JP2006351102A - Manufacturing apparatus of optical disk - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method and a manufacturing apparatus for manufacturing an optical disk of high quality having one or two signal layers and compatible with high density recording. <P>SOLUTION: The manufacturing apparatus of the optical disk is provided with an annular mask member comprising a light shielding material which does not substantially transmit curing light and has an inside diameter more than 90% of the outside diameter of a disk substrate and an outside diameter larger than the outside diameter of the disk substrate and a mask movement mechanism moving the mask member to a set position in the vicinity of the surface of the disk substrate placed on a second rotational treatment device and substantially preventing irradiation of an outer peripheral part exceeding 90% of a light transmission film spread on the disk substrate with the curing light when the disk substrate is irradiated with the curing light by a first irradiation device with the curing light. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an optical disk manufacturing apparatus, and more particularly to an optical disk manufacturing apparatus that enables high-density recording.

  In recent years, the development of DVD (Digital Versatile Disc) has been remarkable and is becoming widespread, and is being produced on a mass production scale. An example of a DVD manufacturing method that is currently widely used is that a stamper having a groove for forming an information signal is generally attached to an injection mold, and a disk substrate having a thickness of 0.6 mm is formed by injection molding. After a reflective film is formed on the surface where the groove exists, a finished product is obtained by laminating two disk substrates with a light-colored or transparent (hereinafter referred to as transparent) adhesive. As described above, various production line mechanisms have already been proposed for an apparatus for manufacturing a DVD by bonding two disk substrates (see, for example, Patent Document 1).

  On the other hand, a blue laser compatible disc is being developed as an information recording medium enabling next-generation high-density recording. In this blue laser compatible disc, information is recorded / reproduced from the opposite side of the disc by a laser beam having a short wavelength of 405 nm, so that a transparent light transmission with a film thickness of 100 μm (0.1 mm) is formed on the reflective film of the disc. It is necessary to form a film. Furthermore, in the case of a blue laser compatible disc having two signal layers, it is necessary to form another light transmission film having a signal layer, a semitransparent reflection film, and a transparent cover layer on the transparent light transmission film. The film thickness including the light transmission film and the cover layer must be approximately 100 μm. In addition, the uniformity of the thickness of the light transmission film and the cover layer has a great influence on the recording / reproduction of information, and therefore, a very high uniformity is required.

For this reason, a method and an apparatus for supplying a radiation-curable liquid material as close to the center of the disk substrate as possible and forming a highly uniform light transmission film by spin coating have already been disclosed (for example, patents). Reference 2 and Patent Reference 3). In addition, if air bubbles enter between the transparent light-transmitting film and the cover layer, the recording / reproduction of information is greatly affected. Therefore, in vacuum, the disk substrate having the first signal layer and the second signal layer are connected to each other. A method and apparatus for bonding a transfer disk substrate on which a light-transmitting film is formed have also been disclosed (for example, see Patent Document 4). Furthermore, a method and apparatus for transferring the signal layer by reliably and easily peeling the transfer disk substrate from the disk substrate has already been disclosed (see, for example, Patent Document 5).
JP 2002-245692 A Japanese Patent No. 3557863 JP 2004-220750 A Japanese Patent No. 3302630 JP 2002-197731 A

However, there is no disclosure of an economical manufacturing apparatus that can rationally form a light transmission film excellent in flatness, which is an optical disk compatible with high-density recording.
It is an object of the present invention to provide a manufacturing apparatus that can rationally manufacture a high-quality optical disc compatible with high-density recording having one or two signal layers.

  In order to solve the above-mentioned problems, a first invention provides a liquid material supply mechanism for supplying a liquid material to a disk substrate, and a light transmission film formed by spreading the liquid material supplied to the disk substrate by centrifugal force. A first rotation processing device to be formed; a second rotation processing device for rotating the disk substrate on which the light-transmitting film is formed; and the disk substrate mounted on the second rotation processing device. An optical disc manufacturing apparatus comprising a first curing light irradiation device for irradiating curing light and a second curing light irradiation device, wherein the disk substrate is made of a light shielding material that does not substantially transmit the curing light. When the first curing light irradiation device irradiates the curing light, an annular mask member having an inner diameter exceeding 90% of the outer diameter of the disk substrate and an outer diameter larger than the outer diameter of the disk substrate, The mask member By moving to a set position near the surface of the disk substrate, it is possible to prevent the curing light from being substantially irradiated to the outer peripheral portion over 90% of the light transmission film spread on the disk substrate. And a mask moving mechanism for moving from the set position to another position after the irradiation.

  In a second aspect based on the first aspect, the mask moving mechanism moves the mask member to a predetermined position near the surface of the disk substrate before the second rotation processing device performs rotation processing. An optical disc manufacturing apparatus is provided.

  According to a third invention, in the first invention or the second invention, the mask moving mechanism includes a mask support portion for supporting the mask member, a base portion fixed to a fixed structure, and the base And a vertical movement unit that moves in the vertical direction with respect to the base part and moves the mask support part up and down, and a turning drive part that turns the mask support part. An optical disc manufacturing apparatus is provided.

  According to a fourth invention, in any one of the first to third inventions, a plurality of cap members placed on a central hole of the disk are placed around the liquid substance supply mechanism. A mounting table; and a cap transfer device that covers the cap member mounted on the cap mounting table over a central hole of the disk substrate mounted on the first rotation processing device. The supply mechanism provides an optical disk manufacturing apparatus that supplies the liquid material to the center of the cap member that is put on the center hole of the disk substrate or to the vicinity of the center.

  In a fifth aspect based on the fourth aspect, the cap transfer device places the cap member placed in the central hole of the disc substrate on the cap placement base for each disc substrate. An optical disc manufacturing apparatus is provided in which the cap member is replaced with another cap member.

  In a sixth aspect based on any one of the first aspect to the fifth aspect, the rotational processing speed of the second rotational processing device is lower than the rotational processing speed of the first rotational processing device. An optical disc manufacturing apparatus is provided.

  According to a seventh invention, in any one of the first invention to the sixth invention, two second rotation processing devices are provided at an equal distance from one first curing light irradiation device, The first curing light irradiation apparatus provides an optical disk manufacturing apparatus that alternately irradiates curing light onto the disk substrate mounted on each of the two second rotation processing apparatuses. .

  According to an eighth invention, in any one of the first invention to the seventh invention, the second curing light irradiation device is provided above a conveyance line for conveying the disk substrate on which the light transmission film is formed. Provided with a shutter member that prevents the curing light from the second curing light irradiation device from being irradiated onto the transport line.

  According to a ninth invention, in any one of the first to eighth inventions, the disk substrate is a disk substrate on which a signal layer is formed or a transfer disk substrate on which a signal layer to be transferred is formed. An optical disc manufacturing apparatus is provided.

  According to the present invention, it is possible to provide an optical disc manufacturing apparatus capable of manufacturing a high-quality optical disc having a uniform light-transmitting film having a predetermined film thickness with no rise in the outer peripheral portion.

  In particular, according to the second and third inventions, since the turbulence of the air flow due to the movement of the mask member does not occur during the rotation of the second rotation processing apparatus, a high-quality optical disc having a more uniform film thickness is manufactured. An optical disc manufacturing apparatus that can be provided can be provided.

  According to the fourth aspect of the present invention, a light transmission film having a more uniform film thickness can be obtained, so that an optical disk manufacturing apparatus capable of manufacturing a higher quality optical disk can be provided.

  According to the fifth aspect of the present invention, since a uniform liquid substance can be supplied to replace the cap member, a light transmission film having a more uniform film thickness can be obtained.

  According to the sixth aspect of the invention, a light transmission film having a film thickness closer to the set value can be obtained, and therefore an optical disk manufacturing apparatus capable of manufacturing a higher quality optical disk can be provided.

