JP2007013103A - Method of positioning production facility - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of positioning production facility that enables an operator to place components in a component mounting device without increasing the operator's burden as much as possible at part replacement. <P>SOLUTION: First, the number of suction nozzles of a multi-mount head attached to each of two secondary facilities is checked (S11). Then, the component cassettes of component type described in the mount component quantity information are assigned to component supply portions according to a ratio of the number of suction nozzles of a multi-mount head that has been checked in the process S11 (S12). The positions of components assigned in the process S12 are swapped between the component supply portions, so that components having a large quantity can be mounted on the inner side of an electronic component mount system as much as possible (S13). <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a production facility arrangement determination method, and more particularly to a production facility arrangement determination method using a component mounting apparatus for mounting electronic components on a substrate as a production facility.

Conventionally, various methods for optimizing the mounting order in component mounting on a substrate by a component mounting apparatus have been proposed. Among such methods for optimizing the mounting order, there is a method for optimizing the mounting order so as to reduce the production time (tact time) per substrate (see, for example, Patent Document 1). .)
JP 2002-50900 A

  However, even if the mounting order of components is determined with priority on the tact time, it is difficult to monitor the components far from the operator's position, and it is difficult to manage them. For this reason, in the case where a component breakage or the like occurs, it takes time to replace the component, and there is a problem that the effect is hardly obtained even if the mounting order is optimized by giving priority to the tact time.

  The present invention has been made to solve the above-described problems, and is a production facility capable of determining the component placement position in the component mounting apparatus so as not to place a burden such as component replacement on the operator as much as possible. An object is to provide an arrangement determination method.

  In order to achieve the above object, a production facility arrangement determining method according to the present invention is a production facility arrangement determining method by a production facility arrangement determining apparatus that determines the arrangement of a production facility that produces a component mounting board with components mounted on the board. The production facility arrangement determining apparatus includes a determining step of determining a surface on which the operator mainly operates on the production facility depending on a position where the operator is arranged.

  According to this configuration, it is possible to determine the arrangement of the production equipment so that the surface on which the operator mainly operates the production equipment faces the operator. For this reason, it is possible to improve the working efficiency of the operator's production facilities, and in particular, when the main operation is part replacement, component mounting is performed so that the operator is not burdened with part replacement as much as possible. It is possible to determine the component placement position on the apparatus.

  For example, the production facility is a component mounting apparatus that includes a plurality of component supply units and mounts a component on a board. In the determining step, the component is stored depending on the position where the operator is arranged. The arrangement position of the cassette in the component supply unit is determined.

  According to this configuration, it is possible to determine the placement position of the component cassette so as to improve the operator's work efficiency. For this reason, the part replacement work by the operator can be quickly performed, and the efficiency of the part replacement work by the operator is improved.

  Preferably, in the determination step, the arrangement position of the component cassette is determined so that a component cassette of a component having a relatively large number of mounting points is arranged in the component supply unit on the side where the operator is arranged.

  More preferably, the component mounting apparatus is an apparatus in which a plurality of mounting heads alternately mount components on a single board, and the component mounting apparatus includes a plurality of components corresponding to the plurality of mounting heads. Each of the component supply units is provided, and in the determination step, the production facility arrangement determination device acquires the number of suction nozzles for acquiring the number of suction nozzles for suctioning the components provided in each of the plurality of mounting heads. And the production equipment arrangement determining device is configured to place the component cassette of the component to be mounted on the plurality of component supply units so that a ratio of the number of the suction nozzles and a ratio of the number of components mounted on the substrate are equal. And the production facility arrangement determination device exchanges a component cassette between the plurality of component supply units, and the ratio of the number of suction nozzles to the substrate The placement position of the component cassette is determined so that the ratio of the number of mounting points of the components becomes equal, and the component cassette of the component having a relatively large number of mounting points is placed in the component supply unit on the side where the operator is placed. And an arrangement position determining step.

  According to this configuration, in a component mounting apparatus that mounts components on a single substrate while a plurality of mounting heads cooperate, the number of tasks of the plurality of mounting heads is equalized, and a component cassette with a large number of mounting points is mounted. It can be arranged on the side where the operator exists. In general, a component having a large number of mounting points is frequently broken. For this reason, by arranging the component cassette of such components on the operator side, the component replacement operation by the operator can be quickly performed, and the efficiency of the component replacement operation by the operator is improved.

  In the determination step, the arrangement position of the component cassettes may be determined so that the number of component cassettes in the component supply unit on the side where the operator is arranged is relatively large.

  Preferably, the component mounting apparatus is an apparatus in which a plurality of mounting heads alternately mount components on a single substrate, and the component mounting apparatus includes a plurality of mounting heads corresponding to the plurality of mounting heads. Each of the component supply units is provided, and the determining step includes the step of acquiring the number of suction nozzles by which the production facility arrangement determining device acquires the number of suction nozzles that suck the components provided in each of the plurality of mounting heads. And the production equipment arrangement determining device sets the component cassette of the component to be mounted in the plurality of component supply units so that the ratio of the number of suction nozzles and the ratio of the number of components mounted on the substrate are equal. The allocation step for allocating to any of the above and the production equipment arrangement determining apparatus is configured so that a ratio of the number of the suction nozzles and a ratio of the number of components mounted on the substrate are equal. Motor, characterized in that and a position determination step of determining a placement position of the component cassette so that the number of the component cassette component supply section of the side to be placed relatively increases.

  By determining the arrangement positions of the component cassettes in this way, the operator can exchange more types of component cassettes at a time.

  The production facility is a component mounting apparatus in which a component supply unit is provided only on one side surface and mounts a component on a board. In the determining step, a surface on which the component supply unit of the component mounting apparatus is provided The operator determines that the surface mainly operates the component mounting apparatus.

  According to this configuration, in the component mounting apparatus in which the component supply unit is provided only on one surface, the component mounting apparatus can be arranged so that the component supply unit faces the operator. For this reason, the operator can perform the component replacement work without going to the back side of the component mounting apparatus. Therefore, the part replacement work by the operator can be performed quickly, and the efficiency of the part replacement work by the operator is improved.

  Preferably, in the determining step, the arrangement of the plurality of production facilities is further determined to be a U shape centered by an operator, and the operator has an inner surface of the U shape for each production facility. It is characterized in that it is mainly determined as a surface to be operated.

  Since the production line has a U shape, if the operator is arranged at the center, the moving distance to each mounting facility can be reduced. In addition, by making the production line U-shaped, the surface on which the operation unit of each production facility exists can be directed to the operator side. For this reason, the operator can monitor all the production apparatuses arranged in the U shape simultaneously by looking at the display of the operation unit of each production facility or operating the operation unit. Therefore, the burden of monitoring each production facility by the operator is reduced.

  The present invention can be realized not only as a production facility arrangement determination method including such characteristic steps, but also as a production facility arrangement determination apparatus using the characteristic steps included in the production facility arrangement determination method. Or a program that causes a computer to execute the characteristic steps included in the production facility arrangement determination method. Needless to say, such a program can be distributed via a recording medium such as a CD-ROM (Compact Disc-Read Only Memory) or a communication network such as the Internet.

