JP2007043050A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2007043050A5 JP2007043050A5 JP2005359591A JP2005359591A JP2007043050A5 JP 2007043050 A5 JP2007043050 A5 JP 2007043050A5 JP 2005359591 A JP2005359591 A JP 2005359591A JP 2005359591 A JP2005359591 A JP 2005359591A JP 2007043050 A5 JP2007043050 A5 JP 2007043050A5
- Authority
- JP
- Japan
- Prior art keywords
- green sheet
- cavity
- multilayer ceramic
- ceramic substrate
- shrinkage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Claims (32)
前記キャビティの開口部における開口面積が、前記キャビティの深さ方向中途位置における開口面積よりも小であり、
前記キャビティ内に電子デバイスが樹脂封止されていることを特徴とする多層セラミック基板。 A multilayer ceramic substrate having a plurality of ceramic layers laminated and having a cavity,
The opening area in the opening of the cavity is smaller than the opening area in the midway position in the depth direction of the cavity ,
An electronic device is sealed in the cavity with a resin .
前記キャビティの底面を構成する基板用グリーンシート上に収縮抑制材グリーンシート片を配し、前記収縮抑制材グリーンシート片上に前記キャビティを埋める形で前記各キャビティ形成用グリーンシートとは分離された埋め込み用グリーンシートを配し、さらに前記積層体の最外層となる基板用グリーンシートの表面にそれぞれ収縮抑制材グリーンシートを積層した状態で前記プレスを行った後、A shrinkage-suppressing material green sheet piece is disposed on a green sheet for a substrate constituting the bottom surface of the cavity, and the embedding is separated from each cavity-forming green sheet in such a manner that the cavity is filled on the shrinkage-suppressing material green sheet piece. After performing the press in a state in which the shrinkage-suppressing material green sheet is laminated on the surface of the green sheet for the substrate, which is the outermost layer of the laminate,
前記基板用グリーンシートの表面の収縮を抑制し、且つ前記埋め込み用グリーンシートのキャビティ開口部表面の収縮を抑制することなく焼成を行い、Firing without suppressing the shrinkage of the surface of the green sheet for the substrate and the shrinkage of the cavity opening surface of the green sheet for embedding,
焼成後に前記埋め込み用グリーンシートの焼成物を除去することを特徴とする多層セラミック基板の製造方法。A method for producing a multilayer ceramic substrate, wherein the fired product of the green sheet for embedding is removed after firing.
前記キャビティの底面を構成する基板用グリーンシート上に収縮抑制材グリーンシート片を配し、前記収縮抑制材グリーンシート片上に前記キャビティを埋める形で前記各キャビティ形成用グリーンシートとは分離された埋め込み用グリーンシートを配し、さらに前記積層体のキャビティ開口側の最外層基板用グリーンシートの表面にキャビティに対応した開口を有する収縮抑制材グリーンシートを積層した状態で前記プレスを行った後、焼成を行い、A shrinkage-suppressing material green sheet piece is disposed on a green sheet for a substrate constituting the bottom surface of the cavity, and the embedding is separated from each cavity-forming green sheet in such a manner that the cavity is filled on the shrinkage-suppressing material green sheet piece. After the pressing is performed in a state in which the green sheet for the shrinkage suppression material having the opening corresponding to the cavity is laminated on the surface of the green sheet for the outermost substrate on the cavity opening side of the laminate, And
焼成後に前記埋め込み用グリーンシートの焼成物を除去することを特徴とする多層セラミック基板の製造方法。A method for producing a multilayer ceramic substrate, wherein the fired product of the green sheet for embedding is removed after firing.
