JP2007059354A - Connecting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a connecting device which has a high reliability of wiring from one surface side to the other surface side of a base substrate and is capable of space-saving. <P>SOLUTION: A connector A, which is a connecting device, has a recess 11a formed at each portion corresponding to each connecting terminal 23 of a mating connector B on one surface side of the base substrate 11; and in each recess 11a, a contact part 13 with the connecting terminal 23 and a contact pressure applying part 12 which elastically deforms at the time of connection of the connector terminal 23 and the contact part 13 and gives contact pressure to the connecting terminal 23 and the contact part 13 are arranged. The contact pressure applying part 12 is formed of a material having elasticity and conductivity and also serves as a contact part 13. The base substrate 11 has a penetrating wiring 16, which constitutes a wiring from one surface side to the other surface side of the base substrate 11 together with the contact pressure applying part 12, formed respectively at each portion between the inner bottom face of each recess 11a and the other surface. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a connection device.

  As a portable device is miniaturized, thinned, and enhanced in performance, as a connection device for electrically connecting two circuit boards (for example, between a flexible board and a printed board) in the body of the portable device. For connectors, there is a demand for downsizing, thinning, increasing the number of contacts that connect multiple connection terminals of the mating connector, which is the mating member, and narrowing the arrangement pitch of the contacts. A connector having a contact arrangement pitch of 0.5 mm is provided. In this type of connector, along with the narrowing of contacts, it is necessary not only to increase the accuracy of the arrangement pitch but also to increase the accuracy of the spacing between adjacent contacts.

  Further, in recent years, a connection device having a plurality of contact portions respectively connected to spherical connection terminals arranged in a two-dimensional array on a counterpart member such as BGA (Ball Grid Array) or CSP (Chip Size Package). As shown in FIG. 13, a configuration is proposed in which a plurality of spiral contact portions 102 are arranged in a two-dimensional array on one surface side of a base substrate 101 made of a glass epoxy insulating substrate ( For example, see Patent Document 1). Here, the contact portion 102 is made of copper and nickel. Further, the base substrate 101 is provided with a through-hole 101 b that allows the contact portion 102 to be displaced in the thickness direction of the base substrate 101. In Patent Document 1, it is described that when the arrangement pitch of the connection terminals of the mating member is 0.4 mm, the thickness of the base substrate 101 is about 1 mm and the inner diameter of the through hole 101b is about 0.3 mm. Has been.

  Incidentally, in the connection device disclosed in Patent Document 1, the contact portion 102 on the one surface side of the base substrate 101 and the external connection electrode 107 provided on the other surface side of the base substrate 101 are formed on the inner surface of the through hole 101b. They are electrically connected through the formed wiring 106. Here, it is considered that the wiring 106 is formed by forming a seed layer on the inner surface of the through hole 101b by sputtering or the like and then performing copper plating.

Note that Patent Document 1 also describes that an elastic body is filled inside the through hole 101b.
JP 2002-175859 A

  In the connection device disclosed in Patent Document 1, it is difficult to form a seed layer having a uniform thickness on the inner surface of the through hole 101b provided in the thickness direction of the base substrate 101, and the seed layer is deposited from the seed layer by copper plating. Since the thickness of the metal part is not uniform, the wiring 106 may be disconnected, and there is a problem in reliability. Therefore, it is also conceivable to form a through wiring penetrating in the thickness direction of the base substrate 101 at an appropriate position separated from the formation site of the through hole 101b as the wiring from the one surface side of the base substrate 101 to the other surface side. However, in the base substrate 101, a space for forming the through wiring is required on the side of the formation portion of the through hole 101b, and it becomes difficult to reduce the pitch of the contact portions 102.

  The present invention has been made in view of the above reasons, and an object of the present invention is to provide a connection device that is highly reliable in wiring from one surface side to the other surface side of a base substrate and can save space. It is in.

