JP2007021506A - Electronic component box body and production method therefor, and laser beam spot welding method therefor - Google Patents

Electronic component box body and production method therefor, and laser beam spot welding method therefor Download PDF

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JP2007021506A
JP2007021506A JP2005203213A JP2005203213A JP2007021506A JP 2007021506 A JP2007021506 A JP 2007021506A JP 2005203213 A JP2005203213 A JP 2005203213A JP 2005203213 A JP2005203213 A JP 2005203213A JP 2007021506 A JP2007021506 A JP 2007021506A
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magnesium
electronic device
welding
spot welding
chemical conversion
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Masayuki Sato
昌之 佐藤
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YAMASE DENKI KK
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YAMASE DENKI KK
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Abstract

<P>PROBLEM TO BE SOLVED: To provide techniques in which in the case of using a material having light weight and sufficient strength such as magnesium material as an electronic component box body, the corrosion resistance as a problem is secured and also, various kinds of treating liquid such as chemical conversion liquid which is used for giving the corrosion resistance and acid, alkali, and washing water are not remained in the box body after welding, and further the welded mark on the outward appearance does not occure. <P>SOLUTION: After forming a corrosion resistant film by applying the surface treatment on both of a magnesium-made electronic component box main body and a magnesium-made member, this electronic component box body is obtained by performing a laser beam spot welding to both. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、携帯電話やパーソナルコンピューター等の電子機器筐体、その製造方法及びその製造の際のレーザースポット溶接方法に関する。   The present invention relates to an electronic device casing such as a mobile phone or a personal computer, a manufacturing method thereof, and a laser spot welding method in the manufacturing thereof.

電子機器筐体、特に携帯タイプの電子機器の筐体は、軽量であることや十分な強度を有することが求められる。ここで、マグネシウム及びその合金製の筐体は、前記性質を充足する上、埋蔵量の多さ、リサイクルが容易であること等の付加価値もあるため、非常に有望である。   An electronic device casing, particularly a portable electronic device casing, is required to be lightweight and have sufficient strength. Here, a housing made of magnesium and its alloy is very promising because it satisfies the above properties and has added value such as a large amount of reserves and easy recycling.

しかしながら、マグネシウム及びその合金は耐食性が悪いという欠点があるので、当該材料を筐体として採用した場合には、耐食性を担保するために表面処理(化成処理や陽極酸化処理)を行なう必要がある。ここで、マグネシウム素材の典型的な溶接手法であるスタッド溶接や抵抗溶接(スポット溶接)の場合には、電気が流れることが接合する上での基本のため、表面処理を行う前に溶接するのが一般的である。しかしながら、溶接したものに対して表面処理(例えば、化成処理)を施す場合には、(1)溶接部近傍の二枚の板の隙間に化成処理液が侵入しない又は侵入量が少なくなり、当該部分での防食処理が全くなされない又は不十分になる、(2)当該隙間に化成処理液が侵入したときでも、当該部分に存在する化成処理液を完全に除去することが非常に困難である、という問題を招く。前記(1)の場合には、製品寿命を縮める結果となり、前記(2)の場合には、化成処理液が製品中に残存することになり、特に、従来の化成処理液がいずれも6価クロムイオンという有害成分を含有するものである場合(JIS−H−8651、MIL−M−3171等)、ユーザの健康上及び環境上好ましくない。更には、化成処理工程で表面調整用として使用される、酸やアルカリ成分等の溶液が、溶接部周辺や板と板との間に洗浄後も残留し、経時変化による溶接部の劣化が危惧されている。また、各種薬剤を洗浄するために水洗を行った後、乾燥工程に付されるが、溶接部分の形状等により、板と板の隙間部分に侵入した水を完全に除去することが困難な場合がある。このように、後工程に基づく溶接部の劣化等の不安定要素が不可避的に存する。   However, since magnesium and its alloys have a drawback of poor corrosion resistance, when the material is used as a casing, it is necessary to perform surface treatment (chemical conversion treatment or anodizing treatment) in order to ensure corrosion resistance. Here, in the case of stud welding and resistance welding (spot welding), which are typical welding methods of magnesium material, welding is performed before performing surface treatment because the basics of joining are that electricity flows. Is common. However, when performing surface treatment (for example, chemical conversion treatment) on the welded material, (1) the chemical conversion liquid does not enter the gap between the two plates in the vicinity of the welded portion or the amount of intrusion decreases. Anticorrosion treatment at the part is not performed at all or becomes insufficient. (2) Even when the chemical conversion liquid enters the gap, it is very difficult to completely remove the chemical conversion liquid present at the part. Invite the problem. In the case of (1), the product life is shortened. In the case of (2), the chemical conversion treatment solution remains in the product. In particular, all the conventional chemical conversion treatment solutions are hexavalent. When it contains a harmful component called chromium ion (JIS-H-8651, MIL-M-3171, etc.), it is not preferable for the health and environment of the user. In addition, acids and alkali components used for surface adjustment in the chemical conversion treatment process remain even after cleaning around the weld and between the plates, and there is a risk of deterioration of the weld due to changes over time. Has been. Also, after washing with water to wash various chemicals, it is subjected to a drying process, but it is difficult to completely remove the water that has entered the gap between the plates due to the shape of the welded part etc. There is. Thus, unstable elements such as deterioration of the welded portion based on the post-process exist unavoidably.

