JP2007042864A - Prober and probing test method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To achieve a prober and a probing method which substantially improves the throughput with a simple configuration. <P>SOLUTION: The prober for connecting terminals of a tester to electrodes of a semiconductor device formed on a wafer 15 comprises a probe card 13 having probes 12, a wafer chuck 16 having temperature adjusting means for adjusting the temperature of parts for holding the wafer after holding the wafer, a wafer delivery mechanism, and a controller for controlling each part. The controller obtains test information including temperature conditions at the test of the wafers of the next lot to be housed in the next fed wafer cassette before finishing the test of the all wafers of the previous lot housed in the fed wafer cassette, and controls the temperature adjusting means of the wafer chuck just after finishing the test of all wafers of the previous lot according to test information of the wafers of the next lot. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a prober and a probing test method for connecting a die electrode to a tester in order to electrically inspect a plurality of semiconductor chips (dies) formed on a semiconductor wafer, and more particularly to a wafer chuck for holding a wafer. The present invention relates to a wafer prober and a probing test method in which a surface can be heated and cooled to perform inspection at a high temperature and a low temperature.

  In the semiconductor manufacturing process, various processes are performed on a thin disk-shaped semiconductor wafer to form a plurality of chips (dies) each having a semiconductor device (device). Each chip is inspected for electrical characteristics, then separated by a dicer, and then fixed to a lead frame and assembled. The inspection of the electrical characteristics is performed by a wafer test system composed of a prober and a tester. The prober fixes the wafer to the stage and brings the probe into contact with the electrode pad of each chip. The tester supplies power and various test signals from the terminals connected to the probe, and analyzes the signals output to the electrodes of the chip with the tester to check whether it operates normally.

  Semiconductor devices are used in a wide range of applications. There are also semiconductor devices (devices) that are used in a low temperature environment such as −50 ° C. and a high temperature environment such as 150 ° C. It is required to be able to perform inspection at Therefore, a wafer temperature adjusting mechanism for changing the surface temperature of the wafer chuck, such as a heater mechanism, a chiller mechanism, and a heat pump mechanism, is provided below the wafer mounting surface of the wafer chuck for holding the wafer in the prober. The wafer held on is overheated or cooled. In recent years, a prober capable of adjusting the temperature of a wafer in a wide temperature range, for example, −55 ° C. to + 200 ° C. has been realized.

  When the inspection is performed by overheating or cooling the wafer, it is important to set the wafer at a set temperature accurately and at high speed. If the error between the actual temperature of the wafer and the set temperature is large, there is a problem that accurate inspection cannot be performed. If the time until the wafer actually reaches the temperature after setting the temperature is long, the prober inspects during that time. This is not possible, resulting in a problem of reduced throughput.

  Patent Document 1 describes an inspection method and an inspection apparatus that accurately control the temperature of a non-inspection object.

  Patent Document 2 describes a configuration for improving throughput in a prober that performs inspection at a low temperature.

  Patent Document 3 describes a prober that controls the temperature of a wafer accurately and at high speed.

  As described above, probers that perform inspection by overheating or cooling a wafer are widely known, and thus further description thereof is omitted.

  In the mass production process, since several hundred chips are formed on one wafer, it usually takes 30 minutes or more to complete the inspection of all the chips formed on one wafer. It may take several hours to ten and several hours. The wafer to be inspected is supplied while being accommodated in a wafer cassette, and the prober takes out one wafer from the wafer cassette by the wafer transfer mechanism and places it on the wafer chuck for inspection. The wafer is returned from the wafer chuck to the wafer cassette by the wafer delivery mechanism, and when the inspection of all the wafers in the wafer cassette is completed, the wafer cassette is recovered. A general wafer cassette can accommodate ten to several tens of wafers, and it takes a very long time to complete the inspection of all the wafers in the wafer cassette. Usually, the wafer in one wafer cassette is referred to as one lot, so this term is also used here.

