JP2007043597A - Speaker device and diaphragm therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a diaphragm etc. for a speaker device which has good moldability and productivity, is excellent in thermal resistance and fatigue resistance, and has a configuration of holding a voice coil. <P>SOLUTION: The diaphragm has a dome, an edge, and a recess provided between the dome and the edge, and these constituents are integrally formed. The voice coil is arranged in the recess, and the recess is used for holding the voice coil. Since polyether ether ketone is used as a resin base material of the diaphragm and an object to be molded can be molded at a very low temperature, i.e. not less than 145°C; a charge preventing agent is not thermally decomposed in molding the diaphragm, the charge preventive agent hardly adheres to a die for molding the diaphragm, thus, the die for molding the diaphragm can be prevented from being contaminated. In this way, the cleaning of the die for molding the diaphragm is almost unnecessary every time the diaphragm is manufactured, production efficiency of the diaphragm can be improved. Further. the polyether ether ketone is excellent in thermal resistance and fatigue resistance etc. as its characteristic. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a configuration of a diaphragm in a speaker device.

  2. Description of the Related Art Conventionally, as a speaker device that achieves weight reduction or the like, for example, a speaker device having a speaker diaphragm formed by combining a voice coil and a diaphragm is known (see, for example, Patent Documents 1 and 2).

  The speaker devices described in Patent Documents 1 and 2 are not provided with a voice coil bobbin for winding a voice coil, in other words, have a voice coil bobbin-less (air core) structure, A concave portion (or a folded portion) for holding the voice coil is provided in a part of the plate. Moreover, this diaphragm is produced using the resin film or the thermoplastic resin. Moreover, as a resin material for producing such a diaphragm, generally, polyetherimide (PEI) that has good moldability and can be molded at low temperature is used. In addition, the strength of the diaphragm is necessary to achieve high power of the speaker device. When realizing such a purpose, the resin material for producing such a diaphragm is excellent in heat resistance and strength. Polyimide (PI) is used. In addition, as a method of shape | molding a diaphragm using such a resin raw material, a press molding method, a blow molding method, a vacuum forming method, a pressure forming method etc. are mentioned, for example.

  Further, as this type of speaker device, for example, a speaker device is known in which a diaphragm and a voice coil are coupled via a heat dissipating member, thereby enhancing the heat dissipating effect and obtaining excellent sound quality and the like. (For example, see Patent Document 3).

  Further, as this type of speaker device diaphragm, for example, the thickness of the annular concave fitting portion of the diaphragm for joining the voice coil is thicker than the thickness of the outer peripheral portion of the diaphragm, making it difficult to peel off the voice coil. A diaphragm for a speaker device is known (see, for example, Patent Document 4).

  A diaphragm formed by molding a composite material of a resin such as polyether ether ketone and a cylindrical graphene structure into a sheet shape is known (see, for example, Patent Document 5). Accordingly, the diaphragm described in Patent Document 5 constitutes a diaphragm having a high elastic modulus, high rigidity, and low density. In addition, a speaker device is known that uses a diaphragm that is formed using a resin material such as polyetheretherketone and has a shape that does not include a substantially flat portion at the joint with the voice coil (for example, , See Patent Document 6). As a result, the speaker device described in Patent Document 6 constitutes a super high frequency reproduction speaker having a very high high frequency reproduction limit frequency fh and having excellent frequency characteristics without a peak dip.

Japanese Patent No. 3337631 Japanese Patent No. 3334842 JP 2002-271890 A JP 2003-264890 A JP 2003-319490 A JP 2003-163989 A

  However, the diaphragm manufactured using the polyetherimide (PEI) described above is not strong enough for the amplitude operation of the diaphragm by the voice coil, and is deformed by the heat generated by the voice coil. Or there is a problem of being damaged.

  For this reason, a diaphragm made of polyimide (PI) having excellent heat resistance and strength is generally used for a high-power speaker device. However, when a diaphragm is molded using polyimide (PI) as a resin material, the molding temperature is as high as 300 ° C. or higher, so that when the diaphragm is molded, the antistatic agent and the like are thermally decomposed, There is a problem that the antistatic agent or the like adheres to the mold for forming the vibration plate, and the mold is likely to become dirty. Therefore, there is a problem that the mold needs to be cleaned each time the diaphragm is manufactured, and the production efficiency of the diaphragm is lowered. That is, in this case, in order to produce the diaphragm, there is a problem that a great amount of energy is required such as an increase in the number of steps.

  Examples of problems to be solved by the present invention include the above. The present invention mainly provides a diaphragm for a speaker device having a structure that has good moldability and productivity, is excellent in heat resistance and fatigue resistance, and holds a voice coil, and a speaker device to which the diaphragm is applied. The task is to do.

