JP2007052939A - Method of assembling flat display device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of assembling a flat display device in which occurrence of displacement between two panels can be prevented effectively despite of a simplified constitution. <P>SOLUTION: In the method of assembling the flat display device, a first panel P<SB>1</SB>and a second panel P<SB>2</SB>are aligned in a state that a joint member 30 is arranged in their peripheral parts, and subsequently after positioning of the second panel P<SB>2</SB>to the first panel P<SB>1</SB>is carried out, while a force proceeding to a first ridge extending in a first direction of the second panel P<SB>2</SB>, a force proceeding to a second ridge extending in the second direction, and a force proceeding to the first panel P<SB>1</SB>are added against the second panel P<SB>2</SB>by an energizing means, and by heating the joint member 30, the first panel P<SB>1</SB>and the second panel P<SB>2</SB>are joined at their peripheries. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a method for assembling a flat display device.

  As an image display device that can replace the mainstream cathode ray tube (CRT), various types of flat display devices have been studied. Examples of such a flat display device include a liquid crystal display device (LCD), an electroluminescence display device (ELD), and a plasma display device (PDP). In addition, development of a flat display device incorporating a cathode panel equipped with an electron-emitting device is also in progress. Here, as the electron-emitting device, a cold cathode field electron-emitting device, a metal / insulating film / metal-type device (also called MIM device), and a surface conduction electron-emitting device are known. A flat display device incorporating a cathode panel provided with the electron-emitting device is attracting attention from the viewpoint of high-resolution, high-luminance color display and low power consumption.

  A cold cathode field emission display device (hereinafter sometimes abbreviated as a display device), which is a flat display device incorporating a cold cathode field electron emission device as an electron emission device, generally has a plurality of cold cathode field electron emission. A cathode panel provided with a device (hereinafter sometimes abbreviated as a field emission device) and an anode panel having a phosphor layer that emits light when excited by collision with electrons emitted from the field emission device are high vacuum. The cathode panel and the anode panel are joined to each other at the peripheral edge portion via a joining member. Here, the cathode panel has an electron emission region corresponding to each pixel arranged in a two-dimensional matrix, and one or a plurality of field emission elements are provided in each electron emission region. Examples of field emission devices include Spindt type, flat type, edge type, and planar type.

  As an example, a conceptual partial end view of a display device having a Spindt-type field emission device is shown in FIG. 7, and a schematic view of a part of the cathode panel CP and the anode panel AP when the cathode panel CP and the anode panel AP are disassembled. A simple exploded perspective view is shown in FIG. A Spindt-type field emission device constituting a display device includes a cathode electrode 11 formed on a support 10, an insulating layer 12 formed on the support 10 and the cathode electrode 11, and a gate formed on the insulating layer 12. An electrode 13, an opening 14 provided in the gate electrode 13 and the insulating layer 12 (a first opening 14 </ b> A provided in the gate electrode 13 and a second opening 14 </ b> B provided in the insulating layer 12), and an opening It is composed of a conical electron emission portion 15 formed on the cathode electrode 11 located at the bottom of the portion 14.

  Alternatively, FIG. 8 shows a conceptual partial end view of a display device having a so-called flat type field emission device provided with a substantially planar electron emission portion 15A. The field emission device includes a cathode electrode 11 formed on a support 10, an insulating layer 12 formed on the support 10 and the cathode electrode 11, a gate electrode 13 formed on the insulating layer 12, a gate An opening 14 provided in the electrode 13 and the insulating layer 12 (a first opening 14A provided in the gate electrode 13 and a second opening 14B provided in the insulating layer 12) and a bottom of the opening 14 The electron emission portion 15A is formed on the cathode electrode 11 positioned. The electron emission portion 15A is composed of, for example, a large number of carbon nanotubes partially embedded in a matrix.

  In these display devices, the cathode electrode 11 has a strip shape extending in the X direction (refer to the X direction in FIG. 7, FIG. 8 or FIG. 9), and the gate electrode 13 has a Y direction different from the X direction (FIG. 7, FIG. 8 or refer to the Y direction in FIG. 9). In general, the cathode electrode 11 and the gate electrode 13 are each formed in a strip shape in a direction in which the projected images of both the electrodes 11 and 13 are orthogonal to each other. An overlapping region where the strip-shaped cathode electrode 11 and the strip-shaped gate electrode 13 overlap is an electron emission region EA, which corresponds to one subpixel. The electron emission areas EA are normally arranged in a two-dimensional matrix within the effective area of the cathode panel CP (area that functions as an actual display portion).

  On the other hand, the anode panel AP has a phosphor layer 22 (specifically, a red light-emitting phosphor layer 22R, a green light-emitting phosphor layer 22G, and a blue light-emitting phosphor layer 22B) having a predetermined pattern on the substrate 20. The phosphor layer 22 is formed and covered with the anode electrode 24. A space between these phosphor layers 22 is embedded with a light absorbing layer (black matrix) 23 made of a light absorbing material such as carbon, thereby preventing display image color turbidity and optical crosstalk. . In the figure, reference numeral 21 represents a partition wall. In FIGS. 8 and 9, the illustration of the partition walls is omitted.

  One subpixel is composed of an electron emission area EA on the cathode panel side and a phosphor layer 22 on the anode panel side facing a group of these field emission elements. In the effective area, pixels (pixels) are arranged in an order of several hundred thousand to several million, for example. In a display device for color display, one pixel (one pixel) is composed of a set of a red light emitting subpixel, a green light emitting subpixel, and a blue light emitting subpixel.

  In assembling the display device, a joining member 30 made of a frame body coated with frit glass (not shown) is prepared. Then, for example, after the bonding member 30 is disposed on the peripheral edge of the anode panel AP, the anode panel AP and the cathode panel CP are aligned so that the electron emission region EA and the phosphor layer 22 face each other. Do. Thereafter, the frit glass is baked, so that the anode panel AP and the cathode panel CP are bonded to each other at the peripheral portion via the bonding member 30. Next, a through hole (not shown) provided in a portion of the support 10 corresponding to an ineffective area of the cathode panel CP (that is, an area surrounding an effective area functioning as a display screen), and the cathode panel CP are attached to the support 10. A space sandwiched between the cathode panel CP and the anode panel AP (more specifically, surrounded by the cathode panel CP, the anode panel AP, and the joining member 30 through an exhaust pipe (not shown) made of a glass tube. After the space has reached a predetermined degree of vacuum, the exhaust pipe is sealed. Thus, a display device can be manufactured.

  By the way, in order to obtain a good display image, it is important to dispose the electron emission area EA on the cathode panel side and the phosphor layer 22 on the anode panel side accurately and relative to each other.

Usually, as described above, in joining the cathode panel CP and the anode panel AP, the joining member 30 made of a frame body coated with frit glass is used. The thickness (the height, which is the distance before joining between the cathode panel CP and the anode panel AP) of the joining member 30 composed of the frame body to which the frit glass before joining is applied is H, and when the display device is completed of the distance between the anode panel AP and the cathode panel CP when the d _0, a relationship of H> d _0. For example, after the joining member 30 is disposed on the peripheral edge of the anode panel AP, the anode panel AP and the cathode panel CP are aligned and positioned so that the electron emission region EA and the phosphor layer 22 face each other. Thereafter, in the conventional technique, the anode panel AP and the cathode panel CP are fixed by a fixing jig so that no positional deviation occurs between the anode panel AP and the cathode panel CP. The fixing jig is composed of, for example, a kind of clamp with a spring.

Then, the assembly of the anode panel AP, the cathode panel CP, and the joining member 30 is carried into a firing furnace, and the frit glass is fired by performing heat treatment in the firing furnace. When the frit glass is fired, the distance between the anode panel AP and the cathode panel CP changes from “H” to “d ₀ ”. That is, when the anode panel AP is used as a reference, the cathode panel CP is displaced in the direction approaching the anode panel AP (Z direction), but at this time, it is easily displaced in the XY directions. When the cathode panel CP is displaced in the X and Y directions with respect to the anode panel AP, the electron emission area EA on the cathode panel side and the phosphor layer 22 on the anode panel side are accurately positioned relative to each other. It will disappear. That is, a positional deviation occurs between the anode panel AP and the cathode panel CP.

  Techniques for preventing the occurrence of such misalignment are known from, for example, Japanese Patent Application Laid-Open Nos. 10-254374, 11-67094, and 2005-5141.

JP 10-254374 A JP 11-67094 A JP 2005-5141 A

  Although the technique disclosed in these patent publications can effectively prevent the occurrence of misalignment between the anode panel AP and the cathode panel CP, Japanese Patent Laid-Open Nos. 10-254374 and 11- In the technique disclosed in Japanese Patent No. 67094, the positioning member or the positioning fixing member is composed of a plurality of parts, and the manufacturing cost of the positioning member or the positioning fixing member is high. Increases manufacturing costs. In the technique disclosed in Japanese Patent Application Laid-Open No. 2005-5141, the cathode panel CP and the material constituting the anode panel AP when the frit glass is fired by performing the heat treatment in the firing furnace. The anode panel AP and the cathode panel CP may not be smoothly assembled due to a difference in thermal expansion from the material.

  Accordingly, an object of the present invention is to provide a method for assembling a flat panel display device that can effectively prevent the occurrence of misalignment between two panels despite the extremely simplified configuration. It is in.

In order to achieve the above object, the flat panel display assembly method of the present invention is a flat surface in which a first panel and a second panel having a rectangular planar shape are joined to each other at a peripheral portion thereof via a joining member. A method of assembling a mold display device,
(A) The first panel and the second panel are aligned in a state where the joining members are arranged on the peripheral portions thereof, and then,
(B) After positioning the second panel relative to the first panel,
(C) For the second panel, the force toward the first side extending in the first direction of the second panel, the second side adjacent to the first side and extending in a second direction different from the first direction The first panel and the second panel are joined at their peripheral portions by heating the joining member while applying a force toward the two sides and a force toward the first panel by the biasing means.
It comprises the process.

