JP4369409B2 - Light source device - Google Patents

Description

The present invention uses two types of lead frames, a mounting lead frame for mounting a semiconductor light emitting element chip by insert molding or the like, and an electric lead frame for electrically connecting the semiconductor light emitting element chip. The lead frame for mounting and the lead frame for mounting are located at different surface positions, and the light from the semiconductor light emitting element chip and the opening exposing the opposite side of mounting the semiconductor light emitting element chip on the mounting lead frame An exit opening that exits to the outside, and the exit opening and the opening are connected to each other via a mounting lead frame, and a material having a high thermal conductivity is inserted into the opening or Filled with resin mixed with (good) material with high thermal conductivity and mounted the semiconductor light emitting device chip with Joule heat from the semiconductor light emitting device chip And mounting can be released to the lead frame, it relates to a light source device capable of obtaining high luminance emitted light to be able to flow more current.

As a conventional light source device, for example, a lead frame is insert-molded, and a plurality of semiconductor light-emitting element chips are placed in parallel in a linear shape and integrated with one or a plurality of light-emitting portions (openings). Things are known.
JP-A-11-004022

  As the above-described conventional light source device, the one formed by integral molding cannot release Joule heat from the semiconductor light emitting element chip, and heat is trapped in the light source device. For example, white light is emitted by a fluorescent material. In some cases, the phosphor may be deteriorated by heat.

(Object of invention)
The present invention has been made to solve the above-described problems. As two types of lead frames, a dedicated mounting lead frame on which a semiconductor light emitting element chip is mounted and a semiconductor light emitting element chip are electrically connected. Two dedicated lead frames, each with a dedicated electrical lead frame connected to the lead frame, are exposed to the outside of the light source device main body, and the mounting lead frame on which the semiconductor light emitting element chip is placed is radiated. Electrical lead frames that are used for terminals and electrically connected with semiconductor light emitting element chips are used for electrode terminals so that these electrical lead frames and mounting lead frames have different surface positions. In addition, an opening exposing the opposite side of the mounting lead frame on which the semiconductor light emitting element chip is mounted, and light from the semiconductor light emitting element chip And an exit aperture for emitted to the outside, with are connected through the exit aperture and the opening and is mounting a lead frame, a high thermal conductivity material insert or a thermally conductive to the opening For mounting a semiconductor light-emitting element chip on a semiconductor light-emitting element chip filled with a resin mixed with a high-concentration substance, regardless of the electrical lead frame that electrically connects the semiconductor light-emitting element chip A light source device capable of obtaining high-intensity emitted light because a large amount of current can flow through the semiconductor light-emitting element chip by being emitted to the lead frame and further thermally conducted to a material or resin having high thermal conductivity. It is to provide.

In the light source device according to claim 1 of the present invention, the lead frame includes two types of lead frames: a mounting lead frame for mounting the semiconductor light emitting element chip and an electric lead frame for electrically connecting the semiconductor light emitting element chip. The lead frame is composed of a lead frame, and the electrical lead frame and the mounting lead frame have different surface positions, and an electrode terminal from the electrical lead frame and a heat dissipation terminal from the mounting lead frame are provided outside the light source device body. And the electrode terminals are provided in the same direction or in the opposite direction .