  According to the seventh aspect, since the temperature rise of the entire apparatus can be suppressed, a stable high quality optical disc can be manufactured.

  According to the eighth aspect of the present invention, it is possible to provide an optical disc manufacturing apparatus that can perform a light irradiation process without adversely affecting other parts such as a transport line due to heat generation.

  According to the ninth aspect of the invention, since it can be applied to a transfer disk, even if the signal layer is an optical disk having two or more layers, a high-quality optical disk can be provided.

  First, an optical disk manufacturing apparatus 200 according to Embodiment 1 which is the best mode for carrying out the present invention will be described with reference to FIGS. 1 shows the entire optical disk manufacturing apparatus 200, FIGS. 2 and 3 show a part of the optical disk manufacturing apparatus 200, FIGS. 4-1 and 4-2 are diagrams for explaining the optical disk manufacturing process, and FIG. FIG. 6 is a diagram for explaining the mask member and the mask moving mechanism, and FIG. 6 is a diagram for explaining the curing light irradiation device and the shutter member.

[Embodiment 1]
The optical disc manufacturing apparatus 200 includes two mechanism units 200A and 200B separated by a one-dot chain line. When manufacturing an optical disc with one signal layer, only the mechanism unit 200A is operated, and the mechanism unit 200B is not operated. Then, when manufacturing an optical disc having two signal layers, the two mechanism sections 200A and 200B are operated. First, as an example of an optical disc having one signal layer, a mechanism unit 200A for manufacturing an optical disc compatible with high-density recording will be described.

  In FIG. 1, an injection molding machine 1 has a stamper having a desired recording groove attached to an injection mold (not shown), and a disk substrate D having a signal layer a1 as shown in FIG. Injection molding. The disk substrate D is made of a polycarbonate resin disk having a thickness of 1.1 mm, a diameter of 120 mm, and a center hole diameter of 15 mm, but is not limited thereto. In the signal layer a1, information signals are formed as concave and convex pits, and the concave and convex pits are greatly enlarged as compared with the thickness of the disk substrate D for easy understanding. The disk substrate D is transferred to the cooling mechanism 5 installed in the vicinity of the injection molding machine 1 by the disk substrate take-out mechanism 3 and is rotationally cooled.

  Although the present applicant has already proposed the cooling mechanism 5 (for example, Japanese Patent Laid-Open No. 2002-358695), the disk substrate D is taken out from the injection molding machine 1 almost perpendicularly to the top and bottom, although not shown in detail. Therefore, the cooling mechanism 5 performs high-speed rotation cooling while holding the disk substrate D in the vertical direction. Since the disk substrate D just taken out from the injection molding machine 1 is still soft, the cooling mechanism 5 is rotated at a high speed of several thousand revolutions or more, preferably 3000 rpm or more, so that a large centrifugal force is applied to the disk substrate D. A disk substrate D that can be cooled at high speed and has a small warpage can be obtained. Although not shown in the drawing, the cooling mechanism 5 includes three rotary cooling devices, which are in balance with the performance of the injection molding machine 1 and the effective cooling time. Arranged at the same distance. The disc substrate D from the injection molding machine 1 is transferred to the three rotary cooling devices in order by the disc substrate take-out mechanism 3.

  When the rotary cooling device rotates for a predetermined time, the rotary cooling device stops and the transfer mechanism 7 transfers the disk substrate D from the rotary cooling device to the aging mechanism 9 in order while holding the disk substrate D in the vertical direction. The aging mechanism 9 has a general structure, and advances at a constant speed while holding a plurality of disk substrates D vertically at substantially constant intervals, thereby cooling the disk substrates D to approximately room temperature. At the end of the aging mechanism 9, the disk substrate D is sequentially delivered to the intermittent rotation mechanism 11, and is conveyed to the front / back reversing mechanism 13 at the next position as the intermittent rotation mechanism 11 rotates. The front / back reversing mechanism 13 is for inverting the signal layer a1 formed on the disk substrate D to the upper surface or the lower surface, and the surface on which the signal layer a1 of the disk substrate D taken out from the injection molding machine 1 exists is the upper surface. Alternatively, the operation is selectively performed depending on which direction the lower surface is supplied to a film forming apparatus 19 described later. In this example, the signal is reversed 180 degrees by the front / back reversing mechanism 13 so that the signal layer a <b> 1 faces upward. As the intermittent rotation mechanism 11 further rotates, the disk substrate D is transferred to the transfer line 17 of the first transfer mechanism by the first transfer mechanism 15 at the next position.

  1 and 2, the transport line 17 of the first transport mechanism has an endless (endless) shape that is long in the vertical direction of the drawing, and includes a plurality of disk mounting portions 17a indicated by circles. As shown in FIG. 4B, the disk substrate D transferred to the disk mounting portion 17a is formed by the film forming apparatus 19 such as a sputtering apparatus as the transfer line 17 operates intermittently. A reflective film b1 is formed on the signal layer a1. The reflective film b1 is a thin film made of aluminum or silver and having a thickness of 1 μm or less. A disk on which the reflective film b1 is formed is represented by Da. A disk storage unit 20 is provided along the transport line 17, and the disk storage unit 20 includes a disk loading rotary table 21, a transfer mechanism 23, and a spacer supply mechanism 25. These mechanisms are not used when the apparatus is operating normally. However, when a trouble or the like occurs and a later stage mechanism, which will be described later, stops, it operates as follows to store the disk Da in the disk stacking rotary table 21. .

  The disk stacking rotary table 21 has a plurality of, for example, four, stacking portions 21A for stacking a plurality of disks Da, and the spacer supply mechanism 25 secures a gap between the disks Da when the disks Da are stacked. The spacers (not shown) are supplied one by one. As shown in FIG. 2, the transfer mechanism 23 transfers and loads the disks Da one by one from the transfer line 17 of the first transfer mechanism to the disk stacking rotary table 21 with one transfer arm 23A. On top of this, one spacer (not shown) taken out from the spacer supply mechanism 25 by the other transfer arm 23B is provided one by one. When the trouble is recovered, the transfer mechanism 23 receives the trouble recovery signal, and the transfer mechanism 23 transfers the transfer line from the disk loading rotary table 21 by the transfer arm 23A while the disk Da is not transferred on the transfer line 17. The disk Da is also automatically transferred one by one to the 17 disk mounting portions 17a. Therefore, the disk Da can be used effectively without wasting it. The transfer arm 23B will be described later.

  Next, as indicated by the chain line, the disk Da is transferred by the transfer mechanism 27 from the first transfer position X of the transfer line 17 to the transfer line 29 that is the first transfer line of the second transfer mechanism. , And are sequentially conveyed intermittently by the conveyance line 29. The mounting table 29a will be described later with reference to FIGS. 6A and 6B. However, the mounting table 29a is provided on the transport line 29 at almost regular intervals, and the disks Da are sequentially mounted on the mounting table 29a. The First, a light transmission film forming portion 31 for forming a light transmission film serving as a cover layer having a thickness of about 100 μm is provided along the transport line 29 of the second transport mechanism. The light transmission film forming unit 31 includes a simultaneous transfer mechanism 33, a liquid supply mechanism 35 that supplies a liquid material to the disk substrate Da, and a rotation processing device 37 that performs high-speed rotation processing to spread the liquid material on the disk Da. A plurality of, for example, three sets of mechanisms each including the mounting mechanism 39, the cap accumulating mechanism 41, and the cap cleaning mechanism 42 are provided. These three sets of mechanisms are identical and operate simultaneously. The number of sets is not limited to three, and production is possible if one or more sets are provided.