  ADVANTAGE OF THE INVENTION According to this invention, the production equipment arrangement | positioning determination method which can determine the component arrangement position to a component mounting apparatus can be provided so that the burden of parts replacement | exchange etc. may be imposed on an operator as much as possible.

  Hereinafter, an electronic component mounting system according to an embodiment of the present invention will be described with reference to the drawings.

(Embodiment 1)
FIG. 1 is an external view showing a configuration of an electronic component mounting system, and FIG. 2 is a schematic view when the component mounting system shown in FIG. 1 is looked down from above.

  The electronic component mounting system 10 is a system that transports a substrate from an upstream production facility to a downstream production facility, and produces an electronic component mounting substrate in which electronic components are mounted on both sides of the substrate. 100, solder printing device 112, conveyor 114, adhesive application device 116, component mounting device 120, component mounting device 140, conveyor 150, reflow furnace 152, conveyor 154, and board reversing device 156 A solder printing device 158, a conveyor 160, an adhesive application device 162, a component mounting device 170, a component mounting device 180, a conveyor 182, a reflow furnace 190, and a stocker 192.

  The stockers 100 and 192 are devices for stocking substrates, and the stocker 100 is located on the most upstream side of the production line, and the stocker 192 is located on the most downstream side of the production line. That is, the stocker 100 stocks a substrate on which no component is mounted, and the stocker 192 stocks a finished product substrate on which the component is mounted.

  The solder printing devices 112 and 158 are devices that print solder on the surface of the substrate. Operation units 113 and 159 for operating the solder printing apparatus are provided on the front surfaces of the solder printing apparatuses 112 and 158, respectively.

  The conveyors 114, 150, 154, 160, and 182 are apparatuses for transporting the substrate. The adhesive application devices 116 and 162 are devices that apply an adhesive on a substrate.

  The reflow furnaces 152 and 190 are devices for fixing the components on the substrate after melting the solder and the like by heating the substrate 20 on which the components are mounted. Operation parts 153 and 191 for operating the reflow furnace for operating the reflow furnace are provided on the front surfaces of the reflow furnaces 152 and 190, respectively.

  The electronic component mounting system 10 is configured by arranging production facilities in a “U” shape as illustrated. An operator 200 is arranged at the center of the electronic component mounting system 10 (inside the U-shape). In the following description, the inside of the letter U, that is, the side on which the operator 200 is arranged is called “inside the electronic component mounting system 10”, and the outside of the letter U is called “outside of the electronic part mounting system 10”. And

  By arranging the production equipment in a U-shape, the operation unit of each production equipment inevitably faces the inside of the electronic component mounting system 10. That is, an operation unit 113 for operating the solder printing device 112, an operation unit 117 for operating the adhesive application device 116, an operation unit 127a for operating the component mounting device 120, and a component mounting device 140 are operated. The operation unit 141 a and the operation unit 153 for operating the reflow furnace 152 face the inside of the electronic component mounting system 10. Also, an operation unit 159 for operating the solder printing device 158, an operation unit 163 for operating the adhesive application device 162, an operation unit 171a for operating the component mounting device 170, and a component mounting device 180 are operated. The operation unit 181 a and the operation unit 191 for operating the reflow furnace 190 also face the inside of the electronic component mounting system 10. For this reason, the operator can operate each production facility without moving to the outside of the electronic component mounting system 10. In each of the component mounting apparatuses 120, 140, 170, and 180, operation units are provided on both the front surface and the back surface of each apparatus. This is because parts can be supplied from both sides of the component mounting apparatus, so that when the operator 200 supplies the parts to the component mounting apparatus, each surface can be identified so as to know where to supply the parts. An operation unit is provided in the main body. That is, the operator 200 immediately knows where to supply the parts by looking at the display included in the operation unit.

  Such a U-shaped arrangement is an example of the arrangement of the production equipment determined by determining the surface on which the operator mainly operates the production equipment. The “surface on which the operator mainly operates the production equipment” includes, for example, a component supply unit that performs operations such as replacement of component cassettes and maintenance in addition to the above-described surface including the operation unit. There are aspects. Here, “mainly” means that the operation frequency is relatively high.

  The substrate 20 accommodated in the stocker 100 is transported to the substrate reversing device 156 by the conveyor 154 after electronic components are mounted on the surface of the substrate 20 by the production equipment from the solder printing device 112 to the reflow furnace 152. The substrate reversing device 156 reverses the front and back of the substrate 20. Thereafter, electronic components are mounted on the back surface of the substrate 20 by production equipment from the solder printer 158 to the reflow furnace 190, and then the electronic component mounting substrate is stored in the stocker 192.

  The component mounting apparatuses 120, 140, 170 and 180 are connected to the production facility arrangement determining apparatus 300.

  The production facility arrangement determining apparatus 300 is a computer that performs processing for determining a surface on which the operator mainly operates the production facility. Specifically, in addition to the arrangement of the production facility, the arrangement of the component cassette and the component Also determines the mounting order. That is, as will be described in a later embodiment, the production facility arrangement determination device 300 performs processing such as determination of the mounting order of components on the board 20 and determination of the supply position of components to each component mounting device. The production facility arrangement determination apparatus 300 performs “optimization of mounting order” and “optimization of component supply position” instead of “determination of mounting order” and “determination of component supply position”. There may be. Alternatively, the production facility arrangement determining apparatus 300 may determine or optimize the mounting order and the component arrangement position so that the component mounting time is shortened. Furthermore, each production facility (for example, a component mounting device) may have a function included in the production facility arrangement determination device 300.

  Here, the production facility placement processing by the production facility placement determination apparatus 300 will be described. FIG. 3 is a flowchart of the production facility placement process executed by the production facility placement determination apparatus 300. The production facility arrangement determining apparatus 300 detects the relative position of the operator with respect to the production facility (S1). Next, the production facility arrangement determining apparatus 300 determines the arrangement of the production facility by determining the surface on which the operator mainly performs operations based on the relative position of the operator with respect to the production facility (S2).

  First, the operator position detection process (S1) will be described. For example, an operator may input which side of the production facility is from an operation unit provided in each production facility, and transmit the information to the production facility arrangement determining apparatus 300. Further, it is possible to input which side of the production equipment is from the portable terminal owned by the operator and transmit the information to the production equipment arrangement determining apparatus 300, or the position of the portable terminal is automatically set to GPS ( It is also possible to detect which side of the production facility is obtained by using a Global Positioning System) and transmit the detection result to the production facility arrangement determining apparatus 300. Furthermore, the production facility arrangement determining apparatus 300 counts and compares the number of times of operator input from the operation unit provided on the front surface of the production facility and the number of operator inputs from the operation unit provided on the back surface. It may be determined that the operator exists on the side where the number of operations is large. Furthermore, when the production facility is a component mounting apparatus, the component cassette is obtained by counting and comparing the number of replacement of the component cassette in the front component supply unit and the number of replacement of the component cassette in the rear component supply unit. It may be determined that there is an operator on the side where the number of exchanges is large.

