JP2006511085A5 - - Google Patents
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- Publication number
- JP2006511085A5 JP2006511085A5 JP2004561876A JP2004561876A JP2006511085A5 JP 2006511085 A5 JP2006511085 A5 JP 2006511085A5 JP 2004561876 A JP2004561876 A JP 2004561876A JP 2004561876 A JP2004561876 A JP 2004561876A JP 2006511085 A5 JP2006511085 A5 JP 2006511085A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- foil
- patterned
- providing
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011888 foil Substances 0.000 claims description 51
- 239000004020 conductor Substances 0.000 claims description 47
- 238000000034 method Methods 0.000 claims description 43
- 239000000758 substrate Substances 0.000 claims description 40
- 239000004065 semiconductor Substances 0.000 claims description 35
- 238000005538 encapsulation Methods 0.000 claims description 23
- 239000011810 insulating material Substances 0.000 claims description 21
- 239000000463 material Substances 0.000 claims description 21
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 238000002161 passivation Methods 0.000 claims description 8
- 239000010410 layer Substances 0.000 description 162
- 229910052751 metal Inorganic materials 0.000 description 14
- 239000002184 metal Substances 0.000 description 14
- 229910000679 solder Inorganic materials 0.000 description 11
- 239000010949 copper Substances 0.000 description 10
- 239000012790 adhesive layer Substances 0.000 description 9
- 238000005530 etching Methods 0.000 description 9
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 238000005520 cutting process Methods 0.000 description 4
- 238000000059 patterning Methods 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical group [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 230000002411 adverse Effects 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 3
- 238000001259 photo etching Methods 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229920001778 nylon Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910018182 Al—Cu Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 150000002118 epoxides Chemical class 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000005226 mechanical processes and functions Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP02080665 | 2002-12-20 | ||
| PCT/IB2003/006028 WO2004057662A2 (en) | 2002-12-20 | 2003-12-15 | Electronic device and method of manufacturing same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2006511085A JP2006511085A (ja) | 2006-03-30 |
| JP2006511085A5 true JP2006511085A5 (https=) | 2007-02-08 |
Family
ID=32668880
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004561876A Pending JP2006511085A (ja) | 2002-12-20 | 2003-12-15 | 電子デバイス及びその製造方法 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20070052091A1 (https=) |
| EP (1) | EP1579496A2 (https=) |
| JP (1) | JP2006511085A (https=) |
| KR (1) | KR20050084417A (https=) |
| CN (1) | CN100365792C (https=) |
| AU (1) | AU2003286362A1 (https=) |
| TW (1) | TW200416968A (https=) |
| WO (1) | WO2004057662A2 (https=) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1774965A (zh) * | 2004-03-30 | 2006-05-17 | 松下电器产业株式会社 | 模块元件及其制造方法 |
| US7405476B2 (en) * | 2005-10-27 | 2008-07-29 | Lsi Logic Corporation | Asymmetric alignment of substrate interconnect to semiconductor die |
| WO2008137511A1 (en) | 2007-05-04 | 2008-11-13 | Crossfire Technologies, Inc. | Accessing or interconnecting integrated circuits |
| DE102007034949A1 (de) * | 2007-07-26 | 2009-02-05 | Siemens Ag | Einheitlich normierte Leistungspackages |
| US8110912B2 (en) * | 2008-07-31 | 2012-02-07 | Infineon Technologies Ag | Semiconductor device |
| JP5147678B2 (ja) * | 2008-12-24 | 2013-02-20 | 新光電気工業株式会社 | 微細配線パッケージの製造方法 |
| JP5147677B2 (ja) | 2008-12-24 | 2013-02-20 | 新光電気工業株式会社 | 樹脂封止パッケージの製造方法 |
| EP2242094A1 (en) | 2009-04-17 | 2010-10-20 | Nxp B.V. | Foil and method for foil-based bonding and resulting package |
| CN109917622B (zh) | 2015-04-10 | 2021-08-06 | Asml荷兰有限公司 | 用于检查和量测的方法和设备 |
| US10083781B2 (en) | 2015-10-30 | 2018-09-25 | Vishay Dale Electronics, Llc | Surface mount resistors and methods of manufacturing same |
| US10217690B2 (en) * | 2015-11-30 | 2019-02-26 | Kabushiki Kaisha Toshiba | Semiconductor module that have multiple paths for heat dissipation |
| US10438729B2 (en) | 2017-11-10 | 2019-10-08 | Vishay Dale Electronics, Llc | Resistor with upper surface heat dissipation |
| TWI704628B (zh) * | 2019-04-23 | 2020-09-11 | 智威科技股份有限公司 | 半導體元件封裝結構與半導體元件封裝方法 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2104262A1 (en) * | 1970-02-02 | 1971-08-26 | Int Standard Electric Corp | High resolution metal or plastic screen gauze - printing plate |
| US4897327A (en) * | 1988-05-27 | 1990-01-30 | E. I. Du Pont De Nemours And Company | Correct-reading images from photopolymer electrographic master |
| US5350947A (en) * | 1991-11-12 | 1994-09-27 | Nec Corporation | Film carrier semiconductor device |
| JPH06268020A (ja) * | 1993-03-10 | 1994-09-22 | Sumitomo Electric Ind Ltd | 半導体装置 |
| DE59713027D1 (de) * | 1996-09-30 | 2010-03-25 | Infineon Technologies Ag | Mikroelektronisches bauteil in sandwich-bauweise |
| JP2000114413A (ja) * | 1998-09-29 | 2000-04-21 | Sony Corp | 半導体装置、その製造方法および部品の実装方法 |
| US6300161B1 (en) * | 2000-02-15 | 2001-10-09 | Alpine Microsystems, Inc. | Module and method for interconnecting integrated circuits that facilitates high speed signal propagation with reduced noise |
| US6234072B1 (en) * | 2000-03-06 | 2001-05-22 | John C. Kooima | Grain husk cracking plate |
| JP3467454B2 (ja) * | 2000-06-05 | 2003-11-17 | Ｎｅｃエレクトロニクス株式会社 | 半導体装置の製造方法 |
| TW511405B (en) * | 2000-12-27 | 2002-11-21 | Matsushita Electric Industrial Co Ltd | Device built-in module and manufacturing method thereof |
-
2003
- 2003-12-15 WO PCT/IB2003/006028 patent/WO2004057662A2/en not_active Ceased
- 2003-12-15 EP EP03777107A patent/EP1579496A2/en not_active Withdrawn
- 2003-12-15 KR KR1020057011400A patent/KR20050084417A/ko not_active Withdrawn
- 2003-12-15 CN CNB2003801071095A patent/CN100365792C/zh not_active Expired - Fee Related
- 2003-12-15 AU AU2003286362A patent/AU2003286362A1/en not_active Abandoned
- 2003-12-15 JP JP2004561876A patent/JP2006511085A/ja active Pending
- 2003-12-15 US US10/539,314 patent/US20070052091A1/en not_active Abandoned
- 2003-12-17 TW TW092135836A patent/TW200416968A/zh unknown
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