JP2007062014A - Mold release film and manufacturing method of electronic material substrate - Google Patents
Mold release film and manufacturing method of electronic material substrate Download PDFInfo
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本発明は、電子材料基板の製造に好ましく用いられ、特にＵＶレーザーによる加工性に優れた離型フィルム、及びこの離型フィルムを用いた電子材料基板の製造方法に関する。 The present invention is preferably used in the production of an electronic material substrate, and particularly relates to a release film excellent in workability by a UV laser, and a method for producing an electronic material substrate using the release film.
従来より、ポリエステルフィルムなどの熱可塑性樹脂フィルム基材の表面に、硬化型シリコーン樹脂膜などの離型層を設け、その反対側面にアクリル樹脂、スチレン樹脂などの粘着層を形成した離型フィルムは、マザーボードやＩＣパッケージなどの電子材料基板、ドライフィルムレジスト、セラミックコンデンサー、セラミック基板などの電子部品製造の工程で利用されるフィルムとして、あるいは、偏光板、ラベル離型紙などの粘着離型紙として大量に使用されている（例えば特許文献１乃至３参照）。 Conventionally, a release film in which a release layer such as a curable silicone resin film is provided on the surface of a thermoplastic resin film substrate such as a polyester film, and an adhesive layer such as an acrylic resin or a styrene resin is formed on the opposite side of the release film. Large quantities as electronic material substrates such as motherboards and IC packages, films used in the production of electronic components such as dry film resists, ceramic capacitors and ceramic substrates, or as adhesive release paper such as polarizing plates and label release paper (See, for example, Patent Documents 1 to 3).
特に近年、携帯電話や携帯用パソコンに代表される移動体通信機器、携帯情報端末機器については、より高機能化の要求が増加してきている。例えば、工程内で加工部以外の部位の加工環境からの汚染を防止するだけでなく、フィルムに剛性（腰の強さ）を持たせてハンドリングを良くしたり、離型フィルムごとドリル、レーザーなどで線引き・穴開け等の形状制御加工を施した後、該離型フィルム厚さまで絶縁性樹脂や導電性樹脂等の機能樹脂を充填した後剥離して機能樹脂を所定の形状で該離型フィルムの厚さ相当分加工するレジストライクな性能が要求されている。 Particularly in recent years, there has been an increasing demand for higher functionality in mobile communication devices and portable information terminal devices typified by mobile phones and portable personal computers. For example, in addition to preventing contamination from the processing environment at parts other than the processing part in the process, the film is made rigid (waist strength) for better handling, and the release film is drilled, lasered, etc. After carrying out shape control processing such as drawing and drilling with, after filling the release film thickness with a functional resin such as an insulating resin or a conductive resin, the release resin is peeled off to form the functional resin in a predetermined shape Resist-like performance is required to process the equivalent of the thickness.
このような線引き・穴開け等の加工に応用されるレーザーは従来高効率・高出力の炭酸ガスレーザーやＹＡＧレーザー、半導体レーザーなどであったが、高精細な加工に対応するためＵＶレーザーなどＵＶ波長域の短波長のレーザーが利用され、それに対応して、上記離型フィルムにもＵＶレーザーに対応できる加工性が求められている。 Conventionally, lasers applied to such processes as drawing and drilling have been high-efficiency and high-power carbon dioxide lasers, YAG lasers, and semiconductor lasers. However, in order to support high-definition processing, UV lasers such as UV lasers are used. A short wavelength laser in the wavelength range is used, and accordingly, the mold release film is also required to have a workability capable of supporting a UV laser.
しかしながら、上記離型フィルムでは、レーザー加工後エッジ部周囲に加工屑が付着してできた断面凸状のダム状構造物や、炭化によるすす（スミア）が生成し易く、前者に対しては本加工後に機能樹脂を充填した後剥離して機能樹脂を所定の形状で該シートの厚さ相当分加工する際に所定より厚く加工され易く、後者に対しては清浄化処理工程が余計に増えるという間題があった。 However, in the above release film, a dam-like structure having a convex cross section formed by processing dust adhering to the periphery of the edge after laser processing and soot due to carbonization (smear) are easily generated. After processing, the functional resin is filled and then peeled off, and when the functional resin is processed in a predetermined shape by an amount corresponding to the thickness of the sheet, it is likely to be processed to be thicker than the predetermined thickness. There was a problem.
また、離型フィルムは最終的には製品構成外の部材となり廃棄される性格のため、リサイクルが可能で環境負荷が少ないことが要求される。 In addition, since the release film is eventually discarded as a member outside the product structure, it is required to be recyclable and have a low environmental impact.
本発明は、かかる従来技術の問題点に鑑み、ＵＶレーザーに対応する加工性を有し、リサイクルし易い離型フィルム及び電子材料基板の製造方法を提供するものである。 In view of the problems of the prior art, the present invention provides a mold release film and an electronic material substrate manufacturing method having processability corresponding to UV laser and easy to recycle.