  In the assembling method of the flat display device of the present invention, the biasing means can be composed of a pin, a spring for applying a force to the pin, and a pin mounting portion. In this case, the force is applied to the pin. For the pin attached to the pin attachment portion by the spring for the purpose, a force toward the first side (sometimes referred to as a first horizontal component force), a force toward the second side (a second horizontal component force) And a combined force of a force toward the first panel (sometimes referred to as a vertical component force) may be applied. In addition, as the number of such urging means, two or more, preferably five or more per side of the first panel and the second panel can be exemplified. The angle formed by the axis of the pin and the normal line of the second panel can be 1 to 40 degrees, preferably 5 to 20 degrees.

  Alternatively, in the method for assembling the flat display device of the present invention, the urging means can be constituted by a clip. In this case, the clip includes a holding member having a holding portion that holds the first panel, a contact member that contacts the second panel at the contact portion, a fixing portion that rotatably fixes the holding member and the contact member to each other, And the holding portion of the holding member and the contact portion of the contact member include a biasing member that applies a force to the holding member and the contact member in a direction in which they are close to each other; A force is applied that is a combination of a force toward the first side (first horizontal component force), a force toward the second side (second horizontal component force), and a force toward the first panel (vertical component force). It can be in the form. Alternatively, in this case, the clip includes a holding member having a holding portion that holds the first panel, a contact member that comes into contact with the second panel at the contact portion, and a fixing portion that rotatably fixes the holding member and the contact member to each other. And a biasing member that applies force to the holding member and the contact member in a direction in which the holding portion of the holding member and the contact portion of the contact member are close to each other; the coefficient of thermal expansion of the material constituting the contact portion of the contact member Is smaller than the coefficient of thermal expansion of the material constituting the holding portion of the holding member; the heat of the contact member and the holding member by heat treatment when the first panel and the second panel are joined at the peripheral edge by the joining member. Due to the expansion, the contact portion of the contact member has a force toward the first side (first horizontal component force), a force toward the second side (second horizontal component force), and a force toward the first panel ( The combined force of the vertical component force is applied It can be a state. Examples of the number of such urging means include two or more, preferably five or more per side of the first panel and the second panel.

In the assembling method of the flat panel display device of the present invention including the above preferred configuration and form, after the alignment between the first panel and the second panel is completed, the edge of the first side of the second panel is The form which performs positioning of the 2nd panel to the 1st panel by fixing the 1st positioning member which touches, and the 2nd positioning member which touches the edge of the 2nd edge of the 2nd panel to a 1st panel, respectively. It can be. In this case, the first positioning member and the second positioning member may be made of, for example, a metal such as stainless steel, various kinds of glass, and ceramics. The portions of the first positioning member and the second positioning member that contact the second panel must be perpendicular to the first panel. When the frit glass is fired, when the distance between the first panel and the second panel changes from “H” to “d ₀ ”, the frit glass moves along the first positioning member and the second positioning member. This is because, if the one positioning member or the second positioning member is inclined by, for example, θ °, it is displaced by (H−d ₀ ) tan (θ). It is desirable that the positioning member has a cylindrical shape or a prismatic shape. When the shape of the positioning member is cylindrical, if the cross section of the edge (side surface) of the second panel is vertical, the contact state between the positioning member and the edge (side surface) of the second panel is line contact. Become. On the other hand, when the shape of the positioning member is a prismatic shape, the contact state is surface contact or line contact. As a method for fixing the first positioning member and the second positioning member to the first panel, for example, a polyimide-based adhesive or an inorganic heat-resistant adhesive is applied to the bottom surface of the positioning member, and the first positioning member and the second positioning member are then applied. A method of curing the adhesive by heating the adhesive with a laser beam or the like in a state where the member is in contact with the first side and the edge of the second side of the second panel can be exemplified. Here, (1, 2), (2, 1), (2, 2) can be exemplified as the number of combinations of (first positioning member, second positioning member). In order to improve positioning accuracy, at least the edge portion of the first side of the second panel in contact with the first positioning member, and the edge portion of the second side of the second panel in contact with at least the second positioning member Is preferably chamfered. Here, examples of the cross-sectional shape of the chamfered portion include a shape having a smooth curve such as a circle and an ellipse, a triangle, a triangle having a rounded ridgeline, and a triangle having a ridgeline cut off. By chamfering, the contact state between the cylindrical positioning member, the edge of the first side of the second panel, and the edge of the second side is point contact. The position of the apex of the chamfered portion is preferably located on the lower surface side of the second panel with respect to 1/2 of the thickness of the second panel.

  Alternatively, in the assembling method of the flat display device of the present invention including the above preferred configuration and form, after the alignment between the first panel and the second panel is completed, the first side of the second panel The first positioning device is brought into contact with the edge and the second positioning device is brought into contact with the edge of the second side of the second panel, thereby positioning the second panel with respect to the first panel. In this case, the first positioning device and the second positioning device are not limited, but are preferably screwed into the biasing means housing. The first side edge of the first positioning device or the second side of the second positioning device, the contact part of the second side edge to the edge of the second side, for example, metal such as stainless steel, various glass, ceramics Can be made from Further, it is desirable that the contact portion of the positioning device has a curved surface shape, a ridge line shape, or a planar shape. When the shape of the contact portion of the positioning device is curved or ridgeline, the contact portion of the positioning device and the edge (side surface) of the second panel are provided if the cross section of the edge (side surface) of the second panel is vertical. Part) is a line contact. On the other hand, when the shape of the contact portion of the positioning device is planar, the contact state is surface contact. Here, (1, 2), (2, 1), (2, 2) can be exemplified as the number of combinations of (first positioning device, second positioning device). Further, in order to improve the positioning accuracy, at least the edge portion of the first side of the second panel that contacts the first positioning device, and at least the second side of the second panel that contacts the second positioning device. The edge is preferably chamfered. Here, examples of the cross-sectional shape of the chamfered portion include a shape having a smooth curve such as a circle and an ellipse, a triangle, a triangle having a rounded ridgeline, and a triangle having a ridgeline cut off. By chamfering, the contact state between the cylindrical positioning member, the edge of the first side of the second panel, and the edge of the second side is point contact. The position of the apex of the chamfered portion is preferably located on the lower surface side of the second panel with respect to 1/2 of the thickness of the second panel.

In the assembling method of the flat display device of the present invention including the above preferred configurations and forms, the flat display device can include a cold cathode field emission display device equipped with a cold cathode field emission device. Examples thereof include a flat display device in which a metal / insulating film / metal element (MIM element) is incorporated, a flat display device in which a surface conduction electron-emitting device is incorporated, and a plasma display device. When the flat display device is composed of a cold cathode field emission display device, the final thickness (height) d ₀ of the bonding member is 0.5 mm to 3.0 mm, preferably 1 mm to 2 mm. It can be illustrated.

In the method for assembling the flat display device of the present invention, the first panel and the second panel are joined to each other at the peripheral portion via a joining member. Here, the joining member is made of insulating rigidity such as glass or ceramics. It can be constituted by a frame made of a material and an adhesive layer formed on the top and bottom surfaces of the frame, and in some cases, it can be constituted by only an adhesive layer (specifically, for example, press Examples thereof include a frit bar made of a molded rod-shaped frit glass and a frit glass shaped into a frame shape (frame shape). When the frame and the adhesive layer are used in combination, the distance between the first panel and the second panel can be further increased by appropriately selecting the height of the frame as compared with the case where only the adhesive layer is used. It can be set longer. As a constituent material of the adhesive layer, a frit glass such as a B ₂ O ₃ —PbO-based frit glass or a SiO ₂ —B ₂ O ₃ —PbO-based frit glass is generally used. A low melting point metal material may be used. Such low melting point metal materials include In (indium: melting point 157 ° C.); indium-gold based low melting point alloy; Sn ₈₀ Ag ₂₀ (melting point 220 to 370 ° C.), Sn ₉₅ Cu ₅ (melting point 227 to 370 ° C.) C) tin (Sn) type high temperature solder such as Pb _97.5 Ag _2.5 (melting point 304 ° C.), Pb _94.5 Ag _5.5 (melting point 304 to 365 ° C.), Pb _97.5 Ag _1.5 Sn _1.0 (melting point 309 ° C.), etc. Lead (Pb) high temperature solder; zinc (Zn) high temperature solder such as Zn ₉₅ Al ₅ (melting point 380 ° C.); Sn ₅ Pb ₉₅ (melting point 300 to 314 ° C.), Sn ₂ Pb ₉₈ (melting point 316 to 322) Tin-lead standard solder such as ° C); brazing material such as Au ₈₈ Ga ₁₂ (melting point 381 ° C) (the above subscripts all represent atomic%).

  In the method for assembling the flat display device of the present invention, the first panel and the second panel are aligned with the joining member before joining interposed therebetween. The first panel on which the joining member is arranged is placed on a placement table (panel stage), alignment marks provided on the first panel and the second panel are optically read, and the second panel relative to the first panel is read. While adjusting the position, the second panel can be placed on the joining member before joining.

  When joining the three members of the first panel, the second panel, and the joining member, the three members may be joined at the same time, or either the first panel or the second panel and the joining member in the first stage. And the other member of the first panel or the second panel and the joining member may be joined in the second stage. If the three-party simultaneous bonding or the second stage bonding is performed in a high vacuum atmosphere, the space surrounded by the first panel, the second panel, and the bonding member becomes a vacuum simultaneously with the bonding. Alternatively, after the three members are joined, the space surrounded by the first panel, the second panel, and the joining member can be evacuated to create a vacuum. When exhausting after joining, the pressure of the atmosphere at the time of joining may be normal pressure / depressurized, and the gas constituting the atmosphere may be air, or nitrogen gas or group 0 of the periodic table An inert gas containing a gas belonging to (for example, Ar gas) may be used.

  When exhaust is performed, the exhaust can be performed through an exhaust pipe called a tip pipe connected in advance to the first panel and / or the second panel. The exhaust pipe is typically a glass pipe, or a metal or alloy having a low coefficient of thermal expansion [for example, an iron (Fe) alloy containing 42 wt% nickel (Ni), 42 wt% nickel (Ni), A hollow tube made of an iron (Fe) alloy containing 6% by weight of chromium (Cr)] and serving as an ineffective area of the first panel and / or the second panel (practical function as a flat display device) Around the through-hole provided in the frame (the area surrounding the effective area, which is the display area in the center), it is joined using frit glass or the above-mentioned low melting point metal material, and the space reaches a predetermined degree of vacuum. After that, it is sealed by thermal fusion or sealed by pressure bonding. In addition, if the whole flat display device is once heated and then cooled before sealing, it is preferable because residual gas can be released into the space, and this residual gas can be removed out of the space by exhaust. .

