a common ink chamber is formed, and is communicated with one end portion in the longitudinal direction of each pressure generation chamber 12 via an ink supply path 14. The ink supply path 14 is formed with a narrower width than the pressure generation chamber 12, and maintains a constant flow path resistance of ink flowing into the pressure generation chamber 12 from the communication portion 13.

Further, on the opening surface side of the flow path forming substrate 10, a protective film 51 used as a mask when forming the pressure generating chambers 12 is provided on the side opposite to the ink supply path 14 of each pressure generating chamber 12. A nozzle plate 20 having a communicating nozzle opening 21 is fixed at room temperature via an adhesive, a heat-welded film, or the like. The nozzle plate 20 has a thickness of, for example, 0.01 to 1 mm, a linear expansion coefficient of 300 ° C. or less, for example, 2.5 to 4.5 [× 10 ⁻⁶ / ° C.] It consists of stainless steel (SUS). The nozzle plate 20 entirely covers one surface of the flow path forming substrate 10 on one surface, and also serves as a reinforcing plate that protects the silicon single crystal substrate from impact and external force.

  On the other hand, an elastic film 50 made of silicon dioxide and having a thickness of, for example, about 1.0 μm is formed on the side opposite to the opening surface of the flow path forming substrate 10. An insulator film 55 made of zirconium oxide or the like and having a thickness of, for example, about 0.4 μm is formed. Further, the insulator film 55 is made of platinum, iridium or the like and has a thickness of, for example, a lower electrode film 60 of about 0.2 μm and lead zirconate titanate (PZT) or the like. The piezoelectric element 300 is configured by laminating a 1.0 μm piezoelectric layer 70 and an upper electrode film 80 made of iridium or the like and having a thickness of, for example, about 0.05 μm. Here, the piezoelectric element 300 refers to a portion including the lower electrode film 60, the piezoelectric layer 70, and the upper electrode film 80. In general, one electrode of the piezoelectric element 300 is used as a common electrode, and the other electrode and the piezoelectric layer 70 are patterned for each pressure generating chamber 12. In addition, here, a portion that is configured by any one of the patterned electrodes and the piezoelectric layer 70 and in which piezoelectric distortion is generated by applying a voltage to both electrodes is referred to as a piezoelectric active portion. In the present embodiment, the lower electrode film 60 is continuously formed over the regions facing each pressure generating chamber 12 to form a common electrode for the plurality of piezoelectric elements 300, and the piezoelectric layer 70 and the upper electrode film 80. Is provided corresponding to each pressure generating chamber 12, so that the upper electrode film 80 is an individual electrode of each piezoelectric element 300. Further, here, the piezoelectric element 300 and the vibration plate that is displaced by driving the piezoelectric element 300 are collectively referred to as a piezoelectric actuator. In the example described above, the elastic film 50, the insulator film 55, and the lower electrode film 60 function as a diaphragm.

  Here, the lower electrode film 60 is formed such that the longitudinal width of the piezoelectric element 300 is the same across the plurality of piezoelectric elements 300, and the end in the width direction is a region facing the pressure generating chamber 12. Is provided inside. The longitudinal direction of the piezoelectric layer 70 and the upper electrode film 80 is extended outward from the end portion of the lower electrode film 60, and one end side of the piezoelectric layer 70 and the upper electrode film 80 in the longitudinal direction is A lead electrode 90 which is a lead-out wiring is provided extending to the outside of the pressure generation chamber 12 and at one end of the extension.

  The lead electrode 90 is made of, for example, gold (Au) or the like, and is connected to an end portion of the upper electrode film 80 of each piezoelectric element 300, and a voltage is selectively applied to each piezoelectric element 300 through the lead electrode 90. It has become so.

