JP2006517332A - Direct LED lamp - Google Patents

Direct LED lamp Download PDF

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JP2006517332A
JP2006517332A JP2006501403A JP2006501403A JP2006517332A JP 2006517332 A JP2006517332 A JP 2006517332A JP 2006501403 A JP2006501403 A JP 2006501403A JP 2006501403 A JP2006501403 A JP 2006501403A JP 2006517332 A JP2006517332 A JP 2006517332A
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led
housing
lamp assembly
platform
groove
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コール ジェイ キュニーン
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デコマ インターナショナル インコーポレイテッド
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60Q—ARRANGEMENT OF SIGNALLING OR LIGHTING DEVICES, THE MOUNTING OR SUPPORTING THEREOF OR CIRCUITS THEREFOR, FOR VEHICLES IN GENERAL
    • B60Q1/00—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor
    • B60Q1/26—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor the devices being primarily intended to indicate the vehicle, or parts thereof, or to give signals, to other traffic
    • B60Q1/2696—Mounting of devices using LEDs
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015—Fastening arrangements intended to retain light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R25/00—Coupling parts adapted for simultaneous co-operation with two or more identical counterparts, e.g. for distributing energy to two or more circuits
    • H01R25/16—Rails or bus-bars provided with a plurality of discrete connecting locations for counterparts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
    • H01R33/05—Two-pole devices
    • H01R33/06—Two-pole devices with two current-carrying pins, blades or analogous contacts, having their axes parallel to each other
    • H01R33/09—Two-pole devices with two current-carrying pins, blades or analogous contacts, having their axes parallel to each other for baseless lamp bulb
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
    • F21S43/10—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
    • F21S43/19—Attachment of light sources or lamp holders
    • F21S43/195—Details of lamp holders, terminals or connectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00—Illumination
    • Y10S362/80—Light emitting diode

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Led Device Packages (AREA)

Abstract

ランプは、非導電性ハウジングを有する。一つ又はそれ以上の発光ダイオード（ＬＥＤ）が、一つ又はそれ以上の導電性エポキシによって、ハウジングに取り付けられる。ＬＥＤを、随意に、ハウジングに機械的に取り付けてもよい。導電性エポキシは、ＬＥＤを駆動回路に接続するための一つ又はそれ以上の電圧レールを提供する。The lamp has a non-conductive housing. One or more light emitting diodes (LEDs) are attached to the housing by one or more conductive epoxies. The LED may optionally be mechanically attached to the housing. The conductive epoxy provides one or more voltage rails for connecting the LED to the drive circuit.

Description

本発明は、ランプの分野に関し、より詳細には、直付けＬＥＤランプに関する。   The present invention relates to the field of lamps and, more particularly, to a direct LED lamp.

発光ダイオード（light emitting diodes：ＬＥＤ）は、多くの自動車用途において、白熱灯電球と徐々に取って代わりつつある。例えば、最新世代のＬＥＤとすれば長寿命かつ高輝度のため、ブレーキランプ、方向指示ランプ又は他の信号ランプのような自動車の外部照明用途にＬＥＤを使用することは魅力的である。ＬＥＤはまた、ランプハウジングが狭い又は浅い輪郭を有することを可能にし、それは、多くの用途で有利であろう。   Light emitting diodes (LEDs) are gradually replacing incandescent bulbs in many automotive applications. For example, because the latest generation of LEDs has a long life and high brightness, it is attractive to use LEDs in automotive exterior lighting applications such as brake lamps, turn signal lamps or other signal lamps. LEDs also allow the lamp housing to have a narrow or shallow profile, which may be advantageous in many applications.

白熱灯に匹敵する輝度レベルを提供するため、一連の又は複数のＬＥＤが、しばしば、ランプに使用されなければならず、かくして、複雑さ及び製造コストを増大させる。例えば、在来の製造実例は、ＬＥＤを、ランプハウジングに取り付けられるプリント回路基板（printed circuit board：ＰＣＢ）に実装することにある。この実例での問題は、典型的には、精巧な半田付け機械装置又は技術の使用を必要とすることであり、また、ＰＣＢが一般に平らである（複雑な形状のＰＣＢは、調達するのに相当高価である。）から、それによって生ずるＰＣＢは、典型的には、形態の要因が限定される。しかしながら、自動車の方向指示信号のような照明器具ハウジングは、複雑な形状に成るかもしれず、かくして、ＰＣＢベースのＬＥＤランプは、最適なデザイン選択ではない。   In order to provide a brightness level comparable to incandescent lamps, a series or multiple LEDs must often be used in the lamp, thus increasing complexity and manufacturing costs. For example, a conventional manufacturing example consists in mounting LEDs on a printed circuit board (PCB) that is attached to a lamp housing. The problem with this example is that it typically requires the use of elaborate soldering machinery or technology, and the PCB is generally flat (complexly shaped PCBs are difficult to procure. The resulting PCB is typically limited in form factors. However, luminaire housings, such as automobile turn signals, may be complex in shape, thus PCB-based LED lamps are not the optimal design choice.