本発明は、かかる課題を解決するために、次の手段を採用するものである。
すなわち、本発明の要旨とするところは、
１．基材フィルムが少なくとも２層以上の積層フィルムからなり、構成するフィルム間の剥離強度が４．９〜２９０Ｎ／ｍであるとともに、基材フィルムの片面に粘着剤層を配してなる離型フィルム。
２．積層フィルムを構成するフィルムの少なくとも粘着剤層の反対側フィルムがポリエステルフィルムからなる１に記載の離型フィルム。
３．１又は２記載の離型フィルムを用い、電子材料基板に粘着剤層を介して離型フィルムを接着し、基材フィルム側から離型フィルムごとレーザーで電子材料基板上もしくは基板内を線引き・穴開け加工した後、表面側フィルムのみを剥がし接着側のフィルムを残すことにより所定の線引き・穴開け加工することを特徴とする電子材料基板の製造方法にある。
The present invention employs the following means in order to solve such problems.
That is, the gist of the present invention is that
1. A release film comprising a base film made of a laminated film of at least two layers, a peel strength between the constituting films of 4.9 to 290 N / m, and an adhesive layer disposed on one side of the base film .
2. 2. The release film according to 1, wherein the film constituting at least the pressure-sensitive adhesive layer of the film constituting the laminated film is made of a polyester film.
3.1 Using the release film described in 1 or 2, adhere the release film to the electronic material substrate via the adhesive layer, and draw the entire release film on the electronic material substrate or inside the substrate with the release film from the base film side. -After carrying out a punching process, it exists in the manufacturing method of the electronic material board | substrate characterized by carrying out predetermined drawing and a punching process by peeling only the surface side film and leaving the film | membrane of an adhesion | attachment side.
本発明の離型フィルムは、ＵＶレーザーに対応する加工性を有するとともに、不良部分を容易に除去できるためリサイクルし易く低コスト化できるという利点を有している。 The release film of the present invention has an advantage that it has a workability corresponding to a UV laser and can easily remove a defective portion and thus can be easily recycled and reduced in cost.
以下に、本発明を詳細に説明する。
本発明において、離型フィルムは、易剥離性の接着層（接着剤・粘着剤・溶剤・熱シール）を介して積層して基材フィルムを少なくとも２層化し、その片面に粘着層を配してなるものである。かかる層構成とすることにより、レーザーなどで線引き・穴開け等の形状制御加工を施した後の表層側基材を、易剥離性の接着層ごと剥離除去することにより、表層側基材表面のエッジ部周囲に加工屑が付着してできたダム状凸構造や炭化によるすす（スミア）を容易かつクリーンに分離除去することが可能となり、所定の寸法仕様のクリーンな切断加工面を確保でき、結果、機能樹脂充填成形等の後加工が支障なく実施できる。
The present invention is described in detail below.
In the present invention, the release film is laminated through an easily peelable adhesive layer (adhesive / adhesive / solvent / heat seal) to form at least two base films, and the adhesive layer is arranged on one side. It will be. By adopting such a layer configuration, the surface layer side substrate after being subjected to shape control processing such as drawing / drilling with a laser or the like is peeled and removed together with the easily peelable adhesive layer, so that the surface layer side substrate surface is removed. It is possible to easily and cleanly remove dam-shaped convex structures and soot due to carbonization (smear) formed by machining scraps around the edge part, ensuring a clean cut surface with specified dimensions, As a result, post-processing such as functional resin filling molding can be performed without hindrance.
基材フィルムとしては、ポリエステルフィルム、ポリプロピレンフィルム、ポリアミドフィルム、ポリカーボネートフィルム、ポリアセテートフィルム、ポリエチレンフィルム、ポリスチレンフィルム、セロハンなどを用いることができるが、中でも、ＵＶ加工性、耐熱性、強度、低価格で再生後の品質安定性にも優れる点で、ポリエステルフィルムが好ましく、特に、ポリエチレンテレフタレートやポリエチレンナフタレートを主たる構成成分とするポリエステルフィルムが好ましく用いられる。
少なくとも２層化した基材フィルムとしては上記の同じ材料としても異なる材料としても良い。
その組み合わせとしては少なくとも一方がポリエステルフィルムからなる構成が好ましく用いられる。
基材フィルムの厚さは、強度、剛性等の点から各々１０〜２００μｍが好ましく用いられる。少なくとも２層化した基材フィルムとしてはその合計が２０〜１０００μｍが好適である。さらには２０〜４００μｍの範囲が好ましい。
As the base film, polyester film, polypropylene film, polyamide film, polycarbonate film, polyacetate film, polyethylene film, polystyrene film, cellophane, etc. can be used. Among them, UV processability, heat resistance, strength, low price In view of excellent quality stability after reproduction, a polyester film is preferable, and in particular, a polyester film mainly composed of polyethylene terephthalate or polyethylene naphthalate is preferably used.