In the method for assembling a flat panel display device of the present invention (hereinafter sometimes referred to as the present invention), a glass substrate is used as a substrate constituting the first panel, the second panel, and a support, and an insulating film is formed on the surface. Glass substrate, quartz substrate, quartz substrate having an insulating film formed on the surface, and semiconductor substrate having an insulating film formed on the surface. From the viewpoint of reducing the manufacturing cost, the glass substrate or the surface may be provided. It is preferable to use a glass substrate over which an insulating film is formed. As a glass substrate, high strain point glass, soda glass (Na ₂ O · CaO · SiO ₂ ), borosilicate glass (Na ₂ O · B ₂ O ₃ · SiO ₂ ), forsterite (2MgO · SiO ₂ ), lead glass (Na ₂ O · PbO · SiO ₂ ) and alkali-free glass can be exemplified.

  When the flat-type display device is a cold cathode field electron emission display device, a cold cathode field electron emission device (hereinafter, abbreviated as a field emission device) constituting an electron emission region is a second panel or a first panel (cathode panel). On the other hand, the anode electrode and the phosphor layer are provided on the first panel or the second panel (sometimes referred to as an anode panel).

And the field emission device is
(A) a strip-shaped cathode electrode formed on the support and extending in the X direction;
(B) an insulating layer formed on the cathode electrode and the support;
(C) a strip-shaped gate electrode formed on the insulating layer and extending in the Y direction different from the X direction;
(D) an opening provided in a portion of the gate electrode and the insulating layer located in an overlapping region where the cathode electrode and the gate electrode overlap, and an exposed portion of the cathode electrode at the bottom; and
(E) an electron emission portion provided on the cathode electrode exposed at the bottom of the opening,
Consists of.

  The type of the field emission device is not particularly limited, and a Spindt-type field emission device (a field emission device in which a conical electron emission portion is provided on the cathode electrode positioned at the bottom of the opening) or a flat type field emission device An element (a field emission element in which a substantially planar electron emission portion is provided on a cathode electrode positioned at the bottom of an opening) can be given.

  In the cathode panel, the projection image of the cathode electrode and the projection image of the gate electrode are orthogonal, that is, the X direction and the Y direction are orthogonal, from the viewpoint of simplifying the structure of the cold cathode field emission display device. To preferred. An overlapping region where the cathode electrode and the gate electrode overlap corresponds to an electron emission region, and the electron emission regions are arranged in a two-dimensional matrix, and each electron emission region includes one or a plurality of field emission elements. Is provided.

  In the cold cathode field emission display, a strong electric field generated by a voltage applied to the cathode electrode and the gate electrode is applied to the electron emission portion, and as a result, electrons are emitted from the electron emission portion by the quantum tunnel effect. The electrons are attracted to the anode panel by the anode electrode provided on the anode panel, and collide with the phosphor layer. As a result of the collision of electrons with the phosphor layer, the phosphor layer emits light and can be recognized as an image.

In the cold cathode field emission display, the cathode electrode is connected to the cathode electrode control circuit, the gate electrode is connected to the gate electrode control circuit, and the anode electrode is connected to the anode electrode control circuit. Note that these control circuits can be constituted by known circuits. During actual operation, the output voltage V _A of the anode electrode control circuit is normally constant, and can be, for example, 5 kilovolts to 15 kilovolts. Alternatively, when the distance between the anode panel and the cathode panel is d ₀ (where 0.5 mm ≦ d ₀ ≦ 10 mm), the value of V _A / d ₀ (unit: kilovolt / mm) is 0. It is desirable to satisfy 5 or more and 20 or less, preferably 1 or more and 10 or less, and more preferably 4 or more and 8 or less. In actual operation of the cold cathode field emission display, the voltage modulation method can be adopted as the gradation control method for the voltage V _C applied to the cathode electrode and the voltage V _G applied to the gate electrode.

A field emission device can be generally manufactured by the following method.
(1) forming a cathode electrode on a support;
(2) forming an insulating layer on the entire surface (on the support and the cathode electrode);
(3) forming a gate electrode on the insulating layer;
(4) forming an opening in a portion of the gate electrode and the insulating layer in a region where the cathode electrode and the gate electrode overlap, and exposing the cathode electrode at the bottom of the opening;
(5) A step of forming an electron emission portion on the cathode electrode located at the bottom of the opening.

Alternatively, the field emission device can be manufactured by the following method.
(1) forming a cathode electrode on a support;
(2) forming an electron emission portion on the cathode electrode;
(3) forming an insulating layer on the entire surface (on the support and the electron emission portion or on the support, the cathode electrode and the electron emission portion);
(4) forming a gate electrode on the insulating layer;
(5) A step of forming an opening in a portion of the gate electrode and the insulating layer in an overlapping region between the cathode electrode and the gate electrode and exposing the electron emission portion at the bottom of the opening.

  The field emission device may be provided with a focusing electrode. That is, for example, a field emission element in which an interlayer insulating layer is further provided on the gate electrode and the insulating layer, and a focusing electrode is provided on the interlayer insulating layer, or a focusing electrode is provided above the gate electrode. It can also be a field emission device. Here, the focusing electrode is an electrode for converging the trajectory of emitted electrons that are emitted from the opening and directed toward the anode electrode, thereby improving the luminance and preventing optical crosstalk between adjacent pixels. It is. In a so-called high voltage type cold cathode field emission display, the potential difference between the anode electrode and the cathode electrode is on the order of several kilovolts or more and the distance between the anode electrode and the cathode electrode is relatively long. The electrode is particularly effective. A relative negative voltage (for example, 0 volts) is applied to the focusing electrode from the focusing electrode control circuit. The focusing electrode does not necessarily have to be individually formed so as to surround each of the electron emission portion or the electron emission region provided in the overlapping region where the cathode electrode and the gate electrode overlap, for example, the electron emission portion or The electron emission region may be extended along a predetermined arrangement direction, or the electron emission portion or the electron emission region may be surrounded by one focusing electrode (that is, the focusing electrode may be a cold cathode field electron). It may be a thin sheet-like structure covering the entire effective area, which is the central display area that performs a practical function as an emission display device), thereby providing a plurality of electron emission areas or electron emission areas. A common convergence effect can be exerted.

  In the Spindt-type field emission device, as the material constituting the electron emission portion, molybdenum, molybdenum alloy, tungsten, tungsten alloy, titanium, titanium alloy, niobium, niobium alloy, tantalum, tantalum alloy, chromium, chromium alloy, and And at least one material selected from the group consisting of silicon (polysilicon and amorphous silicon) containing impurities. The electron emission portion of the Spindt-type field emission device can be formed by, for example, a sputtering method or a chemical vapor deposition method (CVD method) in addition to the vacuum deposition method.

In the flat field emission device, it is preferable that the material constituting the electron emission portion is composed of a material having a work function Φ smaller than that of the material constituting the cathode electrode. What is necessary is just to determine based on the work function of the material which comprises a cathode electrode, the electric potential difference between a gate electrode and a cathode electrode, the magnitude | size of the emission electron current density requested | required, etc. Alternatively, the material constituting the electron emission portion may be appropriately selected from materials in which the secondary electron gain δ of the material is larger than the secondary electron gain δ of the conductive material constituting the cathode electrode. In the flat type field emission device, carbon, more specifically, amorphous diamond or graphite, a carbon nanotube structure (carbon nanotube and / or graphite nanofiber), as a particularly preferable constituent material of the electron emission portion, Examples thereof include ZnO whiskers, MgO whiskers, SnO ₂ whiskers, MnO whiskers, Y ₂ O ₃ whiskers, NiO whiskers, ITO whiskers, In ₂ O ₃ whiskers, and Al ₂ O ₃ whiskers. In addition, the material which comprises an electron emission part does not necessarily need to be provided with electroconductivity.

The constituent materials of the cathode electrode, gate electrode, and focusing electrode are aluminum (Al), tungsten (W), niobium (Nb), tantalum (Ta), molybdenum (Mo), chromium (Cr), copper (Cu), gold ( Metals such as Au), silver (Ag), titanium (Ti), nickel (Ni), cobalt (Co), zirconium (Zr), iron (Fe), platinum (Pt), zinc (Zn); these metal elements Alloys (eg, MoW) or compounds (eg, nitrides such as TiN, silicides such as WSi ₂ , MoSi ₂ , TiSi ₂ , TaSi ₂ ); semiconductors such as silicon (Si); carbon thin films such as diamond; ITO ( Examples thereof include conductive metal oxides such as indium oxide-tin oxide, indium oxide, and zinc oxide. In addition, as a method for forming these electrodes, for example, a vapor deposition method such as an electron beam vapor deposition method or a hot filament vapor deposition method, a sputtering method, a combination of a CVD method, an ion plating method and an etching method; a screen printing method; Plating method and electroless plating method); lift-off method; laser ablation method; sol-gel method and the like. According to the screen printing method or the plating method, for example, a strip-like cathode electrode or gate electrode can be formed directly.

As a material for constituting the insulating layer and the interlayer insulating _{layer, SiO 2, BPSG, PSG,} BSG, AsSG, PbSG, SiON, SOG ( spin on glass), low-melting glass, SiO ₂ based materials such glass paste; SiN-based materials; polyimide These insulating resins can be used alone or in appropriate combination. For forming the insulating layer or the interlayer insulating layer, a known process such as a CVD method, a coating method, a sputtering method, or a screen printing method can be used.

  Planar shape of the first opening (opening formed in the gate electrode) or the second opening (opening formed in the insulating layer) (shape when the opening is cut in a virtual plane parallel to the support surface) ) Can be any shape such as a circle, an ellipse, a rectangle, a polygon, a rounded rectangle, a rounded polygon. The formation of the first opening can be performed by, for example, anisotropic etching, isotropic etching, a combination of anisotropic etching and isotropic etching, or, depending on the method of forming the gate electrode, The first opening can also be formed directly. The second opening can also be formed by, for example, anisotropic etching, isotropic etching, or a combination of anisotropic etching and isotropic etching.