  According to the first aspect of the present invention, the base substrate, the contact portion disposed on the surface of the base substrate corresponding to the connection terminal of the mating member, the contact portion contacting the connection terminal, and the connection terminal and the contact portion are connected. A contact pressure applying portion that elastically deforms to apply a contact pressure between the connection terminal and the contact portion, and the contact pressure applying portion is formed of a material having elasticity and conductivity, and from one surface side of the base substrate to the other surface A part of the wiring to the side is configured.

  According to this invention, it is provided with the contact pressure imparting portion that elastically deforms when the connection terminal and the contact portion are connected to impart contact pressure between the connection terminal and the contact portion, and the contact pressure imparting portion has elasticity and conductivity. Since it is made of material and forms part of the wiring from one surface side to the other surface side of the base substrate, the inner surface of the through hole for enabling displacement of the spiral contact portion as in the prior art It is possible to increase the reliability of the wiring compared to the case of forming the wiring, and the wiring is formed as if the wiring from one surface side of the base substrate to the other surface side is formed separately from the contact pressure applying portion. Space-saving is possible without having to pull it around.

  According to a second aspect of the present invention, in the first aspect of the invention, the base substrate has a recess formed in a portion corresponding to the connection terminal, and the contact pressure applying portion is disposed in the recess. A through-wiring that constitutes the wiring together with the contact pressure applying portion is formed in a portion between the inner bottom surface of the substrate and the other surface.

  According to the present invention, the wiring is constituted by the contact pressure applying portion and the through wiring, and the contact pressure applying portion may be disposed in the recess. Therefore, it is desirable to appropriately set the depth dimension of the recess. It is possible to ensure the contact pressure of.

  The invention of claim 3 is characterized in that, in the invention of claim 2, a metal layer interposed at least between the inner bottom surface of the recess and the contact pressure applying portion is provided.

  According to this invention, since the contact pressure applying portion is connected to the through wiring via the metal layer having a large contact area with the contact pressure applying portion, the resistance of the wiring can be reduced. .

  According to a fourth aspect of the present invention, in the first aspect of the invention, the base substrate has a through hole formed in a portion corresponding to the connection terminal, and the contact pressure applying portion is disposed in the through hole. Features.

  According to this invention, it is not necessary to form the through wiring in the invention of claim 2, and the manufacture is facilitated.

  According to a fifth aspect of the present invention, in the first to fourth aspects of the invention, the contact portion is formed of a metal material and is disposed so as to overlap the contact pressure applying portion.

  According to this invention, it is possible to reduce the contact resistance between the connection terminal of the mating member and the contact portion as compared with the case where the contact pressure applying portion also serves as the contact portion.

  According to a sixth aspect of the invention, in the fifth aspect of the invention, the contact portion is formed in a protruding shape.

  According to this invention, even when the surface of the connection terminal of the counterpart member is flat, contact reliability between the connection terminal and the contact portion can be ensured.

  According to a seventh aspect of the present invention, in the first to sixth aspects of the invention, the base substrate is connected between the contact pressure applying portion and the other surface when the connection terminal and the contact portion are connected. It is characterized in that an escape space composed of a space for releasing a part of the pressure applying portion is formed.

  According to this invention, the contact pressure applying portion is easily elastically deformed, and when the connection terminal has a protruding shape, variation in the protrusion height of the connection terminal, inclination of the connection terminal, and the like are allowed. can do.

  According to the first aspect of the present invention, the reliability of the wiring from the one surface side to the other surface side of the base substrate is high and the space can be saved.

(Embodiment 1)
In this embodiment, the connector which can be utilized for the electrical connection between circuit boards is illustrated as a connection apparatus.

  The connector A of the present embodiment shown in FIGS. 1A and 1B is a counterpart member mounted on a printed circuit board 30 as shown in FIG. 2 and mounted on a flexible board 40 as shown in FIG. It is electrically connected to a connector (hereinafter referred to as a mating connector) B.

