JP2006505679A5 - - Google Patents
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- Publication number
- JP2006505679A5 JP2006505679A5 JP2004551857A JP2004551857A JP2006505679A5 JP 2006505679 A5 JP2006505679 A5 JP 2006505679A5 JP 2004551857 A JP2004551857 A JP 2004551857A JP 2004551857 A JP2004551857 A JP 2004551857A JP 2006505679 A5 JP2006505679 A5 JP 2006505679A5
- Authority
- JP
- Japan
- Prior art keywords
- curing agent
- phenol
- novolac
- pat
- auxiliary curing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003795 chemical substances by application Substances 0.000 description 4
- GHMLBKRAJCXXBS-UHFFFAOYSA-N Resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- WSFSSNUMVMOOMR-UHFFFAOYSA-N formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical class [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N Melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- XUMBMVFBXHLACL-UHFFFAOYSA-N Melanin Chemical compound O=C1C(=O)C(C2=CNC3=C(C(C(=O)C4=C32)=O)C)=C2C4=CNC2=C1C XUMBMVFBXHLACL-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminum Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 125000000732 arylene group Chemical group 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- NJRWNWYFPOFDFN-UHFFFAOYSA-L phosphonate(2-) Chemical compound [O-][P]([O-])=O NJRWNWYFPOFDFN-UHFFFAOYSA-L 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
Description
実施例：
材料：
エポキシ−ビスフェノールＡ型エポキシ樹脂
ノボラック−フェノールホルムアルデヒド樹脂（ノボラック型）（補助硬化剤）
Example:
material:
Epoxy-bisphenol A type epoxy resin novolak-phenol formaldehyde resin (novolak type) (auxiliary curing agent)
メラニン−ノボラック−フェノールとメラミンとホルムアルデヒドの共重合体（補助硬化剤）
リン−ノボラック−ホスホリレート化フェノール−ホルムアルデヒド樹脂（補助硬化剤）
ＡＴＨ−アルミニウムトリハイドレート即ちアルミニウムトリハイドロサイド
ホスホネート−反応性ホスホネート硬化剤（但し「アリーレン」はレゾルシノール）
Melanin -Novolac -Copolymer of phenol , melamine and formaldehyde (auxiliary curing agent)
Phosphorus-Novolac-Phosphorylated phenol-formaldehyde resin (auxiliary curing agent)
ATH-aluminum trihydrate or aluminum trihydroside phosphonate-reactive phosphonate curing agent (where "arylene" is resorcinol)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US42519602P | 2002-11-08 | 2002-11-08 | |
| PCT/US2003/035519 WO2004044054A1 (en) | 2002-11-08 | 2003-11-07 | Epoxy resin composition containing reactive flame retardant phosphonate oligomer and filler |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2006505679A JP2006505679A (en) | 2006-02-16 |
| JP2006505679A5 true JP2006505679A5 (en) | 2010-04-08 |
Family
ID=32312940
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004551857A Pending JP2006505679A (en) | 2002-11-08 | 2003-11-07 | Epoxy resin composition containing reactive flame retardant phosphonate oligomer and filler |
Country Status (12)
| Country | Link |
|---|---|
| US (1) | US7427652B2 (en) |
| EP (2) | EP1719802B2 (en) |
| JP (1) | JP2006505679A (en) |
| KR (1) | KR101169658B1 (en) |
| CN (1) | CN100402605C (en) |
| AT (2) | ATE340220T1 (en) |
| AU (1) | AU2003290646A1 (en) |
| CA (1) | CA2505396A1 (en) |
| DE (2) | DE60308548T2 (en) |
| ES (2) | ES2273060T3 (en) |
| TW (1) | TWI335926B (en) |