  In the field emission device, depending on the structure of the field emission device, one electron emission portion may exist in one opening, or a plurality of electron emission portions may exist in one opening. In addition, a plurality of first openings are provided in the gate electrode, one second opening communicating with the first opening is provided in the insulating layer, and one or more are provided in one second opening provided in the insulating layer. There may be an electron emission portion.

In the field emission device, a resistor film may be provided between the cathode electrode and the electron emission portion. By providing the resistor film, the operation of the field emission device can be stabilized and the electron emission characteristics can be made uniform. As a material constituting the resistor film, a carbon-based material such as silicon carbide (SiC) or SiCN, a semiconductor material such as SiN or amorphous silicon, or a refractory metal oxide such as ruthenium oxide (RuO ₂ ), tantalum oxide, or tantalum nitride. It can be illustrated. Examples of the method for forming the resistor film include a sputtering method, a CVD method, and a screen printing method. The electrical resistance value per one electron emitting portion may be approximately 1 × 10 ⁶ to 1 × 10 ¹¹ Ω, preferably several tens of gigaΩ.

  In the flat display device, examples of the configuration of the anode electrode and the phosphor layer include (1) a configuration in which the anode electrode is formed on the substrate and the phosphor layer is formed on the anode electrode, and (2) on the substrate. The structure which forms a fluorescent substance layer and forms an anode electrode on a fluorescent substance layer can be mentioned. In the configuration (1), a so-called metal back film that is electrically connected to the anode electrode may be formed on the phosphor layer. In the configuration (2), a metal back film may be formed on the anode electrode.

The anode electrode may be composed of one anode electrode as a whole, or may be composed of a plurality of anode electrode units. In the latter case, it is preferable that the anode electrode unit and the anode electrode unit are electrically connected by a resistor layer. As the material constituting the resistor layer, carbon, carbon carbide (SiC), SiCN, and other carbon materials; SiN materials; ruthenium oxide (RuO ₂ ), tantalum oxide, tantalum nitride, chromium oxide, titanium oxide, and other high melting point metals Examples thereof include oxides; semiconductor materials such as amorphous silicon; ITO. It is also possible to realize a stable desired sheet resistance value by combining a plurality of films such as laminating a carbon thin film having a low resistance value on the SiC resistance film. Examples of the sheet resistance value of the resistor layer include 1 × 10 ⁻¹ Ω / □ to 1 × 10 ¹⁰ Ω / □, preferably 1 × 10 ³ Ω / □ to 1 × 10 ⁸ Ω / □. The number (Q) of anode electrode units may be two or more. For example, when the total number of rows of phosphor layers arranged in a straight line is q, Q = q or q = k · Q (K is an integer of 2 or more, preferably 10 ≦ k ≦ 100, more preferably 20 ≦ k ≦ 50), or a number obtained by adding 1 to the number of spacers arranged at a constant interval. It can also be a number that matches the number of pixels or sub-pixels, or an integer fraction of the number of pixels or sub-pixels. The size of each anode electrode unit may be the same regardless of the position of the anode electrode unit, or may vary depending on the position of the anode electrode unit. A resistor layer may be formed on one anode electrode as a whole.

The anode electrode (including the anode electrode unit) may be formed using a conductive material layer. Examples of the method of forming the conductive material layer include various physical vapor deposition methods (PVD methods) such as an evaporation method such as an electron beam evaporation method and a hot filament evaporation method, a sputtering method, an ion plating method, and a laser ablation method; Examples include CVD method; screen printing method; metal mask printing method; lift-off method; sol-gel method. That is, it is possible to form an anode electrode by forming a conductive material layer made of a conductive material and patterning the conductive material layer based on a lithography technique and an etching technique. Alternatively, the anode electrode can be obtained by forming a conductive material based on a PVD method or a screen printing method through a mask or screen having an anode electrode pattern. The resistor layer can also be formed by a similar method. That is, a resistor layer may be formed from a resistor material, and the resistor layer may be patterned based on a lithography technique and an etching technique, or the resistor material may be provided via a mask or screen having a resistor layer pattern. The resistor layer can be obtained by formation based on the PVD method or the screen printing method. 3 × 10 ⁻⁸ m (30 nm) to 5 as the average thickness of the anode electrode on the substrate (or above the substrate) (when the partition is provided as described later, the average thickness of the anode electrode on the top surface of the partition) Examples include x10 ⁻⁷ m (0.5 μm), preferably 5 × 10 ⁻⁸ m (50 nm) to 3 × 10 ⁻⁷ m (0.3 μm).

As the constituent material of the anode electrode, molybdenum (Mo), aluminum (Al), chromium (Cr), tungsten (W), niobium (Nb), tantalum (Ta), gold (Au), silver (Ag), titanium (Ti) ), Cobalt (Co), zirconium (Zr), iron (Fe), platinum (Pt), zinc (Zn), etc .; alloys or compounds containing these metal elements (for example, nitrides such as TiN, WSi ₂ Silicide such as MoSi ₂ , TiSi ₂ , TaSi ₂ ); Semiconductor such as silicon (Si); Carbon thin film such as diamond; Conductive metal oxide such as ITO (indium oxide-tin oxide), indium oxide, zinc oxide can do. When the resistor layer is formed, the anode electrode is preferably made of a conductive material that does not change the resistance value of the resistor layer. For example, when the resistor layer is made of silicon carbide (SiC), the anode electrode is It is preferable to comprise from molybdenum (Mo).

  The phosphor layer may be composed of single-color phosphor particles or may be composed of three primary color phosphor particles. The arrangement pattern of the phosphor layers is, for example, a dot shape. Specifically, when the flat display device is a color display, examples of the arrangement and arrangement of the phosphor layers include a delta arrangement, a stripe arrangement, a diagonal arrangement, and a rectangle arrangement. That is, one line of the phosphor layers arranged in a straight line is occupied by a line occupied by the red light emitting phosphor layer, a line occupied by the green light emitting phosphor layer, and a blue light emitting phosphor layer. It may be comprised from the row | line | column, and it may be comprised from the row | line | column in which the red light emission fluorescent substance layer, the green light emission fluorescent substance layer, and the blue light emission fluorescent substance layer were arrange | positioned in order. Here, the phosphor layer is defined as a phosphor region that generates one bright spot in the flat display device. Further, one pixel (one pixel) is composed of a set of one red light emitting phosphor layer, one green light emitting phosphor layer, and one blue light emitting phosphor layer, and one subpixel is one phosphor. It is composed of layers (one red-emitting phosphor layer, one green-emitting phosphor layer, or one blue-emitting phosphor layer). A gap between adjacent phosphor layers may be filled with a light absorption layer (black matrix) for the purpose of improving contrast.

  The phosphor layer uses a luminescent crystal particle composition prepared from luminescent crystal particles (for example, phosphor particles having a particle size of about 2 to 10 nm), for example, a red photosensitive luminescent crystal particle composition. (Red phosphor slurry) is applied to the entire surface, exposed and developed to form a red light emitting phosphor layer, and then a green photosensitive luminescent crystal particle composition (green phosphor slurry) is applied to the entire surface. Then, it is exposed to light and developed to form a green light emitting phosphor layer. Further, a blue photosensitive luminescent crystal particle composition (blue phosphor slurry) is applied to the entire surface, exposed to light and developed to emit blue light. It can be formed by a method of forming a phosphor layer. Alternatively, after sequentially applying the red light emitting phosphor slurry, the green light emitting phosphor slurry, and the blue light emitting phosphor slurry, each phosphor slurry may be sequentially exposed and developed to form each phosphor layer. Each phosphor layer may be formed by a screen printing method, an inkjet method, a float coating method, a sedimentation coating method, a phosphor film transfer method, or the like. The average thickness of the phosphor layer on the substrate is not limited, but is preferably 3 μm to 20 μm, preferably 5 μm to 10 μm. The phosphor material constituting the luminescent crystal particles can be appropriately selected from conventionally known phosphor materials. In the case of color display, a phosphor material whose color purity is close to the three primary colors specified by NTSC, white balance is achieved when the three primary colors are mixed, the afterglow time is short, and the afterglow time of the three primary colors is almost equal. It is preferable to combine them.

  The light absorption layer that absorbs light from the phosphor layer is preferably formed between adjacent phosphor layers or between the partition wall and the substrate from the viewpoint of improving the contrast of the display image. Here, the light absorption layer functions as a so-called black matrix. As the material constituting the light absorption layer, it is preferable to select a material that absorbs 90% or more of light from the phosphor layer. Such materials include carbon, metal thin films (eg, chromium, nickel, aluminum, molybdenum, etc., or alloys thereof), metal oxides (eg, chromium oxide), metal nitrides (eg, chromium nitride), heat resistance Materials such as photosensitive organic resins, glass pastes, glass pastes containing conductive particles such as black pigments and silver, and specifically, photosensitive polyimide resins, chromium oxides, and chromium oxide / chromium laminated films Can be illustrated. In the chromium oxide / chromium laminated film, the chromium film is in contact with the substrate. For example, the light absorption layer is a combination of a vacuum vapor deposition method, a sputtering method and an etching method, a vacuum vapor deposition method, a sputtering method, a combination of a spin coating method and a lift-off method, a screen printing method, a lithography technique, etc. It can be formed by a method appropriately selected depending on the method.

  In order to prevent the electrons recoiled from the phosphor layer or the secondary electrons emitted from the phosphor layer from entering other phosphor layers, so-called optical crosstalk (color turbidity) is generated. Alternatively, it is preferable to provide a partition in order to prevent electrons recoiled from the phosphor layer or secondary electrons emitted from the phosphor layer from entering another phosphor layer.

