JP2007012727A - 発光装置 - Google Patents

発光装置 Download PDF

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Publication number
JP2007012727A
JP2007012727A JP2005189154A JP2005189154A JP2007012727A JP 2007012727 A JP2007012727 A JP 2007012727A JP 2005189154 A JP2005189154 A JP 2005189154A JP 2005189154 A JP2005189154 A JP 2005189154A JP 2007012727 A JP2007012727 A JP 2007012727A
Authority
JP
Japan
Prior art keywords
emitting device
light emitting
lead frame
led chip
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2005189154A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007012727A5 (enExample
Inventor
Norifumi Hattori
徳文 服部
Yoshimasa Tatewaki
慶真 帯刀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyoda Gosei Co Ltd
Original Assignee
Toyoda Gosei Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyoda Gosei Co Ltd filed Critical Toyoda Gosei Co Ltd
Priority to JP2005189154A priority Critical patent/JP2007012727A/ja
Publication of JP2007012727A publication Critical patent/JP2007012727A/ja
Publication of JP2007012727A5 publication Critical patent/JP2007012727A5/ja
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

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  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP2005189154A 2005-06-29 2005-06-29 発光装置 Withdrawn JP2007012727A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005189154A JP2007012727A (ja) 2005-06-29 2005-06-29 発光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005189154A JP2007012727A (ja) 2005-06-29 2005-06-29 発光装置

Publications (2)

Publication Number Publication Date
JP2007012727A true JP2007012727A (ja) 2007-01-18
JP2007012727A5 JP2007012727A5 (enExample) 2007-09-06

Family

ID=37750872

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005189154A Withdrawn JP2007012727A (ja) 2005-06-29 2005-06-29 発光装置

Country Status (1)

Country Link
JP (1) JP2007012727A (enExample)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008198807A (ja) * 2007-02-14 2008-08-28 Nichia Corp 半導体装置
JP2009054990A (ja) * 2007-05-31 2009-03-12 Avago Technologies Ecbu Ip (Singapore) Pte Ltd 放熱の向上を伴う側面発光ｌｅｄパッケージ
JP2009065152A (ja) * 2007-09-04 2009-03-26 Seoul Semiconductor Co Ltd 熱放出スラグを有する発光ダイオードパッケージ
WO2010119830A1 (ja) 2009-04-13 2010-10-21 パナソニック電工株式会社 発光ダイオード
US7993038B2 (en) 2007-03-06 2011-08-09 Toyoda Gosei Co., Ltd. Light-emitting device
KR20130022642A (ko) * 2011-08-25 2013-03-07 엘지이노텍 주식회사 발광 소자 패키지 및 이를 구비한 조명 시스템
WO2013137005A1 (ja) * 2012-03-13 2013-09-19 シャープ株式会社 発光装置およびバックライト装置
WO2015097955A1 (ja) * 2013-12-26 2015-07-02 アピックヤマダ株式会社 リードフレーム、ｌｅｄパッケージ用基板、リフレクタ部材、ｌｅｄパッケージ、発光装置、発光システム、並びに、ｌｅｄパッケージ用基板及びｌｅｄパッケージの製造方法
EP2372794A3 (en) * 2010-04-01 2015-12-23 LG Innotek Co., Ltd. Lighting device, display device and lighting system having the same
CN106461170A (zh) * 2014-07-18 2017-02-22 堺显示器制品株式会社 光源装置和显示装置
JP2018074149A (ja) * 2016-10-26 2018-05-10 液光固態照明股▲ふん▼有限公司 放熱構造を有する発光ダイオードフィラメント及び放熱構造を有する発光ダイオードフィラメントを用いた発光ダイオードフィラメント電球

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008198807A (ja) * 2007-02-14 2008-08-28 Nichia Corp 半導体装置
US7993038B2 (en) 2007-03-06 2011-08-09 Toyoda Gosei Co., Ltd. Light-emitting device
JP2009054990A (ja) * 2007-05-31 2009-03-12 Avago Technologies Ecbu Ip (Singapore) Pte Ltd 放熱の向上を伴う側面発光ｌｅｄパッケージ
EP2034529B1 (en) * 2007-09-04 2016-04-13 Seoul Semiconductor Co., Ltd. Light emitting diode package having heat dissipating slugs
JP2009065152A (ja) * 2007-09-04 2009-03-26 Seoul Semiconductor Co Ltd 熱放出スラグを有する発光ダイオードパッケージ
WO2010119830A1 (ja) 2009-04-13 2010-10-21 パナソニック電工株式会社 発光ダイオード
EP2372794A3 (en) * 2010-04-01 2015-12-23 LG Innotek Co., Ltd. Lighting device, display device and lighting system having the same
KR20130022642A (ko) * 2011-08-25 2013-03-07 엘지이노텍 주식회사 발광 소자 패키지 및 이를 구비한 조명 시스템
KR101872521B1 (ko) * 2011-08-25 2018-06-28 엘지이노텍 주식회사 발광 소자 패키지 및 이를 구비한 조명 시스템
US9163810B2 (en) 2012-03-13 2015-10-20 Sharp Kabushiki Kaisha Light emitting device and backlight device
JPWO2013137005A1 (ja) * 2012-03-13 2015-08-03 シャープ株式会社 発光装置およびバックライト装置
CN104170105A (zh) * 2012-03-13 2014-11-26 夏普株式会社 发光装置以及背光装置
WO2013137005A1 (ja) * 2012-03-13 2013-09-19 シャープ株式会社 発光装置およびバックライト装置
WO2015097955A1 (ja) * 2013-12-26 2015-07-02 アピックヤマダ株式会社 リードフレーム、ｌｅｄパッケージ用基板、リフレクタ部材、ｌｅｄパッケージ、発光装置、発光システム、並びに、ｌｅｄパッケージ用基板及びｌｅｄパッケージの製造方法
CN106461170A (zh) * 2014-07-18 2017-02-22 堺显示器制品株式会社 光源装置和显示装置
JP2018074149A (ja) * 2016-10-26 2018-05-10 液光固態照明股▲ふん▼有限公司 放熱構造を有する発光ダイオードフィラメント及び放熱構造を有する発光ダイオードフィラメントを用いた発光ダイオードフィラメント電球
US10323799B2 (en) 2016-10-26 2019-06-18 Liquidleds Lighting Corp. Light-emitting diode filament with a heat-dissipating structure and light-emitting diode filament light bulb using the same

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