  Therefore, in the mass production process, a single operator manages a number of adjacent probers, supplies wafer cassettes that contain uninspected wafers, and collects wafer cassettes that contain inspected wafers. Yes. When the inspection of all the wafers in the wafer cassette (one lot) is completed, the prober notifies the end of the inspection by an indicator. When the operator recognizes the notification by the indicator, the prober removes the wafer cassette containing the inspected wafer, Next, a wafer cassette (next lot) containing a wafer to be inspected is set. At this time, the operator inputs the temperature at the time of inspection. Note that the temperature may be input by reading a barcode or the like attached to the wafer cassette.

  In addition, the arrangement and shape of the electrodes differ depending on the type of device. Therefore, the probe card provided with the probe that contacts the electrode of the device can be exchanged, and the probe card corresponding to the type of the device is attached for inspection. As described above, when the wafer cassette to be inspected next is replaced with the wafer cassette to be inspected next, when the wafer device to be inspected is different from the previously inspected wafer device and the probe card needs to be changed, the operator Replaces the wafer cassette as well as the probe card.

  When the probe card is replaced, the probe position is detected by the needle position detection mechanism and stored. When the wafer is chucked on the chuck stage, the position of the electrode of each chip (device) is detected on the wafer by the alignment imaging device, and the probe is brought into contact with the electrode based on the detected probe position data and electrode position data. Align so that.

  As described above, the supply and recovery of the wafer cassette is generally performed by an operator, but a system that automatically supplies and recovers the wafer cassette using a transfer robot has also been proposed. It has also been proposed to automatically replace the probe card. However, if it is automated, it is necessary to hold a large number in an idle state without using a very expensive probe card, and the cost performance is poor. It has not been realized because it is easily damaged and it is difficult to fully automate attachment and detachment.

JP-A-8-210881 (Overall) JP 2000-294606 A (Overall) Japanese Patent Application Laid-Open No. 2004-266666 (Overall)

  In the manufacturing process of a semiconductor device (device), the throughput is very important because it directly affects the manufacturing cost. Japanese Patent Application Laid-Open No. 2005-228561 shortens the setup time until the wafer actually reaches the temperature after setting the temperature to improve the throughput, and shortens the time for transferring the wafer between the wafer chuck and the wafer cassette. The configuration to be described is described. Japanese Patent Application Laid-Open No. H10-228561 describes a configuration for shortening the time for transferring a wafer between a wafer chuck and a wafer cassette.

  As described above, in a mass production process, since a large number of wafers are stored in a wafer cassette and inspected, it generally takes a very long time to complete the inspection of all the wafers in the wafer cassette. Met. Reduction of the wafer transfer time between the wafer chuck and the wafer cassette has an effect of improving the throughput every time the wafer is transferred. In addition, the shortening of the setup time can effectively improve the throughput because the original setup time is long.

  As described above, various configurations for improving throughput have been proposed in conventional probers that perform inspection by overheating or cooling, but the present invention focuses on the processing flow of the actual semiconductor manufacturing process. An object of the present invention is to realize a new prober and probing method that improves throughput with a simple configuration.

  In order to achieve the above object, the prober and the probing method of the present invention are accommodated in the wafer cassette to be supplied next before the inspection of all the wafers in the previous lot accommodated in the wafer cassette is completed. Obtain inspection information including the temperature conditions at the time of inspection of the wafer of the next lot, and immediately start the wafer chuck temperature adjustment according to the inspection information of the wafer of the next lot immediately after the inspection of all the wafers of the previous lot is completed. Features.

  That is, the prober of the present invention is a prober for connecting each terminal of the tester to the electrode of the semiconductor device in order to inspect the semiconductor device formed on the wafer by the tester, and to the electrode of the semiconductor device. A probe card having a probe that contacts and connects the electrode to a terminal of the tester; a wafer chuck having temperature adjustment means for holding a wafer and adjusting a temperature of a portion holding the wafer; a wafer cassette and the wafer A wafer transfer mechanism for transferring the wafer between the chucks and a control unit for controlling each unit, and the control unit completes the inspection of all wafers in the previous lot accommodated and supplied in the wafer cassette. Before the inspection, the inspection information including the temperature condition at the time of inspection of the wafer of the next lot accommodated in the wafer cassette to be supplied next is obtained. Accordance examination information of the wafer following the lot immediately after the inspection of all the wafers of Tsu bets has been completed, and controlling the temperature adjusting means of the wafer chuck.

