JP2007045955A - Pressure-sensitive adhesive, pressure-sensitive adhesive sheet obtained using the same, and manufacturing method of electronic component using pressure-sensitive adhesive sheet - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive that realizes both of contradictory properties of enhanced pressure-sensitive adhesive force and ready peelability, suppresses scattering of electronic components on dicing and exhibits large effects for suppressing static electricity when an electronic component is picked up, a pressure-sensitive adhesive sheet obtained using the same and a manufacturing method of electronic components using the pressure-sensitive adhesive sheet. <P>SOLUTION: The pressure-sensitive adhesive comprises an elastomer having a halogen-containing monomer unit and a heat-polymerizable compound. The pressure-sensitive adhesive sheet is obtained using the same. The manufacturing method of the electronic component comprises using the pressure-sensitive adhesive sheet. The pressure-sensitive adhesive and the pressure-sensitive adhesive sheet are suitably employed for a pressure-sensitive adhesive sheet for fixing electronic components that is pasted on the back surface of an electronic component aggregate when a plurality of electronic component aggregates formed on a plate-like substrate is divided into a separate electronic component by dicing. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

The present invention relates to an adhesive, an adhesive sheet using the adhesive, and an electronic component manufacturing method using the adhesive sheet.

In the manufacture of various electronic components, each unit chip or unit device is fixed by a dicing blade having a circuit pattern formed on a semiconductor wafer or circuit board material, etc., and fixing an assembly of electronic components and having abrasive grains such as diamond. A method of dicing is known (see Patent Documents 1 to 3).

As an electronic component assembly, for example, a sealing resin package sealed with an epoxy resin, specifically, a ball grid array (BGA), a chip size package (CSP), a stack memory module, a system An electronic component assembly formed by forming a circuit pattern on an on-module, a semiconductor wafer, or a circuit board material may be used.

In the pressure-sensitive adhesive sheet for fixing electronic parts, emphasis was placed on chip skipping suppression and the like. Due to the recent miniaturization of the chip size, the contradictory properties of further improvement in adhesive strength and ease of peeling have been required. The adhesive sheet has been required to have properties such as suppressing the scattering of the cut electronic components when dicing the assembled electronic component assembly and having a large static suppression effect during pick-up when the electronic components are diced after dicing. .

JP 09-328663 A JP 2003-007654 A JP 2003-257893 A

Adhesive that has conflicting characteristics of improved adhesive strength and ease of peeling, suppresses scattering of electronic components during dicing, and has a large static-suppressing effect when picking up electronic components, an adhesive sheet using the adhesive, and an adhesive sheet An electronic component manufacturing method using the

The present invention is a pressure-sensitive adhesive containing a halogen-containing elastomer and a heat-polymerizable compound, a pressure-sensitive adhesive sheet using the pressure-sensitive adhesive, and an electronic component manufacturing method using the pressure-sensitive adhesive sheet.

Accompanying the downsizing of electronic components, there are effects such as adhesive force and suppression of static electricity generated at the time of peeling after picking up after dicing.

In this specification, (meth) acrylate is a general term for acrylate and methacrylate. Similarly, a compound name containing (meth) such as (meth) acrylic acid is a general term for a compound having “meta” in the name and a compound not having “meta”. The same applies to (sub) phosphoric acid and the like.

In the present specification, the monomer unit means a structural unit derived from a monomer.

(Elastomer with halogen)
One feature of the present invention is to use an elastomer having halogen (hereinafter, also simply referred to as “elastomer”). Examples of such halogen-containing monomers include epichlorohydrin, epibromohydrin, epiiodohydrin, β-methylepichlorohydrin, vinylidene fluoride, hexafluoropropylene, pentafluoropropylene, chlorotrifluoro. Examples include ethylene, tetrafluoroethylene, hexafluoropropylene, vinyl fluoride, perfluoromethyl vinyl ether, and perfluoropropylvinylidene. As the elastomer, epihadrin rubber and fluororubber can be preferably used.

