JP2006526426A - 多孔質薬剤送出層を形成するための方法 - Google Patents
多孔質薬剤送出層を形成するための方法 Download PDFInfo
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- JP2006526426A JP2006526426A JP2005500649A JP2005500649A JP2006526426A JP 2006526426 A JP2006526426 A JP 2006526426A JP 2005500649 A JP2005500649 A JP 2005500649A JP 2005500649 A JP2005500649 A JP 2005500649A JP 2006526426 A JP2006526426 A JP 2006526426A
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- porous layer
- electroplating
- stent
- drug
- mandrel
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Abstract
Description
例1
金製送出装置を形成するための方法
テクニック社からテクニック・オロテンプ24として販売されている標準的なシアニド高純度金電気めっき浴から幾つかの工程で金を電気めっきする。先ず最初に、標準的全密度金付着物を、平均電流密度が3ASFの1msのオンサイクル及び9msのオフサイクルのパルス電流で20分間に亘ってゆっくりと攪拌しながら形成する。浴の温度は51.67℃(1250F)である。次いで、直流(パルスをなしていない)に切り換え、電流密度を90ASFまで上昇することによって多孔質層を成長する。多孔質層を成長するための時間は、毎分約1μmのめっき速度に基づく。従って、幾つかの薬剤送出の用途について適当な10μm厚の多孔質層は、成長に10分間を要する。SEM写真は、このような状態で成長した代表的な多孔質層を示し、鋭く尖った結晶面を持つ約0.5μm乃至1.5μmの大きさの粒でできている。粒は、ランダムに配向されており、付着物は30%乃至40%の気孔率を有する。
例2
テクニック社が434HSとして販売している金浴を使用して例1の工程を繰り返す。電流密度を例1で使用した電流密度の約1/3まで低下する。同様の付着物が形成された。
例3
自由シアニド濃度を0.2g/l乃至2.0g/lにするために青酸カリウムを加えてpHを11にした例1の浴を使用して例1の工程を繰り返す。電流密度を例1で使用した場合の約20%まで低下した。自由シアニドを含む高pH浴は、逆サイクル中に多孔質層から金を溶解する上で、例1及び例2で使用された浴よりも更に効率的である。高pH浴は、約0.5μmまで小さくなった非常に小さい粒を形成する。
例4
金を電気鋳造した薬剤溶離ステント
ステントを成長し、多孔質層を成長し、そしてオリフィス付着物を成長する連続電気めっき工程で金を電気鋳造した薬剤溶離ステントを製造した。単一の電気めっきで全部で三つの工程を同じ浴で行った。ステントは100%が金でできており、動脈と接触するステントの表面上に薬剤を貯蔵/溶離するための多孔質層を有する。
例5
予め製造したステント上の電気めっき金薬剤溶離層
予め製造したステンレス鋼又はニチノール製のステント基材を賦活し、電気めっきの技術分野で当業者に周知の工程で付着性金ストライクでめっきする。次いで、金ストライク層を十分な密度の高純度の延性の金でできた固体層で、予め製造したステントのベース材料を露呈する全ての小孔をなくすのに十分な厚さまでめっきする。ステントの拡張及び配置後でもベースステント材料が露呈されないことが重要である。ベースステント材料及び電気めっきした金が血液と接触すると、化学電池が形成され、これによりベース金属の腐蝕が加速し、有毒で潜在的に危険なイオンが血液及び組織中に放出される。次いで、多孔質層を十分な密度の金固体層上で成長し、薬剤送出装置を形成する。ニチノール又はステンレス鋼製のステントでは、電気めっき層をニッケルから形成し、電気めっきが破れてベースステントが露呈した場合に発生する化学電池の電位を下げてもよい。
例6
電気めっき金を含む経皮的薬剤溶離パッチ
銅又はアルミニウムのシート、又は他の犠牲マンドレル(すなわち、仮の心金)基材の一方の表面を標準的な全密度高純度金でめっきした後、多孔質金をめっきし、随意であるがこの上にオリフィス付着物を重ねてめっきする。犠牲マンドレルを溶解し又は引き剥がし、金層及び多孔質層を薬剤送出装置として残す。次いで、薬剤送出装置に薬剤を充填する。接着剤、包帯、又は他の方法で薬剤送出装置を皮膚に当てた状態に保持する。
例7
電気めっき金を含む薬剤溶離インプラント
直径1mmの316ステンレス鋼製のワイヤ基材を固体金層及び多孔質層でめっきし、この多孔質層に薬剤を充填し、薬剤送出装置を形成する。めっきを施したワイヤを所定の長さに切断し、端部に中実の金めっきしてワイヤを覆い、身体と接触する連続した金表面を形成する。円筒体又は多数の薬剤溶離円筒体を皮膚の下に、又は腫瘍内に、又は身体の他の部分内に挿入できる。別の態様では、多孔質層に充填できるよりも多量の薬剤を必要とする用途では、外壁が本発明の多孔質層でできているベッセルを電気鋳造してもよい。ベッセルを形成するため、アルミニウム又は銅製の犠牲ロッド又はワイヤ基材に多孔質層を直接めっきする。めっきした犠牲ワイヤマンドレル基材を所定長さに切断した後、犠牲マンドレルを溶解し、多孔質層が薬剤送出装置を形成する中空ベッセルを残す。埋め込み前にベッセルを薬剤で充填し、シールする。シールは、薬剤で充填したチューブの端部を潰したりクリンプ加工したりすることによって、又は金プラグをチューブの開放端に挿入することによって行うことができる。
