JP2007049076A - Method for manufacturing hybrid multilayered circuit substrate - Google Patents

Method for manufacturing hybrid multilayered circuit substrate Download PDF

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Publication number
JP2007049076A
JP2007049076A JP2005234420A JP2005234420A JP2007049076A JP 2007049076 A JP2007049076 A JP 2007049076A JP 2005234420 A JP2005234420 A JP 2005234420A JP 2005234420 A JP2005234420 A JP 2005234420A JP 2007049076 A JP2007049076 A JP 2007049076A
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circuit board
flexible circuit
component mounting
stepped
multilayer circuit
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Hiroaki Inose
瀬 裕 昭 猪
Katsunori Kokubu
分 克 則 国
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Nippon Mektron KK
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Nippon Mektron KK
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Priority to JP2005234420A priority Critical patent/JP2007049076A/en
Priority to TW095116414A priority patent/TW200718322A/en
Priority to CN2006101149521A priority patent/CN1913752B/en
Publication of JP2007049076A publication Critical patent/JP2007049076A/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09154—Bevelled, chamferred or tapered edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a hybrid multilayered circuit substrate that forms a shield layer resistant to EMI without scrape, by printing a conductive paint on a region spreading over a stepped portion between a part mounted section and a flexible circuit board in a screen-printing method. <P>SOLUTION: The method for manufacturing the hybrid multilayered circuit board forms the shield layer resistant to electromagnetic interference (EMI), by printing the conductive paint on the region spreading over the stepped portion between the part mounted section and the flexible circuit board. The cross-section shape of the stepped portion is like stairs of 2 steps or more, the height of a step of each stair step is within 100 μm, each length of the stair steps is the same as in the step or more in dimensions, a step is formed having a shape of a crossing angle of the line connecting the farthermost end of the part mounted section to the peak of the mostly protruded stair step and the flexible circuit substrate of less than 50°. The conductive paint is continuously printed on the stepped portion in the screen-printing method. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、多層の部品実装部相互間を可撓性回路基板で接続する構造を有する混成多層回路基板の製造方法に係わり、とくに部品実装部と可撓性回路基板との段差部分に跨る部位に、導電性塗料をスクリーン印刷手法で印刷し、電磁波妨害（Electro -Magnetic Interference；以下、ＥＭＩという）に対するシールド層を形成させる混成多層回路基板の製造方法に関する。   The present invention relates to a method for manufacturing a hybrid multilayer circuit board having a structure in which multilayer component mounting parts are connected to each other by a flexible circuit board, and in particular, a portion straddling a step portion between the component mounting part and the flexible circuit board. In particular, the present invention relates to a method for manufacturing a hybrid multilayer circuit board in which a conductive coating is printed by a screen printing method to form a shield layer against electromagnetic interference (hereinafter referred to as EMI).

ＥＭＩに対し、導電性塗料を用いて回路基板にシールド層を形成することは、特許文献１などによって知られている。図８は、このような回路基板の一般的な構成を示したもので、特許文献１の第２図に相当する。図８において、絶縁基板５１上に回路パターン５２が形成され、絶縁被覆が必要な箇所をソルダーレジスト５３が覆っている。さらにその上に、導電性塗料によるシールド層５４があり、オーバーコート層５５によって被覆されている。シールド層５４は、例えばスルーホール５２１を介してグラウンドパターン５２２に接続し、アースされる。   For EMI, forming a shield layer on a circuit board using a conductive paint is known from Patent Document 1 and the like. FIG. 8 shows a general configuration of such a circuit board, and corresponds to FIG. In FIG. 8, a circuit pattern 52 is formed on an insulating substrate 51, and a solder resist 53 covers a portion where an insulating coating is required. Further thereon, there is a shield layer 54 made of a conductive paint, which is covered with an overcoat layer 55. The shield layer 54 is connected to the ground pattern 522 through, for example, a through hole 521 and grounded.

シールド層５４を形成する導電性塗料としては、例えば特許文献２に記載されるような銅性インクや、銀、カーボン、フェライトなどの導電性材料とエポキシ樹脂等のバインダとを混合したものが用いられている。オーバーコート層５５には絶縁性樹脂組成物が用いられるが、フレキシブル基板などの屈曲性を要する部位にも使用できる樹脂組成物が特許文献３、特許文献４に示されている。   As the conductive paint for forming the shield layer 54, for example, a copper ink as described in Patent Document 2, or a mixture of a conductive material such as silver, carbon, and ferrite and a binder such as an epoxy resin is used. It has been. Although an insulating resin composition is used for the overcoat layer 55, Patent Documents 3 and 4 disclose resin compositions that can also be used for a portion requiring flexibility such as a flexible substrate.