Other halogen-containing monomers include, for example, vinylidene fluoride, hexafluoropropylene, pentafluoropropylene, chlorotrifluoroethylene, tetrafluoroethylene, hexafluoropropylene, vinyl fluoride, perfluoromethyl vinyl ether, perfluoropropyl vinylidene. Etc.

Other halogen-containing monomers include (1) haloalkyl (meth) acrylates, (2) haloacyloxyalkyl (meth) acrylates, (3) unsaturated haloalkyl haloalkyls, and (4) halogen-containing unsaturated nitriles. (5) halogen-containing unsaturated amides, (6) unsaturated alcohol esters of halogen-containing saturated carboxylic acids, (7) halogen-containing unsaturated ethers, (8) haloalkylalkenyl ketones, (9) halogen-containing It is preferable to use aromatic vinyl compounds, (10) halogenated olefins, (11) halogen-containing dienes, (12) halogen-containing unsaturated amides, and the like. These halogen-containing monomers may be used alone or in combination.

(1) Monomers of haloalkyl (meth) acrylates include, for example, chloromethyl (meth) acrylate, 1-chloroethyl (meth) acrylate, 2-chloroethyl (meth) acrylate, 1,2-dichloroethyl (meth) acrylate , 2-chloropropyl (meth) acrylate, 3-chloropropyl (meth) acrylate, 2,3-dichloropropyl (meth) acrylate, 2-chlorobutyl (meth) acrylate, 3-chlorobutyl (meth) acrylate, 4-chlorobutyl ( And (meth) acrylate, 3,4-dichlorobutyl (meth) acrylate, and the like.

(2) Monomers of haloacyloxyalkyl (meth) acrylates include, for example, chloroacetoxymethyl (meth) acrylate, 2- (chloroacetoxy) ethyl (meth) acrylate, 3- (chloroacetoxy) propyl (meth) acrylate 4- (chloroacetoxy) butyl (meth) acrylate and the like.

(3) Monomers of halogen-containing (meth) acrylates include, for example, chloroacetylcarbamoyloxymethyl (meth) acrylate, 2- (chloroacetylcarbamoyloxy) ethyl (meth) acrylate, 3- (chloroacetylcarbamoyloxy) Examples include propyl (meth) acrylate, 3- (hydroxycyclohexylacetoxy) propyl (meth) acrylate, and 4- (hydroxycyclohexylacetoxy) propyl (meth) acrylate.

(4) Monomers of unsaturated carboxylic acid haloalkyls include, for example, 2-chloroethyl ethacrylate, 2-chloroethyl crotonate, and 2-chloroethyl cinnamate.

(5) Examples of the monomer of the halogen-containing unsaturated nitrile include α-chloroacrylonitrile and α-chloromethylacrylonitrile.

(6) Examples of the monomer of the halogen-containing unsaturated amide include N-chloromethylacrylamide, N-chloromethylmethacrylamide, chloroacetamidomethylacrylamide, chloroacetamidomethylmethacrylamide and the like.

(7) Monomers of unsaturated alcohol esters of halogen-containing saturated carboxylic acids include, for example, vinyl chloroacetate, vinyl 2-chloropropionate, allyl chloroacetate, vinylbenzyl chloroacetate and the like.

(8) Monomers of halogen-containing unsaturated ethers include, for example, chloromethyl vinyl ether, 2-chloroethyl vinyl ether, 3-chloropropyl vinyl ether, 2- (hydroxychloroacetoxy) ethyl vinyl ether, 3- (hydroxychloroacetoxy) There are propyl vinyl ether, chloromethyl allyl ether, 2-chloroethyl allyl ether, 3-chloropropyl allyl ether, 2- (hydroxychloroacetoxy) ethyl allyl ether, 3- (hydroxychloroacetoxy) propyl allyl ether.

(9) Monomers of haloalkylalkenyl ketones include, for example, 2-chloroethyl vinyl ketone, 3-chloropropyl vinyl ketone, 4-chlorobutyl vinyl ketone, 2-chloroethyl allyl ketone, 3-chloropropyl allyl ketone, There is 4-chlorobutyl allyl ketone.

