JP2006351695A - Enamel substrate for light emitting device packaging, light emitting device module, light source apparatus, lighting apparatus, display apparatus, and traffic light - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an enamel substrate for light emitting device package excellent in expandability and usability, a light emitting device module for packaging a light emitting device on the substrate, a light source apparatus including the light emitting device module, a lighting apparatus, a display apparatus, and a traffic light. <P>SOLUTION: The substrate includes a circuit electrically connected with a power supply for driving the light emitting device provided on a packaging surface of the light emitting device on an insulating substrate. The substrate further includes a card edge terminal serving as terminals for power supply from the power supply and/or for inputting/outputting an electric signal. The light emitting device module packages the light emitting device on the substrate for light emitting device packaging. The light source apparatus includes the light emitting device module and a case having a card edge socket capable of mounting the card edge terminal part of the light emitting device module. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a light emitting element mounting enamel substrate for mounting a plurality of light emitting elements such as light emitting diodes (hereinafter referred to as LEDs), and in particular, a light emitting element mounting enamel substrate having excellent expandability and usability. The present invention relates to a light emitting element module in which a light emitting element is mounted on the substrate, a light source device having the light emitting element module, a lighting device, a display device, and a traffic signal device.

  In order to integrate a plurality of LEDs into a module, it is necessary to assemble a chip-like LED or an LED supplied in the form of a shell or surface mount package on an electric circuit board. Hereinafter, the LED assembled on the substrate is referred to as an “LED module”. For example, Patent Documents 1 and 2 have been proposed as conventional techniques related to the LED module and the substrate.

  1A and 1B are diagrams showing an example of a conventional LED module 3. FIG. 1A is a plan view of the LED module 3, and FIG. 1B is a front view thereof. This LED module 3 has a configuration in which a plurality of LEDs 2 are arranged and mounted in a lattice shape on the upper surface of a substrate 1 provided with an electric circuit. Mounting through holes 4 are formed in the corners of the substrate 1. In a light emitting element module such as the LED module, a hollow substrate in which a core metal is covered with a hollow layer is considered as a substrate on which good heat dissipation is obtained and a large number of LEDs can be mounted.

  Further, in order to improve the light extraction efficiency of the LED 2 to be mounted on the enamel substrate, a mortar-shaped reflecting cup portion is formed by performing press working or cutting on the core metal 7 before attaching the enamel layer 8 made of glass. 5 may be provided, and the LED 2 may be mounted on the bottom surface. 2A and 2B are diagrams illustrating the LED module 6 using the substrate having the reflective cup portion 5, FIG. 2A is a plan view of the reflective cup portion 5, and FIG. 2B is a cross-sectional view. This substrate is formed by coating a core metal 7 made of a steel plate or the like with a hollow layer 8, a mortar-shaped reflective cup portion 5 is provided on the light emitting element mounting surface, and a conductor is provided on the hollow layer 8. An electrode 9 is provided. The LED 2 is mounted on the bottom surface of the reflecting cup portion 5 and is electrically connected to the electrode 9 by a gold wire 10.

When such an LED module is attached to a lighting fixture or the like, a power supply wire 12 is connected to a corner wiring end of the LED module 11 by soldering or the like, as shown in FIG. Or a connection method using an insertion-type connector terminal.
JP 2003-243718 A JP 2003-68945 A

However, in the conventional connection method described above, since the space of the terminal portion becomes very large, it is difficult to produce terminals other than those for power supply. Therefore, using terminals other than those for power supply, for example, partially lighting LEDs, arranging multiple color LEDs to express various colors, and monitoring the module drive status It was difficult.
In addition, as shown in FIG. 3, when power is supplied by the electric wires 12, it is necessary to solder the electric wires to the module, attach connectors, and the like, which increases the number of manufacturing steps. Furthermore, in the soldering of the electric wires to the module substrate, the enamel substrate has a high heat capacity and is difficult to heat because the steel plate is the main material. For this reason, there is a problem that the solder is poorly wet and the soldering operation is difficult. In addition, when mounting to lighting equipment, etc., the wire blocks the light beam and the expected amount of light cannot be obtained, or a part of the light source becomes a shadow of the wire and does not form a uniform light emitting surface. Could occur.

  The present invention has been made in view of the above circumstances, and has a light-emitting element mounting enamel substrate that is rich in expandability and usability, a light-emitting element module having a light-emitting element mounted on the substrate, a light source device having the light-emitting element module, an illumination device, and a display The purpose is to provide a device and a traffic signal.