ところで、シールド層４の形成には、一般的にスクリーン印刷が用いられる。この印刷方法は、煩雑な工程がなく汎用性があるため有用である。しかし、例えば特許文献５に示されるような部品実装部相互間を可撓性回路基板で接続する構造を有する混成多層回路基板における、部品実装部と可撓性回路基板との段差部分に跨る部位に導電性塗料をスクリーン印刷で印刷すると、段差部分で導電性塗料の印刷がかすれてしまうという問題がある。これは、スクリーン印刷版が段差に追随できなくなるためで、段差が概ね１００μｍ以上あるときに発生する。   Incidentally, screen printing is generally used to form the shield layer 4. This printing method is useful because it has no complicated steps and is versatile. However, for example, in a hybrid multilayer circuit board having a structure in which component mounting parts are connected to each other by a flexible circuit board as disclosed in Patent Document 5, a portion straddling a step portion between the component mounting part and the flexible circuit board In addition, when the conductive paint is printed by screen printing, there is a problem that the conductive paint is faintly printed at the stepped portion. This is because the screen printing plate cannot follow the step, and occurs when the step is approximately 100 μm or more.

シールド層を形成する導電性塗料の印刷が途中でかすれてしまうと、グラウンドパターンとの導通不良が生じ、電磁波シールドが機能しなくなる。従来、このような混成多層回路基板では、部品実装部の外層にグラウンドパターンを兼ねるシールド層を形成しておき、部品実装部相互間を接続する可撓性回路基板には両面に回路銅箔を有する可撓性回路基板を使用して、その片面にシールドパターンを形成しておき、導電性塗料印刷をしなくてもシールドするようにしている。   If printing of the conductive paint forming the shield layer is faded in the middle, poor conduction with the ground pattern occurs, and the electromagnetic wave shield does not function. Conventionally, in such a hybrid multilayer circuit board, a shield layer that also serves as a ground pattern is formed on the outer layer of the component mounting part, and circuit copper foil is provided on both sides of the flexible circuit board that connects the component mounting parts to each other. Using a flexible circuit board, a shield pattern is formed on one side of the flexible circuit board so as to shield it without conducting conductive paint printing.

一方、近年、ノートパソコン、折畳式携帯電話等の、ヒンジ構造を有し頻繁に開閉を繰り返す部位に混成多層回路基板が使用されることが多くなっている。この場合、例えば特許文献６のように、ヒンジ部内に部品実装部相互間を接続する可撓性回路基板をらせん状に巻いて収納することが行われている。さらに、特許文献７のように、複雑な動きに対応する２軸式のヒンジ部構造も示されている。このため、部品実装部相互間を接続する可撓性回路基板はより屈曲性に富んだものが求められる。   On the other hand, in recent years, hybrid multilayer circuit boards are often used in portions such as notebook personal computers and foldable mobile phones that have a hinge structure and frequently open and close. In this case, for example, as disclosed in Patent Document 6, a flexible circuit board that connects the component mounting portions to each other in a hinge portion is spirally wound and stored. Further, as shown in Patent Document 7, a biaxial hinge structure corresponding to complicated movement is also shown. For this reason, the flexible circuit board which connects between component mounting parts is required to be more flexible.

通常、可撓性回路基板の屈曲性は、両面に回路銅箔を有するものよりも片面のみに回路銅箔があるものの方が良好である。このため、片面のみ回路銅箔がある可撓性回路基板を２枚使用した接続構造が提供されている（特許文献８）。この方法は、屈曲性改善の面では有効であるが、片面にしか回路銅箔がないため、可撓性回路基板にシールドパターンを形成することができない。   Usually, the flexibility of a flexible circuit board is better when the circuit copper foil is on only one side than when the circuit copper foil is on both sides. For this reason, a connection structure using two flexible circuit boards having a circuit copper foil on one side is provided (Patent Document 8). Although this method is effective in terms of improving flexibility, since there is a circuit copper foil on only one side, a shield pattern cannot be formed on the flexible circuit board.