(10) Examples of the monomer of the halogen-containing aromatic vinyl compound include α-chlorostyrene, o-chlorostyrene, m-chlorostyrene, p-chlorostyrene, p-chloromethylstyrene, and o-chloromethyl-methylstyrene. , P-chloromethyl-methylstyrene, o-di (chloromethyl) styrene, o-di (chloromethyl) styrene, vinylbenzyl chloride and the like.

(11) Examples of monomers of halogenated olefins include vinyl chloride, vinylidene chloride, 1,2-dichloroethylene, vinylidene fluoride, and the like.

(12) Monomers of halogen-containing dienes include, for example, 2-chloro-1,3-butadiene, 1,2-dichloro-1,3-butadiene, and 2,3-dichloro-1,3-butadiene. .

(13) Examples of monomers of halogen-containing unsaturated amides include N-chloromethylacrylamide, N-chloromethylmethacrylamide, chloroacetamidomethylacrylamide, chloroacetamidomethylmethacrylamide and the like.

(halogen)
Examples of the halogen element that can be used as the halogen-containing monomer unit include chlorine, fluorine, bromine, and iodine. Among the halogen elements, chlorine and / or fluorine are preferable because of low light molecular weight and high activity, and thus chlorine is preferable, and chlorine is more preferable from the viewpoint of availability and cost.

The elastomer may contain a halogen-free monomer unit. Examples of the halogen-free monomer include (meth) acrylic acid ester monomers and other monomers. One or more of these monomers can be used in the elastomer.

Examples thereof include tetrafluoroethylene / propylene copolymer and hexafluoropropylene / ethylene copolymer.

((Meth) acrylic acid ester monomer)
For example, butyl (meth) acrylate, 2-butyl (meth) acrylate, t-butyl (meth) acrylate, pentyl (meth) acrylate, octyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, nonyl (meth) acrylate, Decyl (meth) acrylate, lauryl (meth) acrylate, methyl (meth) acrylate, ethyl (meth) acrylate, isopropyl (meth) acrylate, tridecyl (meth) acrylate, myristyl (meth) acrylate, cetyl (meth) acrylate, stearyl ( Examples include meth) acrylate, cyclohexyl (meth) acrylate, and benzyl (meth) acrylate.

Examples of other monomers include styrene, vinyl toluene, allyl acetate, (meth) acrylonitrile, vinyl acetate, vinyl propionate, vinyl butyrate, vinyl versatate, vinyl ethyl ether, vinyl propyl ether, vinyl isobutyl ether, and the like. .

The use of an elastomer having a (meth) acrylic acid ester monomer unit is preferable because of its high adhesiveness to a semiconductor wafer.

The elastomer has at least one functional group selected from the group consisting of an amino group, a hydroxyl group, a carboxyl group, an epoxy group, an amide group, a methylol group, a sulfonic acid group, a sulfamic acid group, and a (phosphite) group. Preferably it contains monomer units.

Examples of the monomer having an amino group include N, N-dimethylaminoethyl (meth) acrylate and the like.

Examples of the monomer having a hydroxyl group include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, and the like.

Examples of the monomer having a carboxyl group include (meth) acrylic acid, crotonic acid, maleic acid, maleic anhydride, itaconic acid, fumaric acid, acrylamide N-glycolic acid, and cinnamic acid.

Examples of the monomer having an epoxy group include allyl glycidyl ether and (meth) acrylic acid glycidyl ether.

Examples of the monomer having an amide group include (meth) acrylamide.

Examples of the monomer having a methylol group include N-methylolacrylamide.

In addition to these monomers, the elastomer may contain known halogen-free monomers such as ethylene, styrene and derivatives thereof, dienes (propylene, butadiene, etc.), alkylene oxides, unsaturated epoxides, and the like.