In the light source device according to claim 1, the lead frame includes two types of lead frames including a mounting lead frame for mounting the semiconductor light emitting element chip and an electric lead frame for electrically connecting the semiconductor light emitting element chip. The electrical lead frame and the mounting lead frame have different surface positions, and an electrode terminal from the electrical lead frame and a heat dissipation terminal from the mounting lead frame are provided outside the light source device body, Since the electrode terminals are provided in the same direction or in the opposite direction, Joule heat from the semiconductor light emitting element chip is placed on the semiconductor light emitting element chip regardless of the electrical lead frame that electrically connects the semiconductor light emitting element chip. Can be released to the lead frame.
Further, by using both surfaces of the substrate or the like to which the light source device is attached, for example, the electrode terminal can be connected to the substrate surface so as to sandwich the substrate or the like, and the heat dissipation terminal can be connected to the back surface of the substrate. When the electrode terminals are provided in the same direction, the electric wiring can be concentrated in one direction, and the other can be used as heat dissipation terminals. Further, when the electrode terminals are provided in the opposing direction, it is possible to reduce the polarity of the electrode terminals.
Furthermore, since Joule heat from the semiconductor light emitting element chip is not transmitted to the electrode terminals, an increase in electrical resistance due to heat can be suppressed and electrical considerations for the heat radiating terminals do not have to be made (for example, all are on the ground side). Is possible).

The light source device according to claim 2 has an emission opening for emitting light from the semiconductor light emitting element chip to the outside and an opening for exposing the mounting lead frame on the opposite side on which the semiconductor light emitting element chip is placed. The emission opening and the opening are connected via the mounting lead frame, and the opening is inserted or filled with a heat conductive material.

The light source device according to claim 2 has an emission opening for emitting light from the semiconductor light emitting element chip to the outside and an opening for exposing the mounting lead frame on the opposite side on which the semiconductor light emitting element chip is placed, Since the exit opening and the opening are connected via the mounting lead frame and the conductive material is inserted or filled in the opening, the electrical lead frame and the mounting lead frame are located at different plane positions. The electrical wiring of the semiconductor light emitting element chip can be made possible.
Further, a substrate is provided with a heat sink having a shape that allows Joule heat from the semiconductor light emitting element chip to be released from the exposed mounting lead frame, and further, for example, copper, aluminum, or an alloy thereof having good thermal conductivity can be fitted into the opening. This fitting part is inserted into the opening of the light source device, or the opening is filled with a mixture of fine particles such as metal or diamond with good thermal conductivity in resin with high thermal conductivity (good) In addition, Joule heat can be conducted to these substances and released to the outside.

The light source device according to claim 3 is characterized in that the semiconductor light emitting element chip emits red light, blue light, and green light, or emits red light, blue light, green light, or white light.

In the light source device according to claim 3 , since the semiconductor light emitting element chip emits red light, blue light, green light, or red light, blue light, green light, or white light, the light emission device has various light emission colors. Further, it is possible to emit white light emitted by red light emission, blue light emission, green light emission, or single white light emission (pseudo white color by a fluorescent material or a wavelength conversion material).

As described above, in the light source device according to claim 1, the lead frame includes two mounting lead frames on which the semiconductor light emitting element chip is mounted and two electrical lead frames that electrically connect the semiconductor light emitting element chip. The lead frame of the electrical system and the mounting lead frame have different surface positions, and the heat radiation from the electrode terminal from the electrical system lead frame and the mounting lead frame is outside the light source device body. And the electrode terminals are provided in the same direction or in the opposite direction, so that the Joule heat from the semiconductor light emitting element chip is mounted on the semiconductor light emitting element chip regardless of the electrical lead frame for electrically connecting the semiconductor light emitting element chip. It can discharge | release to the mounted lead frame.

  Therefore, deterioration of the semiconductor light emitting element chip can be prevented. Further, for example, a white light emitting semiconductor light emitting element is mixed with a yellow light emitting color by a yellow light emitting fluorescent material that is excited by the blue light emitting semiconductor light emitting element and emits a different wavelength, and a blue light emitting color of the semiconductor light emitting element is mixed. The emitted light can prevent deterioration of the fluorescent material due to heat and can emit light with a stable wavelength. Furthermore, since a larger amount of current can be passed, high-luminance outgoing light can be obtained.