  The probing method of the present invention is a probing test method in which wafers accommodated in a wafer cassette are held on a temperature-adjustable wafer chuck and sequentially inspected by a tester, which are accommodated in the wafer cassette and supplied. Before the inspection of all the wafers in the previous lot is completed, the inspection information including the temperature conditions at the time of inspection of the wafers in the next lot stored in the wafer cassette to be supplied next is obtained. Immediately after the inspection of the wafer is completed, the temperature adjustment of the wafer chuck is started according to the inspection information of the wafer of the next lot.

  Patent Documents 2 and 3 describe the setup time and the shortening of the wafer delivery time between the wafer chuck and the wafer cassette. After all wafers in the wafer cassette have been inspected, the next wafer cassette is described. There is no description about the effective use of the time until replacement.

  As described above, in the semiconductor manufacturing process, a large number of probers are arranged adjacent to each other, and one operator monitors an indicator of the completion of the inspection of each prober to collect the inspected wafer cassette and supply the pre-inspection wafer cassette. Furthermore, the probe card is replaced as necessary, and inspection information including temperature conditions at the time of inspection is set. The shortening techniques described in Patent Documents 2 and 3 are applied after setting inspection information by an operator.

  Even if the operator notices the indicator and immediately starts the above operation, after performing operations such as selecting a pre-inspection wafer cassette and selecting a probe card, the actual replacement operation is performed, and the inspection information for the next lot is set. Need to do. Although the time required for selecting the wafer cassette and the probe card can be eliminated by the device in the process, it takes time until the inspection information of the next lot is set after each prober completes the inspection. Also, the operator does not always monitor the indicator, but is doing other work such as preparing the next wafer cassette, even if you notice the indicator, you can not immediately start the replacement work, The time until inspection information for the next lot is set becomes longer.

  According to the present invention, as soon as the inspection of the last wafer of the previous lot is completed, the temperature adjustment of the wafer chuck is started according to the inspection information of the wafer of the next lot. The time required for temperature adjustment can be shortened by effectively using the time until the inspection information is set.

  In the conventional prober, even if the inspection of the last wafer is completed, the last wafer is returned to the wafer cassette without being notified immediately by the indicator, the wafer cassette is closed, and the wafer cassette can be removed. Since then, it has been informed by an indicator, and it took time from the end of the inspection to the notification by the indicator. According to the present invention, this time is also used for temperature adjustment.

  In the system that automatically supplies and collects the wafer cassette using the transfer robot, the inspection information of the next lot is set when the wafer cassette is supplied. There is a time from the end of the inspection to the setting of inspection information for the next lot, and if the present invention is applied, this time can be used effectively to improve the throughput.

  When several tens of wafers are accommodated in the wafer cassette as in the prior art, it takes a long time to inspect all the wafers in the wafer cassette. Short and ignored. However, in recent years, in semiconductor manufacturing, the tendency of high-mix low-volume production is remarkable, and accordingly, the number of wafers stored in the wafer cassette and supplied to the prober tends to decrease. In some cases, wafers are accommodated, and the time for inspecting all the wafers in the wafer cassette is about one hour. When the temperature is changed, the setup time may be as long as one hour at a long time, which is a big problem. By applying the present invention, the setup time can be substantially shortened.

  Moreover, the present invention can be realized with a very simple configuration by adding a simple function to a conventional prober or using a conventional function.

  The wafer chuck temperature adjustment immediately after all wafers in the previous lot have been inspected is normally controlled so as to meet the temperature conditions during the inspection of the wafer in the next lot. In contrast, when the probe card is inspected at a low temperature and the probe card is replaced, control to bring the wafer chuck to room temperature is started to prevent condensation.