Examples of the alkylene oxide monomer include ethylene oxide, propylene oxide, 1,2-epoxybutane, 1,2-epoxy-iso-butane, 2,3-epoxybutane, 1,2-epoxyhexane, 1, 2-epoxyoctane, 1,2-epoxydecane, 1,2-epoxytetradecane, 1,2-epoxyhexadecane, 1,2-epoxyoctadecane, 1,2-epoxyeicosane, 1,2-epoxycyclopentane, 1 2, 2-epoxycyclohexane, 1,2-epoxycyclododecane, 1,2-epoxy-isobutane, 2,3-epoxy-isobutane, 2,3-epoxy-3-chloropentane, and the like.

The proportion of the halogen-containing monomer unit in the entire elastomer is preferably 0.1 to 55% by mass. If the content of the halogen-containing monomer unit is small, an improvement in cohesive force cannot be expected, and the glue may be scraped up during dicing, which tends to increase the surface resistivity of the pressure-sensitive adhesive. If the content of the halogen-containing monomer unit is high, the halogen component tends to migrate to the adherend. The more preferable lower limit of the content of the halogen-containing monomer unit in the entire elastomer is 3% by mass, and the more preferable upper limit is 30% by mass.

One or more kinds of, for example, triethylamine, tetraethylpentamine, dimethylamino ether and the like may be added to the adhesive as a polymerization accelerator.

(Heat-polymerizable compound)
The heat-polymerizable compound refers to a low molecular weight compound having at least two carbon-carbon double bonds in a molecule that can be three-dimensionally reticulated by a heated heat polymerization initiator. Examples include acrylate compounds, urethane acrylate oligomers, polyvalent isocyanate compounds, and acrylate compounds having a hydroxyl group. When a heat-polymerizable compound is added and the pressure-sensitive adhesive sheet is heated after the dicing step, the pressure-sensitive adhesive force of the pressure-sensitive adhesive sheet is reduced and peels from the pressure-sensitive adhesive sheet, so that electronic components can be easily picked up.

Examples of the acrylate compound include trimethylolpropane triacrylate, tetramethylolmethane tetraacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol monohydroxypentaacrylate, dipentaerythritol hexaacrylate, or 1,4-butylene glycol diacrylate. Examples include acrylate, 1,6-hexanediol diacrylate, polyethylene glycol diacrylate, and oligoester acrylate.

As the urethane acrylate oligomer, for example, a terminal isocyanate urethane prepolymer obtained by further reacting a polyisocyanate compound or the like with a polyol compound obtained by reacting a polyester type or a polyether, and the terminal isocyanate is synthesized in advance. Examples thereof include a terminal isocyanate urethane prepolymer obtained by reacting a urethane prepolymer with an acrylate (or methacrylate) having a hydroxyl group.

Examples of the polyvalent isocyanate compound include 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 1,3-xylylene diisocyanate, 1,4-xylylene diisocyanate, diphenylmethane 4,4′- And diisocyanate.

Examples of the acrylate compound having a hydroxyl group include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, and polyethylene glycol (meth) acrylate.

If the heat-polymerizable compound is added excessively, glue scraping occurs during dicing. When there are few heat-polymerizable compounds, hardening will be slow and adhesive force will fall, work efficiency will worsen, and pick-up property will fall. It is preferable to set it as 30-200 mass parts of heat-polymerizable compounds with respect to 100 mass parts of elastomers.

(Heating polymerization initiator)
The heat polymerization initiator is a compound that accelerates curing of the heat-polymerizable compound and cures the entire pressure-sensitive adhesive when heated after the dicing step. By heating after the dicing step, the pressure-sensitive adhesive is cured and peeled from the electronic component, so that the electronic component can be easily collected.

Examples of the heat polymerization initiator include an organic peroxide derivative and an azo polymerization initiator. Of these heat polymerization initiators, organic peroxide derivatives having high radical generation efficiency are preferred.

Examples of the organic peroxide derivative include ketone peroxide, peroxyketal, hydroperoxide, dialkyl peroxide, diacyl peroxide, peroxyester, and peroxydicarbonate.