The base film having at least two layers may be the same material or different materials.
As the combination, a structure in which at least one is made of a polyester film is preferably used.
As for the thickness of a base film, 10-200 micrometers is used preferably from points, such as intensity | strength and rigidity, respectively. The base film having at least two layers is preferably 20 to 1000 μm in total. Furthermore, the range of 20-400 micrometers is preferable.
易剥離性の接着層としては、接着法として接着剤・溶剤・熱シール等を介して基材フィルムが隣接して少なくとも２層化してあるのが好ましい。
接着剤としてはポリエステル系樹脂、ポリエーテル系樹脂、ポリエステルウレタン系樹脂、ポリエーテルウレタン系樹脂、アクリル系樹脂、アクリルウレタン系樹脂、エチレンアイオノマー系樹脂、ポリスチレン系樹脂、シリコーン系樹脂、エポキシ系樹脂、ゴム系などの樹脂・ゴム材料一般が制限なく利用でき、コーティングやプレス、共押出などにより加工される。溶剤としては脂肪族炭化水素類、芳香族炭化水素類、アルコール類、ケトン類、エーテル類、エステル類、アミン類、アミド類、脂肪酸類、ハロゲン類等有機溶剤一般から制限なく利用でき、基材フィルムとのぬれ・浸透性が適度に良好で、侵し過ぎず、はじき過ぎない溶剤が選択され、コーティング、スプレー後積層などにより加工される。
熱シールは基材の軟化点以上に加熱して対向させて貼り合わせする一連の手順で行う他、共押出や押出ラミネートなど流動開始点以上に加熱溶融して対向させて貼り合わせする方法もできる。加熱の手段としては電気ヒーターの他温水、加熱オイル、高周波、赤外線など適宜利用できる。
As the easily peelable adhesive layer, it is preferable that the base film is adjacently formed into at least two layers through an adhesive, a solvent, a heat seal or the like as an adhesive method.
Adhesives include polyester resins, polyether resins, polyester urethane resins, polyether urethane resins, acrylic resins, acrylic urethane resins, ethylene ionomer resins, polystyrene resins, silicone resins, epoxy resins, Resins and rubber materials such as rubber can be used without limitation and are processed by coating, pressing, coextrusion, etc. Solvents can be used without limitation from organic solvents such as aliphatic hydrocarbons, aromatic hydrocarbons, alcohols, ketones, ethers, esters, amines, amides, fatty acids, halogens, etc. A solvent is selected that has moderately good wetting / penetration with the film, does not penetrate too much, and does not repel too much, and is processed by coating, lamination after spraying, and the like.
Heat sealing is performed by a series of procedures in which the substrate is heated to a temperature equal to or higher than the softening point of the substrate and bonded to each other. . As a heating means, an electric heater, hot water, heating oil, high frequency, infrared rays, and the like can be used as appropriate.
いずれの接着法でも場合によっては基材との密着性を高めるために基材の対向面の片側もしくは両側にプライマーコートやフレーム処理、プラズマ処理等を行ったり、逆に低くするために基材の対向面の片側もしくは両側にシリコーン系、脂肪酸系、フッ素系等のコーティング剤、界面活性剤、シランカップリング剤等による離型処理を行ったり、することで剥離強度を調整できる。 In any case, primer coating, flame treatment, plasma treatment, etc. are performed on one or both sides of the opposite surface of the substrate in order to increase the adhesion to the substrate, or the substrate The peel strength can be adjusted by performing a release treatment with a coating agent such as silicone, fatty acid or fluorine, a surfactant, a silane coupling agent or the like on one or both sides of the opposing surface.
本発明では基材フィルムとして、２層以上の積層フィルム構成とし、フィルム間の剥離強度が４．９〜２９０Ｎ／ｍ、好ましくは２．０〜１５０Ｎ／ｍとなるように調整する必要がある。
剥離強度が４．９Ｎ／ｍ未満では、加工中に剥がれたりずれたりしてしまい、２９０Ｎ／ｍを越えると剥離が容易でなく、手間取ったり、被着体や被着体側の基材を変形させるという問題が有る。
上記剥離強度の範囲を得るには接着方法、基材・接着剤材料、条件等について上記の内容を適宜選択することにより可能である。
なお、剥離強度の測定法としては（２層化した）基材フィルムを粘着層面でＳＵＳ板と貼り合わせ、２０℃の雰囲気下で表面側のフィルムを剥がして速度２００ｍｍ／分で１８０度剥離試験を行い、剥離時の最大値を剥離強度とした。
In the present invention, it is necessary to adjust the base film so that it has a laminated film structure of two or more layers, and the peel strength between the films is 4.9 to 290 N / m, preferably 2.0 to 150 N / m.