  The invention according to claim 1 is a diaphragm for a speaker device, characterized in that it has a recess for holding a voice coil and is made of a material mainly composed of polyetheretherketone.

  In one aspect of the present invention, the speaker device diaphragm has a recess for holding a voice coil and is made of a material mainly composed of polyetheretherketone.

  The above diaphragm for a speaker device has a concave portion for holding a voice coil, and is formed of a material mainly composed of polyether ether ketone having excellent heat resistance, fatigue resistance, impact resistance, and creep resistance. Has been. In a preferred example, the recess preferably has a U-shaped cross-sectional shape. In a preferred example, the diaphragm for the speaker device includes an antistatic processing, a texture processing (unevenness forming processing), a mat processing (matte processing), a primer processing (for example, polyether ether ketone). It is preferable that at least one of a coating process or a metal vapor deposition process is performed for the purpose of improving the adhesion between the coating film and the coating film or improving the rust prevention property.

  Here, when producing a diaphragm using polyimide (PI) (comparative example), there are the following problems. Generally, when a diaphragm is molded using this polyimide (PI), the molding temperature is as high as 300 ° C. or higher. For this reason, at the time of molding of the vibration plate, there is a problem that the antistatic agent or the like is thermally decomposed, and the antistatic agent or the like adheres to the vibration plate forming mold, and the mold is likely to become dirty. Therefore, it is necessary to clean the mold every time the diaphragm is manufactured, and the production efficiency of the diaphragm is reduced. As a result, a great deal of energy is required to increase the number of steps for producing the diaphragm. There is a problem of doing.

  On the other hand, when polyether ether ketone is used as the resin material, the molding object can be molded at a temperature extremely lower than the molding temperature of polyimide (PI) (300 ° C. or higher), that is, at a low temperature of about 145 ° C. or higher. In this respect, the diaphragm is formed of a material mainly composed of polyetheretherketone as described above. For this reason, the antistatic agent or the like is not thermally decomposed when the diaphragm is formed, and the antistatic agent or the like hardly adheres to the vibration mold. That is, the mold for forming the diaphragm is difficult to get dirty. Thereby, there is almost no need to clean the diaphragm mold each time the diaphragm is manufactured, so that the production efficiency of the diaphragm can be improved. That is, if such a material is used, the diaphragm can be manufactured with a minimum amount of energy (for example, man-hours).

  Further, if the diaphragm is molded using polyetheretherketone, there is an advantage that the molding time can be shortened to about half compared to the above comparative example. For example, in order to form a diaphragm having the above-mentioned shape with a diameter of 30 mm using polyimide (PI), it takes about 50 seconds under the condition of a molding temperature of about 330 ° C., while the diaphragm 5 described above is used. Experimental results have been obtained that it takes about 25 seconds to mold the product using polyetheretherketone under conditions of a molding temperature of about 145 ° C. In this respect, since this diaphragm is formed by using polyether ether ketone as a main component, the molding time of the diaphragm can be shortened to about half as compared with the above comparative example.

  Further, as a practical range of the speaker device, the heat resistant limit temperature of the diaphragm using polyetherimide (PEI) is about 150 ° C. or less, while the heat resistant temperature of the diaphragm using polyether ether ketone is about 200 ° C. ~ 300 ° C. Therefore, this diaphragm is superior in heat resistance as compared with a diaphragm using polyetherimide (PEI).

  As described above, since this diaphragm is formed using a material mainly composed of polyether ether ketone, the moldability and productivity of the diaphragm are good, and heat resistance and fatigue resistance are improved. An excellent diaphragm can be obtained. As a result, when a diaphragm having such a constituent material is applied, it is possible to achieve high power of the speaker device.

  In one aspect of the above diaphragm for a speaker device, the element has a dome portion and an edge having a substantially hemispherical shape, and between the peripheral edge portion of the dome portion and the inner peripheral edge portion of the edge, The concave portion formed integrally with the dome portion and the edge is provided, and the voice coil is held by the concave portion.

  In this aspect, it has the dome part and edge which make a substantially hemispherical shape. And between the peripheral part of a dome part and the inner peripheral part of an edge, the recessed part formed integrally with the said dome part and the said edge is provided. Thereby, what is called a dome shape diaphragm can be comprised. In this aspect, since the dome portion, the concave portion, and the edge are integrally formed, the speaker is compared with the speaker device diaphragm in which at least one of those elements is provided independently of the other elements. It is possible to reduce the number of parts of the diaphragm for the device and to reduce the manufacturing process of the speaker device diaphragm. As a result, it is possible to reduce the product cost of the speaker device diaphragm, and hence the product cost of the speaker device.

  A speaker device including the above-described speaker device diaphragm can be configured.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

[Configuration of speaker device]
FIG. 1 is a cross-sectional view of a speaker device 100 including a diaphragm according to the present invention cut along a plane passing through the central axis L1.