そして、この場合のシールド層形成のために、例えば特許文献９、特許文献１０に示すように、導電性シールドフィルムを可撓性回路基板と部品実装部とに跨るように接着している。
実公昭55-29276号公報 特公平6-82890号公報 特開2000-186248号公報 特開2002-241694号公報 特開昭64-7697号公報 特開平6-311216号公報 特開2003-133764号公報 特開平7-312469号公報 特開2000-269632号公報 特開2003-298285号公報 In order to form the shield layer in this case, for example, as shown in Patent Document 9 and Patent Document 10, a conductive shield film is bonded so as to straddle the flexible circuit board and the component mounting portion.
Japanese Utility Model Publication No.55-29276 Japanese Patent Publication No. 6-82890 JP 2000-186248 A JP 2002-241694 A JP-A-64-7697 JP-A-6-311216 Japanese Patent Laid-Open No. 2003-133764 Japanese Unexamined Patent Publication No. 7-312469 JP 2000-269632 A JP 2003-298285 A

混成多層回路基板を構成するには、適用機器の側からは２軸式ヒンジ構造のような、複雑な動きに対応する屈曲性を求める点からより柔らかい導電材質が必要であり、このためには導電性塗料印刷が望ましい。   In order to construct a hybrid multilayer circuit board, a softer conductive material is required from the point of application equipment, such as a biaxial hinge structure, in order to obtain flexibility corresponding to complicated movements. Conductive paint printing is desirable.

しかし、上述した部品実装部と可撓性回路基板との段差部分での印刷不連続発生という問題点があるため、採用できない状況にある。   However, since there is a problem that printing discontinuity occurs at the step portion between the component mounting portion and the flexible circuit board described above, it cannot be adopted.

本発明は、上述の点を考慮してなされたもので、多層の部品実装部相互間を可撓性回路基板で接続する構造を有する混成多層回路基板において、部品実装部と可撓性回路基板との段差部分に跨る部位に導電性塗料をスクリーン印刷手法で印刷してＥＭＩに対するシールド層をかすれがなく形成させる混成多層回路基板の製造方法を提供することを目的とする。   The present invention has been made in consideration of the above-described points. In a hybrid multilayer circuit board having a structure in which multilayer component mounting parts are connected to each other by a flexible circuit board, the component mounting part and the flexible circuit board are provided. An object of the present invention is to provide a method for manufacturing a hybrid multilayer circuit board in which a conductive paint is printed on a portion straddling the step portion by a screen printing method to form a shield layer against EMI without fading.

上記目的達成のため、本発明では、
多層の部品実装部相互間を可撓性回路基板で接続する構造を有する混成多層回路基板であって、前記部品実装部と前記可撓性回路基板との段差部分に跨る部位に導電性塗料を印刷し、電磁波妨害（ＥＭＩ）に対するシールド層を形成する混成多層回基板の製造方法において、
前記段差部分の断面形状が２以上の階段状であって、各階段状段差の段差高が１００μｍ以内であって、かつ前記階段状段差それぞれの長さが段差と同じかそれ以上の寸法であり、前記部品実装部の最終端と最も突出している階段状段差の頂点を結ぶ線と前記可撓性回路基板との交差角度が５０°以内の形状を有する段差部分を形成し、
次いで前記段差部分にスクリーン印刷手法で導電性塗料を連続的に印刷する
ことを特徴とする混成多層回路基板の製造方法、
を提供するものである。 In order to achieve the above object, in the present invention,
A hybrid multilayer circuit board having a structure in which multilayer component mounting parts are connected to each other by a flexible circuit board, and a conductive paint is applied to a portion straddling a step portion between the component mounting part and the flexible circuit board. In a method for manufacturing a hybrid multilayer circuit board that prints and forms a shield layer against electromagnetic interference (EMI),
The cross-sectional shape of the stepped portion is a step shape of 2 or more, the step height of each stepped step is within 100 μm, and the length of each stepped step is the same as or larger than the step. Forming a step portion having a shape in which an angle of intersection between the line connecting the final end of the component mounting portion and the most protruding stepped step and the flexible circuit board is within 50 °,
Next, a conductive multi-layer circuit board manufacturing method, wherein a conductive paint is continuously printed on the stepped portion by a screen printing method,
Is to provide.

