JP2006508825A - テンプレート - Google Patents
テンプレート Download PDFInfo
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- JP2006508825A JP2006508825A JP2004556469A JP2004556469A JP2006508825A JP 2006508825 A JP2006508825 A JP 2006508825A JP 2004556469 A JP2004556469 A JP 2004556469A JP 2004556469 A JP2004556469 A JP 2004556469A JP 2006508825 A JP2006508825 A JP 2006508825A
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00023—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems without movable or flexible elements
- B81C1/00031—Regular or irregular arrays of nanoscale structures, e.g. etch mask layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C99/00—Subject matter not provided for in other groups of this subclass
- B81C99/0075—Manufacture of substrate-free structures
- B81C99/009—Manufacturing the stamps or the moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82B—NANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS, MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES AS DISCRETE UNITS; MANUFACTURE OR TREATMENT THEREOF
- B82B3/00—Manufacture or treatment of nanostructures by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
- Y10T428/2457—Parallel ribs and/or grooves
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/266—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension of base or substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31855—Of addition polymer from unsaturated monomers
- Y10T428/31935—Ester, halide or nitrile of addition polymer
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Analytical Chemistry (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Moulding By Coating Moulds (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Laminated Bodies (AREA)
- Polarising Elements (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
- Holo Graphy (AREA)
- Manufacture Or Reproduction Of Printing Formes (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Abstract
Description
250nmおよび150nmの厚さのPMGI(マイクロ・ケム・コーポレーション:Micro Chem Corp.,PMGI SF6)層を各シリコン基板上にスピンコートし、170℃で30分間ベークした。次いで、10nm−厚のゲルマニウムをPMGI層上にスパッタリングにより堆積させた。純粋なPMGIのTg(約200℃)を十分に下回る、130℃より高い温度でサンプルを加熱すると、ランダム波のパターンが観察された。
パターン形成された接触面を含む荷重部材は、パターン形成された厚さ1.5μmのフォトレジスト層にPDMSをキャスティングすることにより形成した。結果として生じたPDMS構造物を短形に切断し、20μm四方のアンチドット・パターンを有する、パターン形成されたPDMS荷重部材を提供した。
本実施例は、テンプレートを製造する別の方法、いわゆる「表面波干渉」を提供し、より複雑なパターンを作り出す。表面パターンの波長は、通常は系において最も急速に成長する波モードによって決定され、実験パラメータに強く依存する。波パターン
上述のゲルマニウム−キャップされたPMGIテンプレートにおいて得られたラインパターンの波長は、ミクロンからサブミクロンの範囲にあり、これらの振幅は約20nmであった。
Claims (26)
- 基板および該基板上に位置する単相ポリマー層を含む層構造物から形成されるテンプレートであって、該ポリマー層はテクスチャ表面を含み、そのテクスチャリングはポリマー層に応力を引き起こすことに起因するテンプレート。
- ポリマー層上に位置する半導体層を更に含む、請求項1に記載のテンプレート。
- 単相ポリマーを、ポリメチルグルタルイミド(PMGI)、ポリメチルメタクリレート(PMMA)およびフォトレジストAZ5214Eから選択する、請求項1または2に記載のテンプレート。
- 半導体はゲルマニウムである、請求項2または3に記載のテンプレート。
- 基板はシリコンを含む、請求項1〜4のいずれかに記載のテンプレート。
- テクスチャ表面は平行溝を含む、請求項1〜5のいずれかに記載のテンプレート。
- 単相ポリマー層の厚さは50−300nmである、請求項1〜6のいずれかに記載のテンプレート。
- 半導体層の厚さは約10nmである、請求項2〜6のいずれかに記載のテンプレート。
- ナノメートルスケールで構造物を製造する方法であって:
請求項1〜8のいずれかに記載のテンプレートを提供する工程、
テンプレートに材料をモールドする工程、および
テンプレートからモールドした材料を取り除いて、ナノメートルスケールで構造物を提供する工程
を含んで成る方法。 - 構造物は、アレイ、グリッド、光学素子または電子素子である、請求項9に記載の方法。
- 光学素子は偏光子である、請求項10に記載の方法。
- アレイは磁性ワイヤーアレイである、請求項10に記載の方法。
- 磁性ワイヤーアレイはパーマロイでできている、請求項12に記載の方法。
- テンプレートの製造方法であって:
基板に単相ポリマーの層を堆積させる工程、
堆積工程より得られた構造物を、単相ポリマーのガラス転移温度(Tg)よりも低い温度でベークする工程、
ポリマー層に応力を引き起こすことにより、ポリマー層の表面にテクスチャを与える工程、および
応力を引き起こす工程から得られた構造物をアニールしてテンプレートを提供する工程
を含んで成る方法。 - ポリマー層上に半導体層を堆積させる工程を更に含む、請求項14に記載の方法。
- ベーク工程で用いる温度は120−200℃の範囲である、請求項14または15に記載の方法。
