JP2006351817A - Adhesive support - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a practical adhesive support capable of stably supporting electronic parts over an extended period by adding quartz powder to a silicon adhesive composition when a sheet-like silicon rubber is integrally molded with a base material, for improved adhesive strength to the base material. <P>SOLUTION: In the adhesive support, an adhesive layer is so provided on the base material as to support an object by an adhesive force on the surface of the adhesive layer. The adhesive layer is a settled material of an adhesive composition containing (a) silicon raw rubber, (b) bridging component, (c) adhesive component, (d) white gold compound, and (e) quartz powder of average particle size ≤40 μm, which is bonded to the base material. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an adhesive support having an adhesive layer that supports a support such as an electronic component with adhesive force, and more particularly to an adhesive support using a silicone-based adhesive as the adhesive layer.

  Conventionally, when forming an electrode by coating the end face of an electronic component such as a chip capacitor, it has been necessary to expose the target part and support a large number of electronic components, and many support bodies have been proposed for this purpose. Has been.

As such a support, the following Patent Document 1 discloses a predetermined vinyl group-containing organopolysiloxane, organohydrodiene polysiloxane, (CH ₂ ═CH) R ¹ ₂ SiO _0.5 unit, R ¹ ₃ SiO _0. There is described a support in which a flexible member layer obtained by curing a composition containing ₅ units and an organopolysiloxane containing SiO ₂ units and a platinum compound is formed, and the flexible member is provided with a large number of holes. Here, a part of many electronic components is inserted into many holes formed in the flexible member layer, and the electronic component is supported by the elasticity of the flexible member layer.

  Patent Document 2 below describes a support in which an adhesive layer is provided on the surface of the support. In this support, the end face of the electronic component is supported by adhering to the adhesive surface. Here, unlike the support of Patent Document 1, it is not necessary to insert a part of many electronic components into a large number of fine holes, so it is not necessary to accurately form a large number of fine holes. Manufacture is easy, and the electronic components can be easily attached and detached during use.

  Furthermore, Patent Document 3 below describes that a large number of electronic components supported by adhesion on the surface of the adhesive layer are peeled off and removed by a detaching blade that moves relative to the surface of the adhesive layer in parallel. ing. Here, since the electronic component is supported on the surface of the adhesive surface, it is easy to detach a large number of electronic components.

In the above-mentioned conventional adhesive support that supports a support body such as an electronic component by adhesive force, it is compatible with high-temperature heat treatment such as reflow, and has excellent heat resistance. Is used. In addition, in the case of an adhesive support that supports electronic components, sufficient rigidity is required to stably support the electronic components and withstand relative movement with the detaching blade. Since the pressure-sensitive adhesive has a JIS hardness (durometer A) of about 10 to 40 and a relatively low hardness and is difficult to handle with the adhesive support itself, it is used by being placed on a substrate.
Japanese Patent Publication No. 3-76778 JP-A-4-291712 JP 2000-77772 A

  In order to obtain a silicone adhesive adhesive support on a substrate, a silicone adhesive sheet is first molded and cured, and then applied to the substrate. A method of placing the material before curing, press-molding, pressurizing and heating, and integrally molding the sheet-like silicone adhesive with the base material, etc. can be considered, but the conventional silicone adhesive material is the base material Even if the side was primed, the adhesive strength between the silicone-based pressure-sensitive adhesive and the base material was low, and it could not withstand practical use.

  Therefore, the present invention improves the adhesive strength with the base material by adding quartz powder to the silicone-based pressure-sensitive adhesive composition when the sheet-like silicone rubber is integrally formed with the base material, and thus for a long period of time. It is an object of the present invention to provide a practical adhesive support capable of stably supporting electronic components and the like.

  In order to solve the above-mentioned problems, the invention according to claim 1 is characterized in that the pressure-sensitive adhesive support in which the pressure-sensitive adhesive layer is provided on a substrate so as to support the support by the adhesive force of the surface of the pressure-sensitive adhesive layer, A layer comprising: (a) silicone raw rubber; (b) a crosslinking component; (c) an adhesive component; (d) a platinum compound; and (e) quartz powder having an average particle size of 40 μm or less. It is a cured product, and the substrate and the cured product are bonded to each other.