本発明は上述のように、多層部品実装部相互間を可撓性回路基板で結ぶ混成多層回路基板における部品実装部と可撓性回路基板との段差部分を所定の階段状に形成した上でスクリーン印刷により導電性塗料を印刷してシールド層を形成するようにしたため、部品実装部と可撓性回路基板とを連続的に接続したシールド層を形成することができる。   In the present invention, as described above, the step portion between the component mounting portion and the flexible circuit board in the hybrid multilayer circuit board connecting the multilayer component mounting parts with the flexible circuit board is formed in a predetermined step shape. Since the shield layer is formed by printing the conductive paint by screen printing, the shield layer in which the component mounting portion and the flexible circuit board are continuously connected can be formed.

以下、図１ないし図７を参照して本発明の実施の形態を説明する。なお、各実施形態を示す図はすべて、導電性塗料をスクリーン印刷手法で印刷する前の段階における混成多層回路基板の部品実装部と可撓性回路基板部との境界部分の断面を示したものである。   Hereinafter, embodiments of the present invention will be described with reference to FIGS. In addition, all the drawings showing the respective embodiments show a cross section of the boundary portion between the component mounting portion and the flexible circuit board portion of the hybrid multilayer circuit board before the conductive paint is printed by the screen printing method. It is.

実施形態１Embodiment 1

図１は、本発明の第１の実施形態を断面として示している。この第１の実施形態につき、図２および図３ならびに表１および表２を用いて説明する。   FIG. 1 shows a first embodiment of the invention in cross section. The first embodiment will be described with reference to FIGS. 2 and 3 and Tables 1 and 2.

上記課題を解決するため、本発明では、図１に示すように、部品実装部ｃと可撓性回路基板部ｄとの段差部分の断面形状を階段状とする。このような階段状の断面形成は、部品実装部と可撓性回路基板との境界部に、多層基板形成時に各積層材料２を内側になるに連れて長くなるように食み出させておく。ここで各積層材料２とは、積層接着剤、プリプレグ、内層コア基板などをいう。   In order to solve the above problems, in the present invention, as shown in FIG. 1, the cross-sectional shape of the step portion between the component mounting portion c and the flexible circuit board portion d is stepped. Such a step-like cross-section is formed so that each laminated material 2 protrudes at the boundary between the component mounting portion and the flexible circuit board so as to become longer as the multilayer substrate is formed. . Here, each laminate material 2 refers to a laminate adhesive, a prepreg, an inner layer core substrate, and the like.

次に、導電性塗料を印刷した場合のかすれの発生状況につき、下記の表１および表２、ならびに図２および図３を用いて説明する。

Figure 2007049076
Figure 2007049076
 Next, the state of occurrence of blurring when a conductive paint is printed will be described with reference to Tables 1 and 2 below, and FIGS. 2 and 3.
Figure 2007049076
Figure 2007049076

表１は、図２に示すように段差を１段の階段状にし、階段状段差の段差高Ｔを種々変えて導電性塗料をスクリーン印刷したときのデータを示す。段差厚みTが１０５μｍまではかすれずに印刷できたが、１１０μｍでは印刷圧力およびスキージ搬送速度などの印刷条件次第でかすれが生じてしまい、条件管理範囲が狭いので実用上好ましくなかった。   Table 1 shows data when the step is formed in one step as shown in FIG. 2 and the conductive paint is screen-printed by changing the step height T of the step. Printing was possible without fading up to a step thickness T of 105 μm. However, when the thickness was 110 μm, blurring occurred depending on printing conditions such as printing pressure and squeegee transport speed, and the condition management range was narrow, which was not preferable in practice.

また、段差厚みTが１０５μｍの試料の、段差頂点部の導電性塗料厚みを断面観察した結果、導通信頼性を確保するための塗料厚みである５μｍを下回るものが、２０サンプル中で３サンプルあった。   In addition, as a result of cross-sectional observation of the conductive paint thickness at the top of the step of a sample having a step thickness T of 105 μm, 3 samples out of 20 samples were less than 5 μm, which is a paint thickness for ensuring conduction reliability. It was.

従って、導電性塗料をスクリーン印刷で行った場合、導通信頼性を確保するための段差の上限は１００μｍ近辺にあることが判った。   Accordingly, it was found that when the conductive paint was performed by screen printing, the upper limit of the step for ensuring conduction reliability was in the vicinity of 100 μm.