  Each of the three simultaneous transfer mechanisms 33 includes a pair of transfer arms (not shown) having different 180-degree directions, and at the same time the disk Da on the mounting table 29a of the transport line 29 is sucked and held by one of the transfer arms, The disk Da that has been subjected to the rotation processing in the rotation processing device 37 is sucked and held by the other transfer arm, and then rotated 180 ° horizontally to rotate the disk Da on the mounting table 29a of the transport line 29. Simultaneously with the placement in the apparatus 37, the three disks Da in the respective rotation processing apparatuses 37 are placed on the placement table 29 a of the transport line 29. That is, since the three simultaneous transfer mechanisms 33 perform the transfer operation of the disk Da every time the transfer line 29 performs the transfer operation three times, the rotation processing time in the rotation processing device 37 is reduced to one rotation processing device. Compared to 37, it can be taken approximately three times longer.

  The cap storage mechanism 41 holds a plurality of cap members Ca on a table that rotates intermittently, although details are not shown. When the disk Da on the mounting table 29 a of the transport line 29 is transferred into the rotation processing device 37, the transfer mechanism 39 sucks and holds or grips the top of the cap member Ca from the cap storage mechanism 41. It is placed so as to cover a center hole (not shown) of Da. The cap member Ca has a specific structure that covers a center hole of the disk Da and a center pin (not shown) in the rotation processing device 37 inserted in the center hole. Normally, the disk substrate D has a central hole having a diameter of 15 mm and an inner diameter of the recording area of 43 to 46 mm, and therefore the outer diameter of the cap member Ca is about 18 to 23 mm. However, it is not limited to this.

  When the cap member Ca is put on the disk Da, the liquid supply mechanism 35 supplies the liquid material to the center point of the cap member Ca or in the vicinity of the center point. This liquid substance is a transparent material such as an acrylic resin, and has a viscosity adjusted so that a light transmission film having a thickness of about 100 μm can be formed by a spin coating method. When the liquid material is supplied to the center point of the cap member Ca, the liquid material is given in a point shape, but when the liquid material is supplied near the center point of the cap member Ca, the liquid material has a center point. Supplied in an enclosing annular shape. It is desirable that the inner diameter of the ring is as small as possible. When the liquid material is supplied onto the cap member Ca, the rotation processing device 37 rotates at a high speed and spreads the liquid material on the disk Da by centrifugal force. A disk Db in which a light transmission film c1 serving as a cover layer is formed on the disk Da is shown in FIG.

  In the step of forming the light transmissive film c1 serving as the cover layer in the light transmissive film forming unit 31, the light transmissive film has a thickness of, for example, approximately 100 μm. You may carry out twice or more. For example, by supplying the liquid material and spreading the liquid material by high-speed rotation in two steps, a uniform light-transmitting film c1 having a film thickness approximately equal to 100 μm is formed accurately and in a short time. can do. When performing the rotation process twice, the same liquid material including the viscosity is used. However, the liquid material is not necessarily limited to this, and the viscosity of the liquid material applied for the first time is low. The viscosity of the liquid substance to be applied may be increased. When the rotation processing device 37 stops rotating and the spreading of the light transmission film c <b> 1 ends, the transfer mechanism 39 operates to return the cap member Ca from the rotation processing device 37 to the cap accumulation mechanism 41. Since the liquid material is applied to the returned cap member Ca, the returned cap member Ca is cleaned by the cap cleaning mechanism 42 at the cleaning position, and the liquid material is removed. This cleaning process is performed by various methods such as showering the cleaning liquid or immersing in the cleaning liquid. Since the liquid substance is not irradiated with the curing light, it is easily removed because it is in a liquid state. Such a process is performed simultaneously by the other two sets of mechanisms, and the disks Db each having the light transmission film c1 formed thereon are transferred onto the mounting table 29a of the transport line 29 by these three sets of mechanisms. At this time, the light transmission film c1 is not yet cured.

  As described above, particularly in an optical disc compatible with high-density recording, the flatness of the light transmission film c1 has a great influence on writing or reproduction of an information signal by a laser beam. Therefore, it is important that the light-transmitting film c1 has a uniform thickness everywhere. However, it is extremely difficult to form a light transmissive film c1 having a uniform thickness of approximately 100 μm by the spin coating method, and it has been found that the outer peripheral portion of the light transmissive film c1 is thicker than the inner portion. . As an effective countermeasure, a primary curing step is performed by irradiation with curing light as described below.

  In this primary curing step, the other part except the outer peripheral part of the light transmission film c1 of the disk Db is irradiated with curing light to make it semi-cured or cured to fix the film thickness of the part. By leaving the outer peripheral portion of c1 in an uncured state for a while, the outer peripheral portion becomes thinner due to gravity or gravity and centrifugal force, and the film thickness is made uniform over the entire surface of the light transmission film c1. There is a feature. This curing light irradiation process is performed by a simultaneous transfer mechanism 43 and 45 having the same structure, rotation processing devices 47 and 49 having the same structure, mask moving mechanisms 51 and 53 having the same structure, and a common flash lamp device. This is performed by the light irradiation mechanism 55. The simultaneous transfer mechanisms 43 and 45 operate simultaneously. The simultaneous transfer mechanisms 43 and 45 transfer the disk Db on the transport line 29 to the rotation processing devices 47 and 49, and simultaneously transfer the disk Db irradiated with curing light such as ultraviolet rays by the rotation processing devices 47 and 49. It is transferred onto 29 mounting tables 29a. Therefore, the simultaneous transfer mechanisms 43 and 45 perform the transfer operation every other time in synchronization with the intermittent transfer operation of the transfer line 29, and the rotation processing time of the rotation processing devices 47 and 49 is intermittent for the transfer line 29. Therefore, it is possible to take time required for two transport operations.

  When the simultaneous transfer mechanisms 43 and 45 transfer the disk Db to the rotation processing devices 47 and 49, the mask moving mechanisms 51 and 53 operate, and the mask member Ma as shown in FIG. The mask member Ma is stopped slightly away from the upper surface of the disk substrate D2 placed on the rotation processing devices 47 and 49. The mask member Ma is made of a resin material, an inorganic material, or a metal material that does not substantially transmit curing light such as ultraviolet rays. The distance between the mask member Ma and the upper surface of the disk Db is small so that the curing light does not enter the light transmitting film c1 below the mask member Ma as much as possible. Therefore, the rotation processing devices 47 and 49 perform the rotation processing operation. It is preferable that the mask member Ma is set at a predetermined position before performing. This is because if the mask member Ma is transported to a predetermined position while the rotation processing devices 47 and 49 are performing the rotation processing operation, the airflow is disturbed and the flatness of the light transmission film c1 is adversely affected.

  Here, from various experimental results performed on the disk substrate D having a diameter of 120 mm, when the inner diameter of the mask member Ma is w and the outer diameter of the disk substrate D is W, the inner diameter w is the outer diameter W of the disk substrate D. It was found that it should be in a range (W> w ≧ 0.9 W) that is 90% or more of the disk substrate D and smaller than the outer diameter W of the disk substrate D. When the inner diameter w of the mask member Ma is smaller than 90% of the outer diameter W of the disk substrate D, the flat portion slightly inside the outermost peripheral region is not semi-cured or cured, and the region may become thin. This adversely affects the flatness of the light transmission film c1. Further, when the outer diameter of the mask member Ma is equal to or smaller than the outer diameter W of the disk substrate D, the outer peripheral end surface of the disk substrate D is directly or indirectly irradiated with curing light in the primary curing step, and the outer periphery thereof The material for forming the light transmission film c1 on the end face is semi-cured or cured, the effect of the primary curing process is halved, and the light transmission film c1 cannot be sufficiently flattened. Even if the disk substrate D has a diameter smaller than 120 mm or a larger disk, the same effect can be obtained if the inner diameter w of the mask member Ma is in the range (W> w ≧ 0.9 W).