  In order to achieve the above object, the present invention provides a light emitting element mounting substrate in which a circuit electrically connected to a power source for driving a light emitting element is provided on a light emitting element mounting surface of an insulating substrate. There is provided a light emitting element mounting substrate characterized by having a card edge terminal portion that functions as a power supply terminal and / or a terminal for electric signal input / output.

  In the light emitting element mounting substrate of the present invention, the insulating substrate is preferably a hollow substrate in which a hollow metal layer is coated on the surface of the core metal.

  In the light emitting element mounting substrate of the present invention, the card edge terminal portion preferably has a thickness in the range of 1 mm to 1.6 mm.

  In the light emitting element mounting substrate according to the present invention, when the card edge terminal portion is attached to the card edge socket on the apparatus main body side, a disconnection preventing structure portion that engages with an attachment member provided on the card edge socket side is provided. It is preferably provided.

  In the light-emitting element mounting substrate of the present invention, it is preferable that the removal preventing structure is at least one notch provided on the outer edge of the substrate.

  In the light emitting element mounting substrate of the present invention, it is preferable that a reflection cup portion for mounting a light emitting element is provided on the light emitting element mounting surface.

  Moreover, this invention provides the light emitting element module formed by mounting a light emitting element in the said light emitting element mounting board | substrate which concerns on this invention.

  The present invention also provides a light emitting element module in which a light emitting element module main body formed by mounting a light emitting element on the light emitting element mounting substrate according to the present invention is fixed to a case with an opening.

  The light emitting element module of this invention WHEREIN: It is good also as a structure by which the diffusion plate was attached to the opening part of the said case.

  In the light emitting element module of the present invention, a condensing lens may be attached to the opening of the case.

  In addition, the present invention provides a light source device comprising the light emitting element module according to the present invention and a case having a card edge socket to which a card edge terminal portion of the light emitting element module can be attached.

  In the light source device of the present invention, when the card edge terminal portion is attached to the card edge socket on the device body side in the module housing case, an attachment member that engages with the light emitting element mounting substrate and prevents its removal. It is preferably provided.

  Moreover, this invention provides the illuminating device, display apparatus, and traffic signal apparatus which have the said light source device based on this invention.

According to the present invention, since the card edge terminal portion functioning as a terminal for supplying power from the power source and / or inputting / outputting electric signals is provided, the light emitting element module can be attached to the apparatus main body without a tool. It can be implemented with very simple work.
Moreover, since a terminal part is made into card edge shape, since many terminals can be arrange | positioned and used there, only a desired light emitting element can be lighted. Furthermore, a variety of shades can be reproduced by mounting light emitting elements of a plurality of light emitting colors on a substrate and adjusting the intensity of each color. In addition to supplying power to the light emitting element, sensors and light sources for transmitting infrared communication signals, etc. are installed at the same time, or a sensor such as a thermistor or thermocouple is embedded inside the module board, and the temperature state of the light emitting element module Etc. can also be monitored.

  4A and 4B are views showing the first embodiment of the present invention. FIG. 4A is a plan view of the light emitting element module 20 and FIG. 4B is a front view. The light emitting element module 20 of the present embodiment includes a light emitting element mounting substrate 21 made of a hollow substrate or the like having a rectangular shape and a large number of reflecting cup portions 22 formed on one surface thereof. A light emitting element (not shown) is mounted. On one short side of the light emitting element mounting substrate 21, a card edge terminal portion 24 is provided that functions as a terminal for power supply from a power source and / or an input / output terminal for an electric signal. Further, on both long sides of the light emitting element mounting substrate 21, when the card edge terminal portion 24 is attached to the card edge socket on the apparatus main body side, an attachment member provided on the card edge socket side is provided. A notch 23 is provided as an engagement preventing structure portion to be engaged.

  As the light-emitting element mounting substrate 21, for example, the enamel substrate shown in FIG. 2 is preferably used, but another insulating substrate may be used. On the upper surface (light emitting element mounting surface) of the light emitting element mounting substrate 21 on which the reflection cup portion 22 is provided, circuit patterns (not shown) such as electrodes and wirings that are driven by supplying power to the light emitting elements are formed. . This circuit pattern extends to the card edge terminal portion 24 and forms, for example, a comb-shaped connection terminal. This circuit pattern is preferably formed by printing a conductive paste such as a silver paste or a copper paste on a substrate and then baking it.