  Here, the mating connector B is a rectangular plate-like connector body 21 formed using a resin substrate, and a matrix shape (two-dimensional array shape) at a predetermined arrangement pitch (for example, 500 μm) on one surface of the connector body 21. And a plurality of (for example, 100) projecting (here, spherical) connection terminals 23 arranged in the above-mentioned surface of the connector body 21 and connected to the connection terminals 23 respectively. The wiring 24 can be electrically connected to a conductor pattern (not shown) of the flexible substrate 40 via a through wiring (not shown) penetrating in the thickness direction of the connector body 21.

  The connector A includes a base substrate 11 made of a semiconductor substrate (for example, a silicon substrate), and a recess 11a is formed in each part corresponding to each connection terminal 23 of the mating connector B on one surface side of the base substrate 11. In each of the recesses 11a, contact pressure is applied so that the contact portion 13 with the connection terminal 23 and the contact pressure between the connection terminal 23 and the contact portion 13 are elastically deformed when the connection terminal 23 and the contact portion 13 are connected. The part 12 is arranged. In short, the plurality of connection terminals 23 of the mating connector B and the plurality of contact portions 13 of the connector A correspond one-to-one.

  Here, in this embodiment, the contact pressure applying part 12 is formed of a silicone-based conductive adhesive (for example, a silicone resin containing silver powder), and the contact pressure applying part 12 also serves as the contact part 13. . The material of the contact pressure imparting portion 12 is not particularly limited as long as it is a material having elasticity and conductivity.

  In addition, the base substrate 11 has wiring from the one surface side of the base substrate 11 to the other surface side together with the contact pressure applying portion 12 in each part between the inner bottom surface and the other surface of each recess 11a. A through wiring 16 is formed. In short, in the present embodiment, the contact pressure applying portion 12 constitutes a part of the wiring from the one surface side of the base substrate 11 to the other surface side.

  Here, in the connector A, the contact pressure applying portion 12 is electrically connected to the external connection electrode 17 on the other surface of the base portion 11 through the through wiring 16, and each of the connectors A as shown in FIG. Each of the external connection electrodes 17 can be electrically connected to the conductor pattern 33 of the printed circuit board 30 via the solder balls 18. Each contact pressure applying portion 12, each through wiring 16, and each external connection electrode 17 are electrically insulated from the base substrate 11 via an insulating film (for example, a silicon oxide film) not shown.

  In the connector A of the present embodiment, since the silicon substrate is used as the base substrate 11, each recess 11a in the base substrate 11 can be formed with high accuracy using a photolithography technique and an etching technique. Here, since the recess 11a is formed in an inverted trapezoidal shape in which the opening area gradually decreases as it approaches the inner bottom surface, an alkaline solution (for example, a KOH aqueous solution, for example) is used for etching to form each recess 11a. Anisotropic etching using a TMAH solution or the like is performed. Further, in the connector A of the present embodiment, each through hole for each through wiring 16 can also be formed with high accuracy using a photolithography technique and an etching technique. Here, in the etching for forming each through hole, a dry etching apparatus capable of vertical deep digging (for example, an inductively coupled plasma type dry etching apparatus) is used. Further, in forming the contact pressure applying portion 12, after forming the recess 11a and the through wiring 16 in the base substrate 11, the recess 11a may be filled with the material of the contact pressure applying portion 12 (which may be embedded). ). In forming each external connection electrode 17, a metal film serving as the basis of each external connection electrode 17 is formed by, for example, sputtering, and then appropriately patterned using a photolithography technique and an etching technique. What is necessary is just to form the external connection electrode 17 which consists of a part of said metal film, respectively.