  On the flow path forming substrate 10 on which such a piezoelectric element 300 is formed, that is, on the lower electrode film 60, the insulator film 55, and the lead electrode 90 on the surface opposite to the nozzle opening 21 side, A protective substrate 30 having a reservoir portion 32 constituting at least a part of 100 is bonded via an adhesive 34. In the present embodiment, the reservoir portion 32 is formed across the protective substrate 30 in the thickness direction and across the width direction of the pressure generating chamber 12. As described above, the communication portion 13 of the flow path forming substrate 10. The reservoir 100 is configured as a common ink chamber for the pressure generation chambers 12.

  A piezoelectric element holding portion 31 having a space that does not hinder the movement of the piezoelectric element 300 is provided in a region of the protective substrate 30 that faces the piezoelectric element 300. The piezoelectric element holding portion 31 is formed in a size that integrally covers a plurality of piezoelectric elements 300, and each piezoelectric element 300 is disposed in the piezoelectric element holding portion 31. Thereby, each piezoelectric element 300 is protected in a state hardly affected by the external environment. Note that the piezoelectric element holding portion 31 is not necessarily sealed.

  As such a protective substrate 30, it is preferable to use substantially the same material as the coefficient of thermal expansion of the flow path forming substrate 10, for example, glass, ceramic material, etc. In this embodiment, the same material as the flow path forming substrate 10 is used. The silicon single crystal substrate was used.

  The protective substrate 30 is provided with a through hole 33 that penetrates the protective substrate 30 in the thickness direction. The vicinity of the end of the lead electrode 90 drawn from the upper electrode film 80 of each piezoelectric element 300 is provided so as to be exposed in the through hole 33.

  A wiring film 112 connected to an external wiring (not shown) is provided on the protective substrate 30, and a driving circuit 110 for driving the piezoelectric element 300 is mounted on the wiring film 112. As the drive circuit 110, for example, a circuit board, a semiconductor integrated circuit (IC), or the like can be used. Further, as the wiring film 112, for example, a metal film such as gold (Au) can be used. The drive circuit 110 and the vicinity of the end portion of the lead electrode 90 exposed in the through hole 33 are electrically connected via a connection wiring 111 made of a conductive wire such as a bonding wire.

  In addition, a compliance substrate 40 including a sealing film 41 and a fixing plate 42 is bonded onto the protective substrate 30 via an adhesive 35. Here, the sealing film 41 is made of a material having low rigidity and flexibility (for example, a polyphenylene sulfide (PPS) film having a thickness of 6 μm). The sealing film 41 seals one surface of the reservoir portion 32. It has been stopped. The fixing plate 42 is made of a hard material such as metal (for example, stainless steel (SUS) having a thickness of 30 μm). Since the region of the fixing plate 42 facing the reservoir 100 is an opening 43 that is completely removed in the thickness direction, one surface of the reservoir 100 is sealed only with a flexible sealing film 41. This is a flexible part.

  An induction film 120 is provided in an adhesion region where an adhesive 35 for adhering at least one of the protective substrate 30 and the compliance substrate 40 is provided. The guide film 120 only needs to be provided at least in the bonding region on the side where the adhesive 35 is applied when the flow path forming substrate 10 and the protective substrate 30 are bonded. Since the adhesive 35 is applied to the protective substrate 30, the induction film 120 is provided in the adhesion region of the protective substrate 30. By providing the induction film 120 in a desired adhesive region, the adhesive 35 can be applied to the desired adhesive region when the adhesive 35 is applied. For this reason, the induction film 120 only needs to be provided in the adhesion region, and since the adhesive 35 on the induction film 120 flows out at the time of adhesion, the induction film 120 is preferably provided in the center of the adhesion region.

  The induction film 120 is not particularly limited, and examples thereof include a metal film and an insulating film. In addition, the surface of the guide film 120 preferably has non-water repellency. Thereby, it is possible to easily guide the adhesive 35 on the guide film 120.

  Furthermore, the induction membrane preferably has a thickness of 1 μm to 10 μm. This is because if the guide film is formed to be thicker than 10 μm, a step will be formed and adhesion failure or the like may occur.