  Next, the production facility arrangement determination process (S2) will be described. For example, in the case of a production facility that has only one side of the operation unit, the production facility arrangement determination device 300 makes an announcement or the production facility so that the plane including the operation unit faces the side where the operator is located. It may be displayed on the screen of the arrangement determining apparatus 300. In addition, in the case where the production equipment is a component mounting apparatus having a component supply unit on the front and back surfaces, even if the arrangement of the component cassette is determined so that the component cassette is frequently replaced in the component supply unit on the side where the operator is present Good. Such component cassette arrangement determination processing will be described later in Embodiments 2 and 3. Furthermore, in the case where the production equipment is a component mounting device having a component supply unit only on one side, the production facility arrangement determination device is arranged so that the surface including the component supply unit faces the side where the operator is located. 300 may make an announcement or display on the screen of the production facility arrangement determination apparatus 300. Details of the arrangement processing of the component mounting apparatus will be described later in a fourth embodiment.

  In addition, for a production facility (for example, a component mounting machine) in which operation units are provided on both the inner side and the outer side of the electronic component mounting system 10, the operator is located on the side where the operation unit mainly operated by the operator exists. The production equipment may be arranged so as to face the inside of the electronic component mounting system 10.

  As described above, according to the present embodiment, since the production line has a U shape, if the operator is arranged at the center, the moving distance to each mounting facility can be reduced. In addition, by making the production line U-shaped, the front of the production equipment on the production line that mounts components on the surface of the board and the front of the production equipment on the production line that mounts parts on the back of the board are electronic components. It will face the inside of the mounting system. For this reason, the operator can monitor two lines simultaneously by looking at the display of the operation unit of each production facility or operating the operation unit. Therefore, the burden of monitoring each production facility by the operator is reduced.

(Embodiment 2)
Next, an electronic component mounting system according to Embodiment 2 of the present invention will be described. The electronic component mounting system according to the second embodiment has the same configuration as that of the electronic component mounting system 10 shown in FIGS. However, the component mounting apparatuses 120, 140, 170, and 180 are configured as described below.

FIG. 4 is an external view showing the configuration of the component mounting apparatus 120.
The component mounting apparatus 120 includes two sub facilities (a front sub facility 120a and a rear sub facility 120b) that perform component mounting in cooperation with each other (or in an alternating operation). The front sub-equipment 120a includes two component supply units 124a and 125a each having an arrangement of component cassettes 123 for storing component tapes, and a plurality of suction nozzles that can suck electronic components from the component cassettes 123 and mount them on the substrate 20. (Hereinafter, also simply referred to as “nozzle”), a beam 122 to which the multi-mounting head 121 is attached, and the suction state of the parts sucked by the multi-mounting head 121 are two-dimensionally or three-dimensionally represented. A component recognition camera 126 for inspection is provided. The rear sub-equipment 120b has the same configuration as the front sub-equipment 120a. The rear sub-equipment 120b includes a tray supply unit 128 that supplies tray components, but the tray supply unit 128 and the like may not be provided depending on the sub-equipment.

  Here, the “component tape” is a plurality of components of the same component type arranged on a tape (carrier tape), and is supplied in a state of being wound around a reel (supply reel) or the like. It is mainly used to supply a relatively small size component called a chip component to a component mounting apparatus.

  Specifically, the component mounting apparatus 120 is a mounting apparatus having both functions of a component mounting apparatus called a high-speed mounting machine and a component mounting apparatus called a multi-function mounting machine. A high-speed mounting machine is a facility characterized by high productivity that mainly mounts electronic parts of □ 10 mm or less at a speed of about 0.1 seconds per point. A multi-function mounting machine is a large model of □ 10 mm or more. It is equipment for mounting electronic parts, odd-shaped parts such as switches and connectors, and IC parts such as QFP (Quad Flat Package) and BGA (Ball Grid Array).

  That is, the component mounting apparatus 120 is designed to be able to mount almost all kinds of electronic components (from 0.4 mm × 0.2 mm chip resistor to 200 mm connector as components to be mounted) A mounting line can be configured by arranging the required number of component mounting apparatuses 120.

  Since the configuration of component mounting apparatuses 140, 170, and 180 is the same as that of component mounting apparatus 120, detailed description thereof will not be repeated here.

FIG. 5 is a plan view showing a main configuration inside the component mounting apparatus 120.
The component mounting apparatus 120 includes sub-equipment arranged in the transport direction (X-axis direction) of the substrate 20 inside, and further includes sub-equipment in the front-rear direction (Y-axis direction) of the component mounting apparatus 120. A total of four sub-equipment 130a, 132a, 130b, and 132b are provided. 4 is provided with two sub-equipment, the component mounting apparatus 120 shown in FIG. 5 has the component mounting apparatus 120 shown in FIG. It is assumed that the internal configuration when two units are connected in the transport direction is described below.

  The sub-equipment (130a and 132a, 130b and 132b) arranged side by side in the X-axis direction is independent from each other, and different mounting operations can be performed at the same time. Further, the sub-equipment (130a and 132b, 132b and 130b) is also independent of each other, and different mounting operations can be performed at the same time. On the other hand, the sub-equipment (130a and 130b, 132a and 132b) arranged facing each other in the front-rear direction (Y-axis direction) cooperates with each other to perform a mounting operation on one board. Hereinafter, the sub facilities 130a and 130b are collectively referred to as “left sub facility 120c”, and the sub facilities 132a and 132b are collectively referred to as “right sub facility 120d”. That is, in each of the left sub-equipment 120c and the right sub-equipment 120d, the two multi mounting heads 121 perform component mounting work on one substrate 20 in cooperation.

  Each sub-equipment 130a, 132a, 130b, 132b includes a beam 122, a multi-mounting head 121, and component supply units 124a, 125a, 124b, 125b for the sub-equipment 130a, 132a, 130b, 132b. Yes. In addition, the component mounting apparatus 120 is provided with a pair of rails 129 for transporting the substrate 20 between the front and rear sub-equipment.

  The rail 129 includes a fixed rail 129a and an operating rail 129b. Although the position of the fixed rail 129a is fixed in advance, the operating rail 129b has a Y-axis according to the length of the substrate 20 to be transported in the Y-axis direction. It is configured to be movable in the direction.

  Note that the component recognition camera 126, the tray supply unit 128, and the like are not the main points of the present invention, and are not shown in FIG.

  The beam 122 is a rigid body that extends in the X-axis direction, and moves on a track (not shown) provided in the Y-axis direction (perpendicular to the conveyance direction of the substrate 20) while being parallel to the X-axis direction. Is something that can be done. Further, the beam 122 can move the multi-mounting head 121 attached to the beam 122 along the beam 122, that is, in the X-axis direction. The multi mounting head 121 can be moved freely in the XY plane by moving the multi mounting head 121 moving in the Y axis direction in the X axis direction. In addition, a plurality of motors such as a motor (not shown) for driving them are provided in the beam 122, and electric power is supplied to these motors and the like via the beam 122.

  FIG. 6 is a schematic diagram showing the positional relationship between the multi-mounting head 121 and the component cassette 123.

  The multi-mounting head 121 can mount a plurality of suction nozzles 121a to 121b, and ideally, electronic components for the maximum number of suction nozzles can be simultaneously supplied from each of the component cassettes 123 (by one up and down movement). ) Can be adsorbed.

  The multi mounting head 121 can move along the beam 122, and this movement is driven by a motor (not shown). Further, the vertical movement when the electronic component is sucked and held or when the held electronic component is mounted on the substrate 20 is also driven by the motor.