  As the light emitting element mounted on the light emitting element mounting substrate 21, an LED is preferable. When the light emitting element module 20 is applied to a lighting device, a white LED is preferable as the light emitting element. As this white LED, for example, a blue LED made of a gallium nitride (GaN) -based semiconductor is combined with one or more phosphors that are excited by blue light and emit visible light other than blue such as yellow. It is desirable to use a white LED or the like. The phosphor is desirably mixed and dispersed in a transparent resin (not shown) for sealing the light emitting element mounted on the substrate. Further, the light emitting element is not limited to the white LED, and other red, green, or other light emitting LEDs can be appropriately selected and used according to the application.

  FIG. 5 is a view showing a lighting device 25 as an example of a light source device using the light emitting element module 20 according to the present embodiment, FIG. 5A is a plan view of the lighting device, and FIG. 5B is a front view. . The illuminating device 25 includes a transparent case 25 that accommodates two light emitting element modules 20 separated from each other in the left-right direction, card edge sockets 28 provided on the left and right sides of the case 25, and the card edge socket 28. And a fixing hook 27 that engages with each notch 23 of the light emitting element module 20 in a state of being mounted on.

  The card edge socket 28 has a terminal that can be connected to a connection terminal formed on the card edge terminal portion 24 when the card edge terminal portion 24 of the light emitting element module 20 is inserted. The fixing hook 27 has a base end portion of an elongated member having a hook bent at the distal end portion, and is attached in a direction in which the distal end portion is fitted into the notch 23 by a biasing means such as a spring. It is energized. Therefore, in a state where the card edge terminal portion 24 of the light emitting element module 20 is inserted into the card edge socket 28, the fixing hook 27 engages with the notch 23, thereby preventing the light emitting element module 20 from being pulled out. When the light emitting element module 20 is extracted, both the fixing hooks 27 are spread in the opening direction, the engagement of the fixing hooks 27 is released, and the light emitting element module 20 is pulled out from the socket and can be removed.

According to the present embodiment, since the light emitting element mounting substrate 21 is provided with the card edge terminal portion 24 that functions as a terminal for supplying power from the power source and / or for inputting and outputting electric signals, the light emitting element module 20 is provided. Can be mounted on the main body of the machine with very simple work without tools.
Moreover, since a terminal part is made into card edge shape, since many terminals can be arrange | positioned and used there, only a desired light emitting element can be lighted. Furthermore, a variety of shades can be reproduced by mounting light emitting elements of a plurality of light emitting colors on a substrate and adjusting the intensity of each color. In addition to supplying power to the light emitting element, sensors and light sources for transmitting infrared communication signals, etc. are installed at the same time, or a sensor such as a thermistor or thermocouple is embedded inside the module board, and the temperature state of the light emitting element module Etc. can also be monitored.
In this embodiment, the transparent case 25 is used, but the material of the case may be made of metal or resin. The color of the case is not limited to transparent, and a case coated with a highly reflective paint or a surface-treated one may be used.

FIG. 6 is a diagram showing a modification of the present embodiment, and the light emitting element module 20 according to the present example has a configuration having a card edge terminal portion 24 that is thinner than the plate thickness of the light emitting element mounting substrate 21. As described above, the plate thickness of the card edge terminal portion 24 is not necessarily equal to the plate thickness of the light emitting element mounting substrate 21. Thus, by changing the thickness of the card edge terminal portion 24, it becomes easy to correspond to the applicable thickness of the general-purpose card edge socket 28, and the cost can be reduced by using an inexpensive card edge socket 28. Can be planned.
In the present embodiment, there is a step between the surface having the reflective cup portion 22 and the card edge terminal portion 24, but the two may be on the same plane.

  7A and 7B are diagrams showing a second embodiment of the present invention, in which FIG. 7A is a plan view of the light emitting element module 30, FIG. 7B is a front view, and FIG. 7C is a right side view. The light emitting element module 30 of the present embodiment is thicker than the light emitting element module 20 of the first embodiment described above, and is a light emitting element mounting in which a reflective cup portion 32 is provided on both the long side surfaces and one short side surface. The light emitting element is mounted on the substrate 31 for use. The card edge terminal portion 34 formed on the light emitting element mounting substrate 31 is thinner than the plate thickness of the main body portion of the light emitting element mounting substrate 31. Further, a notch 33 is formed on the long side of the light emitting element mounting substrate 31.