  In this embodiment, when forming the wiring film 112 on which the driving circuit 110 is mounted on the protective substrate 30 as the induction film 120, the wiring film 112 is left so as to be discontinuous with the wiring film 112, thereby forming the wiring film. 112 and the same layer. In the present embodiment, the induction film 120 is formed in the same layer as the wiring film 112, but is not particularly limited thereto, and is formed separately from the wiring film 112 using, for example, plating, sputtering, printing, or the like. You may make it do.

  By forming the induction film 120 in the adhesion region, when the adhesive 35 is applied to the protective substrate 30, the adhesive 35 is guided onto the induction film 120 simply by bringing the adhesive 35 into contact with the induction film 120. Since the adhesive 35 can be applied on the induction film 120, the adhesive 35 can be applied to a desired region with high accuracy without performing high-precision alignment when the adhesive 35 is applied. it can. For this reason, it is possible to prevent the adhesive 35 from flowing into the reservoir portion 32 and causing a malfunction of the flexible portion. In addition, ink leakage due to poor adhesion between the protective substrate 30 and the compliance substrate 40 can be reliably prevented.

  An ink inlet (not shown) for supplying ink to the reservoir 100 is formed on the compliance substrate 40 on the outer side of the central portion of the reservoir 100 in the longitudinal direction.

  In such an ink jet recording head of this embodiment, ink is taken in from an ink introduction port connected to an external ink supply means (not shown), and the interior from the reservoir 100 to the nozzle opening 21 is filled with ink, and then the drive circuit 110. In accordance with the recording signal from, a voltage is applied between each of the lower electrode film 60 and the upper electrode film 80 corresponding to the pressure generating chamber 12, and the elastic film 50, the lower electrode film 60, and the piezoelectric layer 70 are bent and deformed. As a result, the pressure in each pressure generating chamber 12 increases and ink droplets are ejected from the nozzle openings 21.

  Here, a method of manufacturing such an ink jet recording head will be described in detail with reference to FIGS. 3 to 6 are cross-sectional views showing the manufacturing process of the ink jet recording head.

First, as shown in FIG. 3A, a flow path forming substrate 10 made of a silicon single crystal substrate is thermally oxidized in a diffusion furnace at about 1100 ° C., and a silicon dioxide film serving as an elastic film 50 and a protective film 51 is formed on the surface. 52 is formed. Then, an insulator film 55 made of zirconium oxide is formed on the elastic film 50 (silicon dioxide film 52). Specifically, after forming a zirconium (Zr) layer on the elastic film 50 (silicon dioxide film 52) by, for example, sputtering, the zirconium layer is thermally oxidized in a diffusion furnace at 500 to 1200 ° C., for example. Thus, the insulator film 55 made of zirconium oxide (ZrO ₂ ) is formed.

  Next, as shown in FIG. 3B, for example, platinum and iridium are laminated on the insulator film 55 to form the lower electrode film 60, and then the lower electrode film 60 is patterned into a predetermined shape. The lower electrode film 60 has the same width over the plurality of piezoelectric elements 300, and the longitudinal end of the piezoelectric element 300 of the lower electrode film 60 is a region facing the pressure generation chamber 12. To pattern.

  Next, as shown in FIG. 3C, for example, a piezoelectric layer 70 made of, for example, lead zirconate titanate (PZT) and an upper electrode film 80 made of, for example, iridium are formed on the entire surface of the flow path forming substrate 10. To form.

  As a material of the piezoelectric layer 70 constituting the piezoelectric element 300, for example, a ferroelectric piezoelectric material such as lead zirconate titanate (PZT) or a metal such as niobium, nickel, magnesium, bismuth or yttrium is used. An added relaxor ferroelectric or the like is used. The method for forming the piezoelectric layer 70 is not particularly limited. For example, in this embodiment, a so-called sol in which a metal organic substance is dissolved and dispersed in a catalyst is applied, dried, gelled, and further fired at a high temperature. The piezoelectric layer 70 was formed by using a so-called sol-gel method for obtaining a piezoelectric layer 70 made of an oxide.

  Next, as shown in FIG. 3D, the piezoelectric layer 300 is formed by patterning the piezoelectric layer 70 and the upper electrode film 80 in a region facing each pressure generating chamber 12 by dry etching.