更には、前記のように、スタッド溶接(例えば、カーナビやノートPCにおける、薄肉外装筐体へのボス溶接)や抵抗溶接(例えば、板金重ね合わせ溶接)を行なう場合、外観面への影響を与えないためには、熱の影響を少なくするために溶接を短時間で行なう必要がある。例えば、スタッド溶接では、1000分の数秒単位、抵抗溶接(スポット溶接)においても、この種の溶接の電源方式をコンデンサ方式とすることにより短時間での加工を実行している。しかしながら、いずれの場合も、電子機器筐体という薄肉板に適用する場合、外観面に溶接痕が発生し、溶接後に修正処理が必要となるという問題がある。ここで、これら溶接法によると、当該溶接痕が凹状になったり面自体が複雑に波打つ場合が多く、当該溶接痕を修正し目立たなくするには熟練が必要である。
特開2001−198686 特開平9−19778号公報 特開平8−300173号公報 特開平8−39277号公報 特開平8−33996号公報 特開昭58−58988号公報
Furthermore, as described above, when stud welding (for example, boss welding to a thin-walled outer casing in a car navigation system or notebook PC) or resistance welding (for example, sheet metal overlay welding) is performed, the appearance is affected. In order to avoid this, it is necessary to perform welding in a short time in order to reduce the influence of heat. For example, in the stud welding, even in resistance welding (spot welding) in units of several thousandths of a second, machining is performed in a short time by using this type of welding power supply system as a capacitor system. However, in any case, when applied to a thin plate called an electronic device casing, there is a problem that a welding mark is generated on the outer surface and correction processing is required after welding. Here, according to these welding methods, there are many cases where the welding trace becomes concave or the surface itself undulates in a complicated manner, and skill is required to correct the welding trace and make it unnoticeable.
JP2001-198686 Japanese Patent Laid-Open No. 9-19778 JP-A-8-300173 JP-A-8-39277 JP-A-8-33996 JP 58-58988 A

そこで、本発明は、マグネシウム材料という軽量かつ十分な強度を有する材料を電子機器筐体として採用する場合に問題となる耐食性を担保すると共に、当該耐食性付与のために使用された化成処理液、酸・アルカリ等の各種処理液及び洗浄水が溶接後の筐体に残存せず、更には、外観面に溶接痕が発生しない技術の提供を目的とする。   Therefore, the present invention secures the corrosion resistance which becomes a problem when adopting a lightweight and sufficient strength material such as a magnesium material as an electronic device casing, and also provides a chemical conversion treatment solution, an acid used for imparting the corrosion resistance. The purpose of the present invention is to provide a technique in which various treatment liquids such as alkali and cleaning water do not remain in the casing after welding, and further, welding marks are not generated on the appearance surface.

本発明者は、まず、表面処理を行なうタイミングを溶接前に移行させることにより、前記後工程での溶接部の劣化等の不安定要素を除外できること、即ち、例えば、化成処理液等が筐体に残存することを防止できることにまず着目し、マグネシウム製電子機器筐体の溶接手法として、従来のスタッド溶接や抵抗溶接ではなくレーザースポット溶接を採用する構成にしたと共に、表面処理により形成された金属光沢を失した防食被膜が、レーザー光の反射を低減させることを見出し、本発明(1)〜(8)を完成させたものである。   First, the inventor can eliminate unstable elements such as deterioration of the welded portion in the post-process by shifting the timing of performing the surface treatment before welding. First, focusing on the fact that it can be prevented from remaining on the metal, the laser welding method is adopted instead of the conventional stud welding or resistance welding as a welding method for the magnesium electronic equipment casing, and the metal formed by surface treatment The anticorrosive film that has lost its gloss has been found to reduce the reflection of laser light, and the present inventions (1) to (8) have been completed.