  Details of the mask moving mechanisms 51 and 53 and the mask member Ma will be described with reference to FIGS. Since both the mask moving mechanisms 51 and 53 have the same structure, only the mask moving mechanism 51 will be described. The mask moving mechanism 51 includes a base portion 51A fixed to a fixed structure (not shown), a vertically moving portion 51B, a turning drive portion 51C, a rotatable / vertically movable portion 51D, a mask support portion 51E, and the like. The vertically moving portion 51B includes an air cylinder 51Bb having a cylinder rod 51Ba that moves up and down by air suction and discharge, and the cylinder rod 51Ba extends upward through a hole in the base portion 51A. The upper part of the cylinder rod 51Ba is coupled to a rotatable / vertically movable portion 51D via a floating joint 51Bc. Further, the vertically moving portion 51B is attached to the base portion 51A, and serves as a stopper member 51Bd that determines the lower limit of the mask member Ma, and a damper that absorbs shock and vibration when the mask member Ma contacts the stopper member 51Bd. The stopper member 51Bd and the damper / stopper member Be allow the mask member Ma to be stably and horizontally stopped at the lower limit position without being biased.

  The turning drive unit 51C is mainly composed of a rotary table 51Ca, a rotary drive mechanism 51Cb capable of rotating the rotary table 51Ca in both directions by a set angle, and a disc-shaped gear coupled to the rotary table 51Ca and rotating with the rotation. 51Cc. The teeth of the gear 51Cc are coupled to the teeth of the gear 51Da of the rotatable / vertically movable portion 51D, and the shaft of the gear 51Da has a structure combining a radial bearing and a linear drive bearing (not shown). It is coupled to the possible mechanism 51Db. The rotatable / vertically movable mechanism 51Db is coupled to the shaft portion 51Ea of the mask support 51E. The mask support 51E is mainly composed of a shaft portion 51Ea, an angle adjustment mechanism 51Eb such as a goniometer that can adjust the angle in the front and back directions of the mask member Ma and the angle in the left and right direction of the paper, and a vertical fine adjustment mechanism 51Ec such as a micrometer. The mask member Ma is coupled to and supported by the vertical fine adjustment mechanism 51Ec.

  Next, the operation of the mask moving mechanism 51 will be described. When the mask member Ma is at the origin position P1, the cylinder rod 51Ba of the vertical movement portion 51B is in a state of moving upward. When the disk Db on which the light transmission film c1 is formed is transferred from the transport line 29 to the rotation processing device 47, the turning drive unit 51C of the mask moving mechanism 51 starts to operate, and the rotation drive mechanism 51Cb is a rotary table. 51Ca is rotated by a predetermined rotation angle. Along with this, the disc-shaped gear 51Cc rotates, the gear 51Da of the rotatable / vertically movable portion 51D meshing with this rotates, and the rotatable / vertically movable mechanism 51Db rotates by a predetermined angle to support the mask. The portion 51E rotates and the mask member Ma supported by the portion 51E rotates by a predetermined angle. As shown by the broken line in FIG. 5B, the mask member Ma moves from the origin position P1 to the masking position P2 on the rotation processing device 47. Turn until. Next, the cylinder rod 51Ba of the vertically moving portion 51B is retracted downward by a set amount. At this time, the angle adjustment mechanism 51Eb previously adjusts the angle of the mask member Ma so that the mask member Ma is parallel to the disk Db with high accuracy, and the fine adjustment mechanism 51Ec does not contact the upper surface of the disk Db. Moreover, it is adjusted to a height located at a close distance. Therefore, when the mask member Ma is at the masking position P2, the center of the mask member Ma and the center of the disk Db substantially coincide, and the mask member Ma is parallel to a slight position from the upper surface of the disk Db.

  Then, when curing light such as ultraviolet rays from the curing light irradiation mechanism 55 shown in FIG. 1 is irradiated to the light transmission film c1 of the disk Db through the void T surrounded by the inner diameter w of the mask member Ma, first, the vertical movement portion When the cylinder rod 51Ba of 51B moves forward, the rotatable / vertically movable portion 51D, the mask support portion 51E, and the like rise, and the mask member Ma also rises. At substantially the same time, the turning drive unit 51C operates to rotate the gear 51Cc and the gear 51Da of the rotatable / vertically movable portion 51D, and rotate the mask support portion 51E to turn the mask member Ma by a predetermined angle. Immediately thereafter, the simultaneous transfer mechanism 43 returns the disk Db of the rotation processing device 47 onto the transport line 29. Then, the mask member Ma returns to the origin position P1 shown in FIG. 5B and prepares for the operation of the next cycle. The mask moving mechanism unit 53 operates in exactly the same manner as the mask moving mechanism 51 and will not be described.

  On the other hand, in the common curing light irradiation mechanism 55 at the same position from the rotation processing devices 47 and 49, the simultaneous transfer mechanisms 43 and 45 transfer the disk substrate Db on the transport line 29 to the rotation processing devices 47 and 49. When loaded, it first moves to a set position above the rotation processing device 47. Therefore, the rotation processing device 47 performs a rotation operation immediately after the mask member Ma is set at a predetermined position. This rotation operation finely adjusts the film thickness of the light transmission film c1 and moves to the light transmission film c1. Therefore, the flash lamp is rotated at a rotation speed lower than the rotation speed of the rotation processing device 37 in the light transmission film forming unit 31, and the flash lamp is used at the final stage of the rotation processing or immediately after that. A curing light irradiation device 55 such as a device irradiates the curing light uniformly for a short time, for example, about 200 ms. By the irradiation of the curing light, the portion of the light transmission film c1 other than that shielded by the mask member Ma is cured or semi-cured. However, the outer peripheral portion of the light transmission film c1 shielded by the mask member Ma is not semi-cured and remains in a soft state. In addition, irradiation of this hardening light may be performed in the middle of the said rotation process for extending the light transmissive film | membrane c1.

  When the curing light irradiation device 55 finishes irradiating the curing light such as ultraviolet rays, the curing light irradiation device 55 passes through the original position to the rotation processing device 49, stops at the set position above the rotation processing device 49, or immediately before it. The rotation processing device 49 starts rotating operation, and at the final stage of the rotation processing or immediately after that, the curing light irradiation device 55 irradiates the curing light uniformly for a short time. Thereafter, the curing light irradiation device 55 returns to the original position, and the mask moving mechanisms 51 and 53 move the respective mask members Ma to the original positions that are out of the rotation processing devices 47 and 49, so that the operation of the next cycle is performed. Prepare. The entire surface of the light transmission film c1 is cured in the next secondary curing process of the disk Db returned to the mounting table 29a of the transport line 29 with only the outer peripheral portion of the light transmission film c1 being soft. The time from the primary curing step to the secondary curing step is a time length during which the soft outer peripheral portion of the light transmission film c1 is flattened by reducing the thickness due to gravity, and is adjusted by the length of the conveyance time. is doing. Note that the irradiation time of the curing light irradiation device 55 is significantly shorter than the time required for the rotation processing, for example, several hundred ms or less (for example, about 200 ms). This is economically advantageous because it can be handled by one curing light irradiation device 55. Further, the adverse effect on the quality of the disk due to the heat generated by the apparatus can be reduced. When the disk Db is rotated even after the curing light is irradiated in the rotation processing devices 47 and 49, only the soft outer peripheral portion of the light transmission film c1 shielded by the mask member Ma receives the centrifugal force and further spreads. Since the thickness is reduced, the flattening is further promoted by adjusting the rotation time and the rotation speed, and a high-quality optical disc can be obtained.