  Next, as shown in FIG. 4A, a lead electrode 90 made of, for example, gold (Au) or the like is formed over the entire surface of the flow path forming substrate 10, and then a mask pattern (for example, made of resist or the like) is formed. Pattern) for each piezoelectric element 300.

  Next, as shown in FIG. 4B, the protective substrate 30 in which the reservoir portion 32 and the piezoelectric element holding portion 31 are formed in advance is bonded onto the flow path forming substrate 10 with an adhesive 34. In addition, a wiring film 112 for mounting the drive circuit 110 is formed on the protective substrate 30 in advance. The wiring film 112 can be formed, for example, by forming a metal film made of gold (Au) over the entire surface of the protective substrate 30 and then patterning it into a predetermined shape. At this time, the wiring film 112 and the discontinuous induction film 120 are formed in the same layer as the wiring film 112 by patterning so that the metal film remains in the adhesion region of the protective substrate 30 to which the compliance substrate 40 is bonded. Form.

  In order to join the compliance substrate 40 on the protective substrate 30 in a later step, the guide film 120 is for guiding the adhesive to the bonding region when applying the adhesive on the protective substrate 30. . For this reason, in this embodiment, the induction film 120 is continuously provided over the adhesion region to which the compliance substrate 40 on the protective substrate 30 is adhered. That is, the induction film 120 was continuously provided around the opening of the reservoir portion 32. In the present embodiment, the induction film 120 is made narrower than the bonding area by the actual adhesive, and is continuously provided over the central portion of the bonding area. Thereby, it is possible to prevent the adhesive from protruding from the adhesive region when the adhesive applied on the induction film 120 is pressurized and flows out when the protective substrate 30 and the compliance substrate 40 are bonded.

  As described above, in this embodiment, the induction film 120 can be formed in the same layer as the wiring film 112 at the same time, thereby preventing an increase in manufacturing steps and reducing the cost. It is not necessary to form the same layer as the film 112 and may be formed separately from the wiring film 112. For example, a metal material or an insulating material can be used as the induction film 120. In addition, the induction film 120 can be formed by plating, sputtering, or printing. Furthermore, the induction film 120 is preferably formed with a thickness of 1 to 10 μm. This is because, in a later step, when the compliance substrate 40 is bonded onto the protective substrate 30 via the adhesive 35, the guide film 120 becomes a step, and adhesion failure between the protective substrate 30 and the compliance substrate 40 is caused. This is to prevent it.

  Next, as shown in FIG. 4C, the protective film 51 is formed by patterning the silicon dioxide film 52 on the opposite side of the surface on which the piezoelectric element 300 of the flow path forming substrate 10 is formed into a predetermined shape. Then, the flow path forming substrate 10 is anisotropically etched (wet etching) using an alkaline solution such as KOH by using the protective film 51 as a mask, whereby the pressure generating chamber 12, the communication portion 13, and the ink supply are supplied to the flow path forming substrate 10. A path 14 and the like are formed.

  Next, the compliance substrate 40 is bonded onto the protective substrate 30 via an adhesive. Specifically, first, as shown in FIG. 5A, an adhesive 35 is applied to a region of the protective substrate 30 to which the compliance substrate 40 is bonded. Specifically, as shown in FIG. 6A, the adhesive 35 is brought into contact with the induction film 120 by using a dispenser having a nozzle 130 through which the adhesive 35 flows out from the tip. Thereby, as shown in FIG. 6B, the adhesive 35 can be applied on at least the induction film 120.

  At this time, for example, as shown in FIG. 6C, even if the position of the nozzle 130 of the dispenser is deviated from the desired adhesion region, the adhesive 35 that has flowed out of the nozzle 130 is put before the protective substrate 30. By contacting the induction film 120, the adhesive 35 can be applied onto the induction film 120 as shown in FIG. 6 (d). Further, as shown in FIG. 6E, even when the nozzle is bent, similarly, the adhesive 35 that has flowed out of the nozzle 130 is brought into contact with the guide film 120 before the protective substrate 30, thereby causing the adhesive 35. Can be applied onto the guide film 120.

