JP2007032535A - Vacuum pump device and its controller - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a vacuum pump device having a reduced size with no vibration by efficiently removing the heat of a control circuit board built in a controller without relying on a conventional forcible air/water cooling system. <P>SOLUTION: The controller 3 with the built-in control circuit board 34 mounted outside a pump body 2 for controlling the operation thereof comprises a heat sink 4 covering the periphery of the controller 3 and having a plurality of fins 43, 43 lined on the outer wall face. The direction of the fins 43 is inclined to a rotational center axis L of the pump body 2, and a number of vent holes 36, 36 are opened to a back panel 31-2 and a bottom panel 31-2 of a controller case 31. Thus, even when the pump body 2 has any attitude relative to a vacuum chamber 10, the radiating surfaces of the fins 43 are directed obliquely upward to easily cause natural convection of air flowing between the fins 43, 43 and surely escape hot air in the case from the vent holes 36 to the outside, improving the efficiency of radiating the higher-temperature controller 3. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a vacuum pump device and a controller thereof used in, for example, equipment such as a semiconductor manufacturing apparatus, an electron microscope, and a mass spectrometer.

  Conventionally, in various devices as described above, a vacuum pump device has been used to create a high vacuum in the vacuum chamber. This type of vacuum pump device controls a pump body attached to the vacuum chamber and its operation. It is configured with a controller. As a pump body, a turbo molecular pump is generally known. In this turbo molecular pump, a rotor is rotatably supported in a pump case, and radial and multistage rotor blades are provided on the outer wall surface of the rotor. A plurality of stages of stator blades positioned between the rotor blades are arranged on the inner wall surface of the pump case facing each other. When the rotor controlled by the controller is rotated at a high speed after the inside of the vacuum chamber has been decompressed to some extent, the gas molecules colliding with the rotating rotor blades and the fixed stator blades are given momentum and exhausted. By this evacuation operation, gas molecules sucked into the pump body from the vacuum chamber are exhausted while being compressed, and a predetermined high degree of vacuum is formed in the vacuum chamber.

  By the way, in such a vacuum pump apparatus, a control circuit board for mainly controlling the rotation operation of the rotor is built in the controller. The elements that make up the electronic circuit are mounted on the control circuit board, but there are elements that generate heat during operation, such as transistors and resistors, which are controlled by the heat of these elements during operation of the pump body. The circuit board becomes very hot. Thus, if the operation of the pump body is continued with the control circuit board heated to a high temperature by the element that generates heat, the life of the element will be significantly reduced due to the heat, and it will lead to the failure of the controller. The main unit cannot be operated normally. Therefore, in the vacuum pump device, it is essential to remove the heat of the control circuit board built in the controller.

  As a method, a cooling fan is installed inside the controller and the air from the cooling fan is directly applied to the control circuit board for forced air cooling, or the hot air in the housing is exhausted to the outside and cooled. Although known, the air cooling method using these cooling fans has the following problems. For example, when the above-described vacuum pump device is attached to a vacuum chamber of a measuring instrument that requires a vibration-proof environment such as an electron microscope, the vibration of the pump body must be suppressed as much as possible because the vibration is a great enemy. Therefore, a magnetic bearing is adopted as a structure for supporting a rotating rotor which is a generation source of vibration, and mechanical contact is eliminated to reduce the vibration of the pump body. However, when a cooling fan is installed inside the controller as described above, the vibration of the motor that drives the cooling fan is transmitted to the pump main body via the controller, and the vibration of the pump main body is transmitted to the measuring device. Therefore, it is not particularly desirable to employ a forced air cooling method using a cooling fan that causes vibration, particularly in a vacuum pump device that requires low vibration.

  On the other hand, Patent Document 1 below discloses a method for cooling a controller without using a cooling fan. The method is to connect the pump body and the controller with a connection connector and to install a cooling jacket closely attached to both. And cooling water is poured into piping in this cooling jacket, and a controller is water-cooled via a cooling jacket. However, according to the water-cooling method using this cooling jacket, piping equipment for flowing cooling water is required separately, and the vacuum pump device becomes larger and the handling becomes worse. In addition, there is a drawback that the running cost increases because the cooling water must be continuously supplied during operation of the pump body.