ＰＣＢ又は他の基板に実装されたＬＥＤアレイの例が、米国特許第４７４２４３２号、第４９６６８６２号、第５１１９１７４号、第５３３１５１２号、第６２９９３３７号及び第６３４６７７７号に見出される。   Examples of LED arrays mounted on a PCB or other substrate can be found in US Pat. Nos. 4,742,432, 4,966,862, 5,119,174, 5,331,512, 6,299,337 and 6,346,777.

ＬＥＤアレイを構成する他の方法は、ＬＥＤを、クリンチング機を使用して、半田なしで接続することができる折り畳み可能な金属基板を用いる。その金属基板は、ＬＥＤの母線の列の間に、基板を複雑な形状に形成することを可能にするフレキシブルジョイントを有する。かかる装置は、米国特許第５，４０４，２８２号及び米国特許第５５１９５９６号に開示されている。米国特許５，５１９，５９６号に開示のものと同じ市販の装置は、カリフォルニア州サンジョゼ（San Jose）のルミレドス・ライティング（LumiＬＥＤ Lighting）によってスナップＬＥＤ（SnapLED（登録商標））のブランドに関連して販売されている。この装置は、金属基板の制作のための機械装置、ＬＥＤを金属基板にクリンチングするための工具設備（又は、その外部委託）、並びに、金属基板を所望の最終形状に打ち抜くための工具設備を必要とする。   Another method of constructing an LED array uses a foldable metal substrate that allows the LEDs to be connected without soldering using a clinching machine. The metal substrate has flexible joints between rows of LED bus bars that allow the substrate to be formed into complex shapes. Such devices are disclosed in US Pat. No. 5,404,282 and US Pat. No. 5,519,596. The same commercial device disclosed in US Pat. No. 5,519,596 is related to the SnapLED® brand by LumiLED Lighting of San Jose, California. Sold. This equipment requires mechanical equipment for the production of metal substrates, tool equipment for clinching LEDs to metal boards (or its outsourcing), and tool equipment for punching metal boards into the desired final shape And

特に、自動車外部照明用途において見出されるような、複雑に形成された照明器具ハウジングに使用するＬＥＤアレイを組み立てるためのコスト及び／又は複雑さを最小にするより経済的な方策が望まれる。   In particular, a more economic strategy is desired that minimizes the cost and / or complexity of assembling LED arrays for use in complex shaped luminaire housings, as found in automotive exterior lighting applications.

本発明の一つの側面によれば、ランプは、非導電性ハウジングを有する。一つ又はそれ以上の発光ダイオード（ＬＥＤ）が、導電性エポキシの一つ又はそれ以上のビードによってハウジングに取り付けられる。ＬＥＤは、選択的に、ハウジングに機械的に取り付けられてもよい。導電性エポキシは、ＬＥＤを駆動回路に接続するための一つ又はそれ以上の電圧レール（voltage rail）をなす。   According to one aspect of the invention, the lamp has a non-conductive housing. One or more light emitting diodes (LEDs) are attached to the housing by one or more beads of conductive epoxy. The LED may optionally be mechanically attached to the housing. The conductive epoxy forms one or more voltage rails for connecting the LED to the drive circuit.

好ましい実施形態では、少なくとも二つの溝がハウジングに形成される。二つの壁の間に形成され、或いは存在するプラットホームが、ＬＥＤをハウジングに機械的に取り付けるためのスナップをなす。溝の一方は、ＬＥＤカソードの位置決めのためのものであり、他方の溝は、ＬＥＤアノードの位置決めのためのものである。導電性エポキシのビードは、ＬＥＤに電力供給する電圧レールをなすように、各溝に堆積される。   In a preferred embodiment, at least two grooves are formed in the housing. A platform formed or present between the two walls provides a snap for mechanically attaching the LED to the housing. One of the grooves is for positioning the LED cathode, and the other groove is for positioning the LED anode. A conductive epoxy bead is deposited in each groove to form a voltage rail that powers the LED.

本発明の別の側面によれば、ランプを構成する方法を提供する。非導電性ハウジングが設けられる。一つ又はそれ以上の発光ダイオード（ＬＥＤ）が、ハウジングに機械的に取り付けられる。導電性エポキシの一つ又はそれ以上のビードが、ＬＥＤをハウジングに固着し、かつ、ＬＥＤを駆動回路に接続するように、ハウジングに堆積される。   According to another aspect of the invention, a method for constructing a lamp is provided. A non-conductive housing is provided. One or more light emitting diodes (LEDs) are mechanically attached to the housing. One or more beads of conductive epoxy are deposited on the housing to secure the LED to the housing and connect the LED to the drive circuit.