  In addition to the structure of Claim 1, the invention of Claim 2 is the addition amount of the said quartz powder with respect to 100 mass parts of said (a)-(d), and 5-35 mass parts. It is characterized by being.

  According to a third aspect of the present invention, in addition to the configuration according to the first or second aspect, the base material is a hard member made of metal, resin, or ceramics, and a primer is applied to an adhesive surface thereof. It is characterized by having.

  According to a fourth aspect of the present invention, in addition to the structure according to any one of the first to third aspects, the base material is a hard member made of metal, resin, or ceramics, and an adhesive surface thereof is blasted, One of the surface treatments of corona treatment and plasma treatment is performed.

  According to a fifth aspect of the present invention, in addition to the structure according to any one of the first to fourth aspects, the pressure-sensitive adhesive surface comprising at least a part of the surface of the pressure-sensitive adhesive layer in contact with the supported body is a flat surface. It is said.

  The invention according to claim 6 is characterized in that, in addition to the configuration according to any one of claims 1 to 5, the supported body is an electronic component.

  According to the invention according to any one of claims 1 to 6, the adhesive strength with the base material is improved by adding and adding quartz powder having an average particle size of 40 μm or less to the silicone-based pressure-sensitive adhesive composition, An adhesive support capable of stably supporting a support such as an electronic component over a long period of time can be provided.

  According to the second aspect of the invention, by adding 5 to 35 parts by mass of quartz powder having an average particle size of 40 μm or less, an even higher adhesive force can be exhibited. Further improvement.

  According to the invention described in claim 3, since the primer is applied to the surface of the base material, the adhesive force between the adhesive composition and the base material is enhanced, so that the reliability of the adhesive support is further improved. .

  According to the invention described in claim 4, since any one of the blast treatment, corona treatment and plasma treatment is applied to the surface of the substrate, the adhesive force between the adhesive composition and the substrate is increased. Therefore, the reliability of the adhesive support is further improved.

  According to the invention described in claim 5, since the pressure-sensitive adhesive surface consisting of at least a part of the pressure-sensitive adhesive layer in contact with the supported body is a flat surface, when the support supported by the pressure-sensitive adhesive layer is detached during use, It is easy to move the detachment blade to the supported body in a direction along the surface of the adhesive layer, or to apply a force in the direction along the surface of the adhesive layer to detach the supported body. Even in such a use, since the rigidity of the pressure-sensitive adhesive support is maintained by the high adhesive force between the silicone-based pressure-sensitive adhesive and the substrate, a durable pressure-sensitive adhesive support can be provided.

  According to the invention described in claim 6, since a small electronic component such as a chip capacitor can be supported by being adhered to the surface of the adhesive support, an electrode or the like is provided on the end surface of the small electronic component such as a chip capacitor. It can be used as a manufacturing jig when forming.

  Embodiments of the present invention will be described below.

  FIG.1 and FIG.2 shows the adhesive support body of this embodiment.

  In the figure, reference numeral 1 denotes an adhesive support formed in a flat plate shape, a plate-like base material 2 having strength against a load during use, and an adhesive layer 3 laminated on one surface of the base material 2. It is made up of.

  Such an adhesive support 1 is used to support a large number of electronic components 4 as supported bodies. For example, one end 4a of the electronic component 4 is supported on the surface of the adhesive layer 3 by adhesive force. In this state, the other end 4b can be coated. Here, since the entire surface including the adhesive surface composed of the surface in contact with each electronic component 4 of the adhesive layer 3 is formed flat, each electronic component 4 is supported only by the adhesive force of the adhesive layer 3.

  Here, the flatness of the pressure-sensitive adhesive surface of the pressure-sensitive adhesive layer 3 (difference between the maximum value and the minimum value of the pressure-sensitive adhesive surface) is preferably 50 μm or less, and the surface roughness (Ra) is preferably 1 μm or less. preferable. This is because it is easy to ensure a sufficient contact area with the electronic component 4 on the adhesive surface.

  Examples of the electronic component 4 include finished products or unfinished products such as capacitors, resistors, inductors, FPCs, and wafers.