If the peel strength is less than 4.9 N / m, it peels off during processing, and if it exceeds 290 N / m, it is not easy to peel off, which takes time and deforms the adherend or the substrate on the adherend side. There is a problem.
The range of the peel strength can be obtained by appropriately selecting the above contents for the bonding method, substrate / adhesive material, conditions, and the like.
In addition, as a measuring method of peeling strength, a base film (double-layered) was bonded to the SUS plate on the adhesive layer surface, and the film on the surface side was peeled off in an atmosphere of 20 ° C., and a 180 ° peeling test at a speed of 200 mm / min. The maximum value at the time of peeling was taken as the peeling strength.
上記基材フィルムに配する粘着層としてはポリエステル系樹脂、ポリエーテル系樹脂、ポリエステルウレタン系樹脂、ポリエーテルウレタン系樹脂、アクリル系樹脂、アクリルウレタン系樹脂、ポリスチレン系樹脂、シリコーン系樹脂、エポキシ系樹脂、ゴム系などの樹脂・ゴム材料一般が制限なく利用でき、コーティングや押出法などにより加工される。
被着体との接着性は被着体によって適宜選択・調整され、その剥離強度としては２層化した基材フィルム間の剥離強度との剥離強度比として１．０〜３．０、好ましくは１．２〜２．０である。１．０未満ではＵＶレーザー加工を施した後の表層側フィルムのみを剥離除去することが容易でなく、被着体と粘着層界面で剥離し、３．０を越えると離型フィルムを該巻物から自背面を離型層として剥離する際或いは該枚葉の該粘着層対応の離型材から剥離する際などにおいて２層化した基材フィルム間で剥離しやすく好ましくない。該接着性調整としては前述の剥離層での接着剤の場合の方法が同様に適用できる。
As the adhesive layer to be disposed on the base film, polyester resin, polyether resin, polyester urethane resin, polyether urethane resin, acrylic resin, acrylic urethane resin, polystyrene resin, silicone resin, epoxy resin Resins and rubber materials such as resins and rubbers in general can be used without limitation, and are processed by coating or extrusion methods.
The adhesion to the adherend is appropriately selected and adjusted depending on the adherend, and the peel strength is 1.0 to 3.0, preferably as the peel strength ratio between the two layers of the base film. 1.2-2.0. If it is less than 1.0, it is not easy to peel and remove only the surface layer side film after the UV laser processing, and if it exceeds 3.0, the release film is removed from the roll. When peeling from the self-back surface as a release layer, or when peeling from the release material corresponding to the adhesive layer of the sheet, it is not preferable because it easily peels between the two-layered base film. As the adhesion adjustment, the method in the case of the adhesive in the release layer can be similarly applied.
本発明では上述した内容の離型フィルムを用いた電子材料基板の製造方法を含み、被着体の電子材料基板としてはポリエステルフィルム、ポリイミドフィルム、ポリプロピレンフィルム、ポリアミドフィルム、ポリアミドイミドフィルム、ポリカーボネートフィルム、ポリアセテートフィルム、ポリエチレンフィルム、ポリフェニレンスルフィドフィルム、ポリエーテルエーテルケトンフィルム、ポリエーテルスルフォンフィルム、ポリエーテルイミドフィルム、エポキシ樹脂フィルム、フェノール樹脂フィルム、ユリア樹脂フィルムなどを用いることができ、さらにはこれら樹脂フィルムにガラス繊維、シリカ等のフィラーを充填したフィルムも用いることができる。さらにこれらはシート、板でも良い。また、これら単独材以外に裏面側に他の樹脂や同じ樹脂、ガラス、セラミックス、金属材を１層以上積層した構成も用いることができる。 The present invention includes a method for producing an electronic material substrate using the release film having the above-described contents, and as an electronic material substrate for an adherend, a polyester film, a polyimide film, a polypropylene film, a polyamide film, a polyamideimide film, a polycarbonate film, Polyacetate film, polyethylene film, polyphenylene sulfide film, polyether ether ketone film, polyether sulfone film, polyether imide film, epoxy resin film, phenol resin film, urea resin film, etc. can be used, and these resin films A film filled with a filler such as glass fiber or silica can also be used. Further, these may be sheets and plates. Moreover, the structure which laminated | stacked one or more layers of other resin, the same resin, glass, ceramics, and a metal material on the back side besides these single materials can also be used.