  In this secondary curing step, as shown in FIG. 4-1 (E), the curing light is irradiated from the upper side of the disk Db. Therefore, as shown in FIG. Such a curing light irradiation device 57 is provided. As shown in FIG. 6B, the curing light irradiation device 57 includes an outer shell 57A serving as a light shielding cover, a curing light lamp 57B such as a flash lamp provided in the outer shell 57A, and an outer shell. An exhaust part 57C, such as a fan, is provided on the upper part of the shell part 57A and exhausts the internal temperature so as not to rise so much, and a lamp support that extends inward from the inner wall of the outer shell part 57A and supports the curing light lamp 57B. Part 57D, and a reflecting plate part 57E that reflects light from the curing light lamp 57B to the circumferential part of the disk Db and cures the uncured part of the light transmission film c1 attached to the circumference. Further, a light-shielding seal 57F for improving the light-shielding property is also provided on the lower surface of the outer shell part 57A. In addition, there is provided a shutter member 58 that forms a sealed space so that the curing light does not leak in cooperation with the outer shell 57A of the curing light irradiation device 57. Although the shutter member 58 will not be described in detail, the shutter member 58 includes two light shielding plates 58 a and 58 b that can move back and forth in a direction perpendicular to the traveling direction of the transport line 29. The part that contacts the surface is a semi-circular cutout, and when the two light shielding plates 58a and 58b are in contact, the upper part of the light shielding plates 58a and 58b overlaps with each other so that they are in contact with each other. The other shading plate is cut and thinned at the lower side.

  The curing light irradiation device 57 can move up and down in synchronization with the intermittent conveyance operation of the conveyance line 29. When the conveyance line 29 stops intermittently, the curing light irradiation device 57 is shown in FIGS. Thus, the curing light irradiation device 57 is lowered to the set position. At this time, the light shielding plates 58a and 58b of the shutter member 58, which are located on the mounting table 29a of the transport line 29 and are spaced so as not to interfere with the transport, are perpendicular to the traveling direction of the transport line 29, respectively. Moving in the direction of the arrow, the opposing portions of the light shielding plates 58a, 58b overlap. Then, the light shielding seal 57F at the lower end of the outer shell portion 57A abuts on the upper surface of the cutter member 58, and a sealed space is formed. The disk holder 29a and the disk Db exist in this sealed space. In this state, the curing light lamp 57B emits light. The ultraviolet light from the curing light lamp 57B is directly applied to the planar light-transmitting film c1 of the disk Db, and the light transmitting film formed on the circumference of the disk Db is irradiated with the ultraviolet light reflected by the reflecting plate part 57E. Therefore, all the light transmission films are cured to form a light transmission film. At this time, the exhaust part 57C exhausts the air in the sealed space.

  When the irradiation of the ultraviolet light from the curing light lamp 57B is completed, the curing light irradiation device 57 and the shutter member 58 start to operate almost simultaneously, the curing light irradiation device 57 moves upward, and the shutter member 58 moves to the transport line 29. Move in the opposite direction at right angles to the transport direction. When the curing light irradiation device 57 and the shutter member 58 return to their original positions, the transport line 29 starts transporting again. The curing light irradiation device 57 and the shutter member 58 are prepared for the next cycle operation. Here, as can be seen from the left diagram of FIG. 6C, the two light shielding plates 58a and 58b of the shutter member 58 need only face each other at a distance that does not contact the mounting table 29a. The shutter member 58 does not irradiate the transport line 29 with ultraviolet rays, so that the temperature of the transport line 29 can be prevented from rising.

  At the end of the transport line 29, a disk storage unit 59 similar to the disk storage unit 20 is provided, and at the same time, transfer to and from the start end of the transport line 61 serving as the second transport line of the second transport mechanism. A mechanism 63 is provided. The disk storage unit 59 includes a disk stacking rotary table 59A and a spacer storage mechanism 59b. The disk stacking rotary table 59A has four stacking units for stacking a plurality of, for example, 200 disks Db. The mechanism 59B accumulates a number of spacers (not shown) for securing a gap between the disks Db when the disks Db are stacked. The disk stacking rotary table 59A and the spacer storage mechanism 59B are the same as the disk stacking rotary table 21 and the spacer storage mechanism 23 described above, and will not be described. The disk storage unit 59 may waste a disk in progress on the transport line 17 of the first transport mechanism and the transport line 29 of the second transport mechanism when a trouble occurs in the later stage of the production line. It is for accumulating or extracting a sample of a disc in the middle of manufacture. Accordingly, during normal operation, the transfer mechanism 63 transfers all the disks Db at the end of the transfer line 29 to the transfer line 61 of the second transfer mechanism. The transfer mechanism 63 automatically transfers the disk Db of the transport line 29 to the disk storage unit 59 when receiving a failure occurrence signal, and receives the disk Db from the disk storage unit 59 when receiving a failure recovery signal. Transfer to the transfer line 61. Furthermore, by pressing a sample collection button (not shown), a predetermined number of disks Db can be transferred to the disk storage unit 59 as samples.

  The disc Db transferred to the transport line 61 of the second transport mechanism is first supplied with a liquid material for hard coating on the transport line 61 by the liquid material supply mechanism 65. The liquid material supply mechanism 65 has a nozzle portion 65A that rotates almost once while discharging a liquid material, and is liquid in a donut shape at a predetermined position on the inner circumference side of the disk Db that is sequentially transported on the third transport line 61. Supply substances. This liquid substance has a lower viscosity than the liquid substance for the light-transmitting film, and a material suitable for forming a hard coat layer exhibiting excellent scratch resistance is used. The liquid substance supplied in a donut shape to the disk Db is spread in the rotation processing unit 67 to form a hard coat layer e having a thickness of about 1 to 4 μm, for example, as shown in FIG. . A disk in which the hard coat layer e is formed on the disk Db is referred to as Dc. The rotation processing unit 67 includes three simultaneous transfer mechanisms 69 having the same configuration and three rotation processing devices 71 that perform high-speed rotation processing. The three simultaneous transfer mechanisms 69 operate at the same time to move the transfer line 61. At the same time that the upper disk Db is transferred to the corresponding rotation processing device 71, the disk Dc that has been subjected to the rotation processing is transferred onto the transport line 61. Since the liquid substance supply mechanism 65 is disposed in the vicinity of the transport line 61 and the nozzle portion 65A is waiting on the transport line 61, the processing time can be shortened.

  In the next step, as shown in FIG. 4G, the hard coat layer e is cured by curing light such as ultraviolet rays from above the curing light irradiation device 73. Since the curing light irradiation device 73 has the same configuration as that of the curing light irradiation device 57, the description thereof is omitted, but the curing light irradiation device 73 is provided only above the transport line 61. The disk Dc is transferred from the transfer line 61 to the turntable mechanism 77 by the transfer arm 75a of the transfer mechanism 75 having two transfer arms 75a and 75b. The turntable mechanism 77 has four positions at 90 ° intervals where the disk Dc is placed and rotates intermittently by 90 °. A front / back reversing mechanism 79 is disposed in the vicinity of the position next to the position where the disk Dc is received from the transport line 61, and reverses the disk Dc. By the reverse of the front and back, the back surface of the disk substrate D is turned up, and water is absorbed on the back surface of the disk substrate D by a film forming device 81 such as a sputtering device at the next position as shown in FIG. A prevention film f is formed. This water absorption preventing film f has the purpose of preventing the material of the disk substrate D itself from being warped and the purpose of preventing corrosion of the metal reflective film. A disk in which the water absorption preventing film f is formed on the disk Dc is referred to as Dd.

