JP2007051308A5 - - Google Patents

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Publication number
JP2007051308A5
JP2007051308A5 JP2005235130A JP2005235130A JP2007051308A5 JP 2007051308 A5 JP2007051308 A5 JP 2007051308A5 JP 2005235130 A JP2005235130 A JP 2005235130A JP 2005235130 A JP2005235130 A JP 2005235130A JP 2007051308 A5 JP2007051308 A5 JP 2007051308A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2005235130A
Other languages
Japanese (ja)
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JP2007051308A (ja
JP4939009B2 (ja
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Publication date
Application filed filed Critical
Priority to JP2005235130A priority Critical patent/JP4939009B2/ja
Priority claimed from JP2005235130A external-priority patent/JP4939009B2/ja
Priority to TW095125489A priority patent/TWI381062B/zh
Priority to KR1020060076093A priority patent/KR101330651B1/ko
Priority to CN2006101155202A priority patent/CN1916232B/zh
Publication of JP2007051308A publication Critical patent/JP2007051308A/ja
Publication of JP2007051308A5 publication Critical patent/JP2007051308A5/ja
Application granted granted Critical
Publication of JP4939009B2 publication Critical patent/JP4939009B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2005235130A 2005-08-15 2005-08-15 ターゲット組立体及びこのターゲット組立体を備えたスパッタリング装置 Active JP4939009B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2005235130A JP4939009B2 (ja) 2005-08-15 2005-08-15 ターゲット組立体及びこのターゲット組立体を備えたスパッタリング装置
TW095125489A TWI381062B (zh) 2005-08-15 2006-07-12 A target assembly, and a sputtering apparatus provided with the target assembly
KR1020060076093A KR101330651B1 (ko) 2005-08-15 2006-08-11 타깃 조립체 및 이 타깃 조립체를 구비한 스퍼터링 장치
CN2006101155202A CN1916232B (zh) 2005-08-15 2006-08-15 靶组合体以及具有该靶组合体的溅射装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005235130A JP4939009B2 (ja) 2005-08-15 2005-08-15 ターゲット組立体及びこのターゲット組立体を備えたスパッタリング装置

Publications (3)

Publication Number Publication Date
JP2007051308A JP2007051308A (ja) 2007-03-01
JP2007051308A5 true JP2007051308A5 (es) 2008-08-14
JP4939009B2 JP4939009B2 (ja) 2012-05-23

Family

ID=37737295

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005235130A Active JP4939009B2 (ja) 2005-08-15 2005-08-15 ターゲット組立体及びこのターゲット組立体を備えたスパッタリング装置

Country Status (4)

Country Link
JP (1) JP4939009B2 (es)
KR (1) KR101330651B1 (es)
CN (1) CN1916232B (es)
TW (1) TWI381062B (es)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4599473B2 (ja) * 2008-09-30 2010-12-15 キヤノンアネルバ株式会社 スパッタリング装置および薄膜形成方法
WO2012036079A1 (ja) * 2010-09-15 2012-03-22 シャープ株式会社 半導体装置の製造方法
JP5653257B2 (ja) * 2011-03-07 2015-01-14 株式会社アルバック スパッタリング装置及びスパッタリング方法
EP2748351A1 (en) * 2011-08-25 2014-07-02 Applied Materials, Inc. Sputtering apparatus and method
CN111719123A (zh) * 2019-03-21 2020-09-29 广东太微加速器有限公司 组合式靶件
KR20210010741A (ko) * 2019-07-18 2021-01-28 삼성디스플레이 주식회사 증착 장치

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5952957B2 (ja) * 1980-06-16 1984-12-22 日電アネルバ株式会社 マグネトロン型スパッタ装置のカソ−ド部
DE4242079A1 (de) * 1992-12-14 1994-06-16 Leybold Ag Target für eine in einer evakuierbaren mit einem Prozeßgas flutbaren Prozeßkammer angeordneten Kathode
JP2000239841A (ja) * 1999-02-24 2000-09-05 Ulvac Japan Ltd スパッタリング方法と装置
JP3993721B2 (ja) * 1999-06-09 2007-10-17 東ソー株式会社 スパッタリングターゲット

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