例8
経口錠剤又は座薬錠剤
金製の薄い多孔質のフィルムを犠牲マンドレル(すなわち、仮の心金)基材にめっきし、犠牲マンドレルを溶解し、薬剤送出装置を形成する。金製の薄い多孔質層に薬剤を充填し、錠剤に形成し、嚥下する。薬剤は消化管内に溶離し、錠剤はこれを通過する。金製の薬剤溶離錠剤は、座薬として配合することもできる。
14 小孔 16 顆粒
18 開口部 20 固体層
Claims (26)
- 薬剤送出装置を形成するための方法において、
基材を提供する工程、及び
制御された大きさ及び性質を持つ小孔に連結された開口部を持つ多孔質層を前記基材に電気めっきする工程を含む、方法。 - 請求項1に記載の方法による製品。
- 請求項1に記載の方法において、前記電気めっき工程後、一つ又はそれ以上の薬剤を前記小孔に充填する工程を更に含む、方法。
- 請求項3に記載の方法による製品。
- 請求項3に記載の方法において、前記薬剤は、デキサメタゾン、イマチニブメシレート、シロリマス、アスピリン、ヘプリン、及びパクリタクセル、及びその組み合わせからなる群から選択された、方法。
- 請求項1に記載の方法において、前記薬剤送出装置はステントである、方法。
- 請求項6に記載の方法による製品。
- 請求項1に記載の方法において、前記電気めっき工程は、金、ニッケル、銀、銅、錫、パラジウム、プラチナ、ロジウム、イリジウム、及びこれらの合金及びその組み合わせからなる群から選択された金属を電気めっきする工程を含む、方法。
- 請求項8に記載の方法において、前記金属は金である、方法。
- 請求項1に記載の方法において、前記提供工程と前記多孔質層を電気めっきする前記工程との間に、前記基材上に固体層を電気めっきする工程を含む、方法。
- 請求項10に記載の方法において、前記基材は犠牲マンドレルであり、前記固体層を電気めっきする前記工程の後に前記マンドレルを溶解する工程を更に含む、方法。
- 請求項1に記載の方法において、前記基材は医療装置である、方法。
- 請求項12に記載の方法において、前記医療装置はステントである、方法。
- 請求項1に記載の方法において、前記多孔質層上にオリフィス付着物を重ねてめっきする工程を更に含む、方法。
- 請求項1に記載の方法において、前記多孔質層に重ねて上層を形成する工程を更に含む、方法。
- 請求項15に記載の方法において、前記形成工程は、前記多孔質層にピーニングを施して前記上層を形成する工程を含む、方法。
- 請求項15に記載の方法において、前記形成工程は、前記多孔質層上にポリマーを適用する工程を含む、方法。
- 薬剤送出ステントを形成するための方法において、
マンドレルを提供する工程、
前記マンドレルをレジストでコーティングする工程、
前記レジストの部分を光パターンに露呈し、前記マンドレル上のレジストにステントパターンを形成する工程、
気孔率が1%以下のステントを前記マンドレルに電気めっきする工程、
大きさ及び性質が制御された小孔に開口部が連結された多孔質層を前記ステントに電気めっきする工程、及び
前記レジスト及び前記マンドレルを除去する工程を含む、方法。 - 請求項18に記載の方法による製品。
- 薬剤送出ステントを形成するための方法において、
予め製造されたステントを提供する工程、及び
大きさ及び性質が制御された小孔に開口部が連結された多孔質層を前記ステントに電気めっきする工程を含む、方法。 - 請求項20に記載の方法による製品。
- 請求項20に記載の方法において、
前記提供工程と前記電気めっき工程との間に、気孔率が約1%以下の金属を前記ステントに電気めっきする工程を更に含む、方法。 - 薬剤送出装置を形成するための方法において、
基材を提供する工程、
大きさ及び性質が制御された小孔を持つ、気孔率が約1%以上の多孔質層を前記基材に電気めっきする工程、及び
薬剤を前記小孔に充填する工程を含む、方法。 - 請求項23に記載の方法において、前記薬剤送出装置はステントである、方法。
- 埋め込み式薬剤送出装置を形成するための方法において、
犠牲マンドレルを提供する工程、
前記マンドレルに多孔質層を電気めっきし、前記マンドレル上にベッセルを形成する工程、
前記マンドレルの一部を露呈するため、前記ベッセルに少なくとも一つの穴を形成する工程、
前記マンドレルを溶解する工程、
前記ベッセルに一つ又はそれ以上の薬剤を充填する工程、及び
前記穴の全てをシールする工程を含む、方法。 - 請求項25に記載の方法による製品。
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US10/452,891 US6904658B2 (en) | 2003-06-02 | 2003-06-02 | Process for forming a porous drug delivery layer |
PCT/US2003/039865 WO2004108346A1 (en) | 2003-06-02 | 2003-12-15 | Process for forming a porous drug delivery layer |
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Also Published As
Publication number | Publication date |
---|---|
EP1635985A1 (en) | 2006-03-22 |
US6904658B2 (en) | 2005-06-14 |
WO2004108346A1 (en) | 2004-12-16 |
US20040237282A1 (en) | 2004-12-02 |
AU2003293557A1 (en) | 2005-01-04 |
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