JP-A-11-173293

  The present invention has been made in view of such circumstances, and an object of the present invention is to efficiently remove the heat of the control circuit board built in the controller without using the conventional forced air cooling or water cooling method. Thus, it is an object of the present invention to provide a vacuum pump device and a controller thereof that can be reduced in size with less vibration.

  In order to achieve the above object, a vacuum pump device according to the present invention is attached to a vacuum chamber, and a pump body that sucks and exhausts gas molecules in the vacuum chamber, and is mounted outside the pump body. A controller with a built-in control circuit board that controls the operation of the pump body, and a plurality of fins that cover the periphery of the controller, contact the control circuit board, conduct heat, and align the heat on the outer wall surface. A heat sink that dissipates heat, so that the orientation of the fins of the heat sink is inclined with respect to the rotation center axis of the pump body regardless of the mounting posture of the pump body with respect to the vacuum chamber. It is characterized by that.

  In order to achieve the same object, the controller of the vacuum pump device according to the present invention is detachably mounted outside the pump body of the vacuum pump device, and controls the operation of the pump body. A heat sink that contacts the circuit board to conduct heat and dissipates the heat to the outside air from a plurality of fins aligned on the outer wall surface, and the direction of the fins of the heat sink is inclined with respect to the rotation center axis of the pump body It is characterized by the fact that it is in a state that has been changed.

  On the other hand, as another embodiment, the vacuum pump device according to the present invention is attached to a vacuum chamber, and is attached to the outside of the pump main body, a pump main body for sucking and exhausting gas molecules in the vacuum chamber, A controller with a built-in control circuit board for controlling the operation of the pump body; a controller case that covers the periphery of the controller and has a vent hole for venting the hot air heated by the heat of the control circuit board to the outside; , Provided.

  The controller of the vacuum pump device according to the present invention is detachably mounted outside the pump body of the vacuum pump device, covers a control circuit board for controlling the operation of the pump body, and surrounds the control circuit board. And a controller case having a vent hole through which hot air heated to high temperature by the heat of the circuit board is vented to the outside.

  In the vacuum pump apparatus and its controller, as a specific mode, the heat sink has fins on both sides inclined at an arbitrary angle on the outer plate facing the outside air, and connects the intersections of the fins on both sides. It is possible to adopt a configuration in which a communication passage through which air passes is formed at the position. Similarly, the heat sink has fins on both sides that are inclined at an arbitrary angle on the inner plate facing the pump body, and a communication path through which air passes through at the intersection of the fins on both sides. May be formed. According to such a configuration, natural convection of the air that flows between the fins on both sides through the fins to the outside air is likely to occur, and the heat exchange efficiency between the heat sink and the outside air that is heated is increased.

  Further, as another aspect, the heat sink can adopt a configuration in which the tips of the fins of the inner plate facing the pump main body are extended along the outer shape of the pump case. When this configuration is adopted, the pump case can be removed while the controller is mounted, so that the assembling workability of the pump is improved.

  In the above vacuum pump device, if the pump mechanism inside the pump body is a magnetic bearing type rotating body, the vacuum pump device can be mounted in a horizontal posture with respect to the vacuum chamber. The advantage of the present invention that the same air cooling action can be obtained without lowering the heat dissipation performance even if the mounting posture is changed is utilized.

  According to the vacuum pump device and the controller thereof according to the present invention, regardless of the mounting posture of the pump body with respect to the vacuum chamber, the heat radiating surface of the fin of the heat sink covering the periphery of the controller faces obliquely upward, and the gap between the fins Natural convection of the flowing air is likely to occur, and the heat is released from the vent hole of the controller case to the outside, so that the heat dissipation efficiency of the controller having a high temperature is greatly improved. Therefore, a sufficient air cooling effect can be obtained without installing a cooling fan inside the controller as in the conventional forced air cooling method, and thus the air cooling fan can be eliminated. As a result, the vibration due to the mechanical operation is completely eliminated, and a vacuum pump device requiring low vibration performance can be realized, and the controller can be downsized at the same time. Compared to the conventional water-cooling method, there is no need for a separate piping facility, and the handling workability is excellent and the running cost can be reduced.

  Further, in the vacuum pump device and its controller according to the present invention, by adopting a configuration in which the tip of the fin of the inner plate of the heat sink is extended along the outer shape of the pump case, the pump case can be removed while the controller is mounted. As a result, the assembly workability of the pump is improved. For this reason, the maintenance work of the pump body can be easily performed, the time required for the assembly work can be shortened, and the cost can be reduced.

  Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings. 1 is a front view showing the appearance of the vacuum pump device, FIG. 2 is a left side view of the device, FIG. 3 is a top view of the device, FIG. 4 is a bottom view of the device, and FIG. 5 is a rear view of the device. FIG. 6 is an enlarged plan view showing a modification of the apparatus, FIG. 7 is a partially enlarged sectional view of the apparatus, and FIG. 8 is an explanatory view showing the mounting posture of the apparatus.

  The vacuum pump device 1 of the present embodiment is used as a means for making the inside of a vacuum chamber 10 (see FIG. 8) of a target device such as a semiconductor manufacturing device, an electron microscope, and a mass spectrometer high vacuum. As shown in FIG. 1, the vacuum pump device 1 includes a pump body 2 that sucks and exhausts gas molecules from a vacuum chamber 10, a controller 3 that controls the operation of the pump body 2, and a heat sink 4 that removes heat from the controller 3. And are integrated.

  The pump body 2 has a structure in which a cylindrical pump case 22 is covered on a base 21 and a bottom opening of the base 21 shown in FIG. A flange 24 is provided on the bottom periphery of the pump case 22, and the flange 24 is placed on the base 21 and fastened with bolts 52, 52,... At equal intervals in the circumferential direction as shown in FIG. The pump case 22 is detachably attached to the base 21. The upper opening portion of the pump case 22 is a gas molecule intake port 25, and the gas molecule exhaust port 26 is opened on the side surface of the base 21. In addition, a pump mechanism (not shown) including a turbo molecular pump or the like is built in the pump case 22, and gas molecules sucked from the intake port 25 are transferred by the pump mechanism while being compressed. Is exhausted from the exhaust port 26 to the outside of the pump body 2. A well-known pump mechanism can be applied to the internal structure of the pump case 22 and is not related to the gist of the present invention.

  On the other hand, the controller 3 controls the operation of the pump mechanism of the pump main body 2. As shown in FIG. 1, serial communication is performed as an interface 32 for connecting various peripheral devices to the front panel 31-1 constituting the controller case 31. RS232C port, RS422 port, mini DSUB connector, etc. are provided. Further, in the vicinity thereof, there is a display unit 33 composed of LEDs, and the operation status of the controller 3 is displayed. In FIG. 1, three LEDs light up and display the power on / off of the controller 3 and the normal / abnormal communication state between the controller 3 and peripheral devices.

  As shown in FIG. 7, a control circuit board 34 for mainly controlling the rotation operation of the rotor is accommodated in the controller case 31. Although two control circuit boards 34 are installed in the figure, in order to reduce the thickness of the controller 3, the two control circuit boards 34 and 34 are arranged upright inside the controller case 31.

  In the controller 3 having the above-described configuration, the periphery of the controller case 31 is covered with the heat sink 4, and the heat dissipation is enhanced by natural air cooling. The heat sink 4 is made of a metal material having high thermal conductivity. As shown in FIG. 7, the control circuit board 34 built in the controller 3 is fixed to the inner wall surface with screws 53 to conduct heat, and the heat is radiated to the outside air. In order to achieve this, a plate type in which a plurality of fins 43, 43,. The heat sink 4 is composed of two plates, an outer plate 41 that faces the outside air and an inner plate 42 that faces the pump body 2, and the outer plate 41 is placed on the outside so as to be exposed to the outside air in as wide an area as possible. Curved towards. The controller case 31 is sandwiched from the outside and inside by the outside plate 41 and the inside plate 42, both plates are fixed to the controller case 31 by bolts 54 and the plates are connected by bolts 55, and the controller 3 and the heat sink 4 are connected to each other. It is integrated.