  Thus, even if the position of the tip of the nozzle 130 of the dispenser is deviated from the desired adhesion area, the adhesive 35 is applied on the induction film 120 by providing the induction film 120 in the desired adhesion area. Can do. For this reason, even if it does not position the position of the nozzle 130 of a dispenser with high precision, the adhesive agent 35 can be apply | coated to a desired adhesion | attachment area | region with high precision. This eliminates the need for a highly accurate positioning control device and reduces costs.

  In this embodiment, the adhesive 35 is applied on the induction film 120. However, the present invention is not particularly limited to this, and the adhesive 35 may be applied so as to cover the side surface of the induction film 120. .

  And as shown in FIG.5 (b), in the state which contacted the flow-path formation board | substrate 10 and the protective substrate 30, both are joined by hardening the adhesive agent 35. FIG. In addition, the drive circuit 110 is mounted on the wiring film 112 of the protective substrate 30.

  Thereafter, the ink jet recording head as shown in FIG. 1 is formed by joining the nozzle plate 20 having the nozzle openings 21 formed on the surface of the flow path forming substrate 10 opposite to the protective substrate 30. .

  In practice, a large number of chips are simultaneously formed on a single wafer by the above-described series of film formation and anisotropic etching, and after the process is completed, a single chip-sized flow path is formed as shown in FIG. An ink jet recording head is formed by dividing each substrate 10.

(Other embodiments)
Although the embodiments of the present invention have been described above, the basic configuration of the ink jet recording head is not limited to the above. For example, in Embodiment 1 described above, the induction film 120 is provided in the adhesion region between the protective substrate 30 and the compliance substrate 40. However, the present invention is not limited to this. For example, when the head case is adhered on the protective substrate 30 In addition, the guide film 120 may be formed also in the adhesion region between the protective substrate 30 and the head case. In addition, the guide film 120 may be provided in a part of the adhesion region between the flow path forming substrate 10 and the protective substrate 30. In this case, for example, if the induction film 120 is formed in the same layer as the lead electrode 90 at the same time, the induction film 120 can be easily formed without increasing the number of manufacturing steps.

  In the first embodiment described above, the piezoelectric element holding unit 31 is provided on the protective substrate 30 and the piezoelectric element 300 is formed in the piezoelectric element holding unit 31. The piezoelectric element holding part 31 may not be provided. In this case, the surface of the piezoelectric element 300 may be covered with a protective film made of an inorganic material such as alumina to prevent destruction of the piezoelectric layer 70 due to moisture (humidity). Of course, the piezoelectric element 300 covered with the protective film may be provided in the piezoelectric element holding portion 31.

  Furthermore, in the above-described first embodiment, the flexural vibration type ink jet recording head 220 is illustrated, but the present invention is not limited to this. For example, a longitudinal direction in which piezoelectric materials and electrode forming materials are alternately stacked and expanded and contracted in the axial direction is used. Needless to say, the present invention can be applied to a head unit having an ink jet recording head having various structures, such as an ink jet recording head that ejects ink droplets by bubbles generated by heat generation of a vibration type ink jet recording head or a heating element. .

  The pressure generating means for ejecting ink droplets from the nozzle openings has been described using a piezoelectric element. However, the pressure generating means is not limited to a piezoelectric element. For example, a heating element is arranged in the pressure generating chamber, and the heating element is arranged. So that droplets are ejected from the nozzle opening by bubbles generated by the heat generated by the nozzle, and so-called static electricity is generated between the diaphragm and the electrode, and the diaphragm is deformed by electrostatic force to eject the droplet from the nozzle opening. An electrostatic actuator or the like can be used.