本発明の前述及び他の側面は、例示の実施形態の以下の説明、及び、本発明の原理を、例示として図示する添付の図面からより明らかになるであろう。   The foregoing and other aspects of the present invention will become more apparent from the following description of exemplary embodiments and the accompanying drawings which illustrate, by way of example, the principles of the invention.

図１は、ランプハウジング組立体１２を有し、レンズ（図示せず）がハウジングの周囲に沿って取り付けられるＬＥＤ式ランプ１０を示す。ハウジング１２は、好ましくは、ポリ塩化ビニル（polyvinyl chloride：ＰＣＢ）、ポリエチレン・テレフタレート（polyethylene terephthalate：ＰＥＴ）及びアクリロルニトリル・ブタジエン・スチレン（acrylonitorile butadiene styrene：ＡＢＳ）のような、非導電性プラスチック材料から構成され、かつ、それ自体当該技術で知られているように、周知の成形技術により製造される。図示した例では、ハウジング１２は、（図２に最もよく見えるように、）形状が曲線であるが、スタイリング基準によって決定された、もっと複雑な形状に成形されてもよいことが理解されるべきである。他の種類の非導電性材料をハウジングに用いることもできるが、まもなく論ずるように、幾分弾力性がある材料が最も好ましい。   FIG. 1 shows an LED lamp 10 having a lamp housing assembly 12 with a lens (not shown) mounted along the periphery of the housing. The housing 12 is preferably a non-conductive plastic material, such as polyvinyl chloride (PCB), polyethylene terephthalate (PET), and acrylonitorile butadiene styrene (ABS). And is produced by well-known molding techniques, as is known per se in the art. In the illustrated example, the housing 12 is curved in shape (as best seen in FIG. 2), but it should be understood that the housing 12 may be molded into a more complex shape as determined by styling criteria. It is. Other types of non-conductive materials can be used for the housing, but a material that is somewhat elastic is most preferred, as will be discussed shortly.

ハウジング１２は、それに形成された少なくとも一つのチャネル１５を有し、チャネル１５は、二つの独立した溝１６ａ及び１６ｂを有する。図２の線Ａ−Ａ及び線Ｂ−Ｂに沿う好ましいハウジング１２の断面形状を、図２及び図３に示し、ハウジングの詳細な斜視図を図４に示す。これらの図面で分かるように、チャネル１５は、内壁２０ａ及び２０ｂと、外壁２２ａ及び２２ｂと、を有する。畝又はプラットホーム１８が、接合部の内壁２０ａと内壁２０ｂとの間に形成される。このプラットホームには、各々二つのポスト２３ａ及び２３ｂからなる複数のスナップが設けられている。各ポストは小さいノッチ２４を有し、ノッチより上のポストの上部分は、僅かにテーパー付けされ、或いは面取りされる。   The housing 12 has at least one channel 15 formed therein, the channel 15 having two independent grooves 16a and 16b. A preferred cross-sectional shape of the housing 12 along lines AA and BB in FIG. 2 is shown in FIGS. 2 and 3, and a detailed perspective view of the housing is shown in FIG. As can be seen in these drawings, the channel 15 has inner walls 20a and 20b and outer walls 22a and 22b. A heel or platform 18 is formed between the inner wall 20a and the inner wall 20b of the joint. The platform is provided with a plurality of snaps each consisting of two posts 23a and 23b. Each post has a small notch 24 and the upper portion of the post above the notch is slightly tapered or chamfered.