即ち、本発明(1)は、マグネシウム製電子機器筐体本体及びマグネシウム製部材の両方に表面処理を施して防食被膜を形成した後、両者をレーザースポット溶接することにより得られる電子機器筐体である。ここで、当該手法により得られた電子機器筐体であるか否かは、溶接部分を確認することで判定可能である。尚、防食被膜は、少なくともその溶接部分の表面に形成されていればよく、マグネシウム製電子機器筐体本体やマグネシウム製部材の全体に形成されている必要はない。   That is, the present invention (1) is an electronic device casing obtained by surface-treating both the magnesium electronic device casing body and the magnesium member to form an anticorrosion coating, and then laser spot welding the two. is there. Here, whether or not the electronic device casing is obtained by the method can be determined by checking the welded portion. The anticorrosion film only needs to be formed on at least the surface of the welded portion, and does not need to be formed on the entire magnesium electronic device casing body or the magnesium member.

本発明(2)は、前記防食被膜が、ノンクロム化成処理又はクロム化成処理により形成された被膜である、前記発明(1)の電子機器筐体である。   The present invention (2) is the electronic device casing of the invention (1), wherein the anticorrosive film is a film formed by a non-chromium chemical conversion treatment or a chrome chemical conversion treatment.

本発明(3)は、前記被膜の明度が65%以下である、前記発明(1)又は(2)の電子機器筐体である。   The present invention (3) is the electronic device casing of the invention (1) or (2), wherein the lightness of the film is 65% or less.

本発明(4)は、リン酸カルシウムマンガン被膜である、前記発明(1)〜(3)のいずれか一つの電子機器筐体である。   The present invention (4) is the electronic device casing according to any one of the inventions (1) to (3), which is a calcium manganese phosphate coating.

本発明(5)は、前記マグネシウム製部材が、電子部品を搭載するための台座、ボス、リブ、フック部材、内部構造物、ツメ形状物、ステー、補強用部材、アングル、シャーシ、L金具又はスペーサである、前記発明(1)〜(4)のいずれか一つの電子機器筐体である。   According to the present invention (5), the magnesium member is a base for mounting an electronic component, a boss, a rib, a hook member, an internal structure, a claw-shaped object, a stay, a reinforcing member, an angle, a chassis, an L metal fitting, The electronic device casing according to any one of the inventions (1) to (4), which is a spacer.

本発明(6)は、前記発明(1)〜(5)のいずれか一つの電子機器筐体内に電子部品を内蔵した電子製品である。   The present invention (6) is an electronic product in which an electronic component is incorporated in the electronic device casing of any one of the inventions (1) to (5).

本発明(7)は、マグネシウム製電子機器筐体本体及びマグネシウム製部材の両方に表面処理を施して防食被膜を形成した後、両者をレーザースポット溶接する工程を含む、電子機器筐体の製造方法である。   The present invention (7) is a method of manufacturing an electronic device casing, comprising a step of performing a surface treatment on both the magnesium electronic device casing main body and the magnesium member to form an anticorrosion coating, and then laser spot welding the two. It is.

本発明(8)は、マグネシウム製電子機器筐体本体及びマグネシウム製部材の両方に表面処理を施して防食被膜を形成した後、両者をレーザースポット溶接する工程を含む、レーザースポット溶接方法である。   The present invention (8) is a laser spot welding method including a step of laser spot welding both of the magnesium electronic device casing body and the magnesium member after surface treatment to form an anticorrosion coating.