Examples of the azo polymerization initiator include azobisisobutyronitrile, 2,2′-azobisisobutyronitrile, 2,2′-azobis (2,4-dimethylvaleronitrile), 2,2′-azobis. (2-methylbutyronitrile) and the like.

Although the usage-amount of a heat polymerization initiator is not specifically limited, When it mix | blends excessively, an adhesive may fall with the change of environmental temperature. If the blending amount of the heat polymerization initiator is small, the heat curing reaction is slow and it may be difficult to peel the electronic component. It is preferable to use 0.1 to 10 parts by mass of the heat polymerization initiator with respect to 100 parts by mass of the elastomer.

(Amine curing agent containing a compound having two or more amino groups)
An amine curing agent containing a compound having two or more amino groups (hereinafter simply referred to as “amine curing agent”) is characterized by having at least two amino groups in the molecule. By adding an amine curing agent to the pressure-sensitive adhesive, effects such as cohesion of itself, a decrease in resistivity on the surface of the pressure-sensitive adhesive, and an improvement in adhesive strength can be obtained.

Examples of amine curing agents include diethylenetriamine, dipropylenetriamine, triethylenetriamine, tetraethylenepentamine, dimethylaminopropylamine, diethylaminopropylamine, dibutylaminopropylamine, hexamethylenediamine, N-aminoethylpiperazine, and bis-aminopropyl. Piperazine, trimethylhexamethylenediamine, dicyandiamide, polyoxypropylenediamine, 3,3′-dimethyl4,4′-diaminodicyclohexylmethane, 3-amino-1-cyclohexylaminopropane, 4,4′-diaminodicyclohexylmethane, isophoronediamine 1,3-bis (aminomethyl) cyclohexane, 4,4′-diaminodiphenylmethane, 4,4′-diaminodiphenyl ether, Aminodiphenylsulfone, m-phenylenediamine, 2,4-toluylenediamine, m-toluylenediamine, O-toluylenediamine, metaxylylenediamine, xylylenediamine, N-benzylethylenediamine, N, N-dibenzylethylenediamine Etc.

The addition amount of the amine curing agent is preferably 0.05 to 30 parts by mass with respect to 100 parts by mass of the elastomer. If the addition amount of the amine curing agent is small, the improvement of the cohesive force due to crosslinking cannot be expected, and the glue may be scraped up during dicing, and the decrease in the resistivity of the pressure-sensitive adhesive surface tends not to be expected. If the amine curing agent is excessive, the adhesive strength tends to decrease and chip fly tends to occur.

(Additives, etc.)
A known additive such as a tackifier, a softener, an anti-aging agent, a filler, and a thermal polymerization inhibitor may be appropriately added to the pressure-sensitive adhesive.

(Manufacture of adhesive sheet)
The pressure-sensitive adhesive sheet is produced by applying or printing a pressure-sensitive adhesive on a sheet-like substrate made of resin or the like. The pressure-sensitive adhesive can be dissolved in an undiluted solution or an organic solvent and applied or printed on a substrate.

The thickness and material of the base material of an adhesive sheet can be suitably selected according to a use. Examples of the resin suitable for the substrate include polyvinyl chloride, polyethylene, polypropylene, polyester, ethylene vinyl alcohol, and polyethylene terephthalate. A single layer sheet or a laminated sheet of these resins may be used, or a sheet appropriately foamed by adding a foaming agent may be used as a substrate.

Although the electronic component manufacturing method using an adhesive sheet is not specifically limited, It is used suitably for the cutting | disconnection of the electronic component assembly called a workpiece | work. The electronic component assembly is, for example, a silicon wafer or a semiconductor wafer such as gallium-arsenide, or an insulator substrate such as a BGA (ball grid array) substrate, a glass substrate, an epoxy substrate, or a polymer liquid crystal polymer substrate. One formed by forming a wiring pattern can be mentioned. As a method for using the electronic component assembly as an electronic component, dicing is exemplified. The electronic component assembly or the electronic component may be subjected to processing such as polishing or etching as necessary.