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005359591A JP3963328B2 (en) | 2005-04-19 | 2005-12-13 | Multilayer ceramic substrate and manufacturing method thereof |
KR1020060034914A KR100849455B1 (en) | 2005-04-19 | 2006-04-18 | Multilayer ceramic substrate and prduction method thereof |
TW095113715A TW200644757A (en) | 2005-04-19 | 2006-04-18 | Multilayer ceramic substrate and production method thereof |
US11/405,462 US7578058B2 (en) | 2005-04-19 | 2006-04-18 | Production method of a multilayer ceramic substrate |
EP06252137A EP1720203B1 (en) | 2005-04-19 | 2006-04-19 | Production method of a multilayer ceramic substrate |
DE602006011671T DE602006011671D1 (en) | 2005-04-19 | 2006-04-19 | Method for producing a multilayer ceramic substrate |
US12/149,193 US7733663B2 (en) | 2005-04-19 | 2008-04-29 | Multilayer ceramic substrate |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005121666 | 2005-04-19 | ||
JP2005192496 | 2005-06-30 | ||
JP2005359591A JP3963328B2 (en) | 2005-04-19 | 2005-12-13 | Multilayer ceramic substrate and manufacturing method thereof |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2007043050A JP2007043050A (en) | 2007-02-15 |
JP2007043050A5 true JP2007043050A5 (en) | 2007-03-29 |
JP3963328B2 JP3963328B2 (en) | 2007-08-22 |
Family
ID=37800716
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005359591A Expired - Fee Related JP3963328B2 (en) | 2005-04-19 | 2005-12-13 | Multilayer ceramic substrate and manufacturing method thereof |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3963328B2 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5019106B2 (en) * | 2007-03-27 | 2012-09-05 | Tdk株式会社 | Manufacturing method of multilayer ceramic substrate |
JP5333308B2 (en) * | 2009-05-11 | 2013-11-06 | 株式会社デンソー | Method for manufacturing ceramic laminate |
KR20110014415A (en) * | 2009-08-05 | 2011-02-11 | 삼성전기주식회사 | Manufacturing method of ceramic substrate |
JP6068164B2 (en) * | 2013-01-28 | 2017-01-25 | 京セラ株式会社 | Method for manufacturing ceramic laminate |
JP6076431B2 (en) * | 2014-09-25 | 2017-02-08 | 株式会社イースタン | Manufacturing method of semiconductor package substrate |
CN113573484B (en) * | 2021-09-23 | 2022-03-25 | 西安宏星电子浆料科技股份有限公司 | Small-batch rapid manufacturing method for LTCC (Low temperature Co-fired ceramic) substrates |
-
2005
- 2005-12-13 JP JP2005359591A patent/JP3963328B2/en not_active Expired - Fee Related
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW200644757A (en) | Multilayer ceramic substrate and production method thereof | |
JP2007043050A5 (en) | ||
WO2008146487A1 (en) | Circuit board and method for manufacturing the same | |
JP2006237078A (en) | Laminated electronic component and laminated ceramic capacitor | |
JP5012899B2 (en) | Multilayer ceramic substrate and manufacturing method thereof | |
JP5182367B2 (en) | Multilayer ceramic substrate and manufacturing method thereof | |
EP1806958A4 (en) | Ceramic multilayer substrate and its producing method | |
JP3709802B2 (en) | Manufacturing method of multilayer ceramic substrate | |
JP4788544B2 (en) | Multilayer ceramic substrate and manufacturing method thereof | |
JP3711883B2 (en) | Manufacturing method of multilayer ceramic substrate | |
WO2003036667A1 (en) | Multilayer ceramic electronic component manufacturing method | |
JP2023041842A5 (en) | ||
JP4277012B2 (en) | Multiple wiring board | |
WO2009050974A1 (en) | Process for manufacturing ceramic multilayer substrate with cavity | |
JP5356434B2 (en) | Manufacturing method of ceramic substrate | |
JP2000299561A (en) | Manufacture of ceramic multi-layer substrate | |
WO2009151006A1 (en) | Method for producing ceramic molded body | |
JP4517566B2 (en) | Method for manufacturing non-shrinkable ceramic multilayer substrate | |
JP4659368B2 (en) | Manufacturing method of multilayer electronic components | |
JP3876720B2 (en) | Manufacturing method of multilayer ceramic substrate with cavity | |
KR100511063B1 (en) | Method of manufacturing ceramic laminated body | |
JP2004034448A (en) | Method for manufacturing multi-layer ceramic substrate | |
JP5300527B2 (en) | Multilayer substrate and manufacturing method thereof | |
JP3912153B2 (en) | Manufacturing method of ceramic multilayer substrate | |
JP4419372B2 (en) | Method for manufacturing thin ceramic plate |