  In such a plate-type heat sink 4, the heat dissipation performance is greatly affected by the flow of air passing between the fins 43, 43. Therefore, in this embodiment, the direction of the fins 43 is set as follows. Natural convection is likely to occur. That is, when the outer plate 41 is viewed from the front as shown in FIG. 2, the direction of the fins 43 is inclined at a predetermined angle with respect to the rotation center axis L of the pump body 2. In this embodiment, the tilt angle is set to 45 degrees so that the heat radiating surface of the fin 43 faces obliquely upward, regardless of whether the pump body 2 is mounted vertically or horizontally with respect to the vacuum chamber 10. More specifically, the fins 43 having the same height are formed on the left and right sides of the outer plate 41, but the left fin 43-1 and the right fin 43-2 are at an arbitrary angle (90 degrees in this embodiment). ), And a communication passage 44 through which air passes is formed at a central position connecting the intersections of the fins on both sides.

  On the other hand, as shown in FIG. 3, the inner plate 42 is provided with a plurality of fins 43 aligned in the vertical direction, but the heights of the fins 43 are different. In order to improve heat dissipation, it is necessary to increase the height of the fins 43 as much as possible. However, if the height of the fins 43 is increased toward the pump body 2 side, it becomes an obstacle when the pump case 22 is assembled. The tips of the 42 fins 43-3 extend to the front of the flange 24 so as to follow the outer shape of the pump case 22, respectively.

  In addition, about the structure of the inner side plate 42, you may deform | transform into the fin shape shown in FIG. 6 instead of the fin shape shown in FIG. The shape of FIG. 6 is the same as the outer plate 41, but the fins 43 of the inner plate 42 are also inclined, and the fins 43 are provided in a substantially upper half portion avoiding the base 21 portion when the inner plate 42 is viewed from the front. The direction is inclined at a predetermined angle (45 degrees in this embodiment) with respect to the rotation center axis L of the pump body 2. Also, the left and right fins 43-1 and 43-2 intersect each other at an arbitrary angle (90 degrees in this embodiment), and a communication passage 44 through which air passes through the center position where the intersections of the fins on both sides are connected. Is formed.

  Furthermore, in this embodiment, from the viewpoint of further improving the heat dissipation performance, the controller 3 itself is also processed as follows. That is, as shown in FIG. 5, a large number of ventilation holes 36, 36,... Penetrating into the case are opened in the back panel 31-2 constituting the controller case 31, so It can be ventilated. These air holes 36 are formed as minute holes of several millimeters so that foreign matter does not enter the case, and are formed in high density by arranging the holes in a staggered manner so that more air can escape. . As the formation method, a method of attaching a peripheral edge of a back panel 31-2 made of punching metal to the controller case 31 with a screw 56 as in this embodiment, and a method of directly making a hole in the back surface of the controller case 31 are adopted. May be. Similarly, a bottom panel 31-3 having a large number of air holes 36, 36,... Is attached to the controller case 31 with screws 56 on the bottom surface of the controller case 31 shown in FIG. . Although not shown, it is preferable that a similar vent hole is also formed on the upper surface of the controller case 31.

  The controller 3 covered with the heat sink 4 as described above is mounted on the pump body 2, and the fixing structure of both will be described here. As shown in FIG. 7, the controller 3 with the heat sink 4 is attached to the pump body 2 via a bracket 51. As a structure for that purpose, the controller 3 is provided with a flat mounting surface 31a for attaching a flat bracket 51 to the lower side of the controller case 31 protruding therefrom. On the other hand, as shown in FIG. 4, the pump body 2 is provided with a mounting surface 21 a on the side surface of the base 21 in which a part of the peripheral edge is cut out in accordance with the outer shape of the controller 3. The bracket 51 is formed with a case mounting hole (not shown) to be fastened to the controller case 31 and a through hole 51a for connecting a connector having a built-in current conducting wire or control signal line in the center. Base mounting holes 51b for fastening to the upper and lower sides are formed on the upper and lower sides.

  When assembling the pump, first, a screw (not shown) passed through the case mounting hole of the bracket 51 is fastened to the mounting surface 31 a of the controller case 31 to fix the bracket 51 to the controller 3. Next, the controller 3 with the bracket 51 is moved closer to the base 21, and the male connector 27 protruding from the base 21 is fitted into the female connector 35 protruding from the controller case 31 through the through hole 51 a of the bracket 51. Thus, the controller 3 and the pump body 2 are electrically connected. Finally, the bolt 56 passed through the base mounting hole 51b of the bracket 51 is fastened and fixed to the mounting surface 21a of the base 21, whereby the mounting of the controller 3 on the pump body 2 is completed.