  When the disk Dd returns to the initial position of the turntable mechanism 77, the other transfer arm 75b of the transfer mechanism 75 places the disk Dd on the relay stand 83. At this time, the transfer arm 75a of the transfer mechanism 75 transfers the disk Dc from the transport line 61 to the turntable mechanism 77, and the transfer arm 75b of the transfer mechanism 75 transfers the disk from the turntable mechanism 77 to Dd. The operation of transferring to the relay table 83 is performed at the same time. The disk Dd placed on the relay stand 83 is transferred to the inspection unit 87 by the transfer arm 85a of the transfer mechanism 85, and the disk Dd inspected by the inspection unit 87 is transferred to the transfer mechanism 85. It is transferred to another relay stand 89 by the arm 85b. The inspection unit 87 inspects the disc according to predetermined inspection items by irradiating inspection light from below or using a CCD camera or the like. According to the inspection result, one transfer arm of the transfer mechanism 91 transfers non-defective products to the non-defective product stacking mechanism 93 and defective products to the non-defective product stacking mechanism 95 and sequentially loads them.

This sorting operation of the transfer mechanism 91 is automatically performed in response to a signal indicating a non-defective product and a defective product based on the inspection result in the inspection unit 87. The non-defective product stacking mechanism 93 has a general structure, and although not shown in detail, an optical disk stacking unit including a turntable and a plurality of stack poles arranged on the turntable and capable of stacking a large number of discs sequentially. Consists of. The other transfer arm of the transfer mechanism 91 transfers one spacer from the spacer accumulating unit 96 onto the disk of the non-defective product stacking mechanism 93. The spacer plays a role of securing a gap between the loaded disks and preventing the optical disks from coming into close contact with each other. Although not shown in the figure, a non-defective optical disc is subjected to label printing as necessary, and an optical disc compatible with high-density recording with one signal layer is completed.
[Embodiment 2]
As described above, the optical disc manufacturing apparatus 200 includes the two mechanism portions 200A and 200B separated by a one-dot chain line. When manufacturing an optical disc compatible with high-density recording with two signal layers, two mechanisms are used. The unit 200A and the mechanism unit 200B are operated. First, the outline of the production of an optical disc compatible with high-density recording having two signal layers and the above-mentioned production of an optical disc compatible with high-density recording having one signal layer will be described first. (1) Film forming apparatus 19, the disk Da having the reflection film b1 formed on the first signal layer a1 of the disk substrate D as shown in FIG. 4B is transferred from the transfer line 17 of the first transfer mechanism to the second line. It is not transferred to the transfer line 29 of the transfer mechanism, but is transferred to the transfer line 137 of the third transfer mechanism of the mechanism unit 200B by the simultaneous transfer mechanism 97 that transfers between the two mechanism units 200A and 200B. It will be posted. (2) In the mechanism unit 200B, the disk having the light transmission film having the second signal layer a2 transferred to the disk Da is transferred from the transfer line 137 to the transfer line 17 of the mechanism unit 200A by the simultaneous transfer mechanism 97. It will be posted. (3) The film forming apparatus 19 forms a translucent reflective film on the second signal layer a2, that is, forms not only the first reflective film but also a translucent second reflective film. (4) The disc on which the translucent second reflective film is formed is transferred from the transport line 17 to the transport line 29, and a light transmission film or the like serving as a cover layer is formed in the process described above.

  In the mechanical part 200B, the injection molding machine 101 has a stamper having a desired recording groove attached to an injection mold (not shown), and has a second signal layer a2 as shown in FIG. The transfer disk substrate T is injection molded. The transfer disk substrate T is made of a resin disk having a diameter of 120 mm and a center hole diameter of 15 mm, but is not limited thereto. In the second signal layer a2, information signals are formed as concave and convex pits. To make the explanation easy to understand, the concave and convex pits are greatly enlarged compared to the thickness of the transfer disk substrate T. Show. The transfer disk substrate T is transferred to the cooling mechanism 105 installed in the vicinity of the injection molding machine 101 by the disk take-out mechanism 103, and is rotationally cooled.

  The disk take-out mechanism 103 and the cooling mechanism 105 are the same as the disk substrate take-out mechanism 3 and the cooling mechanism 5 described above, and their operations are also the same, so that the description thereof is omitted. When the rotation cooling device of each cooling mechanism 105 rotates for a predetermined time, it stops, and the transfer mechanism 107 transfers the transfer disk substrate T to the aging mechanism 109 in order while holding the transfer disk substrate T in the vertical direction. The transfer mechanism 107 and the aging mechanism 109 have substantially the same structure as the transfer mechanism 7 and the aging mechanism 9 described above, and the operations thereof are also the same, and thus description thereof is omitted. The transfer disk substrate T cooled to almost room temperature by the aging mechanism 109 is sequentially delivered to the intermittent rotation mechanism 111 at the end of the aging mechanism 109, and at the next position along with the rotation of the intermittent rotation mechanism 111, the front and back reversing mechanism It is inverted 180 degrees by 113, and is brought into a horizontal state so that the second signal layer a2 faces upward. As described above, the front / back reversing mechanism 113 may be operated only when reversal is necessary. Then, as the intermittent rotation mechanism 111 further rotates, the transfer disk substrate T is transferred to the transfer line 117 of the transfer transfer mechanism by the transfer mechanism 115 at the next position.

  A light-transmitting film that has the same configuration as the light-transmitting film forming unit 31 and operates in the same manner along the transfer line 117 of the transfer-use transport mechanism, and forms the transfer light-transmitting film c2 on the transfer disk substrate T. A forming part 119 is provided. The light transmission film forming unit 119 spreads the liquid material onto the transfer disk substrate T by performing a simultaneous transfer mechanism 121, a liquid supply mechanism 123 that supplies the liquid material to the transfer disk substrate T, and a high-speed rotation process. Three sets of mechanisms including a rotation processing device 125, a transfer mechanism 127, a cap accumulation mechanism 129, and a cap cleaning mechanism 131 are provided. These three sets of mechanisms are identical and operate simultaneously. The three simultaneous transfer mechanisms 121 are the same as the simultaneous transfer mechanism 33, and the transfer disk substrates T on the transport line 117 are respectively placed in the rotation processing device 125, and at the same time, the respective rotation processes are performed. Three transfer disk substrates T in the apparatus 125 are placed on the transport line 117. Since the three simultaneous transfer mechanisms 121 perform the transfer operation of the transfer disk substrate T every time the transfer line 117 performs the transfer operation three times, the rotation processing time in the rotation processing device 125 is set to one rotation processing device. It can be taken three times longer than the case of 125.

  The cap accumulating mechanism 129 is the same as the cap accumulating mechanism 41 and is not described in detail, but holds a plurality of cap members Ca on a table that rotates intermittently. Each time the transfer disk substrate T is transferred into the rotation processing device 125, the transfer mechanism 127 loads the cap member Ca from the cap accumulation mechanism 129 so as to cover a center hole (not shown) of the transfer disk substrate T. Put. The cap member Ca has a specific structure that covers the center hole of the transfer disk substrate T and the center pin (not shown) of the rotation processing device 125 inserted in the center hole. As described above, the disc substrate D has a central hole having a diameter of 15 mm and an inner diameter of the recording area of 43 to 46 mm, and the transfer light transmitting film c2 suitable for the disc substrate D is formed on the transfer disc substrate T. There must be. Therefore, the outer diameter of the cap member Ca is about 18 to 23 mm, but is not limited thereto.