Furthermore, since the electrode terminal from the electric lead frame and the heat radiating terminal from the mounting lead frame are provided on the lead frame outside the light source device main body, Joule heat from the semiconductor light emitting element is not transmitted to the electrode terminal. An increase in electrical resistance can be suppressed and electrical considerations for the heat radiating terminal can be avoided (for example, all can be on the ground side). Therefore, it is possible to flow a large amount of current through the electrode terminal, obtain high-luminance outgoing light, and mechanically handle the heat radiating terminal to mechanically fix the light source device itself.
Further, by using both surfaces of the substrate or the like to which the light source device is attached, for example, the electrode terminal can be connected to the substrate surface so as to sandwich the substrate or the like, and the heat dissipation terminal can be connected to the back surface of the substrate. Therefore, the connection between the electrode terminal and the heat dissipation terminal can be made without making a mistake, and the reliability is excellent. Further, it is possible to further enhance the heat dissipation effect from the heat radiating terminal by avoiding adverse effects due to heat on the electric (electronic) circuit, and further to mechanically handle the heat radiating terminal and mechanically fix the light source device itself.
When the electrode terminals are provided in the same direction, the electric wiring can be concentrated in one direction, and the other can be used as heat dissipation terminals. Further, when the electrode terminals are provided in the opposing direction, it is possible to reduce the polarity of the electrode terminals. Therefore, it is excellent in productivity, workability, and reliability.

The light source device according to claim 2 has an emission opening for emitting light from the semiconductor light emitting element chip to the outside and an opening for exposing the mounting lead frame on the opposite side on which the semiconductor light emitting element chip is placed. In addition, since the output opening and the opening are connected via the mounting lead frame, and the thermal conductive material is inserted or filled in the opening, the electrical lead frame and the mounting at different surface positions are used. Electrical wiring of the semiconductor light emitting element chip to the lead frame can be made possible. Therefore, it is excellent in stable electrical supply, safety and workability.
Further, a substrate is provided with a heat sink having a shape that allows Joule heat from the semiconductor light emitting element chip to be released from the exposed mounting lead frame, and further, for example, copper, aluminum, or an alloy thereof having good thermal conductivity can be fitted into the opening. This fitting part is inserted into the opening of the light source device, or the opening is filled with a mixture of fine particles such as metal or diamond with good thermal conductivity in resin with high thermal conductivity (good) In addition, Joule heat can be conducted to these substances and released to the outside.

  Therefore, deterioration of the semiconductor light emitting element chip can be prevented. Further, for example, a white light emitting semiconductor light emitting element is mixed with a yellow light emitting color by a yellow light emitting fluorescent material that is excited by the blue light emitting semiconductor light emitting element and emits a different wavelength, and a blue light emitting color of the semiconductor light emitting element is mixed. The emitted light can prevent deterioration of the fluorescent material due to heat and can emit light with a stable wavelength. Furthermore, since a larger amount of current can be passed, high-luminance outgoing light can be obtained. Further, by using a shape that can be fitted to the opening, positioning and mounting of the light source device can be facilitated, and workability, productivity, reliability, and economic efficiency can be improved.

In the light source device according to claim 3 , since the semiconductor light emitting element chip emits red light, blue light, green light or red light, blue light, green light, or white light, Light emission color, red light emission, blue light emission, white light by green light emission, or white light emission by itself (pseudo white color by a fluorescent material or a wavelength conversion material) can be emitted. Therefore, it can respond to the light source of various apparatuses.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.
The present invention is a light source device that insert molds a lead frame, and the lead frame has a dedicated mounting lead frame for mounting the semiconductor light emitting element chip and a dedicated electric power supply for supplying power to the semiconductor light emitting element chip. The lead frame is composed of two types of lead frames, the electrical lead frame and the mounting lead frame, and the electrode terminals extending from the electrical lead frame are provided in the same direction or in the opposite direction. In addition, an emission opening for emitting light from the semiconductor light-emitting element chip to the outside is provided, and in order to radiate Joule heat from the semiconductor light-emitting element chip to the outside, the mounting side of the mounting lead frame is not insert-molded. an opening provided in, together When with these exit aperture and the opening are connected via a mounting lead frame In this opening, a highly heat conductive (good) material is inserted or filled with resin, and the Joule heat from the semiconductor light emitting device chip is generated by the semiconductor regardless of the electrical lead frame that electrically connects the semiconductor light emitting device chip. By emitting light to the mounting lead frame on which the light emitting element chip is mounted, a large amount of current can flow through the semiconductor light emitting element chip to obtain high-luminance emitted light, and the positioning and mounting of the light source device is easy. It is an object of the present invention to provide a light source device capable of improving workability, productivity, reliability and economy.