本発明によれば、電子機器筐体材料としてマグネシウム材料を使用しているので、軽量かつ十分な強度が担保されると共に、表面処理が施されているので耐食性にも優れている。このような既知の効果に加え、本発明によれば、溶接前に表面処理を行なうので、前記後工程での溶接部の劣化等の不安定要素が除外できるという効果を奏する(具体的には、例えば、表面処理液等の各種処理液や水が溶接後の筐体に残存しない)。更には、表面処理により形成された防食被膜がレーザー光の熱を効率的に吸収するので、レーザー光の出力を低減させることができ、筐体の外観面への熱の影響が低減する結果、当該面での溶接痕の発生を回避できると共に、溶接部の過溶融が無くなるので安定した溶接が可能になるという効果も奏する。更に、レーザースポット溶接であるので、溶接痕が発生した場合でも当該痕が凸状である場合が多く、多大な労力をかけずに当該痕を修正できるという効果も奏する。   According to the present invention, since the magnesium material is used as the electronic device casing material, the lightweight and sufficient strength is ensured and the surface treatment is performed, so that the corrosion resistance is also excellent. In addition to such known effects, according to the present invention, since surface treatment is performed before welding, there is an effect that unstable elements such as deterioration of the welded portion in the subsequent process can be excluded (specifically, For example, various treatment liquids such as surface treatment liquid and water do not remain in the case after welding). Furthermore, since the anticorrosion coating formed by the surface treatment efficiently absorbs the heat of the laser beam, the output of the laser beam can be reduced, and the influence of the heat on the external appearance of the housing is reduced. In addition to avoiding the occurrence of welding marks on the surface, there is also an effect that stable welding is possible because overmelting of the welded portion is eliminated. Furthermore, since laser spot welding is used, even if a welding mark is generated, the mark is often convex, and there is an effect that the mark can be corrected without much effort.

以下、本発明の最良形態を説明する。尚、本発明は、以下の最良形態に何ら限定されるものではなく、同一課題と実質的に同一解決手段である限り、均等物も含め、本発明の技術的範囲内である。   The best mode of the present invention will be described below. It should be noted that the present invention is not limited to the following best mode, and is within the technical scope of the present invention, including equivalents, as long as it is the same problem and substantially the same solution.

まず、本最良形態に係る電子機器筐体は、薄型である電子機器筐体である限り特に限定されず、例えば、携帯電話、携帯型モバイル機器、パソコン、テレビ筐体、デジタルビデオカメラ、PDAの筐体を挙げることができる。ここで、前記電子機器筐体は、マグネシウム製筐体本体とマグネシウム製部材とからなり、両者が溶接された構造を採っている。ここで、マグネシウム製筐体本体とマグネシウム製部材における「マグネシウム製」とは、マグネシウム又はその合金を指す。更に、「合金」とは、通常、マグネシウムにアルミニウム、亜鉛、マンガン、シリコンなどの金属を合金としたものであり、その表記法は、ASTM等で定められている。ASTM表記法の例を挙げると、「AZ31」なる表記において、「A」は第一添加元素、「Z」は第二添加元素、「3」は第一添加元素の割合、「1」は第二添加元素の割合である。即ち、「AZ31」は、アルミニウムを約3%、亜鉛を約1%含む合金である。尚、実際には、主要添加元素以外の元素も含まれ、この例ではMn、Si、Cu、Ni、Feなどが含まれている。また、「マグネシウム部材」とは、電子機器筐体本体と接合されるべき部材であれば特に限定されず、例えば、電子部品の台座の役割を担う部材、補強用の構成部材、組み合わせる際のツメやフック形状を有する部材、例えば、電子部品を搭載するための台座、ボス、リブ、フック部材、内部構造物、ツメ形状物、ステー、補強用部材、アングル、シャーシ、L金具又はスペーサを挙げることができる。また、筐体本体及びマグネシウム部材の厚さは、好適には0.2〜3mmであり、より好適には0.4〜2.0mmである。   First, the electronic device casing according to the best mode is not particularly limited as long as it is a thin electronic device casing. For example, a mobile phone, a portable mobile device, a personal computer, a TV casing, a digital video camera, a PDA A case can be mentioned. Here, the electronic device casing is composed of a magnesium casing body and a magnesium member, and has a structure in which both are welded. Here, “magnesium” in the magnesium casing body and the magnesium member refers to magnesium or an alloy thereof. Furthermore, the “alloy” is usually an alloy of magnesium, aluminum, zinc, manganese, silicon, or the like, and its notation is defined by ASTM or the like. As an example of ASTM notation, in the notation “AZ31”, “A” is the first additive element, “Z” is the second additive element, “3” is the ratio of the first additive element, and “1” is the first additive element. This is the ratio of the two additive elements. That is, “AZ31” is an alloy containing about 3% aluminum and about 1% zinc. In practice, elements other than the main additive element are also included, and in this example, Mn, Si, Cu, Ni, Fe, and the like are included. In addition, the “magnesium member” is not particularly limited as long as it is a member to be joined to the electronic device casing body. For example, a member that plays a role of a pedestal of electronic parts, a structural member for reinforcement, and a nail when combined. Or a member having a hook shape, for example, a base for mounting an electronic component, a boss, a rib, a hook member, an internal structure, a nail shape, a stay, a reinforcing member, an angle, a chassis, an L metal fitting, or a spacer Can do. Moreover, the thickness of the housing body and the magnesium member is preferably 0.2 to 3 mm, and more preferably 0.4 to 2.0 mm.