  As shown in FIG. 1, the speaker device 100 mainly includes a magnetic circuit including a yoke 1, a magnet 2 and a plate 3, and a vibration system including a frame 4, a diaphragm 5 and a voice coil 6. In the present invention, the shape of the diaphragm 5, the configuration of the magnetic circuit, the structure of the speaker device, and the driving method are not particularly limited.

  First, the configuration of the magnetic circuit will be described. This magnetic circuit is configured as an internal magnet type magnetic circuit. The yoke 1 has a substantially bowl shape. On the bottom 1 a of the yoke 1, a magnet 2 having a substantially cylindrical shape is disposed. A plate 3 having a substantially disk shape is disposed on the magnet 2.

  Next, the configuration of the vibration system will be described. The frame 4 has an annular shape and has a function of supporting various components constituting the speaker device 100. The frame 4 has a stepped cross-sectional shape, and includes a first step portion 4a and a second step portion 4b provided above and outside the first step portion 4a. The vicinity of the inner periphery of the frame 4 is attached to the upper end of the yoke 1. The diaphragm 5 is an element that characterizes the present invention, and has a function of emitting a sound wave according to an input signal. The outer peripheral edge of the diaphragm 5 is attached on the second step 4 b of the frame 4. The voice coil 6 is wound around a peripheral surface 5ba in the concave portion 5b located in the vicinity of the plate 3 in a state where the voice coil 6 is disposed in the concave portion 5b of the diaphragm 5 described later. A gap, that is, a magnetic gap 7 is formed between the concave portion 5 b of the diaphragm 5 and the outer peripheral portion of the voice coil 6. The voice coil 6 is composed of one wiring and has positive and negative lead wires (not shown). The positive lead wire is an input wiring for an L (or R) channel signal, and the negative lead wire is an input wiring for a ground (GND) signal. Each of the plus and minus lead wires is connected to a terminal portion (not shown) provided at an appropriate position of the frame 4. The terminal portion is also connected to an amplifier-side output wiring (not shown). As a result, the signal and power for one channel are input to the voice coil 6 from the amplifier side via the terminal portion and the plus and minus lead wires.

  In the speaker device 100 having the above configuration, the signal and power output from the amplifier side are supplied to the voice coil 6 via the terminal portion and the positive and negative lead wires of the voice coil 6. As a result, a driving force is generated in the voice coil 6 within the magnetic gap 7, and the diaphragm 5 is vibrated in the direction of the central axis L <b> 1 of the speaker device 100. Thus, the speaker device 100 radiates sound waves in the direction of the arrow Y1.

(Configuration of diaphragm)
Next, the configuration of the diaphragm 5 having features of the present invention will be described in detail with reference to FIGS. FIG. 2 is a cross-sectional view showing the configuration of the diaphragm 5 according to the embodiment of the present invention.

  The diaphragm 5 has a dome portion 5a, a concave portion (groove portion) 5b provided on the outer side thereof, and an edge (inclined portion) 5c provided on the outer side of the concave portion 5b, and these elements are integrated. Is formed. The dome portion 5a has a substantially hemispherical shape or a substantially dome shape, and plays a role of emitting sound. The concave portion 5b has a substantially U-shaped cross-sectional shape and is provided between the dome portion 5a and the edge 5c. As shown in FIG. 1, a voice coil 6 is wound around the peripheral surface 5ba of the recess 5b, and the voice coil 6 is held in the recess 5b. That is, the concave portion 5b mainly serves to hold the voice coil 6 in a state where the voice coil 6 is dropped into the concave portion 5b. An elastic portion 5ca having an elastic function and having a substantially Ω-shaped cross-sectional shape is provided on the outer peripheral edge portion of the edge 5c. The outer peripheral edge portion of the elastic portion 5 ca has a linear cross-sectional shape and is attached on the second step portion 4 b of the frame 4. For this reason, the edge 5 c mainly plays a role of elastically supporting the dome portion 5 a and the recessed portion 5 b with respect to the frame 4.

  The diaphragm 5 having the above configuration is characterized in that it is formed of a material mainly composed of polyether ether ketone having excellent heat resistance, fatigue resistance, impact resistance, and creep resistance. ing.

  In a preferred example, the diaphragm 5 includes an antistatic processing, a texture processing (unevenness forming processing), a mat processing (matte processing), a primer processing (for example, polyether ether ketone and a coating film). It is preferable that a coating process, a metal deposition process, or the like is performed for the purpose of improving the adhesion of the resin or the anti-rust property. Here, FIG. 3 shows a layer cross-sectional view of the diaphragm 5 subjected to the above-described various treatments. FIG. 3 is an enlarged cross-sectional view showing a part of the layer structure of an arbitrary part of the diaphragm 5 along the cutting line A-A ′ in FIG. 2. As shown in FIG. 3, the diaphragm 5 includes a polyether ether ketone 30 and a portion 31 on the surface of which various treatments described above are performed.