1 to 6 are schematic perspective views of a light source device according to the present invention, FIGS. 7 to 9 are schematic plan and side sectional views of the light source device according to the present invention, and FIG. 10 is a diagram of one of the light source devices according to the present invention. It is a partial side sectional view.

  As shown in FIG. 1, the light source device 1 (1A) includes dedicated mounting lead frames 3a and 3b for mounting a semiconductor light emitting element chip 5 as a light source among a plurality of lead frames, and the semiconductor light emitting device. A package as a light source device main body including insert-type lead frames 3a and 3b, electric lead frames 4a and 4b, etc., including dedicated electric lead frames 4a and 4b for supplying power to the element chip 5. 2 is formed by resin formation.

Further, the light source device 1 (1A) is injected to be of a transfer mold type, comprising a rie de frame pattern of phosphor bronze material or the like to form a pattern on a resin by insert molding or the like mounting a lead frame 3a, 3b, electrical lead frames 4a, 4b, and the like are inserted, and a package 2 as a light source device main body is formed on the lead frames 3, 4 by resin.

  However, in the space where there is nothing in the exit opening 6 such as the portion where the semiconductor light emitting element chip 5 is placed, the bonding wire 9 or the portion to be bonded, the placement lead frames 3a and 3b, and the electrical lead frames 4a and 4b. is there. The exit opening 6 is filled with a transparent resin such as a transparent epoxy resin or silicone resin.

  The mounting lead frames 3a and 3b, the electrical lead frames 4a and 4b, etc. are made of a material having good electrical conductivity such as phosphor bronze material or aluminum and having toughness and plasticity, and the portion not forming the package 2 Adjust to dimensions that are easy to bend.

  The mounting lead frames 3a, 3b, electrical lead frames 4a, 4b, etc. are treated with gold plating, silver plating, etc. after plating with a precious metal such as gold plating or silver plating, and in particular, with exposed portions and semiconductor light emission. The mounting lead frames 3a and 3b and the bonding wires 9 are connected to the semiconductor light emitting element chip 5 when the element chip 5 is placed, the bonding wire 9 is bonded, and the like. When wire-bonding to the electrical lead frames 4a and 4b, the surface of the electrical lead frames 4a and 4b is prevented from being oxidized, thereby preventing peeling and reducing the electrical resistance and reducing the overall conductivity and the electrode terminals. Reduce contact resistance.

  The portions extending from the mounting lead frames 3a and 3b and exposed to the outside of the package 2 are heat radiation terminals 3a and 3b, and the portions extending from the electrical lead frames 4a and 4b and exposed to the outside of the package 2 are electrode terminals 4a and 3b. As for 4b, the heat radiation terminals 3a and 3b and the electrode terminals 4a and 4b exposed to the outside of the package 2 are subjected to solder plating after silver plating or the like so that the soldering is better by wiring or the like.

  Moreover, as shown in FIG.6 (d), the electrode terminal 4a and the electrode terminal 4b are provided in an opposing direction, and similarly the thermal radiation terminal 3a and the thermal radiation terminal 3b are provided in an opposing direction.