次に、本最良形態に係る電子機器筐体の製造方法(レーザースポット溶接方法)を説明する。まず、マグネシウム製筐体本体とマグネシウム製部材を表面処理(例えば化成処理)する前に、例えば、(1)製品外観・寸法精度の調整を目的として、表面研削加工(機械的製品加工、表面研磨加工)を行う、(2)付着性及び防食性の付与、表面の酸化被膜、腐食生成物、めり込んだ研磨剤、焼き付いた潤滑剤、ショット、鋳物砂等の除去を目的として、化学的前処理(脱脂処理、酸洗い処理)を行なう、等の前処理を行なってもよい。尚、溶接性向上のため、表面をサンドブラスト処理する等、面の状態を均一にしておくことが好適である。   Next, the manufacturing method (laser spot welding method) of the electronic device housing according to the best mode will be described. First, before surface treatment (for example, chemical conversion treatment) of the magnesium housing body and the magnesium member, for example, (1) surface grinding (mechanical product processing, surface polishing for the purpose of adjusting the product appearance and dimensional accuracy) (2) Chemical pretreatment for the purpose of removing adhesion, corrosion protection, surface oxide film, corrosion products, embedded abrasives, seized lubricant, shots, foundry sand, etc. A pretreatment such as (degreasing treatment, pickling treatment) may be performed. In order to improve weldability, it is preferable to keep the surface state uniform, for example, by sandblasting the surface.

次に、場合により前処理された前記マグネシウム製筐体本体と前記マグネシウム製部材を表面処理する。ここで、「表面処理」とは、マグネシウム金属と比較して熱吸収率が向上した防食性被膜が形成される表面処理である限り特に限定されず、例えば、塗装密着性、耐食性及び防錆性を付与する手法として知られている、化成処理や陽極酸化処理を挙げることができる。好適には化成処理であり、具体的には、クロム化成処理やノンクロム化成処理(ジルコニウム系、チタン系、リン酸系、スズ酸系、マンガン系処理)、例えば、リン酸カルシウムマンガン化成処理(例えば、特許第3307882号公報)、リン酸マンガン処理(例えば、特開平7−126858号公報)、リン酸マグネシウム処理(例えば、特開平7−126858号公報)、リン酸亜鉛処理(特開平9−31664号公報)、リン酸カルシウム/アルミニウム処理(特開平8−176842号公報)、ジルコニウム含有物処理(特開2005−23422、特開2004−218073)、過マンガン酸イオンを使用した化成処理を挙げることができる。好適にはリン酸カルシウムマンガン化成処理であり、当該処理により、熱吸収能の極めて高いリン酸カルシウムマンガン被膜が形成される。   Next, the magnesium casing body and the magnesium member, which are pretreated in some cases, are surface-treated. Here, the “surface treatment” is not particularly limited as long as it is a surface treatment on which an anticorrosive film having an improved heat absorption rate compared to magnesium metal is formed. For example, coating adhesion, corrosion resistance, and rust prevention Chemical conversion treatment and anodization treatment, which are known as methods for imparting the above, can be mentioned. A chemical conversion treatment is preferable, and specifically, a chromium chemical conversion treatment or a non-chromium chemical conversion treatment (zirconium-based, titanium-based, phosphoric acid-based, stannic acid-based, manganese-based treatment), for example, calcium phosphate manganese chemical conversion treatment (for example, a patent) No. 3307882), manganese phosphate treatment (for example, JP-A-7-126858), magnesium phosphate treatment (for example, JP-A-7-126858), zinc phosphate treatment (JP-A-9-31664). ), Calcium phosphate / aluminum treatment (JP-A-8-176842), zirconium-containing material treatment (JP-A-2005-23422, JP-A-2004-218073), and chemical conversion treatment using permanganate ions. A calcium manganese phosphate chemical conversion treatment is preferred, and a calcium manganese phosphate coating with an extremely high heat absorption capability is formed by this treatment.