  In addition, a head unit having an ink jet recording head that discharges ink as a liquid ejecting head and an ink jet recording apparatus have been described as examples. However, the present invention broadly describes a liquid ejecting head unit having a liquid ejecting head and a liquid ejecting apparatus in general. It is intended. Examples of the liquid ejecting head include a recording head used in an image recording apparatus such as a printer, a color material ejecting head used for manufacturing a color filter such as a liquid crystal display, an organic EL display, and an electrode formation such as an FED (surface emitting display). Electrode material ejecting heads used in manufacturing, bioorganic matter ejecting heads used in biochip production, and the like.

  Furthermore, the present embodiment is widely related to a method for applying a liquid material such as an adhesive and a molding agent, and is not limited to a method for manufacturing a liquid jet head.

FIG. 2 is an exploded perspective view of a recording head according to Embodiment 1 of the invention. 2A and 2B are a plan view and a cross-sectional view of the recording head according to Embodiment 1 of the invention. FIG. 5 is a diagram illustrating a manufacturing process of the recording head according to the first embodiment of the invention. FIG. 5 is a diagram illustrating a manufacturing process of the recording head according to the first embodiment of the invention. FIG. 5 is a diagram illustrating a manufacturing process of the recording head according to the first embodiment of the invention. FIG. 5 is a diagram illustrating a manufacturing process of the recording head according to the first embodiment of the invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Flow path formation board | substrate, 12 Pressure generation chamber, 20 Nozzle plate, 21 Nozzle opening, 30 Protection board, 31 Piezoelectric element holding | maintenance part, 32 Reservoir part, 40 Compliance board | substrate, 60 Lower electrode film, 70 Piezoelectric layer, 80 Upper electrode Film, 90 lead electrode, 100 reservoir, 110 drive circuit, 111 connection wiring, 112 wiring film, 120 induction film, 130 nozzle, 300 piezoelectric element

Claims (9)

When applying the liquid material to the member to be coated by causing the liquid material to flow out of the nozzle, an induction film is formed in a region of the member to be coated where the liquid material is applied, and the liquid material is allowed to flow out of the nozzle. Then, the liquid material is applied to at least the induction film by bringing the liquid material into contact with the induction film. 2. The method of applying a liquid material according to claim 1, wherein when the liquid material is brought into contact with the induction film, the liquid material is brought into contact with an upper surface of the induction film before contacting the member to be coated. . 3. The method for applying a liquid material according to claim 1, wherein the induction film is formed with a thickness of 1 μm to 10 μm. 4. The method of applying a liquid according to claim 1, wherein a surface of the guide film on which the liquid is applied has non-water repellency. 5. The method for applying a liquid material according to claim 1, wherein the induction film is formed by plating, sputtering, or printing. 6. The method of applying a liquid according to claim 1, wherein the liquid is made of an adhesive or a molding agent. 6. The flow path forming substrate provided with a pressure generating chamber connected to a nozzle opening for discharging droplets by pressure generating means by the liquid material application method according to claim 1, opposite to the nozzle opening side. A protective substrate in which a reservoir portion that is partly connected to the surface of the pressure supply chamber and supplies a liquid to each pressure generating chamber is provided in a thickness direction, and an opening of the reservoir portion is provided on the protective substrate. A method of manufacturing a liquid ejecting head, comprising: applying an adhesive that adheres a compliance substrate provided with a flexible portion having flexibility for sealing. A flow path forming substrate in which a pressure generating chamber communicating with a nozzle opening for discharging droplets is formed by pressure generating means, and a pressure generating member that is bonded to a surface opposite to the nozzle opening side of the flow path forming substrate. A protective substrate that forms part of a reservoir for supplying liquid to the chamber is provided in the thickness direction, and the protective substrate is bonded to the protective substrate with an adhesive to seal the opening of the reservoir. A compliance substrate provided with a flexible portion having flexibility to stop,
A liquid ejecting head, wherein an induction film is provided in an adhesive region where the adhesive of at least one of the protective substrate and the compliance substrate is provided. 9. The wiring board according to claim 8, wherein a wiring film on which a driving circuit for driving the pressure generating means is mounted is provided on the protective substrate, and the induction film is made of the same layer as the wiring film. Liquid ejecting head.

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