  When the cap member Ca is placed on the transfer disk substrate T, the liquid supply mechanism 123 supplies the liquid substance to the center point of the cap Ca or in the vicinity of the center point. This liquid substance is a transparent material, for example, an acrylic resin, and has a viscosity adjusted so that a light transmission film having a thickness of several tens of μm can be formed by a spin coating method. When the liquid substance is supplied to the central point of the cap member Ca, the liquid substance is given in a dot shape, but when the liquid substance is supplied near the central point of the cap member Ca, the liquid substance surrounds the center. Supplied in an annular shape. When the liquid material is supplied onto the cap member Ca, the rotation processing device 125 rotates at a high speed and spreads the liquid material on the transfer disk substrate T by centrifugal force. A transfer disk substrate T on which the light transmission film c2 is formed is shown in FIG. The transfer disk substrate T on which the light transmission film c2 is formed is referred to as a transfer disk Ta. The transfer disk Ta is transferred to the transfer line 117 of the transfer transfer mechanism by the simultaneous transfer mechanism 121. Since the formation of the light transmission film c2 can be performed in the same manner as the formation of the light transmission film c1 described in the first embodiment, further description is omitted. Further, the cleaning of the cap Ca by the cap cleaning mechanism 131 can be performed in the same manner as described above, and thus the description thereof is omitted. At this point, the light transmission film c2 has not been cured yet. The transfer disk Ta transferred to the transport line 117 is transferred to the turntable mechanism 135 by the transfer mechanism 133.

  On the other hand, the disk Da on which the reflective film b1 is formed on the first signal layer a1 of the disk substrate D shown in FIG. Are transferred from the second transfer position Y of the transfer line 17 to the transfer position Z of the transfer line 137 of the mechanism unit 200B by the simultaneous transfer mechanism 97 without being transferred to the transfer line 29. The disk Da transferred to the position Z of the transport line 137 is sequentially supplied with the liquid material by the liquid material supply mechanism 139 at the next position. The liquid material supply mechanism 139 has a nozzle portion 139A that rotates almost once while discharging the liquid material, and supplies the liquid material in an annular shape to a predetermined position on the inner circumference side of the disk Da that is sequentially transported on the transport line 137. To do. This liquid substance is a resin material that is transparent and excellent in adhesiveness, typically an adhesive.

  The disk Da supplied with the liquid material is rotated at a high speed by the rotation processing unit 141, and the liquid material is spread on the reflective film b1 to form a thin adhesive layer d as shown in FIG. To do. A disk having an adhesive layer d formed on the disk Da is denoted by De. The rotation processing unit 141 includes three simultaneous transfer mechanisms 143 having the same configuration and three rotation processing devices 145 such as general spinners. The simultaneous transfer mechanism 143 simultaneously transfers the disk Da on the transport line 137 to each rotation processing device 145, and simultaneously transfers the disk rotated by each rotation processing device 145 onto the transport line 137. The adhesive layer d formed on the reflective film b1 of the disk De is sucked and held by one transfer arm 147A of the transfer mechanism 147 without being cured and transferred to the turntable mechanism 135. The turntable mechanism 135 rotates intermittently clockwise. Note that the transfer operation of the three simultaneous transfer mechanisms 143 is performed every three intermittent transfer operations of the transfer line 137, and during that time, each rotation processing device 145 performs the rotation processing operation.

  The turntable mechanism 135 includes four mounting tables 135A at 90 ° intervals. The mounting table 135A is made of a transparent heat-resistant light-transmitting material such as quartz, and the disk De is mounted on two of the four mounting tables 135A facing each other. The transfer disk Ta described above is transferred from the transport line 117 to two empty mounting tables 135A on which the disk De is not mounted. As shown in FIG. 8A, a centering portion P is provided at the center of each mounting table 135A, and the mask member Ma as described above is provided at the outer periphery thereof. The centering portion P includes a small disc portion Pa and a pin portion Pb. The outer peripheral portions of the disk De and the transfer disk Ta are supported by the mask member Ma, and the inner peripheral portion is supported by the small disk portion Pa. The centering portion P is preferably made of the same material as the mounting table 135A.

  As the turntable mechanism 135 rotates intermittently, as shown in FIGS. 7-1D and 7-1E, in the position next to the position where the transfer disk Ta is transferred from the transport line 137. Further, a disk De in which curing light such as ultraviolet rays is not shielded by a mask member Ma (W> w ≧ 0.9 W) as shown in FIG. 8B from the curing light irradiation device 149 provided on the lower side thereof. A primary curing step is performed in which the surface area of the adhesive layer d and the light transmitting film c2 of the transfer disk Ta are alternately irradiated. This primary curing process is performed through the mounting table 135A. W represents the outer diameter of the disk substrate D, and w represents the inner diameter of the mask member Ma. The adhesive layer d of the disk De irradiated with the curing light and the light transmission film c2 of the transfer disk Ta are semi-cured or cured, and the outer peripheral portion shielded by the mask member Ma is conveyed to the next position without being cured. At the next position, the transfer mechanism 151 sucks and holds the disk De, the inner peripheral portion where the adhesive layer d is not formed, and puts the transfer disk Ta on the mounting table 153A of the front / back reversing mechanism 153. The inner periphery where the light transmission film c <b> 2 is not formed is sucked and held and sequentially transferred to the mounting table 155. The curing light may be irradiated from the upper side without being irradiated from the lower side of the turntable mechanism 135. In this case, the mask member Ma may be placed at a distance from the mask De so as not to contact the adhesive layer d of the disk De and the light transmission film c2 of the transfer disk Ta.

  The disk De on the mounting table 153A of the front / back reversing mechanism 153 is mounted on the mounting table 153B with its upper and lower surfaces reversed. By this reversal operation, the adhesive layer d formed on the disk De becomes the lower side. As described above, since at least the outer peripheral portion of the adhesive layer d is not cured, the mounting table 153A and the mounting table 153B have a size that supports the inner peripheral portion of the disk De where the adhesive layer d is not formed. preferable. The reversing operation of the front / back reversing mechanism 153 is a structure in which the mounting table 153A performs a 180-degree reversing operation in a state where the disk De is sucked and held, and the disk De is reversed and mounted on the mounting table 153B. A structure already proposed by the present applicant, such as a structure in which the outer edge of the disk De is held at a position and rotated 180 degrees to be reversed, can be adopted (for example, Japanese Patent Laid-Open No. 5-277427 or JP-A-8-131928).

  The transfer mechanism 157 sucks and holds the inner peripheral portion of the transfer disk Ta mounted on the mounting table 155 where the light transmission film c2 is not formed, and first places the transfer disk Ta in the position of the turntable mechanism 159. Transfer to a. Next, the transfer mechanism 157 transfers the disk De on the mounting table 153B onto the transfer disk Ta. The turntable mechanism 159 has a plurality of transfer positions. Although not shown, the turn table mechanism 159 has a disk De and a transfer disk in order to hold the disk De at a small distance from the transfer disk Ta. A holding member to be inserted into the center hole of the substrate T is provided. With this holding member, the light transmission film of the transfer disk Ta and the adhesive layer of the disk De are conveyed to the vacuum bonding mechanism 161 with a small distance therebetween.

  The vacuum bonding mechanism 161 has two positions b and c, and has two cylindrical chambers (not shown) on the positions b and c, which are slightly larger than the outer size of the disk substrate. The two cylindrical chambers are waiting above the positions b and c when the turntable mechanism 159 rotates intermittently. When the turntable mechanism 159 stops, the two chambers move down to turn the turntable. A small sealed space with the mechanism 159 is created, and a vacuum pump device (not shown) is operated to evacuate the two sealed spaces. When two sets of transfer disks Ta and De that are kept facing each other at a certain interval at position a of the turntable mechanism 159 are formed and conveyed to positions b and c, they are not shown. The two chambers are lowered and the two positions b and c are in a vacuum atmosphere, and the disk De is superimposed on the transfer disk Ta so that pressure is applied. In this manner, two discs without bubbles are bonded between the light transmission film c2 of the transfer disc Ta and the adhesive layer d of the disc De. Note that it is not always necessary to perform the bonding in a vacuum. As already proposed by the present applicant (for example, JP-A-9-63127), the adhesive film c1 is lightly brought into contact with the light transmission transfer layer d1. In this state, it may be a method of bonding together while rotating with a relative rotational difference. In this case, the adhesive film c1 is preferably not subjected to primary curing. Another bonding method may be used.