  7 and 8 are diagrams for explaining component mounting by the component mounting apparatus 120. FIG. 7 and 8, only the left sub-equipment 120c is illustrated, but the component mounting is performed by performing the same operation for the right sub-equipment 120d. For this reason, illustration is abbreviate | omitted in FIG. 7 and FIG.

  As shown in FIG. 7, the multi-mounting head 121 of the sub-equipment 130 b performs “suction” of the component from the component supply unit 124 b, “recognition” of the suctioned component by the component recognition camera 126, and the recognized component board 20. The component is mounted on the board 20 by alternately repeating the three operations “mounting” on the board.

  Similarly, the multi-mounting head 121 of the sub-equipment 130a similarly mounts components on the substrate 20 by repeating three operations of “suction”, “recognition”, and “mounting” alternately.

  When the two multi-mounting heads 121 perform “mounting” of components at the same time, in order to prevent the multi-mounting heads 121 from colliding with each other, the two multi-mounting heads 121 perform component operation on the substrate 20 while performing a cooperative operation. Implement it. Specifically, as shown in FIG. 8A, when the multi mounting head 121 of the sub facility 130b is performing the “mounting” operation, the multi mounting head 121 of the sub facility 130a performs the “adsorption” operation. And perform a “recognition” operation. On the contrary, as shown in FIG. 8B, when the multi mounting head 121 of the sub facility 130a is performing the “mounting” operation, the multi mounting head 121 of the sub facility 130b performs the “adsorption” operation and “ Perform “recognition” action. As described above, the “mounting” operation is alternately performed by the two multi mounting heads 121, thereby preventing the multi mounting heads 121 from colliding with each other. Ideally, if the “adsorption” operation and the “recognition” operation by the other multi mounting head 121 are completed while the “mounting” operation by one multi mounting head 121 is being performed, When the “mounting” operation by the multi mounting head 121 is completed, it is possible to move to the “mounting” operation by the other multi mounting head 121 without delay, and the production efficiency can be improved.

  FIG. 9 is a block diagram showing a configuration example of the production facility arrangement determining apparatus 300 according to the embodiment of the present invention, that is, the production facility arrangement determining apparatus 300 shown in FIG. This production facility arrangement determination device 300 is a computer that performs processing such as determination of the mounting order of components on the substrate 20 and determination of the supply position of components to each component mounting device for each component mounting device. 301, a display unit 302, an input unit 303, a memory unit 304, a determined program storage unit 305, a communication I / F (interface) unit 306, a database unit 307, and the like. As will be described below, the production facility arrangement determining apparatus 300 determines the arrangement of the component cassettes so that the operator's operation (the number of replacements of the component cassettes) for the component supply unit belonging to the surface on which the operator is arranged increases. .

  This production facility arrangement determination device 300 is realized by a general-purpose computer system such as a personal computer executing the determination program according to the present invention, and is not connected to the component mounting device 120, but is a stand-alone simulator (component It also functions as a mounting order determination tool. Note that this production facility arrangement determining device may be provided inside the component mounting device.

The arithmetic control unit 301 is a CPU (Central Processing Unit), a numerical processor, or the like, and loads and executes a necessary program from the determined program storage unit 305 to the memory unit 304 in accordance with an instruction from an operator or the like. Control each of the components 302 to 307.

  The display unit 302 is a CRT (Cathode-Ray Tube), LCD (Liquid Crystal Display), or the like, and the input unit 303 is a keyboard, a mouse, or the like. It is used for dialogue between the apparatus 300 and an operator.

  The communication I / F unit 306 is a LAN (Local Area Network) adapter or the like, and is used for communication between the production facility arrangement determining apparatus 300 and the component mounting apparatus 120 or the like. The memory unit 304 is a RAM (Random Access Memory) or the like that provides a work area for the arithmetic control unit 301.

  The database unit 307 is generated by input data (mounting point data 307a, component library 307b, mounting device information 307c, mounting point number information 307d, etc.) and determination processing used for the above-described determination processing by the production facility arrangement determination device 300. A hard disk or the like for storing mounting point data, component arrangement data, and the like.

  10 to 13 are diagrams illustrating examples of the mounting point data 307a, the component library 307b, the mounting device information 307c, and the mounting point information 307d, respectively.

  The mounting point data 307a is a collection of information indicating mounting points of all components to be mounted. As shown in FIG. 10, one mounting point pi includes a component type ci, an X coordinate xi, a Y coordinate yi, and control data φi. Here, “component type” corresponds to a component name in the component library 307b shown in FIG. 11, and “X coordinate” and “Y coordinate” are coordinates of a mounting point (coordinates indicating a specific position on the board). The “control data” is restriction information related to the mounting of the component (the type of suction nozzle that can be used, the maximum moving speed of the multi-mounting head 121, etc.). NC (Numeric Control) data to be finally obtained is an arrangement of mounting points that minimizes the line tact.

  The component library 307b is a library in which unique information about all the component types that can be handled by the component mounting apparatus 120 and the like is collected. As shown in FIG. 11, the component size and tact (constant) for each component type are collected. A tact peculiar to the part type under the condition), and other constraint information (a type of suction nozzle that can be used, a recognition method by the part recognition camera 126, a maximum speed level of the multi mounting head 121, and the like). In the drawing, the external appearance of the components of each component type is also shown for reference.

  The mounting apparatus information 307c is information indicating the apparatus configuration for each of the sub-equipment constituting the production line, the above-described restrictions, and the like. As shown in FIG. 12, the type of the multi mounting head 121, that is, the multi mounting head 121 The head information related to the number of suction nozzles, etc., the nozzle information related to the types of suction nozzles that can be mounted on the multi mounting head 121, the cassette information related to the maximum number of component cassettes 123, etc. It consists of tray information related to the number of trays and the like.

  The mounting point information 307d is provided for each of the left sub-equipment 120c and the right sub-equipment 120d. As shown in FIG. 13, the component type of the mounting points mounted on the board 20 and the number of the mounting points (the number of mounting points) ) Are associated with each other. For example, when FIG. 13 shows the mounting point number information 307d for the left sub-equipment 120c, the component types mounted on the left sub-equipment 120c are 6 types of A, B, C, D, E, and F. It is shown that the number of mounting points is 50, 50, 20, 30, 20, and 30.

  The determination program storage unit 305 illustrated in FIG. 9 is a hard disk or the like that stores various determination programs that realize the functions of the production facility arrangement determination apparatus 300. The determination program is a program for determining the mounting order of components and the supply position of components to the component mounting apparatus, and functionally (as a processing unit that functions when executed by the arithmetic control unit 301), the mounting order determination unit 305a and a component arrangement determining unit 305b.

  The mounting order determination unit 305a obtains a component mounting order that minimizes the mounting time of components on the board 20 based on various data stored in the database unit 307.

  The component arrangement determination unit 305b determines the arrangement position of the component cassette 123 in the component supply units 124a, 125a, 124b, and 125b. The processing executed by the component placement determining unit 305b will be described later.

  Next, operation | movement of the production equipment arrangement | positioning determination apparatus 300 comprised as mentioned above is demonstrated. FIG. 14 is a flowchart illustrating a component mounting order determination process and a component placement determination process to the component supply unit executed by the production facility layout determination apparatus 300.