Like the light emitting element module 20 of the first embodiment described above, the light emitting element module 30 of the present embodiment emits light by attaching the card edge terminal portion 34 to the card edge socket 28 of the lighting device 25 as shown in FIG. By mounting the light emitting element on the side surface, light can be irradiated in a direction different from that of the light emitting element module 20 of the first embodiment.
Furthermore, an electronic circuit board having a plurality of functions can be formed by separately printing a circuit on the upper surface and mounting an electronic component other than the purpose of driving and controlling the light emitting element to configure the electronic circuit.

  8A and 8B are views showing a third embodiment of the present invention, in which FIG. 8A is a plan view of the light emitting element module 41, FIG. 8B is a front view thereof, and FIG. 8C is a right side sectional view thereof. is there. The light emitting element module 41 of the present embodiment has a rectangular shape, a light emitting element is mounted on a light emitting element mounting substrate having a large number of reflecting cup portions 22 formed on one surface thereof, and a card edge on one long side. The light emitting element module main body 40 provided with the terminal portion 43 and a case 42 with an opening for accommodating the light emitting element module main body 40 are configured.

  In the present embodiment, the case 42 has a box shape in which an opening is provided on one surface and the lower part is opened, and an acrylic plate 48 is fitted into the opening. The light emitting element module main body 40 accommodated in the case 42 is fixed in the case 42 by a plurality of spacers 47 and a fixture 46. In the present embodiment, a notch 44 is provided on the short side of the case 42.

  In the present embodiment, a metal case is used, but a case of plastic or the like may be used. In addition, an acrylic plate is used for an opening for extracting light from the light emitting element. As shown in FIG. 9, this portion is a diffusion plate for making the light spot of the light emitting element a uniform planar light source. 49a may be attached, or a lens 49b for correcting to an arbitrary orientation characteristic may be used.

[Example 1]
A light emitting device module according to the present invention shown in FIG. 4 was produced.
On the upper surface of a very low carbon steel plate having a width of 30 mm, a length of 120 mm, and a thickness of 1.6 mm, mortar-shaped reflection cup portions were arranged in a grid of 11 × 3 rows (total of 33 pieces) at intervals of 7.5 mm.
On one short side of the steel plate, a terminal part having a width of 25 mm was produced with a length of 10 mm. Moreover, the notch was provided in the long side of the steel plate. This notch was provided at a position 25 mm from the terminal portion, and had a length of 3 mm and a cut depth of 5 mm.

  A reflective cup part, terminal part and notch are formed on a steel sheet to form a core metal, and an enamel material mainly composed of glass is electrodeposited on the surface of the core metal, and then subjected to enamel treatment to form an enamel layer by baking. It was. In this enamel treatment, the enamel layer was controlled so that the thickness of the enamel layer was in the range of 50 to 200 μm.

  Next, a silver paste was printed on the upper surface side, and then baked, whereby a circuit pattern capable of driving the light emitting element was manufactured, and a light emitting element mounting substrate was obtained. At this time, six 2.3 mm wide patterns were provided at a pitch of 4 mm on the terminal portion to form card edge terminal portions.

  Next, the light emitting element was mounted on the bottom surface of the reflecting cup portion by a method such as die bonding or wire bonding, and electrically connected to the light emitting element mounting substrate.

  The light-emitting element module thus manufactured was attached to a lighting device having a card edge socket as shown in FIG. The card edge terminal portion was inserted into the socket, and the light emitting element module was fixed by hooking the hook so as to sandwich the notch in the outer edge portion of the substrate from the left and right. After that, it was possible to operate normally by supplying power through the socket.

  In this embodiment, the thickness of the substrate is set to 1.6 mm in order to match the general specifications of the card edge socket. In addition, since sockets for thicknesses of 1.27 mm and 1 mm exist as popular standards, they may be adjusted to these thicknesses. If the substrate thickness is out of this range, the card edge socket cannot be supported. However, even if it is difficult to set the thickness of the entire substrate to the above thickness, as shown in FIG. 6, only the card edge terminal portion may be pressed or cut to match the thickness.

[Example 2]
A light emitting device module according to the present invention shown in FIG. 7 was produced.
11 mortar-shaped reflective cups at 4.8 mm intervals on the long side and short side of an ultra-low carbon steel plate having a width of 30 mm, a length of 92 mm, and a thickness of 4 mm on the long side and 11 on the short side Five were produced in a straight line. Further, a terminal portion having a width of 25 mm was produced on one short side of the steel plate with a length of 10 mm. This terminal portion was pressed or cut so as to have a thickness of 1.6 mm. A notch was provided on the long side of the steel plate. This notch was provided at a position 25 mm from the terminal portion, and had a length of 3 mm and a cutting depth of 5 mm. The steel plate (core metal) thus obtained was subjected to enamel treatment in the same manner as in Example 1.