  Examples of the partition wall forming method include a screen printing method, a dry film method, a photosensitive method, a casting method, and a sandblast forming method. Here, in the screen printing method, an opening is formed in a portion of the screen corresponding to a portion where a partition is to be formed, and the partition forming material on the screen is passed through the opening using a squeegee, and the partition is formed on the substrate. In this method, after the formation material layer is formed, the partition wall formation material layer is fired. The dry film method is a method of laminating a photosensitive film on a substrate, removing the photosensitive film at the part where the partition wall is to be formed by exposure and development, embedding the partition wall forming material in the opening generated by the removal, and baking. . The photosensitive film is burned and removed by baking, and the partition wall-forming material embedded in the openings remains to form partition walls. The photosensitive method is a method in which a barrier rib-forming material layer having photosensitivity is formed on a substrate, the barrier rib-forming material layer is patterned by exposure and development, and then fired (cured). The casting method (embossing molding method) refers to a method for forming a partition wall forming material layer by extruding a partition wall forming material layer made of a paste-like organic material or inorganic material onto a substrate from a mold (cast). In this method, the partition wall forming material layer is fired. The sand blast forming method is, for example, forming a partition wall forming material layer on a substrate using a screen printing or metal mask printing method, a roll coater, a doctor blade, a nozzle discharge type coater, etc. In this method, the part of the partition wall forming material layer to be covered is covered with a mask layer, and then the exposed part of the partition wall forming material layer is removed by sandblasting. After the partition wall is formed, the partition wall may be polished to flatten the top surface of the partition wall.

  As a planar shape of the part surrounding the phosphor layer in the partition wall (corresponding to the inner contour line of the projected image of the partition wall side surface and a kind of opening region), a rectangular shape, a circular shape, an elliptical shape, an oval shape, a triangular shape, Examples include pentagonal or more polygonal shapes, rounded triangular shapes, rounded rectangular shapes, rounded polygons, and the like. By arranging these planar shapes (planar shapes of the opening regions) in a two-dimensional matrix, a lattice-like partition is formed. This two-dimensional matrix-like arrangement may be arranged, for example, like a cross or like a zigzag.

Examples of the partition wall forming material include photosensitive polyimide resin, lead glass colored with a metal oxide such as cobalt oxide, SiO ₂ , and a low melting point glass paste. A protective layer (for example, made of SiO ₂ , SiON, or AlN) is provided on the surface (top surface and side surface) of the partition wall to prevent an electron beam from colliding with the partition wall and releasing gas from the partition wall. It may be formed.

  Depending on the flat display device, the space between the first panel and the second panel is in a high vacuum. Therefore, if a spacer made of a high resistance material such as ceramic material or glass is not disposed between the first panel and the second panel, the flat display device is damaged by atmospheric pressure. End up. The spacer can be made of ceramics or glass, for example. When the spacer is made of ceramics, the ceramics include mullite, alumina, barium titanate, lead zirconate titanate, zirconia, cordiolite, borosilicate barium, iron silicate, glass ceramic materials, titanium oxide and chromium oxide. Examples thereof include iron oxide, vanadium oxide, and nickel oxide added. In this case, the spacer can be manufactured by forming a so-called green sheet, firing the green sheet, and cutting the green sheet fired product. Moreover, soda-lime glass can be mentioned as glass which comprises a spacer. The spacer may be fixed by being sandwiched between the partition walls, for example. Alternatively, for example, a spacer holding part may be formed on the first panel or the second panel and fixed by the spacer holding part.

An antistatic film may be provided on the surface of the spacer. The material constituting the antistatic film preferably has a secondary electron emission coefficient close to 1, and as the material constituting the antistatic film, a semimetal such as graphite, an oxide, a boride, a carbide, a sulfide, and A nitride or the like can be used. For example, compounds containing a metalloid element ₂ such as a semi-metal and MoSe such as _{graphite, CrO x, CrAl x O y} , Nd 2 O 3, La x Ba 2-x CuO 4, La x Ba 2-x CuO 4, Oxides such as La _x Y _1-x CrO ₃ , borides such as AlB ₂ and TiB ₂ , carbides such as SiC, sulfides such as MoS ₂ and WS ₂ , and nitrides such as BN, TiN and AlN In addition, for example, materials described in, for example, JP-T-2004-500688 can be used. The antistatic film may be composed of a single type of material, may be composed of a plurality of types of materials, may be a single layer structure, or may be a multilayer structure. May be. The antistatic film can be formed based on a known method such as a sputtering method, a vacuum deposition method, a CVD method, or the like.

In the assembling method of the flat display device of the present invention, the first panel and the second panel are joined at their peripheral portions by heating the joining member. At this time, the height of the joining member (first The distance between the first panel and the second panel) changes from “H” to “d ₀ (<H)”. That is, when the first panel is used as a reference, the second panel is displaced in the direction approaching the first panel (Z direction). However, the second panel is positioned with respect to the first panel, and the second panel has a force toward the first side, a force toward the second side, and toward the first panel. Power is applied by the biasing means. Therefore, the second panel is not displaced in either the first direction or the second direction. Therefore, there is no displacement between the first panel and the second panel, and a high-quality flat display device can be provided. Moreover, the means for preventing the displacement between the first panel and the second panel has a very simple configuration such as an urging means.

  Hereinafter, the present invention will be described based on examples with reference to the drawings.

Example 1 relates to a method for assembling a flat display device according to the present invention, and includes a flat panel display device in which a first panel and a second panel having a rectangular planar shape are bonded to each other at a peripheral portion thereof via a bonding member. This is an assembly method. Here, more specifically, the flat display device of Example 1 includes a cold cathode field emission display device (hereinafter, abbreviated as a display device). The first panel constituting the display device according to the first embodiment may be hereinafter referred to as an anode panel AP, and the second panel may be hereinafter referred to as a cathode panel CP. Here, FIG. 7 shows a schematic partial cross-sectional view of the display device of Example 1 having Spindt-type cold cathode field emission devices (hereinafter referred to as field emission devices) or Examples 2 to 4 described later. The schematic partial cross-sectional view of the display device of Example 1 having a flat field emission device or Examples 2 to 4 described later is the same as that shown in FIG. The first panel P ₁ (anode panel AP) and a second panel P ₂ first panel P when decomposing (cathode panel CP) ₁ (anode panel AP) and the second panel P ₂ of (cathode panel CP) A schematic exploded perspective view of a part is the same as that shown in FIG.

That is, the display device of Example 1 or Examples 2 to 4 described later includes a first panel P ₁ (anode panel AP) and a second panel P ₂ (cathode panel CP) having a rectangular planar shape. It is joined via the joining member 30 in the peripheral part. More specifically, in this display device, a second panel P ₂ (cathode panel CP) in which a plurality of electron emission areas EA that emit electrons are formed on the support 10 and the electron emission area EA are emitted. The first panel P ₁ (anode panel AP) formed by forming the phosphor layer 22 and the anode electrode 24 on which the electrons collide is formed on the substrate 20 is bonded to the first panel via the bonding member 30 at the peripheral portion thereof. A space sandwiched between P ₁ (anode panel AP) and the second panel P ₂ (cathode panel CP) is maintained in a vacuum.

Here, in the first embodiment or the second to fourth embodiments described later, the field emission elements constituting the electron emission region EA are configured by, for example, Spindt type field emission elements. As shown in FIG. 7, the Spindt-type field emission device has
(A) a cathode electrode 11 formed on the support 10;
(B) an insulating layer 12 formed on the support 10 and the cathode electrode 11;
(C) a gate electrode 13 formed on the insulating layer 12;
(D) the opening 14 provided in the gate electrode 13 and the insulating layer 12 (the first opening 14A provided in the gate electrode 13 and the second opening 14B provided in the insulating layer 12), and
(E) a conical electron emission portion 15 formed on the cathode electrode 11 located at the bottom of the opening 14;
It is composed of

Alternatively, in Example 1 or Examples 2 to 4 to be described later, the field emission device is constituted by, for example, a flat type field emission device. As shown in FIG.
(A) a cathode electrode 11 formed on the support 10;
(B) an insulating layer 12 formed on the support 10 and the cathode electrode 11;
(C) a gate electrode 13 formed on the insulating layer 12;
(D) the opening 14 provided in the gate electrode 13 and the insulating layer 12 (the first opening 14A provided in the gate electrode 13 and the second opening 14B provided in the insulating layer 12), and
(E) an electron emission portion 15A formed on the cathode electrode 11 located at the bottom of the opening 14;
It is composed of The electron emission portion 15A is composed of, for example, a large number of carbon nanotubes partially embedded in a matrix.

  In the cathode panel CP, the cathode electrode 11 has a strip shape extending in the X direction, and the gate electrode 13 has a strip shape extending in the Y direction different from the X direction. The cathode electrode 11 and the gate electrode 13 are each formed in a strip shape in a direction in which the projected images of both the electrodes 11 and 13 are orthogonal to each other. The electron emission area EA corresponding to one subpixel is provided with a plurality of field emission elements, and the electron emission areas EA corresponding to one subpixel are arranged in a two-dimensional matrix within the effective area of the cathode panel CP. It is arranged. One subpixel is constituted by an electron emission area EA on the cathode panel side and a phosphor layer 22 on the anode panel side facing the electron emission area EA. An interlayer insulating layer (not shown) is provided on the insulating layer 12 and the gate electrode 13, and further, a focusing electrode (not shown) is provided between the interlayers along a predetermined arrangement direction of the field emission elements. It is provided on the insulating layer and can exert a common convergence effect on a plurality of field emission devices. A through hole (not shown) for evacuation is provided in the ineffective region of the cathode panel CP, and an exhaust pipe (not shown) called a tip tube that is sealed after evacuation is provided in the through hole. It is attached.

In Example 1 or Examples 2 to 4 to be described later, the anode panel AP includes a substrate 20 and a phosphor layer 22 formed on the substrate 20 (in the case of color display, a red light-emitting phosphor layer 22R, The green light emitting phosphor layer 22 </ b> G, the blue light emitting phosphor layer 22 </ b> B), and the anode electrode 24 covering the phosphor layer 22. That is, the anode panel AP is more specifically formed on the substrate 20 and the substrate 20 between the partition walls 21 formed on the substrate 20 and the phosphor layer 22 made of a large number of phosphor particles. (A red light emitting phosphor layer 22R, a green light emitting phosphor layer 22G, a blue light emitting phosphor layer 22B), and an anode electrode 24 formed on the phosphor layer 22. The anode electrode 24 is made of aluminum (Al) having a thickness of about 70 nm, is in the form of a thin sheet that covers the effective region, and is provided so as to cover the partition wall 21 and the phosphor layer 22. Between the phosphor layer 22 and the phosphor layer 22, and between the partition wall 21 and the substrate 20, a light absorption layer (black) is used to prevent the occurrence of color turbidity and optical crosstalk in the display image. Matrix) 23 is formed. The space sandwiched between the first panel P ₁ (anode panel AP) and the second panel P ₂ (cathode panel CP) is in a vacuum state (pressure: for example, 10 ⁻³ Pa or less).