  In the following description, the determination process for the left sub-equipment 120c will be described, but the same determination process is performed for the right sub-equipment 120d. The same processing is performed for other component mounting apparatuses. First, the component arrangement determining unit 305b confirms the number of suction nozzles 121a of the multi mounting head 121 provided in each of the sub-equipment 130a and the sub-equipment 130b (S11). Next, the component arrangement determining unit 305b selects a component cassette of the component type described in the mounting point information 307d based on the ratio of the number of suction nozzles 121a of the two multi mounting heads 121 confirmed in the process of S11. Components are assigned to the component supply units 124a and 124b (S12). In this way, by assigning components to the two component supply units based on the ratio of the number of suction nozzles 121a, the two multi-mounting heads 121 perform a cooperative operation and mount components on one substrate 20. This is because the number of tasks can be made equal between the sub-equipment 130a and the sub-equipment 130b. Here, the “task” refers to a series of operations in one repetition in a series of operations such as suction, movement, and mounting of parts by the multi mounting head 121.

  For example, it is assumed that the number of suction nozzles 121a of the multi-equipment heads 121 of the sub-equipment 130a and 130b is 4 and 8, respectively, and the total number described in the mounting point information 307d is 120 points. In this case, the component types are assigned to the component supply units 124a and 124b so that the total number of component types is 4: 8. That is, 40 parts are assigned to the parts supply unit 124a, and 80 parts are assigned to the parts supply unit 124b. For this reason, the number of tasks of the sub-equipment 130a is 40/4 = 10 tasks, and the number of tasks of the sub-equipment 130b is 80/8 = 10 tasks. Therefore, the number of tasks of both is equal.

  Next, the component placement determination unit 305b replaces the placement position of the component assigned in the process of S12 between the component supply unit 124a and the component supply unit 124b, and as much as possible inside the electronic component mounting system 10, that is, the component supply. Components having a large number of mounting points (number) are arranged on the part 124a (S13).

  Finally, based on the component arrangement position determined by the component arrangement determining unit 305b, the mounting order determining unit 305a determines the component mounting order (S14). Since various methods have been proposed for determining the component mounting order, detailed description thereof will not be repeated here.

  Next, the component placement position determination processing (S11 to S13 in FIG. 14) by the component placement determination unit 305b will be described in more detail with a specific example. FIG. 15 is a diagram for explaining the component arrangement position determination processing. Here, it is assumed that the number of suction nozzles 121a of the multi mounting heads 121 of the sub-equipment 130a and 130b is equal. Further, it is assumed that the mounting point information 307d is as shown in FIG.

  Since the number ratio of the suction nozzles 121a of the multi-mounting heads 121 of the sub-equipment 130a and 130b is equal (S11 in FIG. 14), the component placement determining unit 305b sends the components to the component supply unit 124a as shown in FIG. C, D, E, and F are arranged, and the arrangement positions of the components are determined so that the components A and B are arranged in the component supply unit 124b (S12 in FIG. 14). That is, the number of mounting points of the components arranged in the component supply unit 124a and the component supply unit 124b is equal to 100 points. Here, it is assumed that the component supply unit 124a exists inside the electronic component mounting system 10 and the operator 200 is also in a position close to the component supply unit 124a.

  Next, the component arrangement determining unit 305b replaces the arrangement positions of the components so that components with a large number of mounting points are arranged as much as possible inside the electronic component mounting system 10, that is, in the component supply unit 124a (FIG. 14). S13). FIG. 15B is a diagram illustrating a result of changing the arrangement positions of the components illustrated in FIG. In this figure, the components arranged in the component supply unit 124a and the components arranged in the component supply unit 124b are all interchanged, and the components A and B having the largest number of mounting points are arranged in the component supply unit 124a. become.

  Another specific example will be described with reference to FIGS. 16 and 17. Here, similarly to the above-described specific example, the number of suction nozzles 121a of the multi mounting heads 121 of the sub-equipment 130a and 130b is assumed to be equal.

  FIG. 16 is a diagram illustrating an example of the mounting point information 307d. As shown in the figure, there are 8 types of components from A to H mounted on the left sub-equipment 120c. For example, the number of mounting points of the component A is 20 points, and the total number of mounting points is 240 points. It is shown.

  As shown in FIG. 17A, the component arrangement determining unit 305b arranges components C, D, E, and F in the component supply unit 124a, and arranges components A, B, G, and H in the component supply unit 124b. As described above, it is assumed that the arrangement position of the component is determined (S12 in FIG. 14). That is, the number of mounting points of the components arranged in the component supply unit 124a and the component supply unit 124b is equal to 120 points.

  Next, the component arrangement determining unit 305b replaces the arrangement positions of the components so that components with a large number of mounting points are arranged as much as possible inside the electronic component mounting system 10, that is, in the component supply unit 124a (FIG. 14). S13). FIG. 17B is a diagram illustrating a result of changing the arrangement positions of the components illustrated in FIG. In this figure, the parts E and F arranged in the part supply part 124a and the part A arranged in the part supply part 124b are exchanged. As a result, the component A with 20 mounting points is arranged inside the electronic component mounting system 10, and the components E and F with 10 mounting points are arranged outside the electronic component mounting system 10. In this way, only a part of the components arranged in the component supply unit 124a and the component supply unit 124b is relocated.

  Instead of component A, component G having the same number of mounting points as component A may be arranged inside. Also, the components B and H (mounting points 40) having a larger number of mounting points than the component A are not arranged on the inner side. If these components are arranged on the inner side, the number of mounting points of the components arranged in the component supply unit 124a is not increased. The ratio between the total value and the total value of the components arranged in the component supply unit 124b differs from the ratio of the number of suction nozzles 121a obtained in the process of S11 in FIG. 14, and the sub-equipment 130a and the sub-equipment 130b have different ratios. This is because the number of tasks cannot be made equal. If the number of tasks differs between the sub-equipment 130a and the sub-equipment 130b, the component is mounted on the board 20 only by one sub-equipment, and the other sub-equipment is in a dormant state. For this reason, work efficiency deteriorates and is not preferable.

  As described above, according to this embodiment, in each component mounting apparatus, the number of tasks of two sub-equipment for mounting components on a single board in a coordinated manner is equalized, and components with a large number of mounting points are provided. These component cassettes are arranged as much as possible in the component supply unit inside the electronic component mounting system. Parts with a large number of mounting points are frequently broken. For this reason, by arranging the component cassette of such components inside the electronic component mounting system, the component replacement operation by the operator can be quickly performed, and the efficiency of the component replacement operation by the operator is improved.

  Further, an electronic component mounting system is configured such that a component is mounted on the back surface of the substrate immediately after the component is mounted on the surface of the substrate. For this reason, there is no need for a stocker for temporarily storing a board with components mounted only on the surface, and intermediate stock stored in such a stocker can be eliminated.

  In the present embodiment, the sub-equipment 130a (component supply unit 124a) of the component mounting apparatus 120 has been described as facing the operator. However, the present invention is not necessarily limited to such an arrangement. The arrangement may be such that 130b (component supply unit 124b) faces the operator.