カリフォルニア州サンジョゼ（San Jose）のルミレドスライティング（LumiＬＥＤ Lighting）によって製造されたスーパーフラックス（SuperFlux（登録商標））モデルのようなＬＥＤ３０（図３に分離して示されている）が、チャネル１５内で又はチャネル１５上でポスト２３ａ及び２３ｂに機械的に取り付けられる。ポスト２３ａ、２３ｂ及びノッチ２４は、ＬＥＤ３０のカソードリード又はピン３２が、溝１６ａ及び１６ｂの一方（図示したように、溝１６ａ）の中へ延び、そして、アノードリード又はピン３４が、他方の溝（図示したように、溝１６ｂ）の中へ延びるように寸法決めされる。ＬＥＤの本体は、ポスト２３ａ及び２３ｂによって支持され、ポストの間隔は、スナップ嵌めをなすように、ＬＥＤ本体の寸法とほぼ一致する。ＬＥＤ３０は、好ましくは、ＬＥＤ本体がポストに形成されたノッチ２４の中に落ちつくまで、ポスト２３ａ及び２３ｂを反らせるように、強制的に挿入される。ポスト２３ａ及び２３ｂは、好ましくは、ＰＶＣ、ＰＥＴ又はＡＢＳプラスチックのような弾性有機材料で形成されているので、一旦ＬＥＤが挿入されると、ポストが反らされない限り、ＬＥＤは、ポストから外れない。通常の操作条件下では、ランプがそのような力に遭遇することはありそうもなく、かくして、好ましい実施形態は、ＬＥＤをハウジング１２に機械的に取り付けるためのスナップ機構を提供する。   An LED 30 (shown separately in FIG. 3), such as a SuperFlux® model manufactured by LumiLED Lighting, San Jose, Calif., Is channel 15 It is mechanically attached to posts 23a and 23b in or on channel 15. Posts 23a, 23b and notch 24 have LED 30 cathode lead or pin 32 extending into one of grooves 16a and 16b (groove 16a as shown) and anode lead or pin 34 is connected to the other groove. (As shown, dimensioned to extend into groove 16b). The body of the LED is supported by posts 23a and 23b, and the spacing between the posts substantially matches the dimensions of the LED body so as to make a snap fit. The LED 30 is preferably forcibly inserted to deflect the posts 23a and 23b until the LED body settles into a notch 24 formed in the post. The posts 23a and 23b are preferably made of an elastic organic material such as PVC, PET or ABS plastic so that once the LED is inserted, the LED will not come off the post unless the post is warped . Under normal operating conditions, the lamp is unlikely to encounter such a force, and thus the preferred embodiment provides a snap mechanism for mechanically attaching the LED to the housing 12.

スナップに加えて、エポキシ２８のビードを使用して、ＬＥＤ３０のリード又はピン３２、３４をチャネル１５に、それ故にハウジング１２に結合する。エポキシ２８は、好ましくは、導電性かつ熱伝導性であり、かくして、同じ溝１６ａ又は１６ｂに取り付けられたＬＥＤのカソード３２又はアノード３４の全てを一緒に電気的に接続するのに役立ち、かつ、ＬＥＤから熱を運び去るためのヒートシンクをなす。ＬＥＤをポスト２３ａ、２３ｂに取り付けることによって、多くの用途のために、十分な著しい熱散逸及び電気伝導をもたらすように、溝１６ａ、１６ｂを比較的広くかつ深く作ることができる。適当なエポキシの例は、マサチューセッツ州、Ｓ．イーストン（S. Easton）のレジン・テクノロジー・グループ・ＬＬＰ（Resin Technology Group LLC）によって販売されているＴＩＧＡ９２０（登録商標）、ＴＩＧＡ９５１（登録商標）及びＴＩＧＡ９０１（登録商標）の銀導電性エポキシ、マサチューセッツ州、ビルリカ（Billerica）のテック・フィルム・サービス社（Tech Film services Inc.）によって販売されているボルジャーＣ−１４（Bolger C-14（登録商標））のエポキシ、ロードアイランド州、ウエスト・ウォリック（West Warwick）のメルコ・テクノロジーズ・グループ（Mereco Technologies Group）によって販売されているメタダクト（Metaduct（登録商標））を含む。これらのエポキシは、広範囲の作業温度にわたって、柔軟であり、変形可能であり、機能的である。手動又は自動手段により、複雑な形態上に塗ることができる。   In addition to snapping, a bead of epoxy 28 is used to couple the LED 30 leads or pins 32, 34 to the channel 15 and hence to the housing 12. The epoxy 28 is preferably conductive and thermally conductive, thus helping to electrically connect all of the cathodes 32 or anodes 34 of the LEDs mounted in the same groove 16a or 16b together, and A heat sink to carry heat away from the LED. By attaching the LEDs to the posts 23a, 23b, the grooves 16a, 16b can be made relatively wide and deep to provide sufficient significant heat dissipation and electrical conduction for many applications. Examples of suitable epoxies are described in Massachusetts, S .; TIGA920 (R), TIGA951 (R) and TIGA901 (R) silver conductive epoxies sold by Resin Technology Group LLC of S. Easton, Massachusetts Bolger C-14 (R) epoxy sold by Tech Film services Inc. of Billerica, West Warwick, Rhode Island Includes Metaduct (R) sold by Warwick's Mereco Technologies Group. These epoxies are flexible, deformable and functional over a wide range of operating temperatures. It can be applied on complex forms by manual or automatic means.