| WO (1) | WO2004044054A1 (en) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4518538B2 (en) * | 2001-10-04 | 2010-08-04 | サプレスタ エルエルシー | Thermosetting resin composition comprising hydroxy-terminated oligomeric phosphonate |
| KR20060019547A (en) * | 2003-05-22 | 2006-03-03 | 슈프레스타 엘엘씨 | Polyphosphonate flame retardant curing agent for epoxy resin |
| US7910665B2 (en) | 2004-05-19 | 2011-03-22 | Icl-Ip America Inc. | Composition of epoxy resin and epoxy-reactive polyphosphonate |
| TW200916561A (en) * | 2007-05-07 | 2009-04-16 | Martinswerk Gmbh | Flame retarded thermosets |
| US9348991B2 (en) * | 2008-05-20 | 2016-05-24 | International Business Machines Corporation | User management of authentication tokens |
| TWI423741B (en) * | 2009-02-13 | 2014-01-11 | Iteq Corp | An epoxy resin composition and a film and a substrate made of the epoxy resin composition |
| KR20170097233A (en) * | 2010-03-05 | 2017-08-25 | 헌츠만 어드밴스드 머티리얼스 아메리카스 엘엘씨 | Low dielectric loss thermoset resin system at high frequency for use in electrical components |
| US20120095132A1 (en) * | 2010-10-19 | 2012-04-19 | Chung-Hao Chang | Halogen- and phosphorus-free thermosetting resin composition |
| KR101489176B1 (en) * | 2010-12-22 | 2015-02-03 | 에프알엑스 폴리머스, 인코포레이티드 | Oligomeric phosphonates and compositions including the same |
| CN102408419B (en) * | 2011-08-10 | 2014-11-05 | 哈尔滨理工大学 | Preparation method of benzoxazine resin |
| TW201439222A (en) * | 2013-01-22 | 2014-10-16 | Frx Polymers Inc | Phosphorus containing epoxy compounds and compositions therefrom |
| JP2015040289A (en) * | 2013-08-23 | 2015-03-02 | 三菱化学株式会社 | Epoxy resin, epoxy resin composition, cured product and laminate for electric/electronic circuit |
| CN105802127B (en) * | 2014-12-29 | 2018-05-04 | 广东生益科技股份有限公司 | A kind of halogen-free thermosetting resin composite and use its prepreg and laminate for printed circuits |
| CN105801814B (en) * | 2014-12-29 | 2018-05-04 | 广东生益科技股份有限公司 | A kind of halogen-free thermosetting resin composite and use its prepreg and laminate for printed circuits |
| CN105802128B (en) * | 2014-12-29 | 2018-05-04 | 广东生益科技股份有限公司 | A kind of halogen-free thermosetting resin composite and use its prepreg and laminate for printed circuits |
| CN107151308B (en) * | 2016-03-04 | 2019-06-14 | 广东生益科技股份有限公司 | A kind of halogen-free thermosetting resin composite and prepreg, laminate for printed circuits using it |
| CN108117632B (en) * | 2016-11-30 | 2019-08-23 | 广东生益科技股份有限公司 | A kind of compositions of thermosetting resin |
| CN108117634B (en) * | 2016-11-30 | 2019-08-27 | 广东生益科技股份有限公司 | A kind of compositions of thermosetting resin |
| CN108164684B (en) * | 2016-12-07 | 2019-08-27 | 广东生益科技股份有限公司 | A kind of compositions of thermosetting resin |
| MX2020002460A (en) | 2017-09-13 | 2020-07-20 | Hexion Inc | Epoxy resin systems. |
| KR102346010B1 (en) * | 2019-09-19 | 2021-12-31 | 코오롱인더스트리 주식회사 | A phosphorous-containing resin whose terminal is capped with and unsaturated group, a method for preparing the same, and a resin composition comprising a phosphorus-containing resin whose terminal is capped with an unsaturated group |