表２は、図３に示すように、各積層材料２を内側になるに連れて長くなるように食み出させて３段の階段状段差を形成し、縦軸に階段状段差ａ、横軸に各層の食み出し量ｂを配して、それぞれ導電性塗料を印刷したときのかすれ状況を示したデータである。この図３は、図１の階段状部Ｄを拡大して示しており、階段状段差ａ、食み出し量ｂは、図示の通りである。ここで、３段の各積層材料２の厚みを足し合わせた厚みをＡで示している。   As shown in FIG. 3, Table 2 shows that each laminated material 2 is protruded so as to become longer as it goes inward to form three stepped steps. It is the data which showed the blurring condition when arranging the protrusion amount b of each layer on the axis | shaft and printing a conductive paint, respectively. FIG. 3 shows the stepped portion D of FIG. 1 in an enlarged manner, and the stepped step a and the protrusion amount b are as shown. Here, A represents the thickness obtained by adding the thicknesses of the three layers of the laminated materials 2 together.

各種サンプルにつき導電性塗料を印刷した結果、部品実装部の最終端と最も突出している階段状段差の頂点を結ぶ線と可撓性回路基板との交差角度θが５０°以内の形状を有するサンプルでは、何れもかすれが生じなかった。   As a result of printing conductive paint on various samples, the sample has a shape in which the intersection angle θ between the line connecting the final end of the component mounting portion and the top of the most protruding stepped step and the flexible circuit board is within 50 ° Then, no fading occurred.

従って、表１および表２のデータから、各階段状段差ａ１，ａ２，ａ３がそれぞれ１００μｍ以内であり、かつ各階段状段差の長さが段差と同じかそれ以上の寸法を有し、かつ部品実装部の最終端と最も突出している階段状段差の頂点を結ぶ線と可撓性回路基板との交差角度θが５０°以内の形状を有する形状を形成すればよいことが判った。この形状であれば、部品実装部ｃと可撓性回路基板ｄとの段差部分に跨る部位がスクリーン印刷版に対して平行方向でも鉛直方向でも追随でき、かすれを生じることなく導電性塗料を印刷することができる。   Therefore, from the data in Tables 1 and 2, each stepped step a1, a2, a3 is within 100 μm, and the length of each stepped step is equal to or greater than the step, and the part It has been found that it is sufficient to form a shape having a shape in which the intersection angle θ between the line connecting the final end of the mounting portion and the most protruding stepped step and the flexible circuit board is within 50 °. With this shape, the part straddling the step between the component mounting part c and the flexible circuit board d can follow the screen printing plate in either the parallel direction or the vertical direction, and the conductive paint can be printed without causing blurring. can do.

図１の場合、２段階に部品実装部ｃの板厚が薄くなっていく構造を示しているが、各階段状段差が１００μｍ以内で、かつ各階段状段差の長さが段差と同じかそれ以上の寸法を有し、かつ部品実装部の最終端と最も突出している階段状段差の頂点を結ぶ線と可撓性回路基板との交差角度θが５０°以内という条件を満たせば、板厚によって１〜４段階で板厚が薄くなっていく構造を採ってもよい。   In the case of FIG. 1, the structure in which the thickness of the component mounting portion c is reduced in two steps is shown, but each stepped step is within 100 μm and the length of each stepped step is the same as the step. If the above-mentioned dimensions are satisfied and the condition that the intersection angle θ between the line connecting the final edge of the component mounting part and the most protruding stepped step and the flexible circuit board is within 50 ° is satisfied, the plate thickness Depending on the case, a structure may be adopted in which the plate thickness decreases in 1 to 4 steps.

なお、部品実装部ｃと可撓性回路基板ｄとの段差が４５０μｍを越えると、ケーブル部へのスクリーン印刷のスキージの追随性が悪くなる場合がある。このことから、部品実装部ｃと可撓性回路基板ｄとの段差は、４５０μｍ以内であることが望ましい。 If the step between the component mounting part c and the flexible circuit board d exceeds 450 μm, the followability of the screen printing squeegee on the cable part may deteriorate. Therefore, it is desirable that the step between the component mounting part c and the flexible circuit board d is within 450 μm.

実施形態２Embodiment 2

図４は、本発明の第２の実施形態を示したもので、図１の段差に替えてスロープ形状としている。この場合も、部品実装部ｃの最終端と可撓性回路基板部ｄとの交差角度θ２が、５０°以内のスロープ形状であれば導電性塗料の印刷は可能となる。   FIG. 4 shows a second embodiment of the present invention, which has a slope shape instead of the step in FIG. Also in this case, if the intersection angle θ2 between the final end of the component mounting portion c and the flexible circuit board portion d is a slope shape within 50 °, the conductive paint can be printed.