  When electrically connecting each contact portion 13 of the connector A and each connection terminal 23 of the mating connector B, the connector A mounted on the printed board 30 and the mating connector B mounted on the flexible board 40 are connected to each other. After facing each other, the mating connector B may be brought close to the connector A as shown in FIG. Here, since the connector A can be elastically deformed by the contact pressure applying portion 12 disposed in each recess 11a, the connector A allows variations in the protruding height of the spherical connection terminal 23, inclination of the connection terminal 23, and the like. And a desired contact pressure can be satisfied. In addition, the lock mechanism for maintaining the electrical connection state of the connector A and the mating connector B includes, for example, the body of a device (for example, a portable device) that houses the printed board 30 and the flexible board 40, It may be provided on the substrates 30 and 40, but may be provided on each connector A and B.

  The connector A of the present embodiment described above is elastically deformed when the connection terminal 23 of the mating connector B and the contact portion 13 are connected, and the contact pressure applying portion 12 that applies the contact pressure between the connection terminal 23 and the contact portion 13 is provided. 13 is formed of a material having elasticity and conductivity, and constitutes a part of the wiring from the one surface side of the base substrate 11 to the other surface side. Compared with the case where the wiring 106 is formed on the inner surface of the through hole 101b for enabling the displacement of the spiral contact portion 102 as in the conventional configuration shown, it is possible to increase the reliability of the wiring, and Unlike the case where the wiring from the one surface side of the substrate 11 to the other surface side is formed separately from the contact pressure applying portion 12, it is not necessary to draw the wiring, and space can be saved. Therefore, in the connector A of the present embodiment, the arrangement pitch of the contact portions 13 can be narrowed compared to the conventional configuration shown in FIG.

  By the way, in the connection apparatus having the configuration shown in FIG. 13, each through hole 101 b is individually formed by drilling in the step of forming the through hole 101 b in the insulating substrate serving as the base of the base substrate 101. It is difficult to increase the accuracy of the arrangement pitch of 101b and the interval between the through holes 101b, and it is difficult to further reduce the pitch of the through holes 101b, and it is difficult to further reduce the size of the entire connecting device.

  On the other hand, since the connector A of the present embodiment can be formed by a general semiconductor process, it can be made thinner, smaller, and narrower than conventional ones.

  In the present embodiment, the contact pressure applying portion 12 and the through wiring 16 form a wiring from the one surface side of the base substrate 11 to the other surface side, and the contact pressure applying portion 12 is disposed in the recess 11a. Therefore, a desired contact pressure can be secured by appropriately setting the depth dimension of the recess 11a. Further, since it is not necessary to form the contact portion 13 in a spiral shape as in the conventional configuration shown in FIG. 13, the contact portion is caused by the variation in the protruding height of the protruding connection terminal 23 of the mating connector B. 13 is less likely to break.

(Embodiment 2)
The basic configuration of the connector A exemplified as a connection device in the present embodiment is substantially the same as that of the first embodiment, and as shown in FIGS. 4A and 4B, each connection of the mating connector B on the base substrate 11 is performed. A through hole 11b penetrating in the thickness direction is formed in each part corresponding to each of the terminals 23, and the through hole 11b is blocked by the external connection electrode 17 on the other surface side of the base substrate 11, and the through hole 11b. The contact pressure applying part 12 is arranged on the inner side, and the contact pressure applying part 12 and the external connection electrode 17 are electrically connected without providing the through wiring 16 described in the first embodiment. . In addition, the same code | symbol is attached | subjected to the component similar to Embodiment 1, and description is abbreviate | omitted.

  In the connector A of the present embodiment, the contact pressure applying portion 12 disposed in each through-hole 11b can be elastically deformed, so that variations in the protruding height of the spherical connection terminal 23, inclination of the connection terminal 23, etc. Can be allowed, and a desired contact pressure can be satisfied.

  Therefore, in the connector A of the present embodiment, it is not necessary to form the through wiring 16 in the connector A of the first embodiment, and the manufacture becomes easy.