  For example, the arrangement of the component mounting apparatus 120 may be determined based on the positional relationship between the center position of the substrate 20 and the steady stop position of the multi mounting head 121. As described above, the operation rail 129b is configured to be movable in the Y-axis direction according to the length of the substrate 20 to be transported in the Y-axis direction. For this reason, as shown in FIG. 18, when the board | substrate 20 with comparatively small size is conveyed, the operation rail 129b approaches the sub equipment 130a side. Therefore, the distance in the Y-axis direction between the center position of the substrate 20 and the stationary stop position of the multi mounting head 121 of the sub-equipment 130a is F, and the stationary position of the central mounting position of the substrate 20 and the multi mounting head 121 of the sub-equipment 130b is F. When the distance in the Y-axis direction is R, the relationship “F <R” is established. That is, the substrate 20 is present at a position closer to the sub-equipment 130a than to the sub-equipment 130b. Therefore, the maintenance work when the multi-mounting head 121 accidentally drops a component on the board 20 during the mounting of the parts on the board 20 or the maintenance work such as replacement of the support pins that support the board 20 is performed by the sub-equipment 130a. The work efficiency of the operator is improved by going from the side. Therefore, the arrangement of the component mounting apparatus 120 may be determined so that the operator is arranged on the side where the fixed rail 129a exists.

  As shown in FIG. 19, when a relatively large substrate 20 is transported, the relationship “F> R” is established. In this case, in order to improve the efficiency of the above-described maintenance work, The arrangement of the component mounting apparatus 120 may be determined so that the operator is arranged on the side where the operation rail 129b exists.

  Such a component mounting device arrangement determination process is not applied only to a component mounting device in which components are mounted on a substrate while a plurality of multi mounting heads perform cooperative operation. The present invention may be applied to a component mounting apparatus in which a mounting head mounts components on a substrate, or may be applied to a component mounting apparatus in which a component supply unit is only on one side.

  Furthermore, the production facility arrangement determining apparatus 300 according to the present embodiment determines the arrangement of parts cassettes so that the number of tasks is equal between the sub-equipment 130a and the sub-equipment 130b. It is not necessary to equalize, and the component cassette may be preferentially arranged in the component supply unit on the side where the operator exists. In this case, the maximum number of component cassettes that can be arranged is arranged in the component supply unit on the side where the operator is present, and only the component cassettes that could not be arranged in the component supply unit are arranged in the component supply unit on the opposite side. It may be.

(Embodiment 3)
Next, a component mounting system according to Embodiment 3 of the present invention will be described. The electronic component mounting system according to Embodiment 3 is the same as the electronic component mounting system 10 shown in FIGS. 1 and 2, except that at least one of the component mounting devices 120, 140, 170, and 180 is the component shown in FIG. The mounting device 500 is replaced.

  The component mounting apparatus 500 is different from the component mounting apparatus 120 and the like in that two multi mounting heads do not mount components on one board 20 while cooperatively operating, but one multi mounting head has one board 20. Install the parts in Along with this, the processing executed by the production facility arrangement determining apparatus 300 is also different. In addition, it shall arrange | position so that the front surface of the component mounting apparatus 500 may face the inner side of an electronic component mounting system.

  FIG. 20 is an external view of the component mounting apparatus 500 according to the third embodiment as viewed from the front side. In the drawing, the component mounting apparatus 500 is partially cut away to show the inside.

  The component mounting apparatus 500 is a device that can be incorporated into a mounting line, mounts an electronic component on a substrate received from upstream, and sends out a circuit board that is a mounting substrate on which the electronic component is mounted downstream, A multi mounting head 510 that transports and mounts electronic components on a substrate, an XY robot 513 that moves the multi mounting head 510 in the horizontal plane direction, and a component supply unit 515 that supplies components to the multi mounting head 510 are provided. An operation unit 516 for operating the component mounting apparatus 500 is provided on the front surface of the component mounting apparatus 500. An operation unit (not shown) is also provided on the back surface of the component mounting apparatus 500.

  Specifically, this component mounting apparatus 500 is a mounting apparatus that can mount various electronic components from minute components to connectors on a substrate. Large-sized electronic components of □ 10 mm or more, and odd-shaped components such as switches and connectors , A mounting apparatus capable of mounting IC components such as QFP (Quad Flat Package) and BGA (Ball Grid Array).

FIG. 21 is a plan view showing the main internal configuration of the component mounting apparatus 500.
The component mounting apparatus 500 further conveys the two substrates 20a and 20b, and a nozzle station 519 on which a replacement nozzle that can be interchangeably attached to the multi-mounting head 510 to accommodate various types of component types. Rails 521, a mounting table (not shown) on which the transported boards 20a and 20b are mounted and electronic components are mounted, and the sucked and held electronic components are recovered if they are defective. And a parts collection device 523.

  Also, the component supply unit 515 is provided before and after the component mounting apparatus 500, and partitions the component supply units 515a, 515b and 515c for supplying electronic components stored in a tape shape according to the size of the component. And a component supply unit 515d for supplying an electronic component stored in the attached plate.

  FIG. 22 is a flowchart showing the component mounting order determination processing for the component mounting device 500 and the component placement determination processing for the component supply unit executed by the production facility placement determination device 300.

  First, the component arrangement determining unit 305b refers to the mounting point information 307d, and rearranges components in descending order of mounting points (S21). Next, the component arrangement determining unit 305b determines the component arrangement position so that the components are arranged in the component supply units 515a and 515b on the front surface of the component mounting apparatus 500 as much as possible (S22). At that time, the arrangement position is determined so that the parts having a larger number of mounting points are arranged in the component supply units 515a and 515b. For the components that could not be arranged in the component supply units 515a and 515b, the arrangement positions of the components are determined in the component supply unit 515c on the back of the component mounting apparatus 500.

  Finally, based on the component arrangement position determined by the component arrangement determining unit 305b, the mounting order determining unit 305a determines the component mounting order (S14). Since various methods have been proposed for determining the component mounting order, detailed description thereof will not be repeated here.

  Next, component placement position determination processing (S21 and S22 in FIG. 22) by the component placement determination unit 305b will be described with a specific example. First, it is assumed that mounting point information 307d as shown in FIG. The mounting point information 307d indicates the mounting point information of components by the component mounting apparatus 500, and eight types of components from component A to component H are mounted on one substrate 20 by the component mounting apparatus 500. Has been shown to be. For example, for component A, the number of mounting points per board is 20 points.

  When the mounting point number information 307d as shown in FIG. 23 (a) is given, the component placement determining unit 305b rearranges the components in descending order of the mounting points, and the mounting point number as shown in FIG. 23 (b). Information 307d is created (S21 in FIG. 22). Next, as shown in FIG. 24, the component arrangement determining unit 305b arranges the components in the component supply units 515a and 515b in descending order of the number of mounting points based on the mounting point information 307d shown in FIG. Then, the arrangement position of the components is determined so that the components that could not be arranged in the component supply units 515a and 515b, that is, the component F are arranged in the component supply unit 515c (S22 in FIG. 22).

  As described above, according to the present embodiment, in each component mounting apparatus, as many component cassettes as possible are arranged in the component supply unit inside the electronic component mounting system. For this reason, the operator can perform component replacement work without going too far outside the electronic component mounting system. Therefore, the part replacement work by the operator can be performed quickly, and the efficiency of the part replacement work by the operator is improved.