ここで、表面処理により形成された被膜は、明度(L)が65%以下であることが好適であり、60%以下であることがより好適であり、55%以下であることが更に好適である。尚、明度の測定は、コニカミノルタ(株)製色彩色差計(CR−241)で測定したものである(測定径:1.8mm、光源:D65)。 Here, the film formed by the surface treatment preferably has a lightness (L) of 65% or less, more preferably 60% or less, and further preferably 55% or less. is there. The brightness was measured with a color difference meter (CR-241) manufactured by Konica Minolta Co., Ltd. (measurement diameter: 1.8 mm, light source: D 65 ).

そして、前記表面処理、例えば、前記化成処理の後、前記マグネシウム製筐体本体と前記マグネシウム製部材に付着した化成処理液を洗浄し、その後、レーザースポット溶接を行なう。当該レーザースポット溶接を行なう際には、溶接により前記マグネシウム製筐体本体と前記マグネシウム製部材とが十分な強度で接合すると共に、溶接後に筐体の外観面に溶接痕(ヒケ等外観不良)が発生しないような条件を設定する(特に、前記マグネシウム製筐体本体及び前記マグネシウム製部材の厚さを考慮)。尚、溶接に先立ち、前記マグネシウム製筐体本体や前記マグネシウム製部材を乾燥させ、洗浄処理等の際にこれらの部材上に残存した水分を十分に除去することが好適である。   And after the said surface treatment, for example, the said chemical conversion treatment, the chemical conversion liquid adhering to the said magnesium housing main body and the said magnesium member is wash | cleaned, and laser spot welding is performed after that. When performing the laser spot welding, the magnesium casing main body and the magnesium member are joined with sufficient strength by welding, and after the welding, there is a welding mark (an appearance defect such as sink marks) on the outer appearance surface of the casing. Conditions that do not occur are set (particularly considering the thickness of the magnesium casing body and the magnesium member). Prior to welding, it is preferable to dry the magnesium casing body and the magnesium member to sufficiently remove moisture remaining on these members during a cleaning process or the like.

尚、レーザスポット溶接後に化成処理を施したもの(従来品)と化成処理を施したもの(本最良形態)との見極めは、(1)レーザ溶接部を拡大して観察すること、及び、(2)溶接品を破壊し、重なっていた面を観察すること、により判別可能である。例えば、(1)に関しては、従来品の場合、レーザ溶接部のクレータにも化成処理の膜が目視にて観察できる(例えば、リン酸カルシウムマンガン被膜が形成させた場合、薄い虹色がかった模様が観察できる)。他方、本最良形態品の場合、そのような膜は観察できず、若干くすんだ面が見られる。また、(2)に関しては、従来品は重なっていた面は処理されていない(又は未処理部分が発生)ため生地のままとなっている。他方、本最良形態品は重なった面が処理されている。   In addition, it is (1) magnifying and observing the laser welded part and (1) magnifying and observing the one subjected to chemical conversion treatment after laser spot welding (conventional product) and the one subjected to chemical conversion treatment (this best mode); 2) It can be determined by destroying the welded product and observing the overlapping surface. For example, with regard to (1), in the case of the conventional product, the film of the chemical conversion treatment can be visually observed even on the crater of the laser welded portion (for example, when a calcium manganese phosphate coating is formed, a thin iridescent pattern is observed. it can). On the other hand, in the case of the best form product, such a film cannot be observed, and a slightly dull surface is seen. Regarding (2), the surface of the conventional product that has overlapped is not processed (or an unprocessed portion is generated), and remains as a fabric. On the other hand, in the best form product, the overlapped surface is processed.