  Moreover, when the probe card is replaced, it is necessary to detect the position of the probe with the needle position detection mechanism. This detection operation was started after the probe card was replaced, the inspected wafer cassette was collected, the pre-inspection wafer cassette was set, and the inspection information was set. However, the detection operation was performed after the probe card was replaced. It is desirable to start automatically when it is ready to perform.

  It is desirable to notify that the inspection end is approaching before the inspection of all wafers in the previous lot is completed. For example, when the inspection of the last wafer in the previous lot is started, the inspection end is approaching. To be notified. The operator inputs inspection information in response to this notification, but may be any time before the inspection of all wafers in the previous lot is completed. For example, when supplying the wafer cassette of the previous lot, the operator already inspects the next lot. If the information is known, it can be input to the prober at that time.

  When the prober is connected to the host computer by communication means, the host computer is notified via the communication means that the end of the inspection is approaching, and the host computer notifies the operator by some means, for example, display display. It is also possible to notify. Further, the inspection information of the next lot may be transmitted from the host computer to the prober via the communication means.

  As described above, the inspection information of the next lot to the prober is preferably input before the inspection of all wafers of the previous lot is completed, but before the wafer cassette of the next lot is set. The throughput is improved as compared with the prior art by the time from the input of the inspection information to the setting of the wafer cassette.

  According to the present invention, in a prober and a probing method for performing inspection by overheating or cooling, the throughput can be substantially improved with a very simple configuration.

  FIG. 1 is a diagram showing a configuration of a wafer test system having a prober according to the first embodiment of the present invention. The prober 11 includes a probe card 13 having a probe 12 made according to the electrode arrangement of a semiconductor chip to be tested, a wafer chuck 16 that holds a wafer 15, a moving mechanism 17 that moves the wafer chuck 16, and a moving mechanism 17. A base 18 for holding the wafer, an alignment camera 19 for detecting the arrangement direction of the dies formed on the wafer, a needle position detection camera 23 for detecting the position of the probe 12, and a surface of the wafer chuck 16 such as a heat pump mechanism. And a wafer temperature control mechanism 21 for changing the temperature. The indicator 22 is provided on the housing 20.

  The tester includes a tester body 1, a test head 2, and a performance board 3 having terminals that are in electrical contact with terminals of a probe card 13 provided on the test head 2. For maintenance and the like, the test head 2 can be separated from the prober 11, and the terminals of the probe card 13 and the performance board 3 have a connection terminal mechanism using a spring, that is, a so-called spring pin structure. The prober performs measurement in cooperation with the tester in the wafer test, but its power supply system and mechanism are independent from the tester body and the test head.

  The wafer temperature control mechanism 21 can set the wafer 15 held by the wafer chuck 16 to an arbitrary temperature from −55 ° C. to + 200 ° C., for example. The wafer temperature control mechanism 21 can be realized by a combination of an electrical heating element (heater), a chiller mechanism for circulating coolant, and the like other than the heat pump mechanism.

  Although not shown, a wafer transfer mechanism is provided for transferring the wafer between the wafer chuck 16 moved to the position indicated by the broken line and the mounted wafer cassette. Further, a dry gas supply mechanism for supplying a dry gas as described in Patent Document 2 is also provided so that condensation does not occur when the wafer chuck 16 is cooled. Further, the prober is provided with an operation panel and a display as in the prior art, and inspection information is input using this.

  The configuration of the prober of the embodiment described above is basically the same as the conventional example described in detail in Patent Documents 1 to 3 and the like, and the present invention is characterized by temperature control in the configuration of the conventional example. In other words, the present invention can be applied to any prober having a temperature adjustment function, and is not limited to the configuration of the above-described embodiment. Therefore, description of the same configuration as the conventional one is omitted here, and only temperature control will be described.

  FIG. 2 is a flowchart showing the configuration of a control unit that controls the entire prober including the wafer temperature control mechanism 21 of the prober of the embodiment. The control unit is realized by a computer system, for example.

  In step 101, the previous lot is inspected according to the set inspection information. This operation is continued until the final wafer inspection is completed.