好ましい実施形態では、導電性エポキシ２８のビードは、当該技術において周知であるようなロボットによって塗られる。上述のエポキシは、硬化前に或る粘度を有し、かくして、エポキシは、溝１６ａ、１６ｂを満たして、リード又はピン３２，３４を定着させる。その上、エポキシをリード又はピンの近位に堆積させるために、ロボットのマニピュレータ又は作業先端をリード又はピン３２，３４の近くでＬＥＤ本体の下に達するように斜めにすることができる。   In a preferred embodiment, a bead of conductive epoxy 28 is applied by a robot as is well known in the art. The epoxy described above has a certain viscosity before curing, thus the epoxy fills the grooves 16a, 16b and fixes the leads or pins 32, 34. In addition, the robot manipulator or working tip can be angled to reach under the LED body near the leads or pins 32, 34 in order to deposit the epoxy proximal to the leads or pins.

図示例では、溝１６ｂは、導電性エポキシで満たされたとき、溝１６ｂに取り付けられた一連のＬＥＤのカソードを電気的に接続する接地レールとして機能する。溝１６ａは、導電性エポキシで満たされたとき、溝１６ａに取り付けられた一連のＬＥＤのアノードを電気的に接続する正電圧レールとして機能する。図示したランプは、第二の電気回路と関連した別の一連のＬＥＤのアノードを取り付けるために、溝１６ｂと協働する第三の溝１６ｃを有する。ハウジングのこの領域では、溝１６ｂ及び１６ｃ。一つ又はそれ以上の列のＬＥＤを取り付けるために、多数の他のパターンを採用することができ、各チャネルのＬＥＤの数は、使用される特定のエポキシの電気伝導及び熱伝導の限度によってのみ制限される。   In the illustrated example, the groove 16b functions as a ground rail that electrically connects the cathodes of a series of LEDs attached to the groove 16b when filled with conductive epoxy. The groove 16a, when filled with conductive epoxy, functions as a positive voltage rail that electrically connects the anodes of a series of LEDs attached to the groove 16a. The illustrated lamp has a third groove 16c that cooperates with the groove 16b to attach the anode of another series of LEDs associated with the second electrical circuit. In this area of the housing, grooves 16b and 16c. Numerous other patterns can be employed to mount one or more rows of LEDs, and the number of LEDs in each channel depends only on the electrical and thermal limits of the particular epoxy used. Limited.

ＬＥＤ制御駆動回路を支持するＰＣＢ４０が、当該技術においてよく知られたように、ハウジングに取り付けられる。ＰＣＢ４０は、導電性エポキシ２８のビードを駆動回路に電気的に接続するための（明示されない）端子を有する。   A PCB 40 that supports the LED control drive circuit is attached to the housing, as is well known in the art. The PCB 40 has terminals (not explicitly shown) for electrically connecting the bead of conductive epoxy 28 to the drive circuit.

変形例の製造工程では、接着ロボットを使用して、導電性エポキシのビードを最初に塗り付けることが可能であり、ＬＥＤをチャネルに取り付けるのに第二のロボットの使用が可能である。これは、エポキシが硬化するのに一般に必要とされる、しばしば１０分間を越える時間により、可能である。これは、各ＬＥＤの下で、各溝内に導電性エポキシの連続ビードを確保するであろう。ＬＥＤが適所に挿入されたときに、エポキシが、ＬＥＤを適所に保持するのに十分に硬化されるならば、機械的アタッチメントの使用を回避することをも可能である。   In an alternative manufacturing process, an adhesive robot can be used to apply a conductive epoxy bead first, and a second robot can be used to attach the LED to the channel. This is possible due to the time generally required for the epoxy to cure, often exceeding 10 minutes. This will ensure a continuous bead of conductive epoxy in each groove under each LED. It is also possible to avoid the use of mechanical attachments if the epoxy is cured sufficiently to hold the LED in place when the LED is inserted in place.

更なる製造工程では、導電性エポキシを各溝に置き、続いて、フレキシブル金属ストリップを各溝に置き、続いて、導電性エポキシの第二の層を各溝に置くことが望ましい。第二のエポキシ層の堆積の前又は後に、ＬＥＤをチャネルに取り付けるのがよい。   In a further manufacturing process, it is desirable to place a conductive epoxy in each groove, followed by a flexible metal strip in each groove, followed by a second layer of conductive epoxy in each groove. The LED may be attached to the channel before or after deposition of the second epoxy layer.

どんな形にもなるエポキシを使用して、ＬＥＤをフレキシブルハウジングに直接取り付けることによって、ランプハウジングは、幾分柔軟性のままでありこれは、ランプハウジングを車両に取り付けるときに有利である。   By attaching the LED directly to the flexible housing using any form of epoxy, the lamp housing remains somewhat flexible, which is advantageous when attaching the lamp housing to the vehicle.