  In order to support the electronic component 4 on the adhesive support 1 when the adhesive support 1 is used, for example, a positioning member (not shown) that can place the electronic component 4 at a predetermined position on the surface of the adhesive layer 3 is adhered. Used in contact or non-contact with the layer 3, the electronic component 4 is placed at a predetermined position on the surface of the adhesive layer 3, pressed against the adhesive layer 3, and then supported by releasing the pressing force. Can do.

  On the other hand, in order to detach a large number of electronic components 4 supported by the adhesive layer 3, the detaching blade 18 is moved with the tip of the detaching blade 18 in pressure contact with the surface of the adhesive layer 3. By relatively moving in the direction A along the surface of the pressure-sensitive adhesive layer 3, a large number of electronic components 4 can be peeled off and detached at the tip.

  In the adhesive support 1 used in this manner, the surface of the adhesive layer 3 is rubbed by the electronic component 4 when the electronic component 4 is supported on the adhesive layer 3 and when the electronic component 4 is detached from the adhesive layer 3. It is done. Therefore, in this invention, in order to ensure the tensile strength etc. which can endure such use, ensuring sufficient adhesiveness, what consists of the hardened | cured material of a specific adhesive composition is used as the adhesion layer 3. FIG.

  That is, in the embodiment according to the present invention, the pressure-sensitive adhesive layer 3 is composed of the component (a) composed of silicone raw rubber, the component (b) composed of the crosslinking component, the component (c) composed of the pressure-sensitive adhesive component, and the platinum compound. It consists of the hardened | cured material of the adhesive composition containing (d) component and (e) component which consists of quartz powder.

  First, in the present invention, as the component (a) made of silicone raw rubber, for example, a polyorganosiloxane having an alkenyl group that can be cross-linked by an addition reaction can be used, and those represented by the following formula (1) are particularly preferable. Can be used.

(In the formula (1), R ¹ and R ² are monovalent hydrocarbon groups having no aliphatic unsaturated bond, and may be the same or different, and X is an alkenyl group-containing organic group. Each of them may be the same or different, a is an integer of 0 to 3, b is an integer of 0 to 3, m is an integer of 0 or more, and n is an integer of 10 or more. , A, b, and m are not 0 at the same time.)

Here, R ¹ is preferably one having 1 to 10 carbon atoms, an alkyl group such as a methyl group, an ethyl group, a propyl group or a butyl group, a cycloalkyl group such as a cyclohexyl group, an aryl such as a phenyl group or a tolyl group. Examples thereof include groups such as a methyl group and a phenyl group.

  The alkenyl group-containing organic group represented by X is preferably one having 2 to 1 carbon atoms, such as vinyl group, allyl group, hexenyl group, octenyl group, acryloylpropyl group, acryloylmethyl group, methacryloylpropyl group, cyclohexenylethyl group. And vinyloxypropyl group.

  The component (a) may have oily or clay-like properties, and preferably has a viscosity of 50 mPa · s or more at 25 ° C., particularly 10 mPa · s or more.

  Moreover, although this (a) component may be used individually by 1 type, you may use it in mixture of 2 or more types.

  Next, the crosslinking component (b) in the present invention is a component capable of undergoing a crosslinking reaction with the component (a). For example, at least 2 H atoms bonded to Si atoms in one molecule, preferably 3 or more. SiH bond-containing polyorganosiloxane (hereinafter sometimes referred to as organohydrogenpolysiloxane) can be used.

  As this polyorganosiloxane, linear, branched, or cyclic compounds can be appropriately selected and used. Examples thereof include those represented by the following formula (2) or (3).

(In the above formulas (2) and (3), R ¹ is the same hydrocarbon group as described above and may be the same or different. C and d are integers of 0 to 3, x, y, and s are integers of 0 or more, r is an integer of 1 or more, c, d, and x are not simultaneously 0, and x + y ≧ 0, and r + s ≧ 3, preferably Is 8 ≧ r + s ≧ 3.)

  This organohydrogenpolysiloxane has oily properties, and preferably has a viscosity of 1 to 5000 mPa · s at 25 ° C.

  This component (b) may also be used alone or in combination of two or more.