  In step 102, it is determined whether the inspection of the last wafer has been started. If it has not been started, the process returns to step 101 to proceed with the inspection. When the inspection of the last wafer is started, the process proceeds to step 103, and the indicator 22 notifies the operator that the inspection of the last wafer has started. The notification can also be performed by a speaker or the like.

  The operator notices the above notification and inputs inspection information for the next lot. As described above, it usually takes at least 30 minutes to inspect one wafer. After the operator notices the notification, the next lot of the next lot is taken into consideration at the appropriate time in consideration of the relationship with other operations. Enter inspection information. Note that when the inspection of the last wafer of the previous lot is started, the next lot to be inspected next by the prober is usually determined. If the next lot is not determined, the present invention is not applicable.

  In step 104, the inspection information of the input next lot is stored. In step 105, it is detected whether the inspection of the last wafer has been completed. When the inspection of the last wafer is completed, an indicator notifies that the inspection of the last wafer has been completed in step 106. The inspection of the last wafer is started and the inspection of the last wafer is finished, for example, by changing the display color of the indicator.

  When the operator notices the notification of the end of the inspection of the last wafer, the operator collects the wafer cassette of the previous lot and sets the wafer cassette of the next lot. This work should be done as soon as possible, but if the next lot changes temperature, it takes time to change the temperature, so there is some time to spare. Considering this relationship, the wafer cassette of the previous lot is collected and the wafer cassette of the next lot is set at an appropriate time. When the operator sets the wafer cassette of the next lot, the operator is notified of the setting by some means.

  The probe card 13 is replaced when the wafer cassette of the previous lot is collected and the wafer cassette of the next lot is set. However, as will be described later, when the probe card 13 is replaced, the housing 20 needs to be opened, and condensation may occur when the chuck stage 16 is at a low temperature. Therefore, in that case, the probe stage 13 is replaced with the chuck stage 16 once at room temperature, so it is necessary to wait until it reaches room temperature, and the collection of the wafer cassette of the previous lot and the setting of the wafer cassette of the next lot are also adjusted at that time. It is desirable to do this. When the operator replaces the probe card, the operator notifies the prober by some means.

  In step 107, it is determined whether the probe card 13 needs to be replaced in order to inspect the next lot based on the inspection information. When the probe card 13 does not need to be replaced, the process proceeds to step 108, and the wafer temperature control mechanism 21 is controlled so as to change the chuck stage 16 to a temperature for inspecting the next lot based on the inspection information. The time required for the temperature change depends on the start temperature and the end temperature of the temperature change, but it may take 30 minutes to 1 hour.

  When the probe card 13 needs to be replaced, the routine proceeds to step 111, where it is determined whether the temperature at that time (in other words, the inspection temperature of the previous lot) is low, specifically, whether the temperature is a predetermined temperature lower than room temperature.

  When the temperature is not low, the process proceeds to step 112, and the wafer temperature control mechanism 21 is controlled so as to change the chuck stage 16 to a temperature for inspecting the next lot based on the inspection information. While the temperature of the chuck stage 16 is changing, the operator replaces the probe card 13 for the next lot as described above. Therefore, in step 113, it is determined whether the probe card 13 has been replaced. stand by. When the probe card 13 is replaced, the process proceeds to step 114, and an operation for detecting the position of the probe 12 by the needle position detection camera 23 is performed. Also during this time, the temperature change of the chuck stage 16 proceeds.

  When it is determined in step 111 that the temperature is low, the process proceeds to step 121 and the wafer temperature control mechanism 21 is controlled so that the chuck stage 16 is changed to room temperature. In step 122, it is detected whether the room temperature has been reached, and the system waits until the room temperature is reached. When the temperature reaches room temperature, the process proceeds to step 123, and an indicator informs that the probe card 13 is in a replaceable state. In step 124, it is detected whether the probe card 13 has been replaced, and waits until it is replaced. When the probe card 13 is replaced, the process proceeds to step 125, and the wafer temperature control mechanism 21 is controlled so as to change the chuck stage 16 to a temperature at which the next lot is inspected based on the inspection information. While the temperature of the chuck stage 16 is changing, the process proceeds to step 126, and an operation of detecting the position of the probe 12 by the needle position detection camera 23 is performed. Also during this time, the temperature change of the chuck stage 16 proceeds.