In Embodiment 1 or Embodiments 2 to 4 described later, the cathode electrode 11 is connected to the cathode electrode control circuit 81, the gate electrode 13 is connected to the gate electrode control circuit 82, and the focusing electrode is the focusing electrode control circuit (see FIG. The anode electrode 24 is connected to the anode electrode control circuit 83. These control circuits can be constituted by known circuits. During actual operation of the display device, the anode voltage V _A applied from the anode electrode control circuit 83 to the anode electrode 24 is normally constant, and can be, for example, 5 kilovolts to 15 kilovolts. On the other hand, regarding the voltage V _C applied to the cathode electrode 11 and the voltage V _G applied to the gate electrode 13 during actual operation of the display device,
(1) A method in which the voltage V _C applied to the cathode electrode 11 is constant and the voltage V _G applied to the gate electrode 13 is changed. (2) The voltage V _C applied to the cathode electrode 11 is changed and applied to the gate electrode 13. the voltage V _G for changing the voltage V _C applied to the method (3) a cathode electrode 11, constant, and may employ any method to change the voltage V _G applied to the gate electrode 13.

During actual operation of the display device, a relatively negative voltage (V _C ) is applied to the cathode electrode 11 from the cathode electrode control circuit 81, and a relatively positive voltage (V _G ) is applied to the gate electrode 13. 82, for example, 0 V is applied to the focusing electrode from the focusing electrode control circuit, and a positive voltage (anode voltage V _A ) higher than that of the gate electrode 13 is applied to the anode electrode 24 from the anode electrode control circuit 83. The When performing display in such a display device, for example, a scanning signal is input to the cathode electrode 11 from the cathode electrode control circuit 81, and a video signal is input to the gate electrode 13 from the gate electrode control circuit 82. Note that a video signal may be input to the cathode electrode 11 from the cathode electrode control circuit 81, and a scanning signal may be input to the gate electrode 13 from the gate electrode control circuit 82. Electrons are emitted from the electron emission portions 15 and 15A based on the quantum tunnel effect due to an electric field generated when a voltage is applied between the cathode electrode 11 and the gate electrode 13, and the electrons are attracted to the anode electrode 24. It passes through 24 and collides with the phosphor layer 22. As a result, the phosphor layer 22 is excited to emit light, and a desired image can be obtained. That is, the operation of this display device is basically controlled by the voltage V _G applied to the gate electrode 13 and the voltage V _C applied to the cathode electrode 11.

Hereinafter, with reference to FIGS. 1A to 1C, FIGS. 2A to 2C, and FIGS. 3A and 3B, the method of assembling the display device of the first embodiment will be described below. Will be explained. 1A, 2A, and 3A are schematic plan views of the first panel, etc., and FIG. 1B and FIG. (B) of FIG. 2 is a schematic cross-sectional view of the first panel and the like along the arrow AA, and (C) of FIG. 1, (C) of FIG. 2, and (B) of FIG. It is a typical partial sectional view of the 1st panel etc. 1A, FIG. 2A, and FIG. 3A, the first panel P ₁ , the second panel P ₂ , and the joining member (hatched for clarity). In addition, illustrations other than the positioning members are omitted, and detailed illustrations of components of the first panel P ₁ and the second panel P ₂ are omitted.

Here, the urging means 50 in the first embodiment includes a pin 51, a spring (pressing spring) 52 for applying a force to the pin, and a pin mounting portion 53. The pin attachment portion 53 is attached to the urging means housing 54. When the rear end portion of the pin 51 is in a state of being locked by a locking portion (not shown), the pin 51 is positioned at the backward movement end (see FIGS. 1C and 2C). rear end is solved the locked state by the locking unit (not shown) of, at a state of being pressed by the biasing force of the spring 52, in contact with the second panel P ₂ advances (see (B) in FIG. 3) . In this state, the pin 51 attached to the pin attachment portion 53 has a force (first horizontal component) toward the first side of the second panel P ₂ and a force toward the second side. A force obtained by combining (second horizontal component force) and a force (vertical component force) toward the first panel P ₁ is applied. That is, the axis of the pin 51 is arranged in parallel to the direction indicated by the white arrow in FIGS. 3A and 3B, and the force component applied to the pin 51 includes a first component described later. A component toward the positioning member 41 and the second positioning member 42 and a component toward the first panel P ₁ are included. In Example 1, a pressing force of 500 g · f is applied so that a pressure of 200 g / cm ² is applied between the first panel P ₁ and the second panel P ₂ by one urging means 50. 28 biasing means 50 having a nominal 20 inch panel were used.

[Step-100]
First, a first panel P ₁ (anode panel AP) provided with the anode electrode 24 and the phosphor layer 22 and a second panel P ₂ (cathode panel CP) provided with field emission elements are prepared. Then, as shown in FIGS. 1A, 1B, and 1C, the first panel P ₁ (anode panel AP) and the second panel P ₂ (cathode panel CP) are attached to the peripheral portions thereof. Positioning is performed in a state where the joining member 30 [applied to the frame 31 with an adhesive layer 32 (specifically, frit glass paste) and pre-fired at 350 ° C. for 20 minutes] is disposed. Specifically, the first panel P ₁ (anode panel AP) in which the joining member 30 is arranged at the peripheral portion and the spacer is attached at a predetermined position is housed in the biasing means housing 54. Then, the urging means housing 54 is placed on a mounting table (panel stage) (not shown), and alignment marks (not shown) provided on the first panel P ₁ and the second panel P ₂ are optically read. The second panel P ₂ is placed on the joining member 30 while adjusting the position of the second panel P _{2 with} respect to the first panel P ₁ . Incidentally, the rear end portion of the pin 51 is in a state of being engaged with an engaging portion (not shown), the pin 51 is located in the backward end, the distal end portion of the pin 51 is not in contact with the second panel P _2. The joining member 30 includes a frame body 31 and an adhesive layer 32 made of frit glass applied to the top and bottom surfaces of the frame body 31. The thickness of the joining member 30 (height, which is the distance before joining between the first panel P ₁ and the second panel P ₂ ) is H (specifically, 2.8 mm). .

[Step-110]
Next, as shown in FIGS. 2A, 2B, and 2C, the second panel P ₂ is positioned with respect to the first panel P ₁ . Specifically, the first positioning member 41 in contact with the edge of the first side of the second panel P _2, and a second positioning member 42 in contact with the edge of the second side of the second panel P _2, Each is fixed to the first panel P ₁ . The first positioning member 41 and the second positioning member 42 are made of glass having a columnar shape, and the contact state between the positioning members 41 and 42 and the edge portion (side surface portion) of the second panel P ₂ will be described later. At least the edge portion of the first side of the second panel P ₂ in contact with the first positioning member 41 and the edge portion of the second side of the second panel P ₂ in contact with at least the second positioning member 42 are chamfered. Since it is, it becomes a point contact. In order to fix the positioning members 41 and 42 to the first panel P ₁ , respectively, polyimide adhesive is applied to the bottom surfaces of the positioning members 41 and 42, and the first positioning member 41 and the second positioning member 42 are applied. in a state in contact with the edge of the first side and a second side of the second panel P _2, by heating the adhesive by a laser beam or the like, it is sufficient to cure the adhesive. The number of combinations of (first positioning member, second positioning member) was (2, 1).

Moreover, to improve the positioning accuracy, at least a first portion of the edge of the sides of the second panel P ₂ in contact with the first positioning member 41, and, the second panel P ₂ in contact with at least a second positioning member 42 first The edges of the two sides are chamfered. The cross-sectional shape of the chamfered portion was a triangle having a rounded ridgeline. The position of the vertex existing in the cross-sectional shape of the chamfered portion are located than half the thickness of the second panel P ₂ second panel lower surface side (first panel side). Further, the height of the first positioning member 41 and the second positioning member 42 after the first positioning member 41 and the second positioning member 42 are fixed to the first panel P ₁ is the same as the completion of the subsequent [Step-130]. Even when the distance between the first panel P ₁ (anode panel AP) and the second panel P ₂ (cathode panel CP) becomes “d ₀ ”, the first panel P ₂ has the first surface from the top surface. The height is set such that the top surfaces of the positioning member 41 and the second positioning member 42 do not protrude. With such a configuration, it is possible to reliably prevent the first positioning member 41 and the second positioning member 42 from becoming obstacles in the assembly process of the display device. In addition, about the structure and structure of the 1st positioning member 41 and the 2nd positioning member 42, and the chamfering of the 2nd panel P2, it is the same also in the following Examples _2-4 .

[Step-120]
Thereafter, when the locking state of the rear end portion of the pin 51 by the locking portion (not shown) is released, the pin 51 is pushed by the urging force of the spring 52 as shown in FIGS. to be in contact with the second panel P ₂ to move forward. In this state, the pin 51 attached to the pin attachment portion 53 has a force toward the first side (first horizontal component force) and a force toward the second side (second horizontal component force). ), and, (force vertical component force) is synthesized (shown in FIG. 3 (a) force toward the first panel P ₁ see the white arrow and (B)) is added. As a result, the second panel P _2, the force toward the first side extending in the first direction of the second panel P ₂ (first horizontal force), adjacent to the first side, the first direction A force toward the second side extending in the second direction different from (second horizontal component force) and a force toward the first panel P ₁ (vertical component force) are applied. However, since the first positioning member 41 and the second positioning member 42 exist, the second panel P ₂ is not displaced (moved) in the first direction and the second direction.

[Step-130]
Next, the entire assembly is carried into a firing furnace and subjected to heat treatment in the firing furnace, whereby the adhesive layer 32 made of frit glass is finally fired at a temperature of about 400 ° C. for about 30 minutes. The pressure of the atmosphere during firing may be either normal pressure or reduced pressure, and the gas constituting the atmosphere may be air, or nitrogen gas or a gas belonging to group 0 of the periodic table (for example, Ar gas) ) Including an inert gas. When the frit glass firing is completed, the distance between the first panel P ₁ (anode panel AP) and the second panel P ₂ (cathode panel CP) is “H” to “d ₀ ” (2.0 mm). To change.