  Next, a silver paste was printed on the upper surface side, and then baked, whereby a circuit pattern capable of driving the light emitting element was manufactured, and a light emitting element mounting substrate was obtained. At this time, six 2.3 mm wide patterns were provided at a pitch of 4 mm on the terminal portion to form card edge terminal portions.

Next, the light emitting element was mounted on the bottom surface of the reflecting cup portion by a method such as die bonding or wire bonding, and electrically connected to the light emitting element mounting substrate.
The obtained light emitting element module was able to operate the light emitting element by supplying power through the card edge socket in the same manner as in Example 1.

  In the first embodiment, the light is irradiated only in the normal direction having the card edge. However, in the present embodiment, the direction parallel to the insertion direction of the card edge or the direction parallel to the card edge surface is used. It became possible to irradiate light.

[Example 3]
A light emitting device module according to the present invention shown in FIG. 8 was produced.
On the upper surface of a very low carbon steel plate having a width of 40 mm, a length of 95 mm, and a thickness of 1.6 mm, mortar-shaped reflection cup portions were arranged in a grid of 11 × 3 rows (total of 33 pieces) at intervals of 7.5 mm. Further, a terminal portion having a width of 90 mm was produced on one long side of the steel plate with a length of 10 mm. Moreover, the notch was provided in the short side of the steel plate. This notch was provided at a position 25 mm from the terminal portion, and had a length of 3 mm and a cutting depth of 5 mm. The core metal was subjected to enamel treatment in the same manner as in Example 1, and a circuit pattern was further formed to produce a light emitting element mounting substrate. At this time, 20 pieces of 2.3 mm wide patterns were provided at a pitch of 4 mm on the terminal portion to form a card edge terminal portion.

  Next, the light emitting element was mounted on the bottom surface of the reflection cup portion by a method such as die bonding or wire bonding, and electrically connected to the light emitting element mounting substrate to produce a light emitting element module.

The light-emitting element module thus obtained was mounted in a metal case having a length of 106 mm, a width of 36 mm, and a thickness of 11 mm. In this case, in order to position and fix the light emitting element module substrate in the case, a rust-shaped fixing rib was provided by press fitting so as not to bite into a notch provided in the outer edge portion of the substrate. An opening of 87 mm × 24 mm was provided so that the light spot of the light emitting element module could be seen from the outside, and an acrylic plate was fitted into the opening.
The light-emitting element module containing the case thus obtained was connected to a card edge socket, and power was supplied through the socket, whereby the light-emitting element could be operated.

  In this embodiment, since the light emitting element module is housed in the metal case, the light emitting element can be prevented from being damaged due to dust contamination or foreign object collision. Also, when mounting the device, it is possible to work without paying attention to contact with the light emitting element mounting portion or the surface of the substrate, which makes handling easier. Even after mounting on the device, the pattern part on the substrate surface is protected by the case, so that accidents such as short-circuit due to foreign matter are less likely to occur, and it can be used more safely.

  In each of the above-described embodiments, a module fixing structure is provided in which a hook-shaped attachment member is hooked to a notch on the outer edge of the substrate. However, when there is no structure for fixing the module, the light emitting element from the card edge connector portion by its own weight. There is a risk that the module will fall off. In particular, when a long light emitting element module is used, or when it is mounted on a lighting device whose socket faces downward as shown in FIG. FIG. 10 is a diagram illustrating a lighting device 52 that does not have a fixed structure. In the drawing, reference numeral 50 denotes a light emitting element module not provided with a notch, 51 denotes a card edge terminal portion thereof, 52 denotes a lighting device, and 53 denotes a lighting device. It is a card edge socket provided downward. Even if the light emitting element module 50 is attached to the socket 53 of the lighting device 52 that does not have such a fixing structure, the light emitting element module 50 is likely to fall out of the card edge connector due to its own weight. In order to increase the degree of freedom in designing an illuminating device to which the present invention can be applied, it is desirable to have a module fixing structure in which a notch and a fixing hook (attachment member) are combined. This also applies to the light emitting element module housed in the case.