  In addition, a component cassette having a larger number of mounting points is arranged in a component supply unit inside the electronic component mounting system. Parts with a large number of mounting points are frequently broken. For this reason, by arranging the component cassette of such components inside the electronic component mounting system, the component replacement operation by the operator can be quickly performed, and the efficiency of the component replacement operation by the operator is improved.

(Embodiment 4)
Next, a component mounting system according to Embodiment 4 of the present invention will be described. The electronic component mounting system according to Embodiment 4 is the same as the electronic component mounting system 10 shown in FIGS. 1 and 2, except that at least one of the component mounting devices 120, 140, 170, and 180 is the component shown in FIG. The mounting device 400 is replaced.

  The component mounting apparatus 400 is provided with operation units 401 a and 401 b for operating the component mounting apparatus 400 and a component supply unit 402 for supplying components to the component mounting apparatus 400. The surface on which the operation unit 401 a is provided is the front surface of the component mounting apparatus 400, and the surface on which the operation unit 401 b is provided is the back surface of the component mounting apparatus 400. The component supply unit 402 is provided on the back surface of the component mounting apparatus 400, and the component mounting apparatus 400 is arranged in such a direction that the back surface of the component mounting apparatus 400 faces the inside of the electronic component mounting system 30.

  Next, the component mounting apparatus 400 will be described in more detail with reference to FIG. FIG. 26 is an external view of the component mounting apparatus 400 as seen from the front side.

  The component mounting apparatus 400 is a mounting apparatus that mounts a plurality of types of components on a printed circuit board that constitutes an electronic device at high speed. The component mounting device 400 picks up, conveys, and mounts components, and the rotary head 403 supports various types of components. And an XY table 404 for moving the placed printed board in the horizontal plane direction.

FIG. 27 is a schematic diagram showing the positional relationship between the component supply unit and the rotary head.
As shown in the upper part of FIG. 27, the rotary head 403 includes 18 mounting heads 406 as mounting means for mounting components on a printed circuit board. Further, the mounting head 406 is attached to a rotating base 405 that rotates without moving in the height direction so as to be movable in the height direction, and a suction nozzle (not shown) that can hold components by vacuum suction. 6 are provided.

  As shown in the lower part of FIG. 27, the component supply unit 402 includes component cassettes 123 that can sequentially provide the same components to the mounting head 406 in a horizontal row. The component supply unit 402 has a function of selecting a component to be mounted by moving and positioning the component supply unit 402 with respect to the rotary head 403 in the Z-axis direction in FIG.

  FIG. 28 is a diagram schematically showing the positional relationship among the rotary head, the substrate, and the component supply unit.

  As shown in the figure, the rotary shaft of the rotary head 403 does not move, and the mounting head 406 provided around the rotary shaft rotates intermittently to perform work corresponding to each position. Briefly, the mounting head 406 positioned at the upper part (position B) of the suction opening 409 provided in each of the component cassettes 123 sucks the component through the suction opening 409, and the mounting head 406 is positioned at a position E opposite to the mounting head 406. The components that are attracted to the substrate 20 when placed are mounted.

  The substrate 20 to be mounted with the component is placed on an XY table (not shown) that can move in the horizontal plane, and the position where the component is to be mounted is determined by moving the substrate 20.

  As described above, according to the present embodiment, in the component mounting apparatus in which the component supply unit is provided only on one surface, the component mounting apparatus is arranged so that the component supply unit faces the inside of the electronic component mounting system. It is arranged. For this reason, the operator can perform component replacement work without going outside the electronic component mounting system. Therefore, the part replacement work by the operator can be performed quickly, and the efficiency of the part replacement work by the operator is improved.

  The electronic component mounting system according to the embodiments of the present invention has been described above, but the present invention is not limited to these embodiments.

  For example, in the second embodiment, the arrangement position of the component cassette is determined so that the component cassette of the component having a large number of mounting points is arranged in the component supply unit of the component mounting apparatus located inside the electronic component mounting system. You may determine the arrangement position of a component cassette so that the number of component cassettes may become so large that the component supply part inside a mounting system.

  For example, in the part placement determination process (S12 in FIG. 14), when the part placement as shown in FIG. 15A is obtained, the part placement determination unit 305b performs the part replacement process (S13 in FIG. 14). ), The component arrangement shown in FIG. 15A is determined as the optimum component arrangement. Further, in the part placement determination process (S12 in FIG. 14), when the part placement as shown in FIG. 17A is obtained, the part placement determination unit 305b performs the part replacement process (S13 in FIG. 14). For example, the component arrangement as shown in FIG. 29 is determined as the optimum component arrangement. By making such a determination, the operator can exchange more types of parts cassettes at a time.

  Moreover, the electronic component mounting system does not necessarily have a U-shape, and may be configured such that production facilities are arranged on a straight line. For example, assuming that each operator is in charge of two lines of production equipment, and the operator is arranged between the two lines in charge, the surface to be operated mainly in the two lines in charge is directed to the operator side. Each production facility is arranged as follows.

  In the fourth embodiment, a component mounting apparatus called a so-called rotary machine has been described as an example. However, the present invention is not limited to this type of component mounting apparatus, and a component having a component supply unit only on one side. As long as it is a mounting device, it may be a component mounting device of another type.

  The present invention can be applied to an electronic component mounting system for mounting components on both sides of a substrate.

1 is an external view showing a configuration of an electronic component mounting system according to Embodiment 1 of the present invention. FIG. 2 is a schematic diagram of the component mounting system shown in FIG. FIG. 3 is a flowchart of the production facility placement process executed by the production facility placement determination apparatus. FIG. 4 is an external view showing the configuration of the component mounting apparatus according to the second embodiment. FIG. 5 is a plan view showing a main configuration inside the component mounting apparatus according to the second embodiment. FIG. 6 is a schematic diagram showing the positional relationship between the multi-mounting head and the component cassette. FIG. 7 is a diagram for explaining component mounting by the component mounting apparatus according to the second embodiment. FIG. 8 is a diagram for explaining component mounting by the component mounting apparatus according to the second embodiment. FIG. 9 is a block diagram illustrating a configuration example of the production facility arrangement determining apparatus. FIG. 10 is a diagram illustrating an example of the mounting point data. FIG. 11 is a diagram illustrating an example of a component library. FIG. 12 is a diagram illustrating an example of mounting apparatus information. FIG. 13 is a diagram illustrating an example of the mounting point information. FIG. 14 is a flowchart showing a component mounting order determination process and a component placement determination process for the component supply unit executed by the production facility layout determination apparatus. FIG. 15 is a diagram for explaining the component arrangement position determination processing. FIG. 16 is a diagram illustrating an example of mounting point information. FIG. 17 is a diagram for explaining a component arrangement position determination process. FIG. 18 is a diagram for explaining the relationship between the distance between the center position of the substrate and the stationary stop position of the multi-mounting head when a small substrate is transported. FIG. 19 is a diagram illustrating the relationship between the distance between the center position of the substrate and the stationary stop position of the multi-mounting head when a large substrate is transported. FIG. 20 is an external view of the component mounting apparatus according to the third embodiment as viewed obliquely from the front. FIG. 21 is a plan view showing the main internal configuration of the component mounting apparatus according to the third embodiment. FIG. 22 is a flowchart showing a component mounting order determination process for the component mounting apparatus according to the third embodiment and a component placement determination process for the component supply unit executed by the production facility placement determination apparatus. FIG. 23 is a diagram for explaining a change in the mounting point information. FIG. 24 is a diagram for explaining a component arrangement position determination process. FIG. 25 is a schematic diagram of a bird's-eye view of the electronic component mounting system according to Embodiment 4 of the present invention. FIG. 26 is an external view of the component mounting apparatus according to the fourth embodiment as viewed obliquely from the front. FIG. 27 is a schematic diagram showing the positional relationship between the component supply unit and the rotary head. FIG. 28 is a diagram schematically showing the positional relationship among the rotary head, the substrate, and the component supply unit. FIG. 29 is a diagram for explaining a component arrangement position determination process.