  The blending ratio of the component (b) can be selected as appropriate, but when the component (a) contains an alkenyl group and the component (b) contains a SiH bond, the component (a) in the component (a) It is preferable that the molar ratio of the SiH bond in the component (b) to the alkenyl group is 0.5 to 20, and it is particularly preferable that the SiH bond is in the range of 1 to 15. If this molar ratio is less than 0.5, the crosslinking density after curing described later will be low, and it may be difficult to maintain the shape of the adhesive layer 3. On the other hand, when the molar ratio exceeds 20, the adhesive strength of the resulting adhesive layer 3 may be reduced.

Next, the component (c), which is an adhesive component in the present invention, is a component blended to improve the adhesive strength, and for example, polyorganosiloxane can be used, and in particular, R ² ₃ SiO _0.5 A unit containing a unit and a SiO ₂ unit and / or a R ² ₃ SiO _2/3 unit (where R ² is a monovalent hydrocarbon group having no aliphatic unsaturated bond) is preferably used. Can do.

Here, R ² is preferably one having 1 to 10 carbon atoms, alkyl group such as methyl group, ethyl group, propyl group or butyl group, cycloalkyl group such as cyclohexyl group, aryl such as phenyl group or tolyl group. Examples thereof include groups such as a methyl group and a phenyl group.

  In general, the component (c) preferably has a structure that does not cause or hardly causes a crosslinking reaction together with the components (a) and (b) in order to ensure a higher degree of adhesiveness.

When polyorganosiloxane is used as the component (c), the molar ratio of (R ² ₃ SiO _0.5 unit and / or R ² ₃ SiO _2/3 unit) / SiO ₂ unit is 0.6 to 1. .7 is preferable. If this molar ratio is less than 0.6, the tackiness may become too high, or it may become difficult to be compatible with the component (a), and may not be separated to express the tackiness. On the other hand, if the molar ratio exceeds 1.7, the adhesive strength may decrease.

  In addition, this polyorganosiloxane may contain OH group couple | bonded with Si atom, and it is preferable that OH group content shall be 0-4.0 mol% in that case.

  In the case of using a substance containing an OH group bonded to an Si atom, when the polyorganosiloxane represented by the following formula (4) is contained as the component (a), the component (a) and the component (b) are one. A partial condensation reaction product may be formed.

(In the formula (4), R ¹ and R ² are monovalent hydrocarbon groups having no aliphatic unsaturated bond, which may be the same or different, and Y is R ¹ or alkenyl. A group-containing organic group, p is an integer of 1 or more, and q is an integer of 10 or more.)

  In order to form such a condensation reaction product of the component (a) and the component (c), a mixture of the component (a) and the component (c) dissolved in a solvent such as toluene is added in the presence of an alkaline catalyst. The reaction may be performed at room temperature or under reflux.

  In addition, such (c) component may be used individually by 1 type, or may be used in mixture of 2 or more types.

  And it is preferable to use such (c) component in the range of 20 / 80-80 / 20 as a weight ratio of (a) component / (c) component, and it is set as 30 / 70-70 / 30 especially. Is preferred. If the amount of the component (c) is less than this range, the adhesiveness tends to be insufficient. On the other hand, if the amount is large, the adhesive layer 3 becomes hard and elastic, and the adhesive layer 3 is difficult to deform. It tends to be difficult to adhere the supported object.

  Next, the component (d) of the present invention is a platinum compound that mainly serves as a catalyst for promoting the crosslinking reaction between the component (a) and the component (b), and is usually used as a hydrosilation catalyst. It is.

  As the component (d), chloroplatinic acid, an alcohol solution of chloroplatinic acid, a reaction product of chloroplatinic acid and alcohol, a reaction product of chloroplatinic acid and an olefin compound, chloroplatinic acid and a vinyl group-containing siloxane And reactants.

  The blending ratio of the component (d) is preferably 1 to 5,000 ppm as a platinum content, particularly 5 to 2,000 ppm, with respect to the total amount of the components (a) and (b). Is preferred. This is because if the blending ratio is less than 1 ppm, the curability is lowered and the crosslinking density is lowered and the holding power may be lowered. On the other hand, if it exceeds 5,000 ppm, the usable time of the treatment bath may be shortened. .