本発明の製造方法では、まず、上記電子材料基板に粘着剤層を介して離型フィルムを接着する。ついで、離型フィルム側からＵＶレーザーが照射される。ＵＶレーザーとしてはレーザー強度、離型フィルムや基板への吸収性、基板の耐熱性等による加工への影響を考慮して適宜波長、強度、速度、回数など選択及び条件設定がなされる。特に波長としては３５５ｎｍ、２６６ｎｍが好適に使用できる。 In the production method of the present invention, first, a release film is bonded to the electronic material substrate via an adhesive layer. Next, UV laser is irradiated from the release film side. As the UV laser, the wavelength, intensity, speed, number of times, and the like are appropriately selected and set in consideration of effects on processing due to laser intensity, release film or substrate absorbability, substrate heat resistance, and the like. In particular, a wavelength of 355 nm or 266 nm can be suitably used.
レーザーにより所定の線引き・穴開け加工をした後、接着側の基材フィルムを残すように表面側のフィルムのみを剥がす。接着側の基材フィルムはきれいに切断、穴開けされているため、引き続いて機能樹脂充填成形等の後加工が支障なく実施できる。また、炭化によるすす（スミア）等が残存する表面フィルムを容易かつクリーンに分離除去することが可能であり、その後のリサイクル処理が容易となる。 After predetermined drawing / drilling with a laser, only the film on the surface side is peeled off so as to leave the base film on the adhesion side. Since the base film on the bonding side is cut and perforated cleanly, subsequent processing such as functional resin filling molding can be carried out without any trouble. Moreover, it is possible to easily and cleanly separate and remove the surface film on which carbonized soot (smear) or the like remains, and the subsequent recycling process becomes easy.
以下、本発明の離型フィルムの製法、効果を実施例により詳細に説明する。
［実施例１］
（離型フィルムの作製）
基材フィルムとして、通常の二軸延伸製膜法で製造した厚さ２５μｍのポリエチレンテレフタレートフィルムを準備した。片面に硬化型シリコーン樹脂のトルエン溶液を乾燥後の塗布量で０．１ｇ／ｍ２となるようメイヤーバーコーターでコーティングし、オーブン中で１４０℃の加熱温度で離型層を形成し、もう片面に硬化型アクリル系粘着剤の酢酸エチル溶液を硬化剤の量を所定の２．０倍として配合し乾燥後の塗布量で１５ｇ／ｍ２となるようロールコーターでコーティングし、オーブン中で１４０℃で加熱して接着層を形成し離型フィルム１とした。
Hereinafter, the production method and effects of the release film of the present invention will be described in detail with reference to examples.
[Example 1]
(Production of release film)
As a base film, a polyethylene terephthalate film having a thickness of 25 μm manufactured by an ordinary biaxial stretching film forming method was prepared. A toluene solution of a curable silicone resin is coated on one side with a Mayer bar coater so that the coating amount after drying is 0.1 g / m 2, and a release layer is formed at a heating temperature of 140 ° C. in an oven. the ethyl acetate solution of the curing-type acrylic pressure-sensitive adhesive was coated by a roll coater so as to be 15 g / m 2 of the coating amount after mixing were dried the amount of the curing agent as given 2.0 times to, 140 ° C. in an oven The release film 1 was formed by forming an adhesive layer by heating.
次いで、硬化型アクリル系粘着剤の酢酸エチル溶液の硬化剤の量を所定に戻した以外は離型フィルム１と同様にして離型層、粘着層を有する離型フィルム２を作製した。
離型フィルム１の接着層と離型フィルム２の離型層を対向して常温でロールラミネートし、かくして離型フィルムを作製した。離型フィルム１と離型フィルム１間の剥離強度は１２７Ｎ／ｍであった。
上記の離型フィルムを被着体の１００μｍ厚のポリエーテルエーテルケトン系フィルム基板に粘着層を介して貼り付けレーザー加工用基板とし、以下のＵＶレーザー加工性、剥離性を評価したところ、
ＵＶレーザー加工性……(○)
剥離性……(○)
いづれも良好な性能を有していた。
Next, a release film 2 having a release layer and an adhesive layer was produced in the same manner as the release film 1 except that the amount of the curing agent in the ethyl acetate solution of the curable acrylic adhesive was returned to a predetermined value.
The adhesive layer of the release film 1 and the release layer of the release film 2 face each other and roll-laminated at room temperature, thus producing a release film. The peel strength between the release film 1 and the release film 1 was 127 N / m.
The release film was attached to a 100 μm-thick polyether ether ketone film substrate of the adherend through an adhesive layer as a laser processing substrate, and the following UV laser processability and peelability were evaluated.
UV laser processability ... (○)
Peelability …… (○)
All had good performance.