以下、実施例を参照しながら本発明を更に具体的に説明する。まず、電子機器筐体及び台座と同等の板厚を有する二枚のマグネシウム製テストピース(マグネシウム素材AZ31:20mm×8mm×0.5mm)に対し、特開2000−96255の実施例に記載された手法(図1参照)に従い、化成処理{リン酸カルシウムマンガン化成処理(化成処理剤:ミリオン化学株式会社 グランダーMC−1000)}を施した。その結果、低電気抵抗特性を有する厚さ0.8μmの被膜(L=53.47)が形成された。その後、図2に示すように、化成処理された二枚のテストピースを重ね合わせ、重ね合わせ部分をレーザー溶接機(ミヤチテクノス株式会社製のYAGレーザ溶接機/発信波長:1064nm、最大定格出力:300W、最大出力エネルギー50J/ファイバ径:0.6mm)によりスポット的に溶接した(2箇所)。尚、アシストガスとしてアルゴンを使用し溶接近傍に吹き付けながら溶接を行った。また、溶接条件は、ピークパワー1.9kw、パルス幅8.0msとした。尚、このときの出力エネルギーを確認したところ、8.1Jであった。その結果、図3に示すように、外観面に影響を与えることなく、互いを接合することができた。尚、図3(a)は、溶接加工品の外観面側であり、図3(b)は、レーザー溶接部側である。更に、溶接部表面の状態を確認したところ、きれいな円形くぼみ形状となっており、表面の割れは確認されなかった。   Hereinafter, the present invention will be described more specifically with reference to examples. First, it describes in the Example of Unexamined-Japanese-Patent No. 2000-96255 with respect to the two magnesium test pieces (magnesium raw material AZ31: 20mmx8mmx0.5mm) which has the board thickness equivalent to an electronic device housing | casing and a base. Chemical conversion treatment {calcium phosphate manganese chemical conversion treatment (chemical conversion treatment agent: Million Chemical Co., Ltd. Grander MC-1000)} was performed according to the method (see FIG. 1). As a result, a 0.8 μm-thick film (L = 53.47) having low electrical resistance characteristics was formed. Thereafter, as shown in FIG. 2, the two test pieces subjected to chemical conversion were superposed, and the superposed portion was laser welded (YAG laser welder manufactured by Miyachi Technos Co., Ltd./transmitting wavelength: 1064 nm, maximum rated output: 300 W, maximum output energy 50 J / fiber diameter: 0.6 mm) was spot-welded (two locations). In addition, welding was performed using argon as an assist gas while spraying in the vicinity of welding. The welding conditions were a peak power of 1.9 kw and a pulse width of 8.0 ms. In addition, when the output energy at this time was confirmed, it was 8.1J. As a result, as shown in FIG. 3, it was possible to join each other without affecting the appearance. 3A is an appearance side of the welded product, and FIG. 3B is a laser welded side. Furthermore, when the state of the welded part surface was confirmed, it became a beautiful circular hollow shape, and the surface crack was not confirmed.

尚、比較のため、前記化成処理が行なわれていない二枚のマグネシウム製テストピース(マグネシウム素材AZ31:20mm×8mm×0.5mm)についてもレーザースポット溶接を行なった。ここで、上記化成処理品と同一条件で行なったところ、出力が足りず接合できなかった。そこで、溶接条件として、外観上、上記実施例と同程度の接合状態となる条件を再設定した。その結果、同様な外観となる溶接条件は、ピークパワー2.5kw、パルス幅8.0msであった。また、このときの出力エネルギーは10.4Jであった。この条件に従い溶接を行なった結果、図4に示すように、外観面には溶接痕が発生した(図中の丸囲部分)。尚、溶接部表面の状態を確認したところ、円形くぼみ形状となっており、若干の焼けが溶接部周辺に見られるものの、表面の割れは確認されなかった。   For comparison, laser spot welding was also performed on two magnesium test pieces (magnesium material AZ31: 20 mm × 8 mm × 0.5 mm) that were not subjected to the chemical conversion treatment. Here, when the test was performed under the same conditions as those of the chemical conversion treatment product, the output was insufficient and joining was not possible. Therefore, as welding conditions, the conditions for appearance in the same degree of joining as in the above example were reset. As a result, the welding conditions giving the same appearance were a peak power of 2.5 kW and a pulse width of 8.0 ms. The output energy at this time was 10.4 J. As a result of welding according to these conditions, as shown in FIG. 4, welding marks were generated on the outer surface (circled portion in the figure). In addition, when the state of the welded part surface was confirmed, it became a circular hollow shape, and although some burns were seen around the welded part, no cracks on the surface were confirmed.

更に、化成処理品の上記結合体と未処理品の上記結合体について引張せん断強度を測定した。その結果、化成処理品の上記結合体は、15〜25N/pointであるのに対し、未処理品の上記結合体は、9〜17N/pointであった。   Furthermore, the tensile shear strength was measured about the said composite body of the chemical conversion treatment product, and the said composite body of an untreated product. As a result, the conjugate of the chemical conversion product was 15 to 25 N / point, while the conjugate of the untreated product was 9 to 17 N / point.