(Embodiment 3)
In the connector A of the second embodiment, when the connection terminal 23 of the mating connector B and the contact portion 13 are connected, the contact pressure applying portion 12 disposed in each through hole 11b is elastically deformed, but the external connection electrode 17 is penetrated. Since the solder ball 18 is formed in the central portion of the external connection electrode 17 so as to close the hole 11b, the displacement amount of the contact portion 13 due to elastic deformation of the contact pressure applying portion 12 is easily limited, and the external connection Stress is easily applied to the electrode 17.

  On the other hand, the basic configuration of the connector A exemplified as the connection device in this embodiment is substantially the same as that of the second embodiment, and the external connection electrode 17 is a base as shown in FIGS. The difference is that the through hole 11 b is not closed on the other surface side of the substrate 11, and a solder ball 18 is formed at the center of the external connection electrode 17. In addition, the same code | symbol is attached | subjected to the component similar to Embodiment 1, and description is abbreviate | omitted.

  Therefore, in the connector A of the present embodiment, compared to the connector A of the second embodiment, the displacement amount of the contact portion 13 due to the elastic deformation of the contact pressure applying portion 12 is less restricted, and the stress applied to the external connection electrode 17 is reduced. Can be reduced.

(Embodiment 4)
The basic configuration of the connector A exemplified as a connection device in this embodiment is substantially the same as that of the first embodiment, and as shown in FIGS. 6A and 6B, the inner surface of the recess 11 a and the contact pressure applying portion 12. And the contact pressure applying portion 12, the metal layer 15, and the through wiring 16 constitute a wiring from the one surface side of the base substrate 11 to the other surface side. Is different. Here, the metal layer 15 extends to the peripheral portion of the recess 11 a on the one surface side of the base substrate 11. The metal layer 15 is electrically insulated from the base substrate 11 by an insulating film (not shown). In addition, the same code | symbol is attached | subjected to the component similar to Embodiment 1, and description is abbreviate | omitted.

  Therefore, in the connector A of the present embodiment, the contact pressure applying portion 12 is connected to the through wiring 16 through the metal layer 15 having a large contact area with the contact pressure applying portion 12, and thus the resistance of the wiring is reduced. It becomes possible to do. In the connector A of the present embodiment, the metal layer 15 is formed over the entire inner surface of the recess 11a, but may be formed at least on the inner bottom surface of the recess 11a. In short, the metal layer 15 may be interposed between at least the inner bottom surface of the recess 11 a and the contact pressure applying portion 12.

(Embodiment 5)
The basic configuration of the connector A exemplified as a connection device in the present embodiment is substantially the same as that of the fourth embodiment, and the opening area of the recess 11a is substantially constant as shown in FIGS. 7 (a) and 7 (b). The point is different. In addition, the same code | symbol is attached | subjected to the component similar to Embodiment 4, and description is abbreviate | omitted.

  In the fourth embodiment, the recess 11a is formed by anisotropic etching using an alkaline solution, as in the first embodiment, whereas in this embodiment, the recess 11a is a dry that allows vertical deep digging. It is formed by dry etching using an etching apparatus (for example, an inductively coupled plasma type dry etching apparatus).

  Thus, in the connector A of the present embodiment, the opening area of the recesses 11a can be reduced and the arrangement pitch of the recesses 11a can be shortened as compared with the connector A of the fourth embodiment. The planar size can be reduced.

(Embodiment 6)
The basic configuration of the connector A exemplified as a connection device in the present embodiment is substantially the same as that of the first embodiment. As shown in FIGS. 8A and 8B, the contact portion 13 is formed of a metal material, The difference is that the pressure application unit 12 is arranged to overlap. That is, in the present embodiment, the contact portion 13 is constituted by a metal thin film formed on the contact pressure applying portion 12 after the contact pressure applying portion 12 is formed. In addition, the same code | symbol is attached | subjected to the component similar to Embodiment 1, and description is abbreviate | omitted.

  Therefore, in the connector A of the present embodiment, the contact resistance between the connection terminal 23 of the mating connector B and the contact portion 13 is smaller than that in the case where the contact pressure applying portion 12 also serves as the contact portion 13 as in the first embodiment. It becomes possible to reduce.