（１）ＵＶレーザー加工性
離型フィルムを被着体の１００μｍ厚のポリエーテルエーテルケトン系フィルムに貼り付け、離型フィルム面からＵＶレーザーで直径８０μｍの穴開け加工を波長３５５ｎｍ、パルス周波数３０ＫＨz、パルス数２００、出力１．８Ｊ／ｃｍ２の条件にて行い、（離型フィルムの基材が１層の場合はそのまま、離型フィルムの基材が２層以上の場合は表面側基材を剥離）、穴の開いた状況を光学顕微鏡観察し、以下の基準に従い判定した。
○：所定の寸法で開き、穴開けによる穴周辺のうねり変形がなく、穴の表面側エッジ周辺
部に著しく大きいスミアがなく、かつ、穴加工時に発生した屑の一部が堆積したコブがない。
△ ：所定の寸法で開き、穴開けによる穴周辺のうねり変形、穴の表面側エッジ周辺部の著しく大きいスミア、コブのいずれか一つがある。
×：所定の寸法で開き、穴開けによる穴周辺のうねり変形、穴の表面側エッジ周辺部の著
しく大きいスミア、コブのいずれか二つ以上がある。
(1) UV laser processability A release film is attached to a 100 μm-thick polyetheretherketone film on an adherend, and a 80 μm diameter drilling process is performed from the release film surface with a UV laser at a wavelength of 355 nm, a pulse frequency of 30 kHz, The number of pulses is 200, and the output is 1.8 J / cm 2. (When the release film substrate is one layer, the surface side substrate is used as it is when the release film substrate is two layers or more. Peeling), the state of opening a hole was observed with an optical microscope and judged according to the following criteria.
○: Open at a predetermined size, no undulation around the hole due to drilling, no significant smear around the surface edge of the hole, and no bumps on which some of the scrap generated during drilling has accumulated .
Δ: There is any one of swell deformation around the hole due to opening with a predetermined dimension, and a remarkably large smear or bump on the surface side edge periphery of the hole.
X: Open at a predetermined size, and there are any two or more of waviness deformation around the hole due to drilling, a significantly large smear around the periphery of the surface edge of the hole, and a bump.
（２）剥離性
離型フィルムを被着体の１００μｍ厚のポリエーテルエーテルケトン系フィルムに貼り付け、ＵＶレーザー加工性評価条件にてレーザー加工した後、離型フィルムの表面側基材を持って剥離した時の状況について以下の基準に従い判定した。
○：剥離が軽くてズレや浮きがなく、スムースに剥離ができ、剥離が重くて手間や被着体
側離型フィルムの被着体からの剥離や伸び変形がなく、穴加工部の離型フィルム基材間での融漕や被着体側離型フィルムの穴の表面側エッジ周辺部のコブがない。
△：ズレ・浮き、手間・被着体からの剥離・伸び変形、離型フィルム基材間での融着・被
着体側離型フィルムの穴周辺部のコブのいずれか一つがある。
×：ズレ・浮き、手間・被着体からの剥離・伸び変形、離型フィルム基材間での融着・被
着体側離型フィルムの穴周辺部のコブのいずれか二つ以上がある。
(2) Peelability A release film is attached to a 100 μm-thick polyetheretherketone film on the adherend, laser-processed under UV laser processability evaluation conditions, and then the release film surface side substrate is held. The situation at the time of peeling was judged according to the following criteria.
○: Peeling is light and there is no deviation or floating, and peeling is smooth, peeling is heavy, and there is no trouble or peeling from the adherend on the adherend-side release film, and there is no elongation deformation. There is no melting between the substrates and no bumps on the periphery of the surface side edge of the hole on the adherend-side release film.
Δ: There is any one of misalignment / floating, labor / peeling / extension deformation from the adherend, fusion between release film bases, and bumps around the hole in the adherend release film.
X: There are any two or more of displacement / floating, labor / peeling / extension deformation from the adherend, fusion between release film substrates, and bumps around the hole in the adherend release film.
［実施例２］
実施例１において、離型フィルム１の接着層の硬化剤を所定量とした以外は、実施例１と同条件で離型フィルムを作製した。離型フィルム１と２間の剥離強度は２７４Ｎ／ｍで、ＵＶレーザー加工性、剥離性を評価したところ、
ＵＶレーザー加工性……（○）
剥離性……（△）
で総合的に良好な結果を示した。
[Example 2]
In Example 1, a release film was produced under the same conditions as in Example 1 except that a predetermined amount of the curing agent for the adhesive layer of the release film 1 was used. The peel strength between the release films 1 and 2 was 274 N / m, and the UV laser processability and peelability were evaluated.
UV laser processability (○)
Peelability …… (△)
Overall, good results were shown.
［実施例３］
実施例１において、離型フィルム１の接着層の硬化剤を所定量の３．０倍とした以外は、実施例１と同条件で離型フィルムを作製した。離型フィルム１と２間の剥離強度は１９Ｎ／ｍで、ＵＶレーザー加工性、剥離性を評価したところ
ＵＶレーザー加工性……（○）
剥離性……（△）
で総合的に良好な結果を示した。
[Example 3]
In Example 1, a release film was produced under the same conditions as Example 1 except that the curing agent of the adhesive layer of the release film 1 was set to 3.0 times the predetermined amount. The peel strength between the release films 1 and 2 is 19 N / m, and the UV laser workability and peelability are evaluated. UV laser workability …… (○)
Peelability …… (△)
Overall, good results were shown.