  After steps 108, 114, and 126, the process proceeds to step 131 to load a wafer from the wafer cassette of the next lot set by the operator. In step 132, it is detected whether or not the wafer 15 on the chuck stage 16 is at the inspection temperature, and it waits until it reaches the inspection temperature. When the inspection temperature is reached, the inspection is started in step 133.

  The operation of the prober of the present invention used in the embodiments has been described above, but it goes without saying that various modifications are possible.

  For example, in the above embodiment, when the inspection of the last wafer of the previous lot is started, it is notified that the inspection end is approaching, but any time before the inspection of all the wafers of the previous lot is completed. Good. For example, if the inspection information of the next lot is already known when supplying the wafer cassette of the previous lot, it can be input to the prober at that time.

  Further, it is desirable that the inspection information of the next lot to be input to the prober is before the inspection of all the wafers of the previous lot is completed, but even after the inspection is completed, before the setting of the wafer cassette of the next lot. If there is, it is desirable to enter inspection information for the next lot. For example, when the wafer cassette of the next lot is not ready, the inspection information of the next lot is input for the time being, the temperature change of the chuck stage is started, and when the wafer cassette of the next lot is ready, If set, the time for temperature change of the chuck stage can be shortened by the time from the input of inspection information to the setting of the wafer cassette.

  Further, although the prober of the embodiment is a stand-alone type, it can be considered that a large number of probers are arranged adjacent to each other and connected to a host computer (overall control unit) via a communication path for management. In such a case, the prober sends information to the host computer via the communication path that the inspection start and end of the last wafer of the previous lot and the probe card can be exchanged, and the host computer instructs the operator. It is also possible to perform. It is also possible to send the inspection information from the host computer to the prober via a communication path.

  In the above embodiment, the operator has performed the collection of the wafer cassette of the previous lot and the setting of the wafer cassette of the next lot, but it is also possible to apply this to a wafer test system that uses a transfer robot. FIG. 3 is a diagram showing the overall configuration of the wafer test system according to the second embodiment of the present invention.

  As shown in the figure, a plurality of probers 11A, 11B, 11C,... Are arranged, and these probers are connected to the overall control unit (host computer) 31 via the communication path 35 and controlled. A pre-inspection wafer cassette stocker 32 for accommodating a wafer cassette containing a pre-inspection wafer and an inspected wafer cassette stocker 33 for accommodating a wafer cassette containing a post-inspection wafer are also connected to the host computer 31 via a communication path 35. Controlled. The transfer robot 34 is connected to and controlled by the host computer 31 by wireless communication means or the like.

  In response to an instruction from the host computer 31, the transfer robot 34 takes out the wafer cassette containing the designated pre-inspection wafer from the pre-inspection wafer cassette stocker 32, conveys the wafer cassette to the designated prober, and inspects the inspected wafer from the prober. The wafer cassette containing the wafer is collected, the wafer cassette containing the pre-inspection wafer is set, and the wafer cassette containing the inspected wafer is transferred to the inspected wafer cassette stocker 33.

  Each prober transmits from the prober to the host computer 31 via the communication path 35 that the inspection of the last wafer of the previous lot is started and ended, and that the probe card is replaceable. On the other hand, the host computer 31 transmits the inspection information of the lot to be inspected by each prober to the prober via the communication path before the inspection of the last wafer of the previous lot being inspected by each prober is completed. The host computer 31 controls the transfer robot 34 based on the information from each prober and the process information, collects the wafer cassette containing the inspected wafers from each prober, and wafers containing the wafers before inspection of the next lot. Set the cassette. Each prober performs the same control as in the first embodiment, and controls to start the change to the inspection temperature of the next lot as soon as the inspection of the last wafer of the previous lot is completed.