  Next, the component (e) of the present invention is quartz powder added together with each of the above components, and reinforces the mechanical strength of the adhesive layer 3 and also provides the components constituting the adhesive layer 3, particularly the adhesiveness. The component (c) to be held is held in the pressure-sensitive adhesive layer 3 to make it difficult to detach.

  According to the pressure-sensitive adhesive layer 3 of the pressure-sensitive adhesive support 1 having the above-described structure, the silicone-based pressure-sensitive adhesive in the pressure-sensitive adhesive layer made of a normal silicone pressure-sensitive adhesive (without filler) containing no quartz powder. In this case, the quartz powder acting as a reinforcing action is also exposed at the bonding interface, so that the adhesion between the pressure-sensitive adhesive layer 3 and the base material 2 is helped and contributed to this.

  Quartz powder has an average particle size of 40 μm or less, and particularly preferably an average particle size of 0.5 to 10 μm. If the average particle diameter of the quartz powder exceeds 40 μm, not only the adhesion reinforcing effect at the adhesion interface with the substrate 2 is reduced, but also the physical properties of the material itself are lowered, which is not preferable. The addition amount of the quartz powder is 5 to 35 parts by mass with respect to 100 parts by mass of the silicone component, and most preferably 10 to 20 parts by mass. The effect of improving the adhesive strength when the addition amount of quartz powder is less than 5 parts by mass is reduced, and if it exceeds 35 parts by mass, the physical properties of the material itself are lowered, which is not preferable.

  As the quartz powder of component (e), for example, Minusi (trade name, manufactured by Penn Glass Sand), Neo-Novacite (trade name, manufactured by Malvern Mineral), Imsil A-10 (trade name, Illinois Minerals) Manufactured). Quartz powder may be used individually by 1 type, or may be used in combination of 2 or more types.

  Moreover, you may use what processed the surface of the quartz powder with surface treatment agents, such as organopolysiloxane, organopolysilazane, chlorosilane, alkoxysilane, as needed.

  Furthermore, in this invention, it is possible to add arbitrary components as appropriate in addition to the components (a) to (e).

  For example, a reaction control agent for suppressing a crosslinking reaction when mixing the above components can be added. Examples of the reaction control agent include 3-methyl-1-butyn-3-ol, 3-methyl-1-pentyn-3-ol, 3,5-dimethyl-1-hexyn-3-ol, and 1-ethynyl. Cyclohexanol, 3-methyl-3-trimethylsiloxy-1-butyne, 3-methyl-3-trimethylsiloxy-1-pentyne, 3,5-dimethyl-3-trimethylsiloxy-1-hexyne, 1-ethynyl-1- Trimethylsiloxycyclohexane, bis (2,2-dimethyl-3-butynoxy) dimethylsilane, 1,3,5,7-tetramethyl-1,3,5,7-tetravinylcyclotetrasiloxane, 1,1,3 Examples include 3-tetramethyl-1,3-divinyldisiloxane.

  When this reaction control agent is added, the blending ratio can be in the range of 0 to 5.0 parts by mass with respect to the total amount of 10 parts by mass of the component (a) and the component (c). It is preferable to set it as 05-2.0 mass parts. It is because it will become difficult to harden | cure at the time of hardening of an adhesive composition when the mixture ratio of this reaction control agent exceeds 5.0 mass parts.

  In addition to the reaction control agent, in the present invention, it is possible to add optional components as appropriate. For example, non-reactive polyorganosiloxanes such as polydimethylsiloxane and polydimethyldiphenylsiloxane, As solvents for reducing the viscosity, aromatic solvents such as toluene and xylene, aliphatic solvents such as hexane, octane and isoparaffin, ketone solvents such as methyl ethyl ketone and methyl isobutyl ketone, ethyl acetate, isobutyl acetate and the like Ester solvents, ether solvents such as diisopropyl ether and 1,4-dioxane, or mixed solvents, dyes, pigments and the like thereof can be used.

  The pressure-sensitive adhesive composition of the pressure-sensitive adhesive support 1 according to the present invention is a mixture obtained by mixing the respective components as described above, and each component is blended in a predetermined amount and preferably uniformly dispersed. belongs to.