[Step-140]
Thereafter, the entire assembly is carried out of the firing furnace, and a space surrounded by the first panel P ₁ (anode panel AP), the second panel P ₂ (cathode panel CP), and the joining member 30 is formed as a through hole (not shown). And the exhaust pipe (not shown), and when the pressure in the space reaches about 10 ⁻⁴ Pa, the exhaust pipe is sealed by heating and melting. In addition, if the entire display device is once heated and then cooled down before sealing, the residual gas can be released into the space, and this residual gas can be removed out of the space by exhaust. It is. Thus, the space surrounded by the first panel P ₁ (anode panel AP), the second panel P ₂ (cathode panel CP), and the bonding member 30 can be evacuated. Thereafter, wiring connection with necessary external circuits is performed, and the display device is completed.

If the atmosphere at the time of joining the first panel P ₁ (anode panel AP) and the second panel P ₂ (cathode panel CP) via the joining member 30 at the peripheral portion thereof is a high vacuum atmosphere, the first The space can be evacuated simultaneously with the joining of the panel P ₁ (anode panel AP) and the second panel P ₂ (cathode panel CP).

In Example 1, during the firing of the adhesive layer 32 made of fritted glass in [Step-130], when the first panel P ₁ and the reference, the second panel P ₂ is the first panel P ₁ Displacement in the approaching direction (Z direction). At this time, the force toward the first side (first horizontal component force), the force toward the second side (second horizontal component force), and the first force are applied to the second panel P ₂ by the urging means 50. A force obtained by synthesizing a force (vertical component force) toward the panel P ₁ is applied. However, since the first positioning member 41 and the second positioning member 42 exist, the second panel P ₂ is not displaced (moved) in either the first direction or the second direction. Therefore, the electron emission area EA on the cathode panel side and the phosphor layer 22 on the anode panel side can be reliably maintained in a state in which they are accurately opposed to each other. That is, no positional deviation occurs between the first panel P ₁ (anode panel AP) and the second panel P ₂ (cathode panel CP). In addition, means for preventing displacement between the first panel P ₁ (anode panel AP) and the second panel P ₂ (cathode panel CP) are extremely strong, such as the biasing means 50 and the positioning members 41 and 42. It is a simple configuration.

The second embodiment is a modification of the first embodiment. In Example 1, the positioning of the second panel P _{2 with} respect to the first panel P ₁ was performed using the positioning members 41 and 42. On the other hand, in Example 2, after completion of the alignment between the first panel P ₁ and the second panel P ₂ , in the same process as [Process-110] of Example 1, it was along the second direction. As shown in FIG. 4A, which is a schematic partial cross-sectional view, the first positioning device 43 is brought into contact with the edge of the first side of the second panel P ₂ , and is along the first direction. As shown in FIG. 4B which is a schematic partial sectional view, the first panel P is brought into contact with the edge of the second side of the second panel P ₂ by bringing the second positioning device 46 into contact therewith. Position the second panel P _{2 with} respect to ₁ . Here, the first positioning device 43 and the second positioning device 46 have contact portions 44 and 47 at their tip portions, and the shapes of these contact portions 44 and 47 are curved. In addition, screw portions 45 and 48 are provided at the central portions of the first positioning device 43 and the second positioning device 46, and are screwed into the biasing means housing 54A.

In the second embodiment, the second panel P ₂ is positioned with respect to the first panel P ₁ in the same process as [Process-110] of the first embodiment. the rotate, the edge of the first side of the second panel P _2, is brought into contact with the contact portion 44 of the first positioning device 43. Furthermore, the second positioning device 46 is rotated, the edge of the second side of the second panel P _2, is brought into contact with the contact portion 47 of the second positioning device 46. The number of combinations of (first positioning device, second positioning device) was (2, 1). Further, in order to improve positioning accuracy, at least the edge portion of the first side of the second panel P _{2 that} contacts the first positioning device 43 and at least the second panel P _{2 that} contacts the second positioning device 46. The edge of the second side is chamfered in the same manner as described in the first embodiment.

  Except for the above points, the method for assembling the flat display device according to the second embodiment can be the same as the method for assembling the flat display device described in the first embodiment, and a detailed description thereof will be omitted.

The third embodiment is also a modification of the first embodiment. In Example 1, the urging means is composed of the pin 51 and the like. On the other hand, in the third embodiment, the urging means includes a clip (clamp) 60. Specifically, as shown schematically in FIG. 5, the clip 60 includes a holding member 61 having a holding portion 62 that holds the first panel P ₁ , and a contact member 63 that comes into contact with the second panel P _{2 through the} contact portion 64. The holding member 61 and the contact member 63 are rotatably fixed to each other, and the holding member 61 is in a direction in which the holding portion 62 of the holding member 61 and the contact portion 64 of the contact member 63 are close to each other. And an urging member 66 (specifically, a pressing spring) for applying a force to the contact member 63. Then, a force toward the first side (first horizontal component force) and a force toward the second side (second horizontal component force) are applied to the contact portion 64 of the contact member 63 by the pressing spring that is the urging member 66. ) And a force obtained by synthesizing a force (vertical component force) toward the first panel P ₁ is applied. In Example 3, a clip having a pressure of 1 kg · f so that a pressure of 200 g / cm ² is applied between the first panel P ₁ and the second panel P ₂ by one clip 60. Fourteen 60 were used with a nominal 20 inch panel.

  Hereinafter, a method of assembling the flat display device of Example 3 will be described with reference to FIGS. 1A and 1B, FIGS. 2A and 2B, and FIG.

[Step-300]
First, as in Example 1, the first panel P ₁ (anode panel AP) provided with the anode electrode 24 and the phosphor layer 22 and the second panel P ₂ (cathode) provided with field emission elements. Prepare panel CP). Then, as shown in FIGS. 1A and 1B, the first panel P ₁ (anode panel AP) and the second panel P ₂ (cathode panel CP) are joined to each other with a joining member 30 at the periphery. Align it in the arranged state. Specifically, the first panel P ₁ (anode panel AP) in which the joining member 30 is arranged at the peripheral portion and the spacer is attached at a predetermined position is placed on a mounting table (panel stage) (not shown). An alignment mark (not shown) provided on the first panel P ₁ and the second panel P ₂ is optically read, and the position of the second panel P _{2 with} respect to the first panel P ₁ is adjusted, and then on the joining member 30. placing the second panel P _2. The joining member 30 has the same configuration and structure as the joining member 30 described in the first embodiment.

[Step-310]
Next, as shown in FIGS. 2A and 2B, the second panel P ₂ is positioned with respect to the first panel P ₁ . Specifically, the first positioning member 41 in contact with the edge of the first side of the second panel P _2, and a second positioning member 42 in contact with the edge of the second side of the second panel P _2, Each is fixed to the first panel P ₁ . The first positioning member 41 and the second positioning member 42 have the same configuration and structure as the first positioning member 41 and the second positioning member 42 described in the first embodiment. Further, the positioning members 41 and 42 can be fixed to the first panel P ₁ in the same manner as in the first embodiment. Since the improvement of positioning accuracy, at least a first portion of the edge of the sides of the second panel P ₂ in contact with the first positioning member 41, and, the second panel P ₂ in contact with at least a second positioning member 42 first The edge of the side of 2 is chamfered as described in the first embodiment.

[Step-320]
Thereafter, as shown in the left hand of FIG. 5, the peripheral portions of the first panel P ₂ and the second panel P ₂ are sandwiched between clips 60. The right hand in FIG. 5 shows a state in which the peripheral portions of the first panel P ₂ and the second panel P ₂ are sandwiched by clips in a state where the clip 60 shown in the left hand in FIG. 5 is turned upside down. The clip 60 is arranged so that the axis of the clip 60 is parallel to the direction indicated by the white arrow in FIG. Accordingly, the contact portion 64 of the contact member 63 has a force toward the first side (first horizontal component force), a force toward the second side (second horizontal component force), and the first panel P _1. A force that is a composite of the force toward the (vertical component force) is applied. That is, the component of force applied to the contact portion 64 of the contact member 63, the first positioning member 41, the component toward the second positioning member 42, and includes a component directed to the first panel P _1. As a result, the second panel P ₂ has a force toward the first side (first horizontal component force), a force toward the second side (second horizontal component force), and toward the first panel P ₁ . The combined force of force (vertical component force) is applied. However, since the first positioning member 41 and the second positioning member 42 exist, the second panel P ₂ is not displaced (moved) in the first direction and the second direction.

[Step-330]
Next, a display device can be obtained by executing [Step-140] and [Step-150] of Example 1.

In the third embodiment or the fourth embodiment described later, the second panel P ₂ is positioned with respect to the first panel P ₁ using the first positioning device 43 and the second positioning device 46 described in the second embodiment. May be.

The fourth embodiment is a modification of the third embodiment. In the fourth embodiment, the clip (clamp) 70 includes a holding member 71 having a holding portion 72 that holds the first panel P ₁ , a contact member 73 that contacts the second panel P ₂ at the contact portion 74, and a holding member 71. The holding member 71 and the contact member 73 in the direction in which the holding portion 72 of the holding member 71 and the contact portion 74 of the contact member 73 are close to each other. It comprises an urging member 76 (specifically, a push spring) that applies a force to the. The coefficient of thermal expansion of the material constituting the contact part 74 of the contact member 73 is smaller than the coefficient of thermal expansion of the material constituting the holding part 72 of the holding member 71. Specifically, the material constituting the holding portion 72 of the holding member 71 (in Example 4, since the holding portion 72 is manufactured integrally with the holding member 71, the material constituting the holding member 71) Is stainless steel (SUS-304) and has a coefficient of thermal expansion of 1.7 × 10 ⁻⁶ / ° C. On the other hand, the material constituting the contact portion 74 of the contact member 73 (in the fourth embodiment, since the contact portion 74 is integrally formed with the contact member 73, the material constituting the contact member 73) is Kovar or It is an Fe—Ni—Co alloy also called Fernico, and its coefficient of thermal expansion is 0.5 × 10 ⁻⁶ / ° C. In Example 4, a clip having a pressure of 1 kg · f so that a pressure of 200 g / cm ² is applied between the first panel P ₁ and the second panel P ₂ by one clip 70. 14 were used with a nominal 20 inch panel.