  For this reason, by applying the diaphragm 5 to the speaker device 100, the present embodiment exhibits the following specific operational effects as compared with the comparative example.

  Here, when the diaphragm having the above shape is manufactured using polyimide (PI) (comparative example), there are the following problems. Generally, when a diaphragm is molded using this polyimide (PI), the molding temperature is as high as 300 ° C. or higher. For this reason, when the diaphragm is molded, there is a problem that the antistatic agent and the like are thermally decomposed, and the antistatic agent and the like adhere to the mold for forming the diaphragm, and the mold is likely to become dirty. Therefore, it is necessary to clean the mold every time the diaphragm is manufactured, and the production efficiency of the diaphragm is lowered. As a result, a great deal of energy is required to increase the number of steps for producing the diaphragm. There is a problem of doing.

  In general, when polyether ether ketone is used as the resin material, the molding can be molded at a temperature extremely lower than the molding temperature of polyimide (PI) (300 ° C. or higher), that is, at a low temperature of about 145 ° C. or higher. In this regard, the diaphragm 5 according to the present embodiment is formed of a material mainly composed of polyether ether ketone having excellent heat resistance, fatigue resistance, impact resistance, and creep resistance. For this reason, at the time of molding of the diaphragm 5, there is no problem as in the comparative example described above. That is, in this embodiment, when the diaphragm 5 is molded, the antistatic agent or the like is not thermally decomposed, and the antistatic agent or the like hardly adheres to the diaphragm molding die. That is, the mold for forming the diaphragm is difficult to get dirty. Thereby, there is almost no need to clean the diaphragm mold each time the diaphragm is manufactured, so that the production efficiency of the diaphragm can be improved. That is, according to the present embodiment, the diaphragm 5 can be manufactured with the minimum necessary energy (for example, man-hours).

  Further, in this embodiment, there is an advantage that the forming time of the diaphragm can be shortened to about half as compared with the comparative example. For example, forming the diaphragm 5 having the above-described shape with a diameter of 30 mm using polyimide (PI) requires about 50 seconds under a molding temperature of about 330 ° C. There is an experimental result that molding of 5 using polyetheretherketone takes about 25 seconds under conditions of a molding temperature of about 145 ° C. As a result, in this embodiment, the molding time of the diaphragm can be reduced to about half compared to the comparative example.

  Further, as a practical range of the speaker device, the heat resistant limit temperature of the diaphragm using polyetherimide (PEI) is about 150 ° C. or less, while the heat resistant temperature of the diaphragm using polyether ether ketone is about 200 ° C. ~ 300 ° C. Therefore, the diaphragm 5 of the present embodiment is superior in heat resistance as compared with a diaphragm using polyetherimide (PEI).

  As described above, in this embodiment, since the diaphragm 5 is formed using a material mainly composed of polyether ether ketone, the moldability and productivity of the diaphragm 5 are good, and heat resistance and A diaphragm having excellent fatigue resistance and the like can be obtained. As a result, in the present embodiment in which the diaphragm 5 having such a constituent material is applied, it is possible to realize high power of the speaker device 100 and the like.

[Modification]
In the above embodiment, the elastic portion 5ca provided on the edge 5c of the diaphragm 5 is formed so as to have a substantially Ω-shaped cross-sectional shape. However, the present invention is not limited to this, and the present invention is shown in FIG. As described above, the elastic portion 5ca of the diaphragm 5 may be formed to have a linear cross-sectional shape.

It is sectional drawing which shows the structure of the speaker apparatus to which the diaphragm which concerns on the Example of this invention is applied. It is sectional drawing which shows the structure of the diaphragm which concerns on the Example of this invention. It is sectional drawing which shows the layer structure of the diaphragm which concerns on the Example of this invention. It is sectional drawing which shows the structure of the diaphragm which concerns on a modification.

Explanation of symbols

1 Yoke 2 Frame 3 Magnet 4 Plate 5 Diaphragm 5b Concave 6 Voice Coil 100 Speaker Device

Claims (4)

  A diaphragm for a speaker device having a concave portion for holding a voice coil and made of a material mainly composed of polyetheretherketone.   The diaphragm for a speaker device according to claim 1, wherein at least one of an antistatic processing, a texture processing, a mat processing, a primer processing, a coating processing, and a metal deposition processing is performed. . It has a dome part and an edge that form a substantially hemispherical shape,
Between the peripheral edge portion of the dome portion and the inner peripheral edge portion of the edge, the concave portion formed integrally with the dome portion and the edge is provided,
The speaker device diaphragm according to claim 1, wherein the voice coil is held in the recess.   A speaker device comprising the diaphragm for a speaker device according to any one of claims 1 to 3.

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