  And in order to manufacture the above adhesive support bodies 1 using the above compositions, the said silicone type adhesive composition is applied to the base material 2, and it makes it harden | cure on predetermined conditions. Thus, it can be manufactured by obtaining the adhesive layer 3.

  Here, the base material 2 is formed of a material capable of holding the adhesive layer 3, for example, a metal plate such as stainless steel or aluminum, a metal foil such as aluminum foil or copper foil, polyester, polytetrafluoroethylene, Resin films and plates such as polyimide, polyphenylene sulfide, polyamide, polycarbonate, polystyrene, polypropylene, polyethylene, polyvinyl chloride, paper such as Japanese paper, synthetic paper, polyethylene laminate paper, ceramics such as cloth, glass fiber, glass plate, glass Examples thereof include composite materials such as epoxy resin plates, and composite materials formed by laminating a plurality of these materials. Here, those made of a hard member made of metal, resin, or ceramic are particularly suitable.

  In order to improve the adhesion between the base material 2 and the adhesive layer 3, these base materials 2 can be used by applying a primer or performing a surface treatment such as a corona treatment, a blast treatment, or a plasma treatment. .

  And in order to apply and harden the adhesive composition as described above on these base materials 2, the adhesive composition is laminated on one surface of the base material 2 and press-molded with a mold or the like. Alternatively, the method can be performed by a method of inserting the base material 2 into a mold and injecting the pressure-sensitive adhesive composition into the mold and molding.

  In such a coating method, the thickness of the adhesive layer 3 after curing can be set to about 0.2 to 5 mm. In this case, the curing conditions can be 3 to 40 minutes at 80 to 130 ° C., but can be adjusted as appropriate.

  In addition, a coating method for further reducing the thickness can be used, such as coating with a comma coater, lip coater, roll coater, die coater, knife coater, blade coater, rod coater, kiss coater, gravure coater, or screen coating. Coating can be performed using a known coating method such as coating by dip coating, dip coating, or cast coating.

  In such a coating method, the thickness of the adhesive layer 3 after curing can be set to 1 to 200 μm. In this case, the curing conditions can be set at 80 to 130 ° C. for 30 seconds to 3 minutes, but can be appropriately adjusted.

In the pressure-sensitive adhesive layer 3 obtained by curing as described above, it is desirable that there is no low-molecular siloxane component or an uncrosslinked component of the component (a), but in practice, siloxane generated from the pressure-sensitive adhesive layer 3 is 1 It is desirable that the total amount of the low-molecular cyclic siloxane D ₄ (tetramer cyclic siloxane) to D ₁₀ (decamer cyclic siloxane) is 300 ppm or less as a monomer.

  According to the pressure-sensitive adhesive support 1 manufactured as described above, the pressure-sensitive adhesive layer 3 is composed of a cured product of a predetermined pressure-sensitive adhesive composition containing quartz powder having an average particle diameter of 40 μm or less. As a result, when a support such as the electronic component 4 is attached to or detached from the surface of the adhesive layer 3 in use, the electronic component is attached to the surface of the adhesive layer 3. Even if the surface of the pressure-sensitive adhesive layer 3 is rubbed by pressing the detaching blade 5 for detaching the support member 4 or the supported body or by applying a force in the direction along the surface of the pressure-sensitive adhesive layer 3, The shavings composed of the components constituting the layer 3, in particular, the shavings or the residue consisting of the component (c) that imparts tackiness hardly occur.

  In addition, the surface of the adhesive layer 3 is formed in a flat surface without a hole for inserting the electronic component 4, and the electronic component 4 is supported on the surface of the adhesive layer 3. When attaching or detaching the electronic component 4, the electronic component 4 or the detaching blade 5 is moved in the direction A along the surface of the adhesive layer 3, or a force in the direction along the surface of the adhesive layer 3 is applied. It is easy to attach and detach. Even in such a use, since the effect of holding the components constituting the adhesive layer 3 in the adhesive layer 3 is high as described above, it is difficult to generate scraped scraps or residue from the components constituting the adhesive layer 3. It is preferable that the product failure of the electronic component 4 hardly occurs.