  In the wafer test system of the second embodiment, one transfer robot 34 performs the collection of the wafer cassette containing the inspected wafers from each prober and the setting of the wafer cassette containing the pre-inspection wafer of the next lot. Even if collection and setting of wafer cassettes are requested in duplicate from a plurality of probers, they cannot be processed at the same time, resulting in a time delay and a decrease in throughput. However, according to the present invention, even during this time delay, each prober starts to change to the inspection temperature of the next lot, so that the influence of the time delay on the throughput can be reduced.

  The present invention can be applied to any prober and probing method for inspecting a wafer under various temperature conditions. By applying the present invention, the throughput of a prober that needs to perform a time-consuming temperature change can be improved very easily, so that the inspection cost can be reduced.

It is a figure which shows the structure of the wafer test system which has the prober of 1st Example of this invention. It is a flowchart which shows operation | movement of the prober of 1st Example of this invention. It is a figure which shows the structure of the wafer test system of 2nd Example of this invention.

Explanation of symbols

2 Test Head 11 Prober 12 Probe 15 Wafer 16 Chuck Stage 19 Alignment Camera 20 Housing 21 Wafer Temperature Control Mechanism 23 Needle Positioning Camera

Claims (12)

A prober for connecting each terminal of the tester to an electrode of the semiconductor device in order to inspect the semiconductor device formed on the wafer by a tester,
A probe card having a probe that contacts the electrode of the semiconductor device and connects the electrode to a terminal of the tester;
A wafer chuck having a temperature adjusting means for holding the wafer and adjusting the temperature of the portion holding the wafer;
A wafer delivery mechanism for delivering the wafer between a wafer cassette and the wafer chuck;
A control unit for controlling each unit,
The controller controls the temperature at the time of inspection of the wafers of the next lot to be supplied next before the inspection of all the wafers of the previous lot received and supplied to the wafer cassette is completed. A prober that obtains inspection information including conditions and controls the temperature adjusting means of the wafer chuck according to the inspection information of the wafers of the next lot immediately after the inspection of all the wafers of the previous lot is completed.   The said control part controls the said temperature adjustment means of the said wafer chuck so that it may become the temperature conditions at the time of the test | inspection of the wafer of the next lot immediately after completion | finish of the test | inspection of all the wafers of the previous lot. Prober.   The prober according to claim 1, wherein prober replacement information relating to presence / absence of replacement of the probe card is obtained together with the temperature condition information.   When the probe card needs to be replaced and the temperature at the time of inspection of the wafers in the previous lot is a low temperature below a predetermined value, the control unit is set to room temperature immediately after the inspection of all the wafers in the previous lot is completed. 4. The prober according to claim 3, wherein the temperature adjusting means of the wafer chuck is controlled. A needle position detection mechanism for detecting the position of the probe of the probe card;
When the probe card needs to be replaced, the control unit activates the needle position detection mechanism and automatically starts the probe position detection operation after the probe card is replaced. Item 4. The prober according to item 3.   The prober according to any one of claims 1 to 5, wherein the control unit notifies that the end of inspection is approaching before the inspection of all the wafers of the previous lot is completed.   The prober according to claim 6, wherein when the inspection of the last wafer of the previous lot is started, the control unit notifies that the end of inspection is approaching.   The prober according to claim 7, further comprising an indicator for notifying that the end of the examination is approaching.   9. The prober according to claim 1, further comprising input means for inputting the inspection information.   The prober according to claim 7, further comprising a communication unit connected to the host computer, and notifying the host computer that the end of inspection is approaching.   The prober according to claim 9, further comprising a communication unit connected to a host computer, wherein the inspection information input unit obtains the inspection information from the host computer via the communication unit. A probing test method in which wafers stored in a wafer cassette are held on a temperature-adjustable wafer chuck and sequentially inspected by a tester,
Inspection information including temperature conditions at the time of inspection of wafers in the next lot to be supplied next before the inspection of all wafers in the previous lot received and supplied in the wafer cassette is completed And the temperature adjustment of the wafer chuck is started according to the inspection information of the wafer of the next lot immediately after the inspection of all the wafers of the previous lot is completed.

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