本発明の別の実施形態が、図５に断面図で示されている。この実施形態では、ハウジング１２に形成されたチャネル２１５が、平らな内壁２２０ａ及び２２０ｂと、平らな外壁２２２ａ及び２２２ｂを有し、外壁は、内壁より高い。独立した溝２１６ａ及び２１６ｂが、図示するように、内壁と外壁との間に位置決めされる。畝又はプラットホーム２１８は、内壁２２０ａと内壁２２０ｂとの間に形成され、内壁は、僅かにテーパー付けされ、或いは面取りされる。外壁２２２ａ、２２２ｂは、小さいノッチ２２４を有し、そのノッチ２２４の上方の外壁２２２ａ、２２２ｂの頂部分も、僅かにテーパー付けされ、或いは面取りされる。この実施形態では、チャネル２１５の外壁２２２ａと外壁２２２ｂとの間の間隔、及び、各ノッチ２２４の寸法は、スナップ嵌めをなすように、ＬＥＤ本体の寸法形状にほぼ一致する。所望ならば、ＬＥＤ３０の本体をもプラットホーム２１８によって支持することができる。   Another embodiment of the present invention is shown in cross-section in FIG. In this embodiment, the channel 215 formed in the housing 12 has flat inner walls 220a and 220b and flat outer walls 222a and 222b, which are higher than the inner walls. Independent grooves 216a and 216b are positioned between the inner and outer walls as shown. A heel or platform 218 is formed between inner wall 220a and inner wall 220b, and the inner wall is slightly tapered or chamfered. The outer walls 222a, 222b have a small notch 224, and the top portions of the outer walls 222a, 222b above the notch 224 are also slightly tapered or chamfered. In this embodiment, the spacing between the outer wall 222a and the outer wall 222b of the channel 215 and the dimensions of each notch 224 substantially match the dimensional shape of the LED body so as to make a snap fit. If desired, the body of the LED 30 can also be supported by the platform 218.

図示した実施形態は、ＬＥＤをハウジングに機械的に取り付けるためのスナップの使用を示したが、移動止め（detents）、インデックス・キー（index keys）、ラッチ、又は他のかかる機構のような、種々の他の機構を、ＬＥＤをハウジングに機械的に取り付けるのに使用することができる。機械的な取り付け手段は、好ましくは、ＬＥＤをハウジングに係止するが、ＬＥＤをハウジングにしっかりと固定する必要ない、というのは、エポキシが、ＬＥＤを適所にしっかりと固定する更なる手段をなすからである。   The illustrated embodiment has shown the use of snaps to mechanically attach the LEDs to the housing, but various such as detents, index keys, latches, or other such mechanisms. Other mechanisms can be used to mechanically attach the LED to the housing. The mechanical attachment means preferably locks the LED to the housing, but does not require the LED to be securely fastened to the housing, because the epoxy provides an additional means to securely secure the LED in place. Because.

当業者は、本発明の精神から逸脱することなく、好ましい実施形態に種々の変更を行うことができることを認識するであろう。   Those skilled in the art will recognize that various modifications can be made to the preferred embodiment without departing from the spirit of the invention.

好ましい実施形態によるランプの平面図である。1 is a plan view of a lamp according to a preferred embodiment. 図１の線Ａ−Ａに沿ったランプの断面図である。FIG. 2 is a cross-sectional view of the lamp along line AA in FIG. 1. 図１の線Ｂ−Ｂに沿ったランプの断面図である。FIG. 2 is a cross-sectional view of the lamp along line BB in FIG. 1. 図１中の領域Ｃの詳細な斜視図である。It is a detailed perspective view of the area | region C in FIG. 本発明の変形例によるランプの断面図である。It is sectional drawing of the lamp | ramp by the modification of this invention.

Claims (18)