(Embodiment 7)
The basic configuration of the connector A exemplified as a connection device in the present embodiment is substantially the same as that of the second embodiment. As shown in FIGS. 9A and 9B, the contact portion 13 is formed of a metal material, The difference is that the pressure application unit 12 is arranged to overlap. That is, in the present embodiment, the contact portion 13 is constituted by a metal thin film formed on the contact pressure applying portion 12 after the contact pressure applying portion 12 is formed. In addition, the same code | symbol is attached | subjected to the component similar to Embodiment 2, and description is abbreviate | omitted.

  Therefore, in the connector A of the present embodiment, the contact resistance between the connection terminal 23 of the mating connector B and the contact portion 13 is smaller than that in the case where the contact pressure applying portion 12 also serves as the contact portion 13 as in the second embodiment. It becomes possible to reduce.

(Embodiment 8)
The basic configuration of the connector A exemplified as a connection device in the present embodiment is substantially the same as that of the sixth embodiment, and as shown in FIGS. 10A and 10B, the contact portion 13 is formed in a protruding shape. Is different. Here, the contact portion 13 is constituted by a hemispherical bump (metal protrusion). In addition, the same code | symbol is attached | subjected to the component similar to Embodiment 6, and description is abbreviate | omitted.

  Thus, in the connector A of the present embodiment, the contact reliability between the connection terminal 23 and the contact portion 13 even when the surface of the connection terminal 23 of the counterpart connector B, which is the counterpart member, is flat as shown in FIG. Sex can be secured.

(Embodiment 9)
The basic configuration of the connector A exemplified as a connection device in the present embodiment is substantially the same as that of the seventh embodiment, and as shown in FIGS. 11A and 11B, the contact portion 13 is formed in a protruding shape. Is different. Here, the contact portion 13 is constituted by a hemispherical bump (metal protrusion). In addition, the same code | symbol is attached | subjected to the component similar to Embodiment 7, and description is abbreviate | omitted.

  Therefore, in the connector A of the present embodiment, the contact reliability between the connection terminal 23 and the contact portion 13 even when the surface of the connection terminal 23 of the mating connector B as the mating member is flat as shown in FIG. Sex can be secured.

(Embodiment 10)
The basic configuration of the connector A exemplified as a connection device in the present embodiment is substantially the same as that of the first embodiment. As shown in FIGS. 12A and 12B, a step portion 11c is formed on the inner peripheral surface of the recess 11a. A relief space 19 is formed between the contact pressure applying portion 12 and the inner bottom surface of the recess 11a. The escape space 19 is a space that allows part of the contact pressure applying portion 12 to escape when the connection terminal 23 and the contact portion 13 are connected. It is provided with a metal layer 15 interposed between the inner surface of the recess 11 a and the contact pressure applying portion 12, and the contact pressure applying portion 12, the metal layer 15, and the through wiring 16, A difference is that a wiring is formed from one surface side to the other surface side. Here, the metal layer 15 extends to the peripheral portion of the recess 11 a on the one surface side of the base substrate 11. The metal layer 15 is electrically insulated from the base substrate 11 by an insulating film (not shown). In addition, the same code | symbol is attached | subjected to the component similar to Embodiment 1, and description is abbreviate | omitted.

  Therefore, in the connector A of the present embodiment, a part of the contact pressure applying portion 12 is released between the contact pressure applying portion 12 and the other surface of the base substrate 11 when the connection terminal 23 and the contact portion 13 are connected. Since the clearance space 19 composed of a space is formed, the contact pressure applying portion 12 is easily elastically deformed, and variation in the protruding height of the projecting connection terminal 23 or inclination of the connection terminal 23 can be allowed. it can. Further, in the connector A of the present embodiment, the contact pressure applying portion 12 is connected to the through wiring 16 via the metal layer 15 having a large contact area with the contact pressure applying portion 12, thereby reducing the wiring resistance. It becomes possible.