The pressure-sensitive adhesive sheet is suitably used for dicing an electronic component assembly, particularly a semiconductor member assembly, in which a wiring pattern is placed on a semiconductor wafer such as a silicon wafer or a gallium-arsenide wafer.

Hereinafter, the prescription for producing the pressure-sensitive adhesive sheet according to Example 1 is shown.

(Materials used)
Heat-polymerizable compound: dipentaerythritol hexaacrylate, commercially available.
Heat polymerization initiator: peroxydicarbonate, commercially available.
Amine curing agent: N-benzylethylenediamine, commercially available product.

(Elastomer)
Elastomer: Epichlorohydrin content 5% by mass, ethylene oxide 45% by mass, and methyl acrylate 50% by mass were polymerized to obtain an epichlorohydrin-ethylene oxide-methyl acrylate copolymer.

(Adhesive)
Adhesive: 100 parts by mass of elastomer, 50 parts by mass of heat-polymerizable compound, 3 parts by mass of heat-polymerization initiator, and 5 parts by mass of amine curing agent were blended.

(Adhesive sheet)
The pressure-sensitive adhesive sheet was made of a polyethylene sheet having a thickness of 150 μm, and a toluene solution of the pressure-sensitive adhesive was applied to one side of the base material and dried by heating at 100 ° C. for 1 minute to form a pressure-sensitive adhesive layer having a thickness of 25 μm.

Examples 2 to 11 and Comparative Example 1 are the same as Example 1 except for the parts specifically mentioned.

Example 2 changed the elastomer of the adhesive layer of Example 1 into vinylidene fluoride-hexafluoropropylene-ethylene oxide-methyl acrylate copolymer (fluorine-containing monomer content 5 mass%).

In Example 3, the elastomer of the pressure-sensitive adhesive layer of Example 1 contains 5% by mass of vinyl bromoacetate units, 90% by mass of butyl acrylate, and 5% by mass of 2-hydroxyethyl acrylate units. The butyl- (2-hydroxyethyl acrylate) copolymer was changed.

In Example 4, the amine curing agent in the example was 0.01 parts by mass.
In Example 5, the amine curing agent in Example was set to 35 parts by mass.
In Example 6, the content of the halogen-containing monomer unit in the elastomer in the example was set to 0.05% by mass.
In Example 7, the content of the halogen-containing monomer unit in the elastomer in the example was 60% by mass.
In Example 8, the amount of the heat polymerizable compound was 25 parts by mass.
In Example 9, the amount of the heat polymerizable compound was 230 parts by mass.
In Example 10, the amount of the heat polymerization initiator was 0.05 parts by mass.
In Example 11, the amount of the heat polymerization initiator was 12 parts by mass.

In Comparative Example 1, an ethylene oxide-methyl acrylate copolymer was used instead of the elastomer in Example 1.

(Evaluation methods)
Dicing property (chip skipping): Adhesive sheet is attached to a 20 mm long and 25 mm wide semiconductor member molded with package molding mold resin so that bubbles do not enter, and after standing for 10 minutes, it is diced to 5 mm □. This is the chip skipping ratio with respect to 100 chips in total when it is repeated five times.

Adhesive strength: A pressure-sensitive adhesive sheet was affixed to a semiconductor member molded with a package-molding mold resin so that air bubbles did not enter, and peel strength was measured according to JIS Z 0237.

Adhesive scraping: Adhesive sheet is affixed to a semiconductor member molded with mold resin for package molding so that air bubbles do not enter, then left for 10 minutes, then diced to 5 mm □, and this operation is repeated 5 times, totaling 100 chips It is the ratio at which adhesion of the adhesive was confirmed on the side surface of the chip.

Pickup suitability: A semiconductor member molded with a molding resin for molding and an adhesive sheet were pasted so that air bubbles would not enter. After standing for 10 minutes, dicing was performed to 5 mm □. The pressure-sensitive adhesive sheet was heated at 100 ° C. for 3 minutes to cure the pressure-sensitive adhesive layer. And it pushed up 1.5 mm with the needle from the base material lower part, and the chip was picked up with the vacuum collet. 100 chips were manufactured and the proportion of electronic components that could not be picked up was measured.