  In addition, although the example which supports the electronic component 4 was demonstrated in the said embodiment, a to-be-supported body is not limited at all, For example, other electronic components, such as a silicon wafer, may be sufficient, and the adhesive force of the adhesion layer 3 is sufficient. It is possible to support a support according to the strength of the adhesive support 1 and the like.

  Moreover, although the adhesive layer 3 was formed in the plate-shaped base material 2 in the above, the shape of the base material 2 is not specifically limited, For example, for uses, such as a roll shape, a curved surface shape, and various irregular shapes. Accordingly, any shape that can hold the adhesive layer 3 can be adopted as appropriate. Further, the material of the base material 2 can be appropriately selected as long as it can stably hold the adhesive layer 3.

  Furthermore, in the above description, an example in which the entire surface of the adhesive layer 3 forms a planar adhesive surface has been described. However, the surface is not particularly limited to a planar shape, and a portion that adheres a support such as the electronic component 4 is not limited. It may be formed into a convex shape or a concave shape. Moreover, as long as to-be-supported bodies, such as the electronic component 4, can be adhere | attached, the adhesive support body 1 from which a part of surface of the adhesion layer 3 becomes a non-adhesion surface may be sufficient.

Examples of the present invention will be described below.
[Example 1]

As component (a), 10 parts by mass of an alkenyl group-containing polyorganosiloxane of 5 mol% of methyl vinyl siloxane units and 95 mol% of dimethyl vinyl siloxane units, and as component (b), H (CH ₃ ) ₂ SiO— 5.7 parts by mass of SiH bond-containing polyorganosiloxane composed of ((CH ₃ ) ₂ SiO) ₁₈ -Si (CH ₃ ) ₂ H, and as component (c), (CH ₃ ) SiO _0.5 unit / SiO ₂ A 2-ethylhexanol solution of chloroplatinic acid comprising 50 parts by mass of a polyorganosiloxane having a molar ratio of (CH ₃ ) SiO _0.5 unit / SiO ₂ unit of 0.85 and a platinum content of 2%. 0.28 parts by mass, 10 parts by mass of quartz powder having an average particle size of 5 μm, and 0.05 parts by mass of 1-ethynylcyclohexanol were uniformly mixed as a reaction control agent. Was to prepare an adhesive composition.

Then, a primer made of a silane coupling agent was applied 50 mm in the length direction to a stainless steel plate-like substrate 2 (width 25 mm × length 150 mm × thickness 1 mm), and the pressure-sensitive adhesive composition was applied 1.5 mm. A uniform thickness was applied and cured at 120 ° C. for 15 minutes to produce an adhesive support 1 as shown in FIG.
[Example 2]

In Example 2, only the amount of quartz powder added in the adhesive composition of Example 1 was changed. Specifically, 20 parts by mass of quartz powder having an average particle diameter of 5 μm was obtained. The amount of addition of quartz powder is increased. In addition, the production method, shape, and size of the adhesive support are the same.
[Example 3]

In Example 3, only the average particle diameter of the quartz powder in the adhesive composition of Example 1 was changed. Specifically, 10 parts by mass of quartz powder having an average particle diameter of 35 μm was obtained. Further, the average particle size of the quartz powder is increased. In addition, the production method, shape, and size of the adhesive support are the same.
[Example 4]

In Example 4, the average particle diameter of the quartz powder of the adhesive composition of Example 1 and only the amount added were changed. Specifically, the quartz powder having an average particle diameter of 35 μm was changed to 20 parts by mass. The average particle size of the quartz powder is made larger than that of Example 1 and the amount added is increased. In addition, the production method, shape, and size of the adhesive support are the same.
[Example 5]

Example 5 is the same in the method, shape, and size of the pressure-sensitive adhesive composition and pressure-sensitive adhesive support of Example 1, but the point that corona-treated surface treatment is applied to the pressure-sensitive adhesive support is Example 1. Is different. In addition, the production method of the adhesive support excluding the surface treatment and the shape and size of the adhesive support are the same.
[Example 6]