鉛直方向の落差が１００μｍ以内の形状を形成するためには、部品実装部と可撓性回路基板との境界にある段差部の側面に、後述の手段によって樹脂組成物を充填すればよい。ここで、樹脂組成物は絶縁性を有し、可撓性回路基板の屈曲性を阻害しない程度の柔軟性があればよい。例として、特許文献３、特許文献４に示されているオーバーコート層用樹脂組成物や流れ出し量の比較的高い絶縁性接着剤などが挙げられる。充填方法は、スクリーン印刷塗布で行える。   In order to form a shape having a vertical drop of 100 μm or less, the side surface of the stepped portion at the boundary between the component mounting portion and the flexible circuit board may be filled with a resin composition by means described later. Here, the resin composition has an insulating property, and it is sufficient that the resin composition has a flexibility that does not hinder the flexibility of the flexible circuit board. Examples include resin compositions for overcoat layers shown in Patent Document 3 and Patent Document 4, insulating adhesives having a relatively high flow-out amount, and the like. The filling method can be performed by screen printing.

例えば、マスク開口位置を硬質部の最終端から可撓性回路基板へ０．２ｍｍとし、樹脂組成物粘度が３５００ｍＰａ・ｓのとき、印刷スキージ圧力を０．２ＭＰａとした場合、樹脂組成物の充填量ｂ２は大体０．３ｍｍとなる。部品実装部の上部へ塗布されてしまう場合でも、鉛直方向の落差が１００μｍ以内の形状であれば、導電性塗料の印刷は可能であり、この粘度でそのような形状を呈することはない。スクリーン印刷塗布の後、加熱キュアによって樹脂組成物を硬化させ、導電性塗料の印刷を行う。   For example, when the mask opening position is 0.2 mm from the end of the hard part to the flexible circuit board, the resin composition viscosity is 3500 mPa · s, and the printing squeegee pressure is 0.2 MPa, the resin composition is filled. The quantity b2 is approximately 0.3 mm. Even when it is applied to the upper part of the component mounting portion, if the vertical drop is within 100 μm, the conductive paint can be printed, and such a shape is not exhibited by this viscosity. After the screen printing application, the resin composition is cured by heat curing, and the conductive paint is printed.

実施形態３Embodiment 3

図５は、本発明の第３の実施形態を示したものである。これは、部品実装部と可撓性回路基板との境界にある段差部の側面に、樹脂組成物を充填または貼り付けするときに、樹脂組成物量が不足して、スロープ形状に段差形状がついた状態である。この場合も、階段状段差ａ４が１００μｍ以内で、部品実装部の最終端と各階段状段差の頂点を結ぶ線とを結ぶ線が可撓性回路基板と交差する角度θ３が５０°以内であれば、導電性塗料の印刷は可能である。   FIG. 5 shows a third embodiment of the present invention. This is because when the resin composition is filled or affixed to the side surface of the step portion at the boundary between the component mounting portion and the flexible circuit board, the amount of the resin composition is insufficient and the step shape is added to the slope shape. It is in the state. Also in this case, the stepped step a4 is within 100 μm, and the angle θ3 at which the line connecting the final end of the component mounting portion and the line connecting the vertices of each stepped step intersects the flexible circuit board is within 50 °. For example, the conductive paint can be printed.

実施形態４Embodiment 4

図６は、第１の実施形態と第２の実施形態とを組み合わせた第４の実施形態を示したものである。部品実装部ｃと可撓性回路基板部ｄとの段差部分の断面形状が階段状で、部品実装部と可撓性回路基板との境界にある段差部の側面に樹脂組成物を充填したものである。   FIG. 6 shows a fourth embodiment in which the first embodiment and the second embodiment are combined. The step shape of the step portion between the component mounting portion c and the flexible circuit board portion d is stepped, and the side surface of the step portion at the boundary between the component mounting portion and the flexible circuit board is filled with a resin composition It is.

実施形態５Embodiment 5

図７は、本発明の第５の実施形態を示したものである。部品実装部と可撓性回路基板との段差が０．１３ｍｍ以内である混成多層回路基板であれば、部品実装部を覆うカバーレイを可撓性回路基板まで食み出させることによって、境界の段差部の傾斜が緩和でき、印刷可能となる。   FIG. 7 shows a fifth embodiment of the present invention. In the case of a hybrid multilayer circuit board in which the step between the component mounting part and the flexible circuit board is 0.13 mm or less, the cover lay covering the component mounting part is projected to the flexible circuit board to The inclination of the step portion can be alleviated and printing becomes possible.