図1は、本実施例に係る、溶接前に行なわれる各種処理を時系列的に示したフローチャートである。FIG. 1 is a flowchart showing, in time series, various processes performed before welding according to the present embodiment. 図2は、本実施例に係る、レーザースポット溶接を行なう際の概念図である。FIG. 2 is a conceptual diagram when performing laser spot welding according to the present embodiment. 図3は、本実施例品(化成処理品)に係る、溶接加工品の外観面側(a)及びレーザー溶接部側(b)の電子写真である。FIG. 3 is an electrophotographic view of the appearance side (a) and the laser welded part side (b) of the welded product according to the product of this example (chemical conversion treatment product). 図4は、比較例品(未処理品)に係る、溶接加工品の外観面側(a)及びレーザー溶接部側(b)の電子写真である。FIG. 4 is an electrophotographic view of the appearance side (a) and the laser welded portion (b) of the welded product according to the comparative example product (untreated product).

Claims (8)

マグネシウム製電子機器筐体本体及びマグネシウム製部材の両方に表面処理を施して防食被膜を形成した後、両者をレーザースポット溶接することにより得られる電子機器筐体。   An electronic device casing obtained by subjecting both a magnesium electronic device casing main body and a magnesium member to surface treatment to form an anticorrosion coating and then laser spot welding them. 前記防食被膜が、ノンクロム化成処理又はクロム化成処理により形成された被膜である、請求項1記載の電子機器筐体。   The electronic device housing according to claim 1, wherein the anticorrosion coating is a coating formed by a non-chromium chemical conversion treatment or a chrome chemical conversion treatment. 前記被膜の明度が65%以下である、請求項1又は2記載の電子機器筐体。   The electronic device housing according to claim 1, wherein the brightness of the coating is 65% or less. 前記被膜が、リン酸カルシウムマンガン被膜である、請求項1〜3のいずれか一項記載の電子機器筐体。   The electronic device housing according to claim 1, wherein the coating is a calcium manganese phosphate coating. 前記マグネシウム製部材が、電子部品を搭載するための台座、ボス、リブ、フック部材、内部構造物、ツメ形状物、ステー、補強用部材、アングル、シャーシ、L金具又はスペーサである、請求項1〜4のいずれか一項記載の電子機器筐体。   The magnesium member is a pedestal, boss, rib, hook member, internal structure, claw-shaped object, stay, reinforcing member, angle, chassis, L bracket, or spacer for mounting an electronic component. Electronic device housing as described in any one of -4. 請求項1〜5のいずれか一項記載の電子機器筐体内に電子部品を内蔵した電子製品。   The electronic product which incorporated the electronic component in the electronic device housing | casing as described in any one of Claims 1-5. マグネシウム製電子機器筐体本体及びマグネシウム製部材の両方に表面処理を施して防食被膜を形成した後、両者をレーザースポット溶接する工程を含む、電子機器筐体の製造方法。   A method for manufacturing an electronic device casing, comprising a step of subjecting both the magnesium electronic device casing body and the magnesium member to surface treatment to form an anticorrosion coating and then laser spot welding the two. マグネシウム製電子機器筐体本体及びマグネシウム製部材の両方に表面処理を施して防食被膜を形成した後、両者をレーザースポット溶接する工程を含む、レーザースポット溶接方法。   A laser spot welding method comprising a step of laser spot welding both of a magnesium electronic device housing body and a magnesium member after surface treatment to form an anticorrosion coating.
JP2005203213A 2005-07-12 2005-07-12 Electronic component box body and production method therefor, and laser beam spot welding method therefor Pending JP2007021506A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009297737A (en) * 2008-06-12 2009-12-24 Denso Corp Laser welding method
JP2010274279A (en) * 2009-05-27 2010-12-09 Nagoya Industrial Science Research Inst Method for joining member using laser
JP2016525449A (en) * 2014-05-13 2016-08-25 ツィンファ ユニバーシティ Apparatus and method for detecting narrow groove of workpiece reflecting specularly

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009297737A (en) * 2008-06-12 2009-12-24 Denso Corp Laser welding method
JP2010274279A (en) * 2009-05-27 2010-12-09 Nagoya Industrial Science Research Inst Method for joining member using laser
JP2016525449A (en) * 2014-05-13 2016-08-25 ツィンファ ユニバーシティ Apparatus and method for detecting narrow groove of workpiece reflecting specularly

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