Surface resistivity (resistivity of the pressure-sensitive adhesive surface): The resistivity of the pressure-sensitive adhesive surface was measured using a surface resistance measuring instrument (Advantest R8340A) in an atmosphere at a temperature of 23 ° C. and a humidity of 55%.

Halogen element extraction amount; put adhesive sheet 100 cm ² to a conical beaker and immersed in ultra-pure water 100 ml, 2 hours and extracted with 100 ° C. using a hot plate, a halogen ion mass, ion chromatography (DIONEX Co. DX-AQ) This is an analysis. A halogen element extraction amount of less than 0.1 ppm was judged good, and a value of 0.1 ppm or more was judged unacceptable.

(Evaluation results)
The pressure-sensitive adhesive sheet in Example 1 has a chip skip of 10% or less, no pressure-sensitive adhesive scraping was confirmed, the pressure-sensitive adhesive surface resistivity was 8.0 × 10 ¹¹ Ω / □, and the halogen element extraction amount was 0.00. It was less than 1 ppm and was good.

Example 2: The adhesive surface resistivity was better than in Example 1.
Example 3: Adhesive strength was higher than in Example 1, and chip fly was less.
Example 4: Although there was no chip jumping, the adhesive was scraped and the adhesive surface resistivity was poor.
Example 5: The adhesive was not scraped up, and the resistivity on the adhesive surface was good, but the adhesive force was low, and many chip jumps were observed.
Example 6: Although the halogen element extraction amount was small, the resistivity of the pressure-sensitive adhesive surface was poor.
Example 7: The adhesive was not scraped, but the halogen element extraction amount was large.
Example 8: The adhesive was not scraped, but the pick-up suitability was poor.
Example 9: There was no chip jumping, but the pressure-sensitive adhesive was poorly picked up.
Example 10: There was no chip jumping, but the pickup suitability was poor.
Example 11: Although the adhesive was not scraped, it was cured when the adhesive was heated and dried, and the adhesive force was low and the chip jumped frequently.

Comparative Example 1: Although the halogen element extraction amount was small, the resistivity of the pressure-sensitive adhesive surface was extremely poor.

The pressure-sensitive adhesive and pressure-sensitive adhesive sheet of the present invention are used by adhering to the back surface of an electronic component assembly when dicing a plurality of electronic component assemblies prepared on a plate-shaped substrate into individual electronic components. It is suitably used for an adhesive sheet for fixing electronic parts.

Claims (9)

An adhesive containing a halogen-containing elastomer and a heat-polymerizable compound. The pressure-sensitive adhesive according to claim 1, comprising an amine curing agent containing a compound having two or more amino groups, and a heat polymerization initiator. 100 mass parts of elastomer, 30-200 mass parts of heat-polymerizable compound, 0.05-30 mass parts of amine curing agent containing a compound having two or more amino groups, and 0.1-10 mass parts of thermal polymerization initiator The pressure-sensitive adhesive according to claim 2, wherein the content of the halogen-containing monomer unit in the elastomer is 0.1 to 55% by mass. The elastomer further has at least one functional group selected from the group consisting of amino group, hydroxyl group, carboxyl group, epoxy group, amide group, methylol group, sulfonic acid group, sulfamic acid group, and (phosphite) group. The pressure-sensitive adhesive according to any one of claims 1 to 3, which has a monomer unit. The pressure-sensitive adhesive according to any one of claims 1 to 4, wherein the elastomer has a halogen-containing monomer unit and a (meth) acrylic acid ester monomer unit. The pressure-sensitive adhesive according to any one of claims 1 to 5, wherein the halogen is chlorine and / or fluorine. The adhesive sheet using the adhesive as described in any one of Claims 1 thru | or 6. The pressure-sensitive adhesive sheet according to claim 7, which is used for fixing an electronic component. An electronic part manufacturing method using the pressure-sensitive adhesive sheet according to claim 7 or 8.