| CN114539313B (en) * | 2022-02-23 | 2024-04-26 | 长春市兆兴新材料技术有限责任公司 | Double-reaction type phosphonate crosslinking flame retardant and preparation method thereof |
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| US2682522A (en) * | 1952-09-10 | 1954-06-29 | Eastman Kodak Co | Process for preparing polymeric organo-phosphonates |
| US2716101A (en) * | 1952-09-10 | 1955-08-23 | Eastman Kodak Co | Polymeric organo-phosphonates containing phosphato groups |
| FR1438381A (en) * | 1964-03-28 | 1966-05-13 | Gelsenberg Benzin Ag | Process for the preparation of phosphonates containing hydroxyl groups |
| GB1308521A (en) * | 1970-03-23 | 1973-02-21 | Exxon Research Engineering Co | Phenolic stabilizers and compositions containing them |
| SU1153835A3 (en) † | 1973-09-11 | 1985-04-30 | Sumitomo Bakelite Co | Binder for laminated plastics |
| DE2715589A1 (en) * | 1976-04-14 | 1977-10-27 | Ciba Geigy Ag | NEW PHENOL STABILIZERS |
| US4268633A (en) * | 1978-04-20 | 1981-05-19 | Stauffer Chemical Company | Polyurethanes containing a poly (oxyorganophosphate/phosphonate) flame retardant |
| DE2925207A1 (en) * | 1979-06-22 | 1981-01-29 | Bayer Ag | THERMOPLASTIC, BRANCHED, AROMATIC POLYPHOSPHONATES, THEIR USE AND A METHOD FOR THE PRODUCTION THEREOF |
| DE3139958A1 (en) * | 1981-10-08 | 1983-04-28 | Basf Ag, 6700 Ludwigshafen | Self-extinguishing thermoplastic moulding compositions |
| DE3520296A1 (en) * | 1985-06-07 | 1986-12-11 | Bayer Ag, 5090 Leverkusen | METHOD FOR PRODUCING COPOLYPHOSPHONATES WITH HIGH TOUGHNESS |
| DE3800672A1 (en) * | 1988-01-13 | 1989-07-27 | Bayer Ag | FLAME-RETARDED POLYETHYLENE TEREPHTHALATE MOLDINGS |
| DE3833694A1 (en) * | 1988-10-04 | 1990-04-05 | Bayer Ag | FLAME-RETARDED, WELL CRYSTALLIZING POLYETHYLENE TEREPHTHALATE MOLDINGS |
| US4952646A (en) † | 1989-07-20 | 1990-08-28 | Akzo America Inc. | Epoxy resin compositions containing a polyphosphoric/polyphosphonic anhydride curing agent |
| FR2660302B1 (en) * | 1990-03-30 | 1992-08-07 | Selas Sa | INSTALLATION FOR HEATING, FORMING AND TEMPERING GLASS SHEETS. |
| GB9007515D0 (en) * | 1990-04-03 | 1990-05-30 | Ciba Geigy Ag | Products |
| US6005064A (en) * | 1993-12-27 | 1999-12-21 | Hitachi Chemical Company, Ltd. | Thermosetting compounds, cured product thereof and method of preparing the thermosetting compound |
| JPH08183835A (en) | 1994-12-28 | 1996-07-16 | Hitachi Chem Co Ltd | Thermosetting resin composition, adhesive sheet, and adhesive-backed metal foil |
| US6214455B1 (en) * | 1995-09-29 | 2001-04-10 | Toshiba Chemical Corporation | Bisphenol A and novolak epoxy resins with nitrogen-containing phenolic resin |
| JP3487083B2 (en) * | 1996-02-09 | 2004-01-13 | 日立化成工業株式会社 | Thermosetting resin composition and cured product thereof |
| GB9713526D0 (en) * | 1997-06-26 | 1997-09-03 | Dow Deutschland Inc | Flame retardant laminating formulations |
| US6353080B1 (en) † | 1997-06-26 | 2002-03-05 | The Dow Chemical Company | Flame retardant epoxy resin composition |