非導電性ハウジングと、
少なくとも二つのＬＥＤと、
ＬＥＤをハウジングに取り付け、かつ、照明のためにＬＥＤを電気的に接続する、導電性エポキシの少なくとも二つのビードと、
を有する、ランプ組立体。 A non-conductive housing;
At least two LEDs;
At least two beads of conductive epoxy that attach the LED to the housing and electrically connect the LED for illumination;
A lamp assembly. 前記ハウジングは、ハウジングに形成された少なくとも二つの溝を有し、前記溝の第一のものは、前記ＬＥＤのアノードを受け入れ、前記溝の第二のものは、前記ＬＥＤのカソードを受け入れる、請求項１記載のランプ組立体。   The housing has at least two grooves formed in the housing, the first of the grooves receiving the anode of the LED and the second of the grooves receiving the cathode of the LED. Item 2. The lamp assembly according to Item 1. 前記ビードの第一のものは、第一の溝に挿入され、前記ビードの第二のものは、第二の溝に挿入される、請求項２記載のランプ組立体。   The lamp assembly of claim 2, wherein a first one of the beads is inserted into a first groove and a second one of the beads is inserted into a second groove. 前記少なくとも二つの溝は、前記ＬＥＤを受け入れる取り付け面を有するプラットホームによって分離される、請求項３記載のランプ組立体。   The lamp assembly of claim 3, wherein the at least two grooves are separated by a platform having a mounting surface for receiving the LED. 前記プラットホームは、前記ＬＥＤを前記ハウジングに機械的に取り付ける、前記ＬＥＤの一つをスナップ的に受け入れる、少なくとも一対の協働する舌部を有する、請求項４記載のランプ組立体。   The lamp assembly of claim 4, wherein the platform has at least a pair of cooperating tongues that mechanically attach the LED to the housing and snap-receive one of the LEDs. 前記ＬＥＤの各々は、アノードリードと、カソードリードと、を有する、請求項４記載のランプ組立体。   The lamp assembly of claim 4, wherein each of the LEDs has an anode lead and a cathode lead. 前記ＬＥＤ組立体は、更に、ＬＥＤ制御及び駆動回路を有するＰＣＢを有し、前記ＰＣＢは、前記ビードに電気的に接続され、前記ＬＥＤの照明を可能にする、請求項５記載のランプ組立体。   6. The lamp assembly of claim 5, wherein the LED assembly further comprises a PCB having LED control and drive circuitry, the PCB being electrically connected to the bead to allow illumination of the LED. . 前記ハウジングは、前記ＬＥＤを受け入れる細長い取り付け面を有するプラットホームを有する、請求項１記載のランプ組立体。   The lamp assembly of claim 1, wherein the housing includes a platform having an elongated mounting surface for receiving the LED. 前記プラットホームは、前記少なくとも二つのビードを分離する、請求項８記載のランプ組立体。   The lamp assembly of claim 8, wherein the platform separates the at least two beads. 前記プラットホームは、その両側に溝を有し、前記ビードの第一のものは第一の溝に挿入され、前記ビードの第二のものは第二の溝に挿入される、請求項９記載のランプ組立体。   The platform of claim 9, wherein the platform has grooves on both sides thereof, the first one of the beads being inserted into the first groove and the second one of the beads being inserted into the second groove. Lamp assembly. 前記ハウジングは、前記ＬＥＤをハウジングに取り付ける少なくとも二つの留め具を有する、請求項１記載のランプ組立体。   The lamp assembly of claim 1, wherein the housing has at least two fasteners for attaching the LED to the housing. 前記留め具の各々は、前記ＬＥＤの一つをスナップして受け入れる少なくとも一対の協働する舌部を有する、請求項１１記載のランプ組立体。   12. The lamp assembly of claim 11, wherein each of the fasteners has at least a pair of cooperating tongues that snap-receive one of the LEDs. 前記ハウジングは、前記ＬＥＤを受け入れる細長い取り付け面を有するプラットホームを有する、請求項１２記載のランプ組立体。   The lamp assembly of claim 12, wherein the housing has a platform having an elongated mounting surface for receiving the LED. 前記プラットホームは、前記少なくとも二つのビードを分離する、請求項１３記載のランプ組立体。   The lamp assembly of claim 13, wherein the platform separates the at least two beads. 前記留め具は、前記プラットホームから延びる、請求項１４記載のランプ組立体。   The lamp assembly of claim 14, wherein the fastener extends from the platform. 前記プラットホームは、その両側に溝を有し、第一の前記ビードは、第一の溝に挿入され、第二の前記ビードは、第二の溝に挿入される、請求項１４記載のランプ組立体。   15. The lamp assembly of claim 14, wherein the platform has grooves on both sides thereof, the first bead being inserted into the first groove and the second bead being inserted into the second groove. Solid. 前記溝は、少なくとも一対の舌部の間に延びる、請求項１６記載のランプ組立体。   The lamp assembly of claim 16, wherein the groove extends between at least a pair of tongues. 細長いプラットホームを有する非導電性ハウジングを準備するステップと、
前記プラットホームに、少なくとも二つのＬＥＤを位置決めするステップと、
ＬＥＤをハウジングに固定し、かつ、照明のためにＬＥＤを電気的に接続するように、ハウジングに、導電性エポキシの一つ又はそれ以上のビードを堆積するステップと、
を有する、ランプ組立体の製造方法。 Providing a non-conductive housing having an elongated platform;
Positioning at least two LEDs on the platform;
Depositing one or more beads of conductive epoxy on the housing to secure the LED to the housing and electrically connect the LED for illumination;
A method for manufacturing a lamp assembly.
JP2006501403A 2003-02-07 2004-01-30 Direct LED lamp Abandoned JP2006517332A (en)

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PCT/CA2004/000125 WO2004070768A2 (en) 2003-02-07 2004-01-30 Direct mount led lamp

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170062405A (en) * 2015-11-27 2017-06-07 발레오 비젼 Light-emitting device for an automotive vehicle headlamp lighting module and associated lighting module and headlamps