［実施例４］
離型フィルム１を接着層として硬化剤を所定量の半分として熱可塑性を残した部分硬化ポリエステル接着剤のトルエン溶液を乾燥後の塗布量で２ｇ／ｍ２となるようメイヤーバーコーターでコーティングし、オーブン中で１４０℃で加熱して形成した以外は、実施例１と同条件で作製した。また、押出機３台とマルチダイを組み合わせての３層共押出装置を用い、順に無水マレイン酸変性ポリプロビレン接着樹脂、ポリプロピレン樹脂、スチレンーイソプレンースチレン共重合粘着樹脂を各々５、２０、１５μｍとした３層フィルムを離型フィルム２として２１０℃で押出し、次いで引き取るためのキャスティングロールで離型フィルム１の接着層面と無水マレイン酸変性ポリプロビレン接着樹脂層をフィルムの熱を利用して熱ラミネート（押出ラミネート）を行い、冷却・巻き取りすることで離型フィルムを作製した。
離型フィルム１と２間の剥離強度は８８Ｎ／ｍで、ＵＶレーザー加工性、剥離性を評価したところ、
ＵＶレーザー加工性……(○)
剥離性……(○)
いづれも良好な性能を有していた。
[Example 4]
Using a release film 1 as an adhesive layer, coat a toluene solution of a partially cured polyester adhesive that leaves thermoplasticity with half of the curing agent as a predetermined amount, and coat with a Mayer bar coater so that the coating amount after drying is 2 g / m 2 . It was produced under the same conditions as in Example 1 except that it was formed by heating at 140 ° C. in an oven. In addition, using a three-layer coextrusion apparatus combining three extruders and a multi-die, maleic anhydride-modified polypropylene adhesive resin, polypropylene resin, and styrene-isoprene-styrene copolymer adhesive resin were respectively set to 5, 20, and 15 μm. The three-layer film is extruded as a release film 2 at 210 ° C., and then the adhesive layer surface of the release film 1 and the maleic anhydride-modified polypropylene adhesive resin layer are heat-laminated using the heat of the film (extrusion laminate). ) Was performed, and a release film was produced by cooling and winding.
The peel strength between the release films 1 and 2 was 88 N / m, and the UV laser processability and peelability were evaluated.
UV laser processability ... (○)
Peelability …… (○)
All had good performance.
［比較例１］
基材フィルムが１層で総厚さ４０μｍのポリエチレンテレフタレートを基材とする市販の離型フィルムを用いてＵＶレーザー加工性、剥離性を評価したところ、
ＵＶレーザー加工性……(×)
剥離性……測定不能
であり、性能に劣っていた。
［比較例２］
実施例１において、離型フィルム２のみを離型フィルムとして用い、ＵＶレーザー加工性、剥離性を評価したところ、
ＵＶレーザー加工性……(×)
剥離性……測定不能
であり、性能に劣っていた。
[Comparative Example 1]
When the UV laser processability and peelability were evaluated using a commercially available release film based on polyethylene terephthalate with a base film of one layer and a total thickness of 40 μm,
UV laser workability …… (×)
Peelability: not measurable and inferior in performance.
[Comparative Example 2]
In Example 1, only the release film 2 was used as the release film, and the UV laser processability and peelability were evaluated.
UV laser workability …… (×)
Peelability: not measurable and inferior in performance.
［比較例３］
実施例２において、離型フィルム２の離型層の加工を行わなかった以外は、実施例２と同条件で離型フィルムを作製した。離型フィルムの剥離強度は３９０Ｎ／ｍで、ＵＶレーザー加工性、剥離性を評価したところ、
ＵＶレーザー加工性……(○)
剥離性……（×）
であり、総合的な性能に劣っていた。
［比較例４］
実施例３において、離型フィルム１の接着層の乾燥後の塗布量を５ｇ／ｍ２とした以外は、実施例３と同条件で離型フィルムを作製した。離型フィルム１、２間の剥離強度は２Ｎ／ｍで、ＵＶレーザー加工性、剥離性を評価したところ、
ＵＶレーザー加工性……(○)
剥離性……（×）
であり、総合的な性能に劣っていた。
[Comparative Example 3]
In Example 2, a release film was produced under the same conditions as Example 2 except that the release layer of the release film 2 was not processed. The peel strength of the release film was 390 N / m, and the UV laser processability and peelability were evaluated.
UV laser processability ... (○)
Peelability …… (×)
It was inferior to the overall performance.
[Comparative Example 4]
In Example 3, a release film was produced under the same conditions as in Example 3 except that the coating amount after drying of the adhesive layer of the release film 1 was 5 g / m 2 . The peel strength between the release films 1 and 2 is 2 N / m, and the UV laser processability and peelability are evaluated.