  In each of the above embodiments, the connector A used for electrical connection between circuit boards is illustrated as the connection device. However, the connection device is not limited to the connector used for electrical connection between circuit boards. The counterpart member of the apparatus is not limited to the counterpart connector B, and may be, for example, a BGA, a CSP, a bare chip, or the like.

The connector in Embodiment 1 is shown, (a) is a schematic sectional drawing, (b) is a schematic sectional drawing of the state connected with the other party connector. The connector in the same as above is shown, (a) is a schematic perspective view in a state where it is surface-mounted on a printed circuit board, and (b) is an enlarged view of a main part of (a). The other party connector in the same as the above is shown, (a) is a schematic perspective view in a state where it is surface-mounted on a flexible substrate, and (b) is an enlarged view of a main part of (a). The connector in Embodiment 2 is shown, (a) is a schematic sectional drawing, (b) is a schematic sectional drawing of the state connected with the other party connector. The connector in Embodiment 3 is shown, (a) is a schematic sectional drawing, (b) is a schematic sectional drawing of the state connected with the other party connector. The connector in Embodiment 4 is shown, (a) is a schematic sectional drawing, (b) is a schematic sectional drawing of the state connected with the other party connector. The connector in Embodiment 5 is shown, (a) is a schematic sectional drawing, (b) is a schematic sectional drawing of the state connected with the other party connector. The connector in Embodiment 6 is shown, (a) is a schematic sectional drawing, (b) is a schematic sectional drawing of the state connected with the other party connector. The connector in Embodiment 7 is shown, (a) is a schematic sectional drawing, (b) is a schematic sectional drawing of the state connected with the other party connector. The connector in Embodiment 8 is shown, (a) is a schematic sectional drawing, (b) is a schematic sectional drawing of the state connected with the other party connector. The connector in Embodiment 9 is shown, (a) is a schematic sectional drawing, (b) is a schematic sectional drawing of the state connected with the other party connector. The connector in Embodiment 10 is shown, (a) is a schematic sectional drawing, (b) is a schematic sectional drawing of the state connected with the other party connector. A prior art example is shown, (a) is a schematic plan view, and (b) is a C-C 'sectional view of (a).

Explanation of symbols

A connector B mating connector 11 base substrate 11a recess 12 contact pressure applying portion 13 contact portion 16 through wiring 17 external connection electrode 23 connection terminal

Claims (7)

  A base substrate, a contact portion disposed on a surface of the base substrate corresponding to the connection terminal of the mating member, the contact portion contacting the connection terminal, and a connection terminal elastically deformed when the connection terminal and the contact portion are connected to each other; A contact pressure applying portion that applies contact pressure to the contact portion, and the contact pressure applying portion is formed of a material having elasticity and conductivity, and a part of the wiring from one surface side of the base substrate to the other surface side The connection apparatus characterized by comprising.   In the base substrate, a recess is formed in a portion corresponding to the connection terminal, and the contact pressure applying portion is disposed in the recess, and the base substrate is formed in a portion between the inner bottom surface of the recess and the other surface. The connection device according to claim 1, wherein a through wiring that constitutes the wiring is formed together with a contact pressure applying portion.   The connection device according to claim 2, further comprising a metal layer interposed between at least an inner bottom surface of the recess and the contact pressure applying portion.   The connection device according to claim 1, wherein the base substrate has a through hole formed in a portion corresponding to the connection terminal, and the contact pressure applying portion is disposed in the through hole.   5. The connection device according to claim 1, wherein the contact portion is formed of a metal material and is disposed so as to overlap the contact pressure applying portion.   The connection device according to claim 5, wherein the contact portion is formed in a protruding shape.   In the base substrate, a clearance space is formed between the contact pressure applying portion and the other surface. The escape space includes a space that allows a part of the contact pressure applying portion to escape when the connection terminal and the contact portion are connected. The connection device according to claim 1, wherein the connection device is a device.

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