Furthermore, as shown in FIG. 9 , the electrode terminal 4a, electrode terminal 4c, electrode terminal 4e and electrode terminal 4b, electrode terminal 4d, and electrode terminal 4f having the same electric polarity are provided in the same direction, and these electrode terminals 4a and 4c are provided. , 4e and the electrode terminals 4b, 4d, 4f are provided with a heat radiating terminal 3a and a heat radiating terminal 3b in a direction intersecting (substantially at right angles).

In the example of FIG. 8 , the mounting lead frame 3 a and the electrical lead frames 4 a and 4 b are electrically completely separated (electrically insulated), and the electrode terminals 4 a and electrode terminals are respectively connected to the polarities of the semiconductor light emitting element chip 5. Although not shown here, it is possible to mount two semiconductor light emitting element chips 5 by using the mounting lead frame 3a on the common ground side (ground side) .

Further , the mounting lead frames 3a and 3b, the electrical lead frames 4a and 4b, and the like are provided on the same surface, but the central portion of the mounting lead frames 3a and 3b on which the semiconductor light emitting element chip 5 is mounted. Make concave.

The electrode terminals 4a, the method of providing the 4b, provided terminal 4a and the electrode terminals 4b conductive in opposite directions, the heat radiating terminal 3a, the direction of providing the 3b, a direction which intersects between the terminal 4a, 4b collector ( The radiation terminals 3a and 3b are provided at substantially right angles.

Thus, when the mounting lead frames 3a, 3b and the electrical lead frames 4a, 4b, etc. of the power supply device 1 etc. are provided in the same direction, the electric wiring can be concentrated in one direction, and the other is All can be heat dissipation terminals. Therefore, it is possible to concentrate the heat dissipation direction and mechanically attach it. Further, when the electrode terminals are provided in the opposing direction, it is possible to reduce the polarity of the electrode terminals. Therefore, it is excellent in productivity, workability, and reliability.

  In the light source device 1 (1B) in FIG. 2 and the light source device 1 (1C) in FIG. 3, the mounting lead frames 3a and 3b and the electrical lead frames 4a and 4b are provided at different surface positions.

Furthermore, as shown in FIG. 8 (b), provided with an electrode terminal 4a and the electrode terminals 4c and the electrode terminals 4b and the electrode terminals 4d in the same direction, similarly to heat-sink terminal 3a and the radiating terminal 3b provided in the same direction. Incidentally, it is shown in FIG. 8 the light source apparatus 1 corresponding to the pattern as shown in (b) a (1C) in FIG.

Further, as shown in FIG. 7 (d), FIG. 8 (a) and FIG. 9 , the electrode terminal 4a, the electrode terminal 4d, the electrode terminal 4c, and the electrode terminal 4b having the same electric polarity are provided in the same direction. , 4b, 4c, 4d are provided with a heat radiating terminal 3a and a heat radiating terminal 3b in a direction (substantially perpendicular) to each other. A light source device 1 (1B) corresponding to these patterns is shown in FIG.

Further, since the mounting lead frames 3a and 3b and the electrical lead frames 4a and 4b are provided at different surface positions, the mounting lead frame 3a and the electrical lead frames 4a and 4b are electrically completely connected. separated (electrical insulation), and although is provided a semiconductor light emitting element of each polarity to the electrode terminal 4a and the electrode terminals 4b of the chip 5 and the like, as shown in FIG. 8 (a), the common one of an electrical system lead frame 4a It is also possible to mount three semiconductor light emitting element chips 5 on the ground side (earth side).

  As described above, when the mounting lead frames 3a and 3b and the electrical lead frames 4a and 4b are provided at different surface positions, the light source device 1 (1B) and the light source device 1 (1D) are not shown. Using both surfaces of the substrate, for example, the electrode terminals 4a and 4b can be connected to the front surface of the substrate so as to sandwich the substrate and the heat radiation terminals 3a and 3b can be connected to the back surface of the substrate.