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI421438B (en) * 2005-12-21 2014-01-01 克里公司 Lighting device
ITPN20100009A1 (en) 2010-02-11 2011-08-12 Franco Corazza "LAMP HOLDER WITH TRANSPARENT INTEGRATED LENS"
ITPN20100005U1 (en) 2010-02-19 2011-08-20 Franco Corazza "LED LAMP HOLDER WITH PERFECT SUPPORT"
CN104654078A (en) * 2015-01-26 2015-05-27 福建永德吉灯业股份有限公司 Integrated light-emitting diode (LED) lamp
DE102016218677A1 (en) * 2016-09-28 2018-04-12 Volkswagen Aktiengesellschaft Lighting device for a motor vehicle
DE202018102945U1 (en) * 2018-05-25 2019-08-29 Automotive Lighting Reutlingen Gmbh Modular system for a motor vehicle lighting device and / or a motor vehicle environment sensor
JP7059865B2 (en) * 2018-08-10 2022-04-26 富士通株式会社 Optical transmitter

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1457805A (en) * 1974-03-01 1976-12-08 Mullard Ltd Electric circuit modules
DE3116030A1 (en) * 1980-04-23 1982-03-25 CTS Corp., 46514 Elkhart, Ind. "METHOD FOR FIXING AN ELECTRICAL COMPONENT TO A SUBSTRATE AND COMPONENT FASTENABLE TO A SUBSTRATE"
FR2574616B1 (en) 1984-12-07 1987-01-23 Radiotechnique Compelec MATRIX OF ELECTRO-LUMINESCENT ELEMENT AND MANUFACTURING METHOD THEREOF
US4694572A (en) * 1986-06-13 1987-09-22 Tektronix, Inc. Printed polymer circuit board method
US4966862A (en) 1989-08-28 1990-10-30 Cree Research, Inc. Method of production of light emitting diodes
US5119174A (en) 1990-10-26 1992-06-02 Chen Der Jong Light emitting diode display with PCB base
US5331512A (en) 1992-04-16 1994-07-19 Orton Kevin R Surface-mount LED
US5455749A (en) * 1993-05-28 1995-10-03 Ferber; Andrew R. Light, audio and current related assemblies, attachments and devices with conductive compositions
US5404282A (en) 1993-09-17 1995-04-04 Hewlett-Packard Company Multiple light emitting diode module
US5567037A (en) * 1995-05-03 1996-10-22 Ferber Technologies, L.L.C. LED for interfacing and connecting to conductive substrates
US5519596A (en) 1995-05-16 1996-05-21 Hewlett-Packard Company Moldable nesting frame for light emitting diode array
US5857767A (en) * 1996-09-23 1999-01-12 Relume Corporation Thermal management system for L.E.D. arrays
US5960942A (en) * 1998-07-08 1999-10-05 Ericsson, Inc. Thin profile keypad with integrated LEDs
DE19909399C1 (en) 1999-03-04 2001-01-04 Osram Opto Semiconductors Gmbh Flexible LED multiple module, especially for a light housing of a motor vehicle
JP3901404B2 (en) * 1999-08-27 2007-04-04 株式会社小糸製作所 Vehicle lamp
US6866394B1 (en) * 1999-10-04 2005-03-15 Nicholas D. Hutchins Modules for elongated lighting system
CA2404503A1 (en) * 2000-03-27 2001-10-04 Nicholas D. Hutchins Underneath connector system
US6520669B1 (en) * 2000-06-19 2003-02-18 Light Sciences Corporation Flexible substrate mounted solid-state light sources for exterior vehicular lighting
US20010055458A1 (en) * 2000-06-22 2001-12-27 Ladd Judith A. Sheet-like light emitting display and method
US6346777B1 (en) 2000-11-03 2002-02-12 Ledart Co., Ltd. Led lamp apparatus
US6660935B2 (en) * 2001-05-25 2003-12-09 Gelcore Llc LED extrusion light engine and connector therefor
US6849935B2 (en) * 2002-05-10 2005-02-01 Sarnoff Corporation Low-cost circuit board materials and processes for area array electrical interconnections over a large area between a device and the circuit board
US7135034B2 (en) * 2003-11-14 2006-11-14 Lumerx, Inc. Flexible array
US7128438B2 (en) * 2004-02-05 2006-10-31 Agilight, Inc. Light display structures

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170062405A (en) * 2015-11-27 2017-06-07 발레오 비젼 Light-emitting device for an automotive vehicle headlamp lighting module and associated lighting module and headlamps
KR102575474B1 (en) * 2015-11-27 2023-09-05 발레오 비젼 Light-emitting device for an automotive vehicle headlamp lighting module and associated lighting module and headlamps

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EP1590601B1 (en) 2008-05-21
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WO2004070768A3 (en) 2005-04-14
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CA2515408A1 (en) 2004-08-19

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