In Example 4, after positioning the second panel P _{2 with} respect to the first panel P ₁ , in the same step as [Step-320] of Example 3, as shown in the left hand of FIG. The peripheral portions of the first panel P ₂ and the second panel P ₂ are sandwiched between clips 70. The right hand in FIG. 6 shows a state in which the peripheral portions of the first panel P ₂ and the second panel P ₂ are sandwiched between the clips 70 in the state in which the clip 70 shown in the left hand in FIG. 6 is turned upside down. The clip 70 is arranged so that the axis of the clip 70 is parallel to the direction indicated by the white arrow in FIG.

Then, in a step similar to [Step-130] of Example 1, the joining member 30 the first panel P ₁ and the second panel P ₂ contact member 73 and by heat treatment in bonding at their periphery Due to the thermal expansion of the holding member 71, the contact portion 74 of the contact member 73 has a force toward the first side (first horizontal component force), a force toward the second side (second horizontal component force), and A force obtained by synthesizing a force (vertical component force) toward the first panel P ₁ is applied. As a result, the second panel P ₂ has a force toward the first side (first horizontal component force), a force toward the second side (second horizontal component force), and toward the first panel P ₁ . The combined force of force (vertical component force) is applied. That is, the component of force applied to the contact portion 74 of the contact member 73, the first positioning member 41, the component toward the second positioning member 42, and includes a component directed to the first panel P _1. However, since the first positioning member 41 and the second positioning member 42 exist, the second panel P ₂ is not displaced (moved) in the first direction and the second direction.

  Except for the above points, the assembling method of the flat display device of the fourth embodiment can be the same as the assembling method of the flat display device described in the third embodiment, and thus detailed description thereof is omitted.

  As mentioned above, although this invention was demonstrated based on the preferable Example, this invention is not limited to these Examples. The configurations and structures of the flat panel display device, the first panel, the second panel, the cathode panel and the anode panel, the cold cathode field emission display device and the cold cathode field emission device described in the embodiments are examples and are appropriately changed. can do. Furthermore, the display device has been described by taking color display exclusively as an example, but it may also be a single color display. In some cases, the formation of the focusing electrode can be omitted.

  In the embodiment, the first panel is composed of an anode panel AP on which an anode electrode and a phosphor layer are formed, and the second panel is composed of a cathode panel CP on which a plurality of cold cathode field emission devices are formed. Instead, the first panel may be constituted by a cathode panel CP in which a plurality of cold cathode field emission devices are formed, and the second panel may be constituted by an anode panel AP in which an anode electrode and a phosphor layer are formed. .

  In addition, in the field emission device, the mode in which one electron emission portion corresponds to one opening has been described. However, depending on the structure of the field emission device, a plurality of electron emission portions correspond to one opening. Alternatively, one electron emission portion may correspond to a plurality of openings. Alternatively, a plurality of first openings may be provided in the gate electrode, a second opening connected to the plurality of first openings in the insulating layer may be provided, and one or a plurality of electron emission portions may be provided. .

The flat display device may be a flat display device including an electron-emitting device commonly referred to as a surface conduction electron-emitting device. This surface conduction electron-emitting device is formed on a support made of glass, for example, tin oxide (SnO ₂ ), gold (Au), indium oxide (In ₂ O ₃ ) / tin oxide (SnO ₂ ), carbon, palladium oxide ( A pair of electrodes made of a conductive material such as (PdO), having a very small area and arranged with a predetermined gap (gap) are formed in a matrix. A carbon thin film is formed on each electrode. The row direction wiring is connected to one electrode of the pair of electrodes, and the column direction wiring is connected to the other electrode of the pair of electrodes. By applying a voltage to the pair of electrodes, an electric field is applied to the carbon thin films facing each other across the gap, and electrons are emitted from the carbon thin film. By causing the electrons to collide with the phosphor layer on the anode panel, the phosphor layer is excited to emit light, and a desired image can be obtained. Alternatively, the flat display device can be a flat display device including a metal / insulating film / metal element, or a plasma display device.

FIG. 1A is a schematic plan view of a first panel and the like for explaining a method of assembling the flat display device according to the first embodiment, and FIG. FIG. 1C is a schematic partial cross-sectional view taken along the line. FIG. 2A is a schematic plan view of a first panel and the like for explaining the assembly method of the flat display device of Example 1, and FIG. 2B is an arrow AA. FIG. 2C is a schematic partial cross-sectional view taken along the line. FIGS. 3A and 3B are a schematic plan view and a schematic partial cross-sectional view of a first panel and the like for explaining an assembly method of the flat display device of the first embodiment. . 4A and 4B are schematic partial cross-sectional views of a first panel and the like for explaining a method of assembling the flat display device according to the second embodiment. FIG. 5 is a schematic partial cross-sectional view of a first panel and the like for explaining an assembling method of the flat display device according to the third embodiment. FIG. 6 is a schematic partial cross-sectional view of the first panel and the like for explaining the assembly method of the flat display device according to the fourth embodiment. FIG. 7 is a conceptual partial end view of a flat display device including a cold cathode field emission display device having a Spindt-type cold cathode field emission device. FIG. 8 is a conceptual partial end view of a flat display device including a cold cathode field emission display device having a flat type cold cathode field emission device. FIG. 9 is a schematic exploded perspective view of a part of a cathode panel and an anode panel in a cold cathode field emission display.

Explanation of symbols

P _1, first panel, P _2, second panel, CP, cathode panel (second panel), AP, anode panel (first panel), EA, electron emission region, DESCRIPTION OF SYMBOLS 10 ... Support body, 11 ... Cathode electrode, 12 ... Insulating layer, 13 ... Gate electrode, 14 ... Opening part, 14A ... 1st opening part, 14B ... 2nd Opening part, 15, 15A ... electron emission part, 20 ... substrate, 21 ... partition wall, 22, 22R, 22G, 22B ... phosphor layer, 23 ... light absorption layer (black matrix) 24 ... anode electrode, 30 ... bonding member, 31 ... frame, 32 ... adhesive layer, 41 ... first positioning member, 42 ... second positioning member, 43, 46 ... Positioning device, 44,47 ... Contact portion of positioning device, 45,48 ... , 50 ... biasing means, 51 ... pin, 52 ... spring, 53 ... pin mounting part, 54, 54A ... biasing means housing, 60, 70 ... clip, 61, 71 ... holding member, 62, 72 ... holding portion, 63, 73 ... contact member, 64, 74 ... contact portion, 65, 75 ... fixing portion, 66, 76 ... .Biasing member, 81... Cathode electrode control circuit, 82... Gate electrode control circuit, 83.

Claims (12)

A planar display device assembly method in which a first panel and a second panel having a rectangular planar shape are joined to each other at a peripheral edge portion thereof via a joining member,
(A) The first panel and the second panel are aligned in a state where the joining members are arranged on the peripheral portions thereof, and then,
(B) After positioning the second panel relative to the first panel,
(C) For the second panel, the force toward the first side extending in the first direction of the second panel, the second side adjacent to the first side and extending in a second direction different from the first direction The first panel and the second panel are joined at their peripheral portions by heating the joining member while applying a force toward the two sides and a force toward the first panel by the biasing means.
A method for assembling a flat panel display device comprising the steps.   2. The flat panel display assembly method according to claim 1, wherein the urging means includes a pin, a spring for applying a force to the pin, and a pin mounting portion.   A force that is applied to the pin mounting portion by a spring for applying a force to the pin is a combined force of the force toward the first side, the force toward the second side, and the force toward the first panel. The method for assembling a flat display device according to claim 2, wherein:   2. The method of assembling a flat display device according to claim 1, wherein the urging means comprises a clip. The clip includes a holding member having a holding portion that holds the first panel, a contact member that contacts the second panel at the contact portion, a fixing portion that rotatably fixes the holding member and the contact member to each other, and a holding member The holding portion and the contact portion of the contact member are composed of a biasing member that applies a force to the holding member and the contact member in a direction in which they are close to each other,
The urging member applies a force that is a combination of a force toward the first side, a force toward the second side, and a force toward the first panel, to the contact portion of the contact member. The method for assembling the flat display device according to claim 4. The clip includes a holding member having a holding portion that holds the first panel, a contact member that contacts the second panel at the contact portion, a fixing portion that rotatably fixes the holding member and the contact member to each other, and a holding member The holding portion and the contact portion of the contact member are composed of a biasing member that applies a force to the holding member and the contact member in a direction in which they are close to each other,
The thermal expansion coefficient of the material constituting the contact part of the contact member is smaller than the thermal expansion coefficient of the material constituting the holding part of the holding member,
Due to the thermal expansion of the contact member and the holding member by the heat treatment when joining the first panel and the second panel at their peripheral portions by the joining member, the contact portion of the contact member has a force toward the first side, The flat panel display assembling method according to claim 4, wherein a force obtained by combining a force toward the second side and a force toward the first panel is applied.   After the alignment between the first panel and the second panel is completed, the first positioning member in contact with the edge of the first side of the second panel and the second in contact with the edge of the second side of the second panel The flat panel display assembly method according to claim 1, wherein the second panel is positioned with respect to the first panel by fixing the positioning members to the first panel.   The edge portion of the first side of the second panel in contact with at least the first positioning member and the edge portion of the second side of the second panel in contact with at least the second positioning member are chamfered, and the chamfered portion 8. The method of assembling a flat display device according to claim 7, wherein the position of the top of the flat panel display device is located on the lower surface side of the second panel with respect to 1/2 of the thickness of the second panel.   After the alignment between the first panel and the second panel is completed, the first positioning device is brought into contact with the edge of the first side of the second panel, and the second edge of the second panel is brought into contact with the edge of the second side. The flat panel display assembly method according to claim 1, wherein the second panel is positioned with respect to the first panel by bringing the positioning device into contact therewith.   9. The method of assembling a flat display device according to claim 8, wherein the first positioning device and the second positioning device are screwed into the urging means housing.   The edge portion of the first side of the second panel that contacts at least the first positioning device, and the edge portion of the second side of the second panel that contacts at least the second positioning device are chamfered, 10. The method of assembling a flat display device according to claim 9, wherein the position of the apex of the chamfered portion is located on the lower surface side of the second panel with respect to 1/2 of the thickness of the second panel. 12. The method for assembling a flat display device according to claim 1, wherein the flat display device is a cold cathode field emission display device.

Images