UV laser processability ... (○)
Peelability …… (×)
It was inferior to the overall performance.
［比較例５］
実施例１において離型フィルム１及び離型フィルム２の基材をいずれも両面コロナ処理された通常の二軸延伸製膜法で製造した厚さ３０μｍのポリプロピレンフィルムとした以外は、実施例１と同一条件で離型フィルムを作製した。離型フィルムの剥離強度は１３７Ｎ／ｍでＵＶレーザー加工性、剥離性を評価したところ、
ＵＶレーザー加工性……(○)
剥離性……（×）
であり、総合的な性能に劣っていた。
［比較例６］
比較例２において、離型フィルム２の基材として厚さ２５μｍのポリイミドフィルムとした以外は、比較例２と同条件で離型フィルムを作製し、ＵＶレーザー加工性、剥離性を評価したところ、
ＵＶレーザー加工性……(○)
剥離性……測定不能
であり、総合的な性能に劣っていた。
[Comparative Example 5]
Example 1 and Example 1 except that the base material of release film 1 and release film 2 is a polypropylene film having a thickness of 30 μm manufactured by a normal biaxially stretched film forming method that has been subjected to double-side corona treatment. A release film was produced under the same conditions. When the peel strength of the release film was 137 N / m and the UV laser processability and peelability were evaluated,
UV laser processability ... (○)
Peelability …… (×)
It was inferior to the overall performance.
[Comparative Example 6]
In Comparative Example 2, a release film was prepared under the same conditions as Comparative Example 2 except that a polyimide film having a thickness of 25 μm was used as the base material of the release film 2, and the UV laser processability and peelability were evaluated.
UV laser processability ... (○)
Peelability: not measurable and poor overall performance.
Claims (3)
The release film according to claim 1 or 2 is used, and the release film is adhered to the electronic material substrate via an adhesive layer, and the release film and the release film are laser-drawn on the electronic material substrate or inside the substrate from the base film side. A method of manufacturing an electronic material substrate, wherein after the perforating process, a predetermined drawing and perforating process is performed by removing only the surface side film and leaving the film on the adhesion side.
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| JP2011074014A (en) * | 2009-09-30 | 2011-04-14 | Rengo Co Ltd | Allyl isothiocyanate-volatilizing preparation |
| US20150114551A1 (en) * | 2013-06-28 | 2015-04-30 | Toray Plastics (America), Inc. | Releasable polyester high gloss metal transfer film |
| US10596794B2 (en) | 2012-11-08 | 2020-03-24 | Toray Plastics (America), Inc. | Releasable polyester high gloss metal transfer film method |
| JP2020164623A (en) * | 2019-03-29 | 2020-10-08 | 株式会社巴川製紙所 | Sealing material and method for producing the same |
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| JP2001323075A (en) * | 1999-12-16 | 2001-11-20 | Matsushita Electric Ind Co Ltd | Releasable film, base material with film, method for forming releasable film and method for producing circuit board |
| JP2003345000A (en) * | 2002-05-29 | 2003-12-03 | Teijin Dupont Films Japan Ltd | Laminated film for photoresist |
| JP2005153328A (en) * | 2003-11-26 | 2005-06-16 | Konica Minolta Medical & Graphic Inc | Inkjet printer |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2001323075A (en) * | 1999-12-16 | 2001-11-20 | Matsushita Electric Ind Co Ltd | Releasable film, base material with film, method for forming releasable film and method for producing circuit board |
| JP2003345000A (en) * | 2002-05-29 | 2003-12-03 | Teijin Dupont Films Japan Ltd | Laminated film for photoresist |
| JP2005153328A (en) * | 2003-11-26 | 2005-06-16 | Konica Minolta Medical & Graphic Inc | Inkjet printer |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011074014A (en) * | 2009-09-30 | 2011-04-14 | Rengo Co Ltd | Allyl isothiocyanate-volatilizing preparation |
| US10596794B2 (en) | 2012-11-08 | 2020-03-24 | Toray Plastics (America), Inc. | Releasable polyester high gloss metal transfer film method |
| US20150114551A1 (en) * | 2013-06-28 | 2015-04-30 | Toray Plastics (America), Inc. | Releasable polyester high gloss metal transfer film |
| US10099462B2 (en) * | 2013-06-28 | 2018-10-16 | Toray Plastics (America), Inc. | Releasable polyester high gloss metal transfer film |
| JP2020164623A (en) * | 2019-03-29 | 2020-10-08 | 株式会社巴川製紙所 | Sealing material and method for producing the same |
| JP7248480B2 (en) | 2019-03-29 | 2023-03-29 | 株式会社巴川製紙所 | Encapsulant and its manufacturing method |
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