  Therefore, the connection between the electrode terminal and the heat dissipation terminal can be made without making a mistake, and the reliability is excellent. Further, it is possible to further prevent the adverse effect due to heat on the electric (electronic) circuit, and to further enhance the heat radiation effect from the heat radiation terminal, and to mechanically handle the heat radiation terminal and to mechanically fix the light source device itself. In particular, the fixing holes 8 provided in the heat radiating terminals can be more reliably mechanically fixed.

  Further, the same effect as that obtained when the mounting lead frames 3a and 3b, the electrical lead frames 4a and 4b, etc. of the power supply device 1 and the like are provided on the same surface can be obtained.

  As described above, the lead frames 3a and 3b for mounting the semiconductor light emitting element chip 5 and the electric lead frames 4a and 4b for electrically connecting the semiconductor light emitting element chip 5 are used. Become. For this reason, even if a large amount of current is passed through the semiconductor light emitting element chip 5, it is possible to prevent the semiconductor light emitting element chip 5 from being deteriorated due to the heat radiation effect by the mounting lead frames 3a and 3b. Further, for example, a blue light emitting semiconductor light emitting element chip 5 and a yellow light emitting color by a yellow light emitting fluorescent material that is excited by the blue light emitting semiconductor light emitting element chip 5 to emit different wavelengths and a blue light emitting of the semiconductor light emitting element chip 5 are emitted. In the case of emitting white light by mixing with color, it is possible to prevent deterioration of the fluorescent material due to heat and to emit light with a stable wavelength. Furthermore, since a larger amount of current can be passed through the semiconductor light emitting element chip 5, high-luminance outgoing light can be obtained.

Further , as shown in FIGS. 7B and 7C, the mounting lead frames 3a and 3b are mounted on the opposite side on which the semiconductor light emitting element chip 5 is mounted when insert molding or the like is performed. Openings 7 and 7b that expose the positions of 3a and 3b are provided (on the back surface side opposite to the light emitting device 1 or the like where the light exit surface side is the front surface side).

  Here, the opening 7 has a rectangular shape, and particularly a part of the electrical lead frames 4a, 4b and the like centering on the position where the semiconductor light emitting element chip 5 of the mounting lead frames 3a, 3b is mounted. Exposed.

  Further, the opening 7 here does not have to be rectangular, and it is sufficient that the mounting lead frames 3a, 3b and the like are exposed.

Further, FIG. 7 (b) placing the lead frame 3a, 3b and the electrical system lead frame 4a, (crossing substantially at right angles with a distance in the thickness direction) and 4b or the like having different surface position light source device provided 1 (1C) shows a schematic side sectional view of such, it has to FIG. 7 (c) light source device 1 (1B) opening 7 and the opening 7b on the back side of such shows these schematic plan sectional view.

  Here, the opening 7 has a circular shape, and is exposed especially at the position where the semiconductor light emitting element chip 5 of the mounting lead frames 3a and 3b is mounted.

  Further, the opening 7b has a circular shape like the opening 7, and a part of the electrical lead frames 4a, 4b and the like are exposed.

  Further, the opening 7 here does not have to be circular, and it is sufficient that the mounting lead frames 3a, 3b and the like are exposed.

Further, these openings 7 and opening 7b, the openings 7 and opening 7b like a fitting can be of copper or aluminum or alloys thereof a heat sink 6bs like, such as shown in FIG. 10 thermal conductivity such as the shape The material created in step 1 is fitted with the opening 7 or the like.

At this time, or bonded with good thermal conductivity silicone resin, an electron (machine) substrate or the like from the beginning the opening 7 and 7b source device coating with good heat conductive silicone grease or the like to heat sink 6 bs shape of the Insert and fit into the opening 7 of the first grade.

  Further, the opening 7 or the opening 7b is filled with a mixture of fine particles such as metal or diamond having good thermal conductivity and a resin such as silicone having good thermal conductivity.

  Thus, by inserting these mating substances and filling materials into the openings 7 and 7b, etc., Joule heat generated from the semiconductor light emitting element chip 5 is conducted to these mating substances and filling substances and released to the outside. Can do.