Explanation of symbols

10, 30 Electronic component mounting system 20, 20a, 20b Substrate 100, 192 Stocker 112, 158 Solder printer 113, 117, 127a, 127b, 141a, 141b, 153, 159, 516
Operation unit 114,154,150,160,182 Conveyor 116,162 Adhesive application device 120,140,170,180,400,500 Component mounting device 163,171a, 181a, 401a, 401b Operation unit 120a Front sub-equipment 120b Rear Sub-equipment 120c Left sub-equipment 120d Right sub-equipment 121,510 Multi-mounting head 121a, 121b Suction nozzle 122 Beam 123 Parts cassette 124a, 124b, 402, 515, 515a, 515b, 515c, 515d Parts supply section 126 Parts recognition camera 128 Tray Supply section 129, 521 Rail 129a Fixed rail 129b Operating rail 130a, 130b, 132a, 132b Sub-equipment 152, 190 Reflow furnace 156 Substrate reversing device 191 Operation section 200 Perator 300 Production equipment arrangement determination device 301 Arithmetic control unit 302 Display unit 303 Input unit 304 Memory unit 305 Determination program storage unit 305a Mounting order determination unit 305b Component arrangement determination unit 306 Communication I / F unit 307 Database unit 307a Mounting point data 307b Component Library 307c Mounting device information 307d Mounting point information 403 Rotary head 404 XY table 405 Rotating base 406 Sequential mounting head 406 Mounting head 409 Suction opening 513 XY robot 519 Nozzle station 523 Parts recovery device

Claims (15)

A production facility layout determination method by a production facility layout determination device that determines the layout of a production facility that produces a component mounting board with components mounted on a board,
The production facility arrangement determining method includes a determining step of determining a surface on which the operator mainly operates the production facility depending on a position where the operator is arranged. Further, the production facility arrangement determination device includes a step of detecting an arrangement position of the operator,
2. The production facility arrangement determination method according to claim 1, wherein in the determination step, a surface on which the operator mainly operates the production facility is determined depending on the detected position of the operator. The production facility includes a plurality of component supply units, and is a component mounting apparatus that mounts components on a board,
In the determining step, the arrangement of the component cassettes is determined so that the replacement of the component cassettes frequently occurs in the component supply unit existing on the side where the operator is arranged as compared with other component supply units. The production facility arrangement determination method according to claim 1. The production facility includes an operation unit on one side for an operator to operate the production facility,
2. The production facility arrangement according to claim 1, wherein in the determination step, a surface including the operation unit that operates the production facility is determined as a surface on which the operator mainly operates the production facility. Decision method. The production facility includes a plurality of component supply units, and is a component mounting apparatus that mounts components on a board,
2. The production facility arrangement according to claim 1, wherein, in the determining step, an arrangement position in the component supply unit of a component cassette storing a component is determined depending on a position where the operator is arranged. Decision method. 6. The determination position of the component cassette is determined in the determining step so that a component cassette of a component having a relatively large number of mounting points is disposed in the component supply unit on the side where the operator is disposed. The production facility arrangement determination method described. The component mounting apparatus is an apparatus in which a plurality of mounting heads alternately mount components on a single substrate, and the component mounting apparatus includes a plurality of component supply units corresponding to the plurality of mounting heads. Are provided,
The determining step includes
The production facility arrangement determining device acquires the number of suction nozzles for sucking the parts provided in each of the plurality of mounting heads;
The production facility arrangement determining device is configured to place a component cassette of a component to be mounted on one of the plurality of component supply units so that a ratio of the number of suction nozzles and a ratio of the number of component mounting points on the substrate are equal. An assignment step to assign to
The production facility arrangement determination device exchanges a component cassette between the plurality of component supply units, and an operator makes a ratio of the number of suction nozzles equal to a ratio of the number of component mounting points on the substrate. The arrangement position determination step of determining the arrangement position of a component cassette so that the component cassette of a component with a relatively large number of mounting points may be arrange | positioned in the component supply part by the side of arrangement | positioning. The production facility arrangement determination method described. 6. The production facility arrangement determination according to claim 5, wherein, in the determination step, the arrangement position of the component cassette is determined so that the number of component cassettes of the component supply unit on the side where the operator is arranged is relatively large. Method. The component mounting apparatus is an apparatus in which a plurality of mounting heads alternately mount components on a single substrate, and the component mounting apparatus includes a plurality of component supply units corresponding to the plurality of mounting heads. Are provided,
The determining step includes
The production facility arrangement determining device acquires the number of suction nozzles for sucking the parts provided in each of the plurality of mounting heads;
The production facility arrangement determining device is configured to place a component cassette of a component to be mounted on one of the plurality of component supply units so that a ratio of the number of suction nozzles and a ratio of the number of component mounting points on the substrate are equal. An assignment step to assign to
The production facility arrangement determining device is configured such that the ratio of the number of suction nozzles and the ratio of the number of parts mounted on the substrate are equal, and the number of component cassettes of the component supply unit on the side where the operator is arranged is relatively The production facility arrangement determination method according to claim 8, further comprising: an arrangement position determination step of determining an arrangement position of the parts cassette so as to increase the number of parts. The production facility is a component mounting apparatus in which a component supply unit is provided only on one side surface, and a component is mounted on a substrate.
2. The production according to claim 1, wherein in the determining step, the surface on which the component supply unit of the component mounting apparatus is provided is determined as a surface on which the operator mainly operates the component mounting apparatus. Equipment layout determination method In the determining step, the arrangement of the plurality of production facilities is further determined to be a U shape centered by the operator, and the operator mainly operates the inner surface of the U shape with respect to each production facility. The production facility arrangement determining method according to claim 1, wherein the method is determined as a surface to be performed. A production facility layout determination device that determines the layout of a production facility that produces a component mounting board with components mounted on a board,
A production facility arrangement determining apparatus, comprising: a determining unit that determines a surface on which the operator mainly operates the production facility depending on a position where the operator is arranged. The production facility includes a plurality of component supply units, and is a component mounting apparatus that mounts components on a board,
The production facility arrangement according to claim 12, wherein the determining means determines an arrangement position of the component supply unit of a component cassette in which components are stored depending on a position where the operator is arranged. Decision device. An electronic component mounting system comprising a plurality of production facilities,
An electronic component mounting system, wherein each production facility is arranged such that a surface on which an operator mainly operates the production facility faces a side where the operator is arranged. A program for determining the arrangement of production equipment for producing a component mounting board in which components are mounted on a board,
A program for causing a computer to execute a determination step of determining a surface on which an operator mainly operates a production facility depending on a position where the operator is arranged.

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