  The above is the configuration of the vacuum pump apparatus of the present embodiment, and the operation thereof will be described below. As shown in FIG. 8, the vacuum pump device 1 can be used by being connected to a vacuum chamber 10 of a measuring instrument using an electron microscope, for example.

  FIG. 8A shows a state when the vacuum pump device 1 is mounted in a vertical posture, and the suction port flange 28 of the pump body 2 and the exhaust port flange 11 of the vacuum chamber 10 are brought into contact with each other and fastened. The vacuum pump device 1 is attached in a suspended state.

  In the vacuum pump device 1 thus installed in a vertical posture, when the controller 3 is turned on and the pump body 2 is operated, gas molecules in the vacuum chamber 10 are sucked into the pump body 2 and the rotating rotor blades are rotated. It is compressed and exhausted while colliding with the fixed stator blade. At this time, the control circuit board 34 built in the controller 3 is heated to a high temperature by a heat generating element such as a transistor or a resistor, but the heat is removed by natural air cooling of the heat sink 4 as follows.

  As shown in FIG. 7, since the two control circuit boards 34 and 34 are in contact with the outer plate 41 and the inner plate 42 having high thermal conductivity, the heat of the control circuit board 34 is applied to both the plates 41 and 42. Quick heat transfer. The surface area of the outer wall surfaces of both plates 41, 42 is enlarged by a plurality of fins 43, 43,..., And heat is radiated from the outer surfaces of these fins 43 to the outside air. Here, as shown in FIG. 8, since the directions of the fins 43-1 and 43-2 on both the left and right sides of the outer plate 41 are obliquely upward, the heat dissipation is superior to those in which the fins are downward or sideways. . Further, the air flowing between the fins 43-1 and 43-2 on both the left and right sides is easy to escape from the gap facing upward, and the air flowing toward the center does not stay between the fins and is surely released from the communication path 44. Since it is designed to escape, the heat exchange efficiency between the heat sink 4 and the outside air increased in temperature due to the air flow. In addition, in the present embodiment, a plurality of vent holes 36, 36,... Are opened in the back panel 31-2 and the bottom panel 31-3 of the controller case 31, respectively. It does not get inside the case through the pores 36. As described above, according to the present embodiment, the heat radiation surface of the fin 43 faces obliquely upward, and natural convection of the air flowing between the fins 43 and 43 is likely to occur, and the hot air is reliably transmitted from the vent hole 36 of the controller case 31. By detaching, the heat dissipation efficiency of the controller 3 is greatly improved.

  Therefore, a sufficient air cooling effect can be obtained without installing a cooling fan in the controller 3 as in the conventional forced air cooling method, and therefore the air cooling fan can be eliminated. As a result, vibration due to mechanical operation is completely eliminated, and the vacuum pump device 1 that requires low vibration performance can be realized, and the controller 3 can be downsized at the same time. Compared to the conventional water-cooling method, there is no need for a separate piping facility, and the handling workability is excellent and the running cost can be reduced.

  Further, in the vacuum pump device 1 of the present embodiment, a magnetic bearing type turbo molecular pump is adopted as the pump mechanism of the pump body 2, so that the vacuum pump device 1 is installed in the vacuum chamber 10 as shown in FIG. On the other hand, it can be mounted in a horizontal position. As described above, when the vacuum pump device 1 is mounted in the horizontal posture, the natural convection of the air flowing between the fins 43 and 43 and the fins 43 of the heat sink 4 tilted and inclined obliquely upward as in the vertical posture. It is easy to happen. Therefore, even if the mounting posture of the vacuum pump device 1 is changed, there is an advantage that the same air cooling effect can be obtained without reducing the heat dissipation performance.

  Furthermore, the vacuum pump device 1 of this embodiment is also excellent in assembling workability. As described with reference to FIG. 3, in the inner plate 42 of the heat sink 4, the tips of the fins 43-3 extend along the outer shape of the flange 24 of the pump case 22. Therefore, when the bolt 52 is loosened, the fin 43-3 does not get in the way, and if the pump 52 is lifted vertically by removing the bolt 52, the controller 3 with the heat sink 4 is attached to the pump body 2. It can be removed as it is. Further, when the removed pump case 22 is attached, it is possible to carry out without removing the controller 3. As described above, the pump case 22 can be removed and attached while the controller 3 is mounted, so that the maintenance work of the pump body 2 can be easily performed, and the time required for the assembly work is shortened and the cost is reduced. be able to.