  Therefore, by using a shape that can prevent deterioration of the semiconductor light emitting element chip 5, obtain stable light emission, flow current to the maximum and obtain high-luminance outgoing light, and fit with the opening 7 or the like. Positioning and mounting can be facilitated, and workability, productivity, reliability, and economy can be improved.

  Furthermore, it is possible to prevent deterioration of the fluorescent material used for pseudo white light emission by the fluorescent material, and to emit light having a long life or a stable wavelength.

  The package 2 is made of an insulating resin material such as a modified polyamide, polybutylene terephthalate, nylon 46 or an aromatic polyester, etc., titanium oxide or the like in order to improve light reflectivity and obtain light shielding properties. The one mixed with white powder is heated and injection molded.

Further , as shown in FIG. 7B , the package 2 has an emission opening 6 for emitting the emitted light emitted from the semiconductor light emitting element chip 5 to the outside, and is mounted on the mounting lead frames 3a, 3b and the like. The placed semiconductor light emitting element chip 5 is positioned substantially at the center, and a part of the electrical lead frames 4a, 4b and the like are also exposed to the emission opening 6.

  Further, the package 2 is connected by an inclined portion 6 b from the portion where the semiconductor light emitting element chip 5 is placed to the emission opening 6.

As shown in FIG. 7, the inclined portion 6b includes four sides of the emission opening 6, and the space between the four inclined portions 6b and the mounting lead frames 3a and 3b is colorless and transparent epoxy resin or silicone. Filled with a transparent resin such as a resin, the semiconductor light emitting element chip 5 is more strongly fixed, and the light emitted from the semiconductor light emitting element chip 5 is emitted from the emission opening 6 without being attenuated without being exposed to the air layer. To do.

  Further, the inclined portion 6b transmits light other than the straight light from the semiconductor light emitting element chip 5 out of the light emitted from the semiconductor light emitting element chip 5 (particularly including the emitted light from the four side surfaces of the semiconductor light emitting element chip 5). The light is reflected by 6b and is emitted from the emission opening 6.

  Further, the surface of the inclined portion 6b does not have to be completely mirror-finished, and it is possible to obtain a broad reflected light by processing fine unevenness and to strengthen the bonding (bonding) with the transparent resin to be filled. Can do.

  The light source device 1 or the like is filled with a transparent resin such as a transparent epoxy resin or a silicone resin having a color adjusted to the same color as the light emitted from the semiconductor light emitting element chip 5 when the color of the emitted light is monochromatic light emission or the like. Thus, a clearer emission color is emitted.

  Further, a resin in which a wavelength conversion material made of an inorganic fluorescent pigment, an organic fluorescent dye, or the like is mixed into a colorless and transparent resin is filled and excited by the emission color of the semiconductor light emitting element chip 5 itself and the semiconductor light emitting element chip 5. Then, light that is a mixture of the light emitting semiconductor light emitting element chip 5 and light of a different wavelength may be emitted.

  The semiconductor light-emitting element chip 5 may be any LED, laser, or the like, and in particular, a red light emission (R), a blue light emission (B), or a semiconductor chip of a compound such as a quaternary compound or a compound of InGaAlP, InGaAlN, or InGaN. It is a high-luminance light emitting element such as green light emission (G). In the case of white light, the mounting lead frames 3a and 3b use these three primary colors of red light emission (R), blue light emission (B), and green light emission (G). It is possible to emit various emission colors by combining RGB from single color emission light.

As described above, the light source device of the present invention is a light source device formed by insert molding or the like, and is a dedicated mounting lead frame for mounting a semiconductor light emitting element chip and a dedicated power source for supplying power to the semiconductor light emitting element chip. and the electrical system lead frame so as to completely separate the two lead frame and mounting the lead frame has a different surface position of the electric system lead frame.