前述のように、階段状段差ａ５が１００μｍ以内で、かつ部品実装部の最終端とカバーレイ先端部との頂点を結ぶ線が可撓性回路基板と交差する角度θ4が５０°以内であれば、印刷可能である。これを実現するためには、カバーレイの接着剤層の厚みが２５μｍ以上であれば、部品実装部の最終端部分にあるカバーレイの接着剤が境界段差部へ流入し、なだらかな傾斜を形成することで階段状段差ａ５が１００μｍ以内となる。   As described above, if the stepped step a5 is within 100 μm and the angle θ4 at which the line connecting the final end of the component mounting portion and the apex of the cover lay intersects the flexible circuit board is within 50 ° Can be printed. In order to achieve this, if the thickness of the adhesive layer of the coverlay is 25 μm or more, the coverlay adhesive at the final end of the component mounting portion flows into the boundary step portion to form a gentle slope. As a result, the stepped step a5 is within 100 μm.

なお、カバーレイ全体の厚みも、階段形状を形成するために１００μｍ以内のものを使用する。そして、積層材料、カバーレイの食み出し量ｂ１,ｂ４、樹脂組成物の充填量ｂ２,ｂ３の最大値は、可撓性回路基板が屈曲する状態、屈曲応力によって決められるが、概ね１．０ｍｍ以内とするべきである。また、可撓性回路基板が屈曲する状態、屈曲応力によって、上記実施形態のうちのどれかを選択することになる。   Note that the thickness of the entire cover lay is 100 μm or less in order to form a staircase shape. The maximum values of the amount of protrusion b1 and b4 of the laminated material and coverlay and the amount of filling b2 and b3 of the resin composition are determined by the state in which the flexible circuit board is bent and the bending stress. Should be within 0 mm. Further, one of the above embodiments is selected depending on the state in which the flexible circuit board is bent and the bending stress.

本発明の第１の実施形態を示す説明図。Explanatory drawing which shows the 1st Embodiment of this invention. 表１の各寸法を示す説明図。Explanatory drawing which shows each dimension of Table 1. FIG. 表２の各寸法を示す説明図。Explanatory drawing which shows each dimension of Table 2. FIG. 本発明の第２の実施形態を示す説明図。Explanatory drawing which shows the 2nd Embodiment of this invention. 本発明の第３の実施形態を示す説明図。Explanatory drawing which shows the 3rd Embodiment of this invention. 本発明の第４の実施形態を示す説明図。Explanatory drawing which shows the 4th Embodiment of this invention. 本発明の第５の実施形態を示す説明図。Explanatory drawing which shows the 5th Embodiment of this invention. 従来の、導電性塗料をスクリーン印刷手法で印刷しＥＭＩに対するシールド層を形成した構造を示す説明図。Explanatory drawing which shows the conventional structure which printed the electrically conductive coating material with the screen printing method, and formed the shield layer with respect to EMI.

符号の説明Explanation of symbols

１ 部品実装部相互間を接続する可撓性回路基板
２ 積層材料
３ 樹脂組成物
４ カバーレイ
５１ 絶縁基板
５２ パターン
５２１ スルーホール
５２２ グラウンドパターン
５４ シールド層
５５ オーバーコート層 DESCRIPTION OF SYMBOLS 1 Flexible circuit board which connects between component mounting parts 2 Laminate material 3 Resin composition 4 Coverlay 51 Insulating board 52 Pattern 521 Through hole 522 Ground pattern 54 Shield layer 55 Overcoat layer

Claims (5)