Example 6 is the same in the preparation method, shape and size of the pressure-sensitive adhesive composition and pressure-sensitive adhesive support of Example 1, but the point that the surface treatment of blast treatment is applied to the pressure-sensitive adhesive support is Example 1. Is different. In addition, the production method of the adhesive support excluding the surface treatment and the shape and size of the adhesive support are the same.
[Comparative Example 1]

Comparative Example 1 is the same as Example 1 except that no quartz powder is added to the adhesive composition and that no primer treatment is applied when preparing the adhesive support. The production method, shape, and size of other adhesive supports are the same.
[Comparative Example 2]

Comparative Example 2 is the same as Example 1 except that the quartz powder is not added to the adhesive composition and the adhesive support is subjected to a corona treatment surface treatment. In addition, the production method, shape, and size of the adhesive support excluding the surface treatment are the same.
[Comparative Example 3]

  Comparative Example 3 is the same as Example 1 except that the quartz powder is not added to the adhesive composition and the adhesive support is subjected to a blasting surface treatment. In addition, the production method, shape, and size of the adhesive support excluding the surface treatment are the same.

  Using the adhesive supports 1 of Examples 1 to 6 and Comparative Examples 1 to 3 obtained as described above, the peeling force was measured according to JIS Z 0237 under the same conditions. The results are shown in Table 1.

  As is apparent from Table 1, Examples 1 to 6 show an average of about three times as much peeling force as Comparative Example 3 having the largest peeling force. Therefore, the adhesive support (Examples 1 to 6) to which 10 to 20 parts by mass of quartz powder having an average particle size of 5 to 34 μm is added is the adhesive support to which quartz powder is not added (Comparative Examples 1 to 3). ) It was confirmed that a larger adhesive force was obtained.

  In addition, since Examples 1, 2, 5, and 6 in which the average particle diameter of the quartz powder is smaller than those in Examples 3 and 4 in which the average particle diameter of the quartz powder is large, the peeling force is larger, so the average particle diameter of the quartz powder is small. It can be said that the adhesive strength of the adhesive support is greater.

  In addition, when the average particle size of the quartz powder is the same, the peel strength is higher in Examples 2 and 4 where the addition amount is higher than those in Examples 1 and 3 where the addition amount is smaller, so the addition amount of quartz powder is larger. However, it can be said that the adhesive strength of the adhesive support is large.

  Furthermore, when the average particle diameter of the quartz powder and the amount of addition thereof are the same, the surface treatments of Examples 5 and 6 with the surface treatment are larger than those of Example 1 with no surface treatment. It can be said that the adhesive force of the adhesive support is greater when the treatment is performed.

It is a perspective view which shows the adhesive support body of embodiment of this invention. It is principal part sectional drawing which shows the use condition of the adhesive support body of the embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Adhesive support body 2 Base material 3 Adhesive layer 4 Electronic component (supported body)
5 Detachment blade

Claims (6)

In the adhesive support provided with the adhesive layer on the substrate so as to support the support by the adhesive force of the surface of the adhesive layer,
The pressure-sensitive adhesive composition, wherein the pressure-sensitive adhesive layer comprises (a) silicone raw rubber, (b) a crosslinking component, (c) a pressure-sensitive adhesive component, (d) a platinum compound, and (e) quartz powder having an average particle size of 40 μm or less. An adhesive support, wherein the substrate and the cured product are bonded to each other. The pressure-sensitive adhesive support according to claim 1, wherein the amount of addition of the quartz powder is 5 to 35 parts by mass with respect to 100 parts by mass of (a) to (d). The pressure-sensitive adhesive support according to claim 1 or 2, wherein the base material is a hard member made of a metal, a resin, or ceramics, and a primer is applied to an adhesive surface thereof. The base material is a hard member made of metal, resin, or ceramics, and an adhesive surface thereof is subjected to any one surface treatment of blast treatment, corona treatment, and plasma treatment. The adhesive support according to any one of 1 to 3. The pressure-sensitive adhesive support according to any one of claims 1 to 4, wherein the pressure-sensitive adhesive surface comprising at least a part of the surface of the pressure-sensitive adhesive layer in contact with the support is a flat surface. The adhesive support according to claim 1, wherein the support is an electronic component.

Images