The front view which shows the external appearance of the vacuum pump apparatus which concerns on this invention. The left view which shows the external appearance of the vacuum pump apparatus of FIG. The top view which shows the external appearance of the vacuum pump apparatus of FIG. The bottom view which shows the external appearance of the vacuum pump apparatus of FIG. The rear view which shows the external appearance of the vacuum pump apparatus of FIG. The enlarged plan view which shows the modification of the controller in the vacuum pump apparatus of FIG. The partial expanded sectional view which shows the fixing structure of the pump main body and controller in the vacuum pump apparatus of FIG. Explanatory drawing which shows the attachment attitude | position of the vacuum pump apparatus of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Vacuum pump apparatus 2 Pump main body 3 Controller 4 Heat sink 21 Base 22 Pump case 23 Bottom cover 24 Flange 25 Intake port 26 Exhaust port 27 Male connector 31 Controller case 31-1 Front panel 31-2 Rear panel 31-3 Bottom panel 32 Interface 33 Display unit 34 Control circuit board 35 Female connector 36 Vent hole 41 Outer plate 42 Inner plate 43 Fin 44 Communication path 51 Bracket

Claims (11)

Attached to the vacuum chamber,
A pump body for sucking and exhausting gas molecules in the vacuum chamber;
A controller that is mounted outside the pump body and includes a control circuit board that controls the operation of the pump body;
A heat sink covering the periphery of the controller, contacting the control circuit board to conduct heat, and dissipating the heat from a plurality of fins aligned on the outer wall surface to the outside air;
A vacuum pump device characterized in that the orientation of the fins of the heat sink is inclined with respect to the rotation center axis of the pump body regardless of the mounting posture of the pump body with respect to the vacuum chamber. . Attached to the vacuum chamber,
A pump body for sucking and exhausting gas molecules in the vacuum chamber;
A controller that is mounted outside the pump body and includes a control circuit board that controls the operation of the pump body;
A controller case covering the periphery of the controller and having a vent hole for venting the hot air heated by the heat of the control circuit board to the outside;
A vacuum pump device comprising:   The heat sink has fins on both sides that are inclined at an arbitrary angle on the outer plate facing the outside air, and a communication passage through which air passes is formed at a position connecting the intersections of the fins on both sides. The vacuum pump device according to claim 1, wherein   The heat sink extends so that the tip of the fin of the inner plate facing the pump body extends along the outer shape of the pump case, and the pump case can be removed while the controller is mounted. The vacuum pump device according to claim 1.   The heat sink has fins on both sides inclined at an arbitrary angle on the inner plate facing the pump body, and a communication passage through which air passes is formed at a position where the intersections of the fins on both sides are connected. The vacuum pump device according to claim 1.   The vacuum pump device according to any one of claims 1 to 5, wherein the pump mechanism inside the pump body is formed of a magnetic bearing type rotating body. Removably mounted outside the pump body of the vacuum pump device,
A control circuit board for controlling the operation of the pump body;
A heat sink that contacts the control circuit board and conducts heat, and dissipates the heat from a plurality of fins arranged on the outer wall surface to the outside air,
A controller of a vacuum pump device, wherein the direction of the fins of the heat sink is inclined with respect to the rotation center axis of the pump body. Removably mounted outside the pump body of the vacuum pump device,
A control circuit board for controlling the operation of the pump body;
A controller case that covers the periphery of the control circuit board and has a vent hole that vents the hot air heated by the heat of the control circuit board to the outside;
A controller for a vacuum pump device, comprising:   The heat sink has fins on both sides that are inclined at an arbitrary angle on the outer plate facing the outside air, and a communication passage through which air passes is formed at a position connecting the intersections of the fins on both sides. The controller of the vacuum pump device according to claim 7, wherein the controller is a vacuum pump device.   8. The controller of a vacuum pump device according to claim 7, wherein the heat sink extends so that the tip of the fin of the inner plate facing the pump body follows the outer shape of the pump case.   The heat sink has fins on both sides inclined at an arbitrary angle on the inner plate facing the pump body, and a communication passage through which air passes is formed at a position where the intersections of the fins on both sides are connected. The controller of the vacuum pump device according to claim 7.

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