多層の部品実装部の相互間を可撓性回路基板で接続する構造を有する混成多層回路基板であって、前記部品実装部と前記可撓性回路基板との段差部分に跨る部位に導電性塗料を印刷し、電磁波妨害（ＥＭＩ）に対するシールド層を形成する混成多層回路基板の製造方法において、
前記段差部分の断面形状が２以上の階段状段差であって、前記階段状段差それぞれの段差高が１００μｍ以内であり、かつ前記階段状段差それぞれの長さが前記段差高と同じかそれ以上の寸法であり、前記部品実装部の最終端と最も突出している階段状段差の頂点とを結ぶ線に対して前記可撓性回路基板のなす交差角度が５０°以内となるように形成し、
次いで前記段差部分にスクリーン印刷手法で導電性塗料を連続的に印刷する
ことを特徴とする混成多層回路基板の製造方法。 A hybrid multilayer circuit board having a structure in which multilayer component mounting parts are connected to each other by a flexible circuit board, wherein a conductive paint is applied to a portion straddling a step portion between the component mounting part and the flexible circuit board. In a method for manufacturing a hybrid multilayer circuit board, in which a shielding layer against electromagnetic interference (EMI) is formed,
The stepped portion has a stepped step having a cross section of 2 or more, the step height of each stepped step is within 100 μm, and the length of each stepped step is equal to or higher than the step height. The cross-section angle formed by the flexible circuit board with respect to a line connecting the final end of the component mounting portion and the apex of the most protruding stepped step is within 50 °,
Next, a conductive multi-layer circuit board manufacturing method, wherein a conductive paint is continuously printed on the step portion by a screen printing method. 請求項１の混成多層回路基板の製造方法において、
前記段差部分の断面形状を、前記部品実装部の最終端と前記可撓性回路基板との交差角度が５０°以内のスロープ形状とした
ことを特徴とする混成多層回路基板の製造方法。 In the manufacturing method of the hybrid multilayer circuit board of Claim 1,
A method for producing a hybrid multilayer circuit board, wherein the cross-sectional shape of the stepped portion is a slope shape in which an intersection angle between the final end of the component mounting portion and the flexible circuit board is within 50 °. 請求項１または２記載の混成多層回路基板の製造方法において、
前記段差部分の断面形状を形成する際に、前記部品実装部と前記可撓性回路基板との境界段差部の側面に絶縁性樹脂組成物を充填し、
次いで前記導電性塗料をスクリーン印刷手法で印刷する
ことを特徴とする混成多層回路基板の製造方法。 In the manufacturing method of the hybrid multilayer circuit board according to claim 1 or 2,
When forming the cross-sectional shape of the stepped portion, the side surface of the boundary stepped portion between the component mounting portion and the flexible circuit board is filled with an insulating resin composition,
Subsequently, the conductive paint is printed by a screen printing method. A method for producing a hybrid multilayer circuit board. 請求項１または２記載の混成多層回路基板の製造方法において、
前記段差部分の断面形状を、多層基板形成時に前記部品実装部と前記可撓性回路基板との境界部の積層材料を前記可撓性回路基板に近接するに連れて長くなるように食み出させて混成多層回路基板を形成し、
次いで導電性塗料をスクリーン印刷手法で印刷する
ことを特徴とする混成多層回路基板の製造方法。 In the manufacturing method of the hybrid multilayer circuit board according to claim 1 or 2,
The cross-sectional shape of the stepped portion protrudes so that the laminated material at the boundary portion between the component mounting portion and the flexible circuit board becomes longer as the multilayer circuit board is formed as it approaches the flexible circuit board. To form a hybrid multilayer circuit board,
Next, a method for producing a hybrid multilayer circuit board, comprising printing a conductive paint by a screen printing method. 請求項１記載の混成多層回路基板の製造方法において、
前記部品実装部と前記可撓性回路基板との境界段差部側面に、前記部品実装部を覆う接着剤層の厚みが２５μｍ以上で、総厚みが１００μｍ以内であるカバーレイを前記可撓性回路基板まで食み出させて、前記部品実装部と前記可撓性回路基板との段差を０．１３ｍｍ以内に形成し、
次いで導電性塗料をスクリーン印刷手法で印刷する
ことを特徴とする混成多層回路基板の製造方法。 In the manufacturing method of the hybrid multilayer circuit board according to claim 1,
A coverlay having a thickness of an adhesive layer covering the component mounting portion of 25 μm or more and a total thickness of 100 μm or less is formed on the side surface of the boundary step portion between the component mounting portion and the flexible circuit board. Protruding to the board, forming a step between the component mounting part and the flexible circuit board within 0.13 mm,
Next, a method for producing a hybrid multilayer circuit board, comprising printing a conductive paint by a screen printing method.
JP2005234420A 2005-08-12 2005-08-12 Method for manufacturing hybrid multilayered circuit substrate Pending JP2007049076A (en)

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EP4135489A4 (en) * 2020-09-09 2023-12-27 Shennan Circuits Co., Ltd. Composite circuit board and manufacturing method therefor

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