JP2007005834A5 - - Google Patents
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- Publication number
- JP2007005834A5 JP2007005834A5 JP2006275955A JP2006275955A JP2007005834A5 JP 2007005834 A5 JP2007005834 A5 JP 2007005834A5 JP 2006275955 A JP2006275955 A JP 2006275955A JP 2006275955 A JP2006275955 A JP 2006275955A JP 2007005834 A5 JP2007005834 A5 JP 2007005834A5
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- film
- design data
- exposure mask
- film thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005498 polishing Methods 0.000 claims 43
- 238000000034 method Methods 0.000 claims 11
- 230000010365 information processing Effects 0.000 claims 10
- 238000005259 measurement Methods 0.000 claims 5
- 238000007517 polishing process Methods 0.000 claims 4
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006275955A JP2007005834A (ja) | 2006-10-10 | 2006-10-10 | 研磨方法および研磨システム |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006275955A JP2007005834A (ja) | 2006-10-10 | 2006-10-10 | 研磨方法および研磨システム |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002157952A Division JP2003347258A (ja) | 2002-05-30 | 2002-05-30 | 研磨方法および研磨システム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2007005834A JP2007005834A (ja) | 2007-01-11 |
| JP2007005834A5 true JP2007005834A5 (https=) | 2007-03-01 |
Family
ID=37691053
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006275955A Pending JP2007005834A (ja) | 2006-10-10 | 2006-10-10 | 研磨方法および研磨システム |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2007005834A (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6018773B2 (ja) * | 2012-03-19 | 2016-11-02 | ラピスセミコンダクタ株式会社 | 半導体素子の製造方法及び製造装置 |
| CN119772182B (zh) * | 2025-03-07 | 2025-05-23 | 昆明理工大学 | 一种弥散强化铜合金制备系统及方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3580036B2 (ja) * | 1996-08-06 | 2004-10-20 | ソニー株式会社 | 研磨シミュレーション方法 |
| JP3745951B2 (ja) * | 2000-09-27 | 2006-02-15 | 松下電器産業株式会社 | 化学機械研磨方法および化学機械研磨装置 |
-
2006
- 2006-10-10 JP JP2006275955A patent/JP2007005834A/ja active Pending
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