| JPH1180178A (en) * | 1997-09-12 | 1999-03-26 | Hitachi Chem Co Ltd | Oligomer terminated with phosphorus-containing phenol and its production |
| JP2000226499A (en) * | 1998-12-03 | 2000-08-15 | Hitachi Chem Co Ltd | Epoxy resin molding material for sealing and electronic part device |
| JP2000256633A (en) | 1999-03-09 | 2000-09-19 | Hitachi Chem Co Ltd | Adhesive composition |
| JP4353589B2 (en) * | 1999-07-09 | 2009-10-28 | 株式会社Ａｄｅｋａ | Flame retardant epoxy resin composition |
| JP2001098273A (en) * | 1999-09-30 | 2001-04-10 | Nippon Chem Ind Co Ltd | Flame retardant composition and flame-retardant resin composition |
| JP2001122948A (en) * | 1999-10-28 | 2001-05-08 | Hitachi Chem Co Ltd | Flame retardant resin composition, prepreg and laminate for printed wiring board |
| TW587094B (en) | 2000-01-17 | 2004-05-11 | Sumitomo Bakelite Co | Flame-retardant resin composition comprising no halogen-containing flame retardant, and prepregs and laminates using such composition |
| US6440567B1 (en) * | 2000-03-31 | 2002-08-27 | Isola Laminate Systems Corp. | Halogen free flame retardant adhesive resin coated composite |
| JP2001302879A (en) * | 2000-04-25 | 2001-10-31 | Shin Kobe Electric Mach Co Ltd | Epoxy resin composition and prepreg and printed circuit board using the same |
| JP2002088138A (en) * | 2000-09-14 | 2002-03-27 | Asahi Denka Kogyo Kk | Epoxy resin composition |
| MY142518A (en) | 2001-01-10 | 2010-12-15 | Hitachi Chemical Co Ltd | Dihydrobenzoxazine ring-containing resin, phenolic-triazine-aldehyde condensate and epoxy resin |
| MY138485A (en) | 2001-03-12 | 2009-06-30 | Hitachi Chemical Co Ltd | Process for producing benzoxazine resin |
| JP4518538B2 (en) * | 2001-10-04 | 2010-08-04 | サプレスタ エルエルシー | Thermosetting resin composition comprising hydroxy-terminated oligomeric phosphonate |
-
2003
- 2003-11-07 AU AU2003290646A patent/AU2003290646A1/en not_active Abandoned
- 2003-11-07 DE DE60308548T patent/DE60308548T2/en not_active Expired - Lifetime
- 2003-11-07 AT AT03783227T patent/ATE340220T1/en not_active IP Right Cessation
- 2003-11-07 ES ES03783227T patent/ES2273060T3/en not_active Expired - Lifetime
- 2003-11-07 US US10/534,137 patent/US7427652B2/en not_active Expired - Lifetime
- 2003-11-07 TW TW092131258A patent/TWI335926B/en not_active IP Right Cessation
- 2003-11-07 EP EP06118096.4A patent/EP1719802B2/en not_active Expired - Lifetime
- 2003-11-07 DE DE60335671T patent/DE60335671D1/en not_active Expired - Lifetime
- 2003-11-07 CN CNB2003801053608A patent/CN100402605C/en not_active Expired - Fee Related
- 2003-11-07 EP EP03783227A patent/EP1570000B1/en not_active Expired - Lifetime
- 2003-11-07 JP JP2004551857A patent/JP2006505679A/en active Pending
- 2003-11-07 KR KR1020057008048A patent/KR101169658B1/en active IP Right Grant
- 2003-11-07 AT AT06118096T patent/ATE494329T1/en not_active IP Right Cessation
- 2003-11-07 WO PCT/US2003/035519 patent/WO2004044054A1/en active IP Right Grant
- 2003-11-07 ES ES06118096T patent/ES2359226T3/en not_active Expired - Lifetime
- 2003-11-07 CA CA002505396A patent/CA2505396A1/en not_active Abandoned
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