  Further, in terms of manufacturing a light emitting element mounting substrate having high heat dissipation, which is one of the features of the present invention, a method using a ceramic substrate or an Al laminated substrate has been proposed. In the case of a ceramic substrate proposed in (Japanese Patent Laid-Open No. 2003-243718) and the like, when trying to have the structure of the card edge portion, there is a risk that the brittleness is high and cracking may occur during insertion and removal. Not appropriate. In addition, in the case of a laminated substrate in which an insulating layer is coated on aluminum proposed in Patent Document 2 (Japanese Patent Laid-Open No. 2003-68945) and the like, it is caused by peeling of the coated resin layer due to rubbing when a card edge is inserted. Since there is a risk of short-circuiting and it is difficult to have a structure for mounting on the side surface as shown in Example 2, a hollow substrate is optimal as the light-emitting element mounting substrate of the present invention. It is.

The conventional LED module is illustrated, (a) is a top view of an LED module, (b) is the front view. It is a figure which illustrates the LED module using the board | substrate which has a reflective cup part, (a) is a top view of a reflective cup part, (b) is sectional drawing. It is a top view which shows the electric power feeding system to the LED module using the conventional electric wire. 1A and 1B show a first embodiment of the present invention, in which FIG. 1A is a plan view of a light-emitting element module, and FIG. The illuminating device which is an example of the light source device which concerns on this invention is shown, (a) is a top view of an illuminating device, (b) is the front view. It is a figure which shows the modification of the light emitting element module shown in FIG. 4, (a) is a top view of a light emitting element module, (b) is the front view. The 2nd Embodiment of this invention is shown, (a) is a top view of a light emitting element module, (b) is the front view. FIG. 3 shows a third embodiment of the present invention, in which (a) is a plan view of the light emitting element module, (b) is a front view thereof, and (c) is a right side sectional view. It is right side sectional drawing which shows the modification of the light emitting element module shown in FIG. It is a front view which illustrates the illuminating device which does not have a fixed structure.

Explanation of symbols

20, 30, 41, 50 ... Light emitting element module, 21, 31 ... Light emitting element mounting substrate, 22, 32, 45 ... Reflecting cup part, 23, 33, 44 ... Notch, 24, 29, 34, 43, 51 ... Card edge terminal portion, 25, 52 .. Illuminating device, 26, 42... Case, 27 .. Fixing hook, 28, 53 .. Card edge socket, 48 .. Acrylic plate, 49a.

Claims (15)

A light emitting element mounting substrate provided with a circuit electrically connected to a power source for driving a light emitting element on a light emitting element mounting surface of an insulating substrate,
A light-emitting element mounting substrate having a card edge terminal portion that functions as a terminal for power supply from a power source and / or an input / output terminal for an electric signal.   The light-emitting element mounting substrate according to claim 1, wherein the insulating substrate is a hollow substrate in which a hollow metal layer is coated on a surface of a core metal.   The board | substrate for light emitting element mounting of Claim 1 or 2 whose thickness of the said card edge terminal part is the range of 1 mm-1.6 mm.   2. A drop prevention structure portion that engages with an attachment member provided on the card edge socket side when the card edge terminal portion is attached to a card edge socket on the apparatus main body side. The board | substrate for light emitting element mounting in any one of 1-3.   The light-emitting element mounting substrate according to claim 4, wherein the drop-off preventing structure is at least one notch provided on an outer edge of the substrate.   The light emitting element mounting substrate according to claim 1, wherein a reflection cup portion for mounting a light emitting element is provided on the light emitting element mounting surface.   The light emitting element module formed by mounting a light emitting element on the light emitting element mounting substrate in any one of Claims 1-6.   The light emitting element module formed by fixing the light emitting element module main body formed by mounting a light emitting element on the light emitting element mounting substrate in any one of Claims 1-6 to a case with an opening.   The light emitting device module according to claim 8, wherein a diffusion plate is attached to the opening of the case.   The light emitting element module according to claim 8, wherein a condensing lens is attached to the opening of the case.   11. A light source device comprising: the light emitting element module according to claim 7; and a case having a card edge socket to which a card edge terminal portion of the light emitting element module can be attached.   The module storage case is provided with an attachment member that engages with the light emitting element mounting substrate to prevent the card edge terminal portion from being pulled out when the card edge terminal portion is attached to the card edge socket on the apparatus main body side. The light source device according to claim 11.   The illuminating device which has a light source device of Claim 11 or 12.   A display device comprising the light source device according to claim 11. A traffic signal having the light source device according to claim 11.

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