  In order to release Joule heat generated from the semiconductor light emitting element chip only to the mounting lead frame, an opening is provided on the opposite side of the mounting lead frame without insert molding.

Further, an emission opening for emitting light from the semiconductor light emitting element chip to the outside is provided. The emission opening and the opening are connected via the mounting lead frame, and a high thermal conductivity (good) substance is inserted into the opening or a high thermal conductivity (good) substance is inserted. For the placement of semiconductor light-emitting element chips, filled with mixed resin, completely separated regardless of the electrical lead frame that electrically connects the semiconductor light-emitting element chips, and the Joule heat from the semiconductor light-emitting element chips is placed Both ends of the mounting lead frame that are released to the lead frame and conducted Joule heat from the semiconductor light emitting element chip are provided as heat radiation terminals outside the package of the light source device body, so that the Joule heat from the semiconductor light emitting element chip is exposed to the outside. Stable light emission of semiconductor light-emitting element chips for radiation, prevention of deterioration, longer life, and more current to flow to semiconductor light-emitting element chips Can. For this reason, high-luminance outgoing light can be obtained, and furthermore, the connection between the electrode terminal and the heat radiating terminal can be made without making a mistake, and the heat radiating terminal can be handled mechanically to fix the light source device itself mechanically. can do. As a result, the light source device can be easily positioned and attached, and can improve workability, productivity, reliability, and economic efficiency.

It is suitable for light sources for backlights of small mobile products to light sources for backlights of large liquid crystal display devices. In particular, since it is a semiconductor light emitting device, it has a wide operating temperature range and can sufficiently cope with the use environment such as a car navigation system.
Further, a full color display can be provided by arranging a large number of light source devices of the present invention in a matrix.

1 is a schematic perspective view of a light source device according to the present invention. 1 is a schematic perspective view of a light source device according to the present invention. 1 is a schematic perspective view of a light source device according to the present invention. 1 is a schematic perspective view of a light source device according to the present invention. 1 is a schematic perspective view of a light source device according to the present invention. 1 is a schematic perspective view of a light source device according to the present invention. (A)-(d) It is a substantially plane sectional view and side surface sectional drawing of the light source device which concerns on this invention. (A) , (b) It is a substantially plane sectional view and side surface sectional view of the light source device concerning the present invention. It is the substantially plane sectional view and side sectional view of the light source device concerning the present invention. It is 1 partial side sectional drawing of the light source device which concerns on this invention.

Explanation of symbols

1 (1A to 1F) Light source device 2 Package 3a, 3b Mounting lead frame and heat dissipation terminal 4a, 4b Electrical lead frame and electrode terminal 5, 5a, 5b, 5c Semiconductor light emitting element chip 6 Output opening 6b Inclined portion 7 7b Opening 8 Mounting hole 9 Bonding wire
6 bs heat sink

Claims (3)

In the light source device in which the semiconductor light emitting element chip is disposed on the lead frame by insert molding or the like with a reflective resin in the lead frame,
The lead frame includes two types of lead frames including a mounting lead frame for mounting the semiconductor light emitting element chip and an electric lead frame for electrically connecting the semiconductor light emitting element chip, and the electric lead. The frame and the mounting lead frame have different surface positions, and an electrode terminal from the electrical lead frame and a heat dissipation terminal from the mounting lead frame are provided outside the light source device body, An electrode terminal is provided in the same direction or in the opposite direction. The light source device has an emission opening for emitting light from the semiconductor light emitting element chip to the outside and an opening for exposing the mounting lead frame on the opposite side on which the semiconductor light emitting element chip is placed, The light source device according to claim 1, wherein the emission opening and the opening are connected to each other through the mounting lead frame, and a thermally conductive material is inserted or filled into the opening. 2. The light source device according to claim 1, wherein the semiconductor light emitting element chip emits three types of red light emission, blue light emission, and green light emission, or any one of red light emission, blue light emission, green light emission, or white light emission.

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