- ポリマーに引き起こされる応力は、0.5−1MPaの範囲である、請求項14〜16のいずれかに記載の方法。
- テクスチャが与えられる表面と係合する、少なくとも1の接触面を含む荷重伝達部材を用いてポリマー層に応力を引き起こす、請求項14〜17のいずれかに記載の方法。
- 荷重伝達部材は、ポリジメチルシロキサン(PDMS)でできている、請求項18に記載の方法。
- 荷重伝達部材の接触面にテクスチャが与えられている、請求項18または19に記載の方法。
- 単相ポリマーを、PMGI、PMMAおよびフォトレジストAZ5214Eから選択する、請求項14〜20のいずれかに記載の方法。
- 半導体はゲルマニウムである、請求項15〜21のいずれかに記載の方法。
- 基板はシリコンを含む、請求項14〜22のいずれかに記載の方法。
- ポリマー層で応力を引き起こすことにより、ポリマー層の表面に平行溝の形成をもたらす、請求項14〜23に記載の方法。
- ポリマー層の厚さは50−300nmである、請求項14〜24のいずれかに記載の方法。
- 半導体層の厚さは約10nmである、請求項15〜25のいずれかに記載の方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GBGB0227902.4A GB0227902D0 (en) | 2002-11-29 | 2002-11-29 | Template |
PCT/GB2003/004911 WO2004051371A2 (en) | 2002-11-29 | 2003-11-12 | Template |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006508825A true JP2006508825A (ja) | 2006-03-16 |
JP4351169B2 JP4351169B2 (ja) | 2009-10-28 |
Family
ID=9948791
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004556469A Expired - Fee Related JP4351169B2 (ja) | 2002-11-29 | 2003-11-12 | テンプレート |
Country Status (16)
Country | Link |
---|---|
US (1) | US20050281982A1 (ja) |
EP (1) | EP1565787B1 (ja) |
JP (1) | JP4351169B2 (ja) |
KR (1) | KR20050102078A (ja) |
CN (1) | CN1717625A (ja) |
AT (1) | ATE422682T1 (ja) |
AU (1) | AU2003283567A1 (ja) |
BR (1) | BR0316636A (ja) |
CA (1) | CA2507521A1 (ja) |
DE (1) | DE60326163D1 (ja) |
GB (1) | GB0227902D0 (ja) |
IL (1) | IL168521A (ja) |
MX (1) | MXPA05005766A (ja) |
MY (1) | MY139728A (ja) |
TW (1) | TW200415119A (ja) |
WO (1) | WO2004051371A2 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2007117107A1 (en) * | 2006-04-10 | 2007-10-18 | Ewha University-Industry Collaboration Foundation | Treating method of mold |
JP2008507114A (ja) * | 2004-04-27 | 2008-03-06 | ザ ボード オブ トラスティーズ オブ ザ ユニヴァーシティー オブ イリノイ | ソフトリソグラフィ用複合パターニングデバイス |
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2002
- 2002-11-29 GB GBGB0227902.4A patent/GB0227902D0/en not_active Ceased
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2003
- 2003-11-12 JP JP2004556469A patent/JP4351169B2/ja not_active Expired - Fee Related
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- 2003-11-12 KR KR1020057009348A patent/KR20050102078A/ko not_active Application Discontinuation
- 2003-11-12 AU AU2003283567A patent/AU2003283567A1/en not_active Abandoned
- 2003-11-12 WO PCT/GB2003/004911 patent/WO2004051371A2/en active Application Filing
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- 2003-11-12 CA CA002507521A patent/CA2507521A1/en not_active Abandoned
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008507114A (ja) * | 2004-04-27 | 2008-03-06 | ザ ボード オブ トラスティーズ オブ ザ ユニヴァーシティー オブ イリノイ | ソフトリソグラフィ用複合パターニングデバイス |
WO2007117107A1 (en) * | 2006-04-10 | 2007-10-18 | Ewha University-Industry Collaboration Foundation | Treating method of mold |
Also Published As
Publication number | Publication date |
---|---|
IL168521A (en) | 2010-05-17 |
CN1717625A (zh) | 2006-01-04 |
US20050281982A1 (en) | 2005-12-22 |
KR20050102078A (ko) | 2005-10-25 |
MXPA05005766A (es) | 2005-09-21 |
CA2507521A1 (en) | 2004-06-17 |
EP1565787A2 (en) | 2005-08-24 |
WO2004051371A3 (en) | 2004-10-07 |
AU2003283567A1 (en) | 2004-06-23 |
DE60326163D1 (de) | 2009-03-26 |
ATE422682T1 (de) | 2009-02-15 |
GB0227902D0 (en) | 2003-01-08 |
EP1565787B1 (en) | 2009-02-11 |
BR0316636A (pt) | 2005-10-11 |
JP4351169B2 (ja) | 2009-10-28 |
MY139728A (en) | 2009-10-30 |
TW200415119A (en) | 2004-08-16 |
WO2004051371A2 (en) | 2004-06-17 |
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