  As shown in FIG. 7-2 (F), the disk Df formed by laminating the transfer disk Ta and the disk De is transferred to the turntable mechanism 165 by the transfer mechanism 163 at the position d of the turntable mechanism 159. The Since the turntable mechanism 165 has the same structure as the turntable mechanism 135, the description thereof is omitted. The disk Df mounted on the mounting table 165A made of a transparent material indicated by the circle of the turntable mechanism 165 is exposed to ultraviolet light from above by the curing light irradiation device 167 as shown in FIG. Secondary curing is performed by irradiation with an appropriate curing light. In this secondary curing step, the uncured portions of the adhesive layer d and the light transmissive film c2 are completely cured by irradiating the entire surface of the adhesive layer d and the light transmissive film c2 with curing light from above. .

  The disk Df that has undergone the secondary curing process is transferred to the transport line 137 by the transfer arm 147B of the transfer mechanism 147, as indicated by the dashed arrow in FIG. The operation of transferring the disk Df from the turntable mechanism 165 to the transfer line 137 and the operation of transferring the disk De from the transfer line 137 to the turntable mechanism 135 include the transfer arm 147B of the transfer mechanism 147 and the transfer arm 147B. Simultaneously with the transfer arm 147A. As shown in FIG. 7-2 (H), the disk Df transported by the transport line 137 is reversed by the front / back reversing mechanism 169 so that the transfer disk substrate T is on the upper side and the disk substrate D is on the lower side. Then, as shown in FIG. 7-2 (I), the transfer disk substrate T is then peeled off from the light transmission film c2 by the peeling mechanism 171 and the second signal layer a2 is transferred to the light transmission film c2. . The peeling mechanism 171 is generally composed of two simultaneous transfer mechanisms 173 and 175, peeling mechanisms 177 and 179, and transfer disk removing mechanisms 181 and 183.

  When the disk Df is transferred from the simultaneous transfer mechanisms 173 and 175, the peeling mechanisms 177 and 179 perform a peeling operation at the next position. For example, a mechanical force is applied between the transfer disk substrate T and the transfer light-transmitting film c2 from the center hole side of the disk Df, and a part of them is partially peeled and opened. By applying compressed air during that time, peeling can be performed reliably and easily without adversely affecting the light transmission film c2. Note that the peeling mechanism 171 is not limited to the above-described peeling mechanism. The peeled transfer disk substrate T is removed by the transfer disk removing mechanisms 181 and 183 at the next positions. The disk Df from which the transfer disk substrate T has been removed and the transfer light-transmitting film c2 has been transferred is referred to as disk Dg. The disk Dg is transferred to the transport line 137 by the simultaneous transfer mechanisms 173 and 175, as indicated by broken line arrows in FIG. At this time, of course, the disk Df is simultaneously transferred from the transport line 137 to the peeling devices 177 and 179.

  Next, as indicated by the broken line arrow in FIG. 3, the disk Dg is transferred from the position Z of the transport line 137 to the disk mounting portion 17 a at the position Y of the transport line 17 by the simultaneous transfer mechanism 97. Here, a plurality of disk mounting portions 17a are provided at regular intervals as indicated by circles, and every other disk Dg is mounted on the disk mounting portion 17a. The injection-molded disk substrate D is transferred by the transfer mechanism 15 to the disk mounting portion 17a where the disk Dg is not mounted. Therefore, every other disk substrate D is also placed on the disk placing portion 17a. In the case of manufacturing an optical disc having two signal layers as compared with the manufacturing of an optical disc having one signal layer, the first signal layer is formed by doubling the transport speed of the transport line 17. The disk substrate and the disk Dg on which the second signal layer is formed can be alternately mounted on the disk mounting portion 17a and conveyed.

  The film forming apparatus 19 alternately forms the reflective film b1 on the first signal layer a1 of the disk substrate D shown in FIG. 4-1 (B), and as shown in FIG. 7-3 (J), A translucent second reflective film b2 made of Au, Ag, Si, Ai, Ag alloy or the like is formed on the light transmission film c2 having the second signal layer a2 in the disk Dg. The disc Dg on which the second reflective film b2 is formed is called a disc Dh. Therefore, in the transfer line 17 after the film forming apparatus 19, the disk Da and the disk Dh on which the reflection film b1 is formed on the first signal layer a1 of the disk substrate D are alternately transferred in order. As described above, the disk storage unit 20 loads the disk Da and the disk Dh onto the stacking unit 21A of the disk stacking rotary table 21 by the transfer arm 23A of the transfer mechanism 23 when a trouble or the like occurs. When the trouble is recovered, the disk Da and the disk Dh are alternately transferred from the stacking portion 21A of the disk stacking rotary table 21 to the transport line 17.

  Then, only the disk Dh is transferred to the transfer line 29 by the transfer mechanism 27 at the transfer position X of the transfer line 17 as indicated by the broken line arrow in FIG. The disk Da is conveyed on the conveyance line 17 as it is. Next, as shown in FIG. 7-3 (K), the light transmission film forming part 31 forms a light transmission film c1 serving as a cover layer on the translucent second reflection film b2. The method of forming the light transmissive film forming portion 31 and the light transmissive film c1 has already been described in detail and will not be described here. However, the light transmissive film c1 is thinner than when the signal layer is one layer, and the light transmissive film c1 This is the thickness at which the sum of c2 is approximately 100 μm. Next, as shown in FIG. 7-3 (L), a primary curing step of the light transmission film c1 is performed. Further, a secondary curing step of the light transmission film c <b> 1 is performed by the curing light irradiation device 57. The disk on which the light transmission film c1 is formed is called a disk Di. A hard coat layer is formed on the light transmission film c1 of the disk Di in the same manner as described above, and then inspected, and it is sorted out by inverting whether it is a non-defective product or a defective product. Each mechanism and operation after the light transmission film forming unit 31 has already been described in detail, and is the same as described above except that the light transmission film c1 is formed on the second reflection film b2. Is omitted. In this manner, an optical disc having two signal layers compatible with high-density recording can be manufactured.

In the embodiment described above, individual mechanisms and devices such as a cooling mechanism, a light transmission film forming unit, a curing light irradiation device, a rotation processing unit for forming an adhesive layer, a bonding mechanism, and a peeling mechanism are different. Of course, it may be used. Further, the disk storage units 20, 59, the curing light irradiation device that performs the primary curing, the water absorption prevention film forming mechanism, and the like are not necessarily required, and those having another structure may be used as necessary.

It is a figure which shows schematic structure of the whole optical disk manufacturing apparatus 200 of the best embodiment based on this invention. It is a figure which shows a part of optical disk manufacturing apparatus 200 based on this invention. It is a figure which shows a part of optical disk manufacturing apparatus 200 based on this invention. It is a figure which shows the process (A)-(E) which manufactures the optical disk corresponding to a high density recording which has one signal layer using the optical disk manufacturing apparatus 200 based on this invention. It is a figure which shows the process (F)-(H) which manufactures the optical disk corresponding to a high density recording which has one signal layer using the optical disk manufacturing apparatus 200 based on this invention. It is a figure which shows an example of the mask moving mechanism used for the optical disk manufacturing apparatus 200 concerning this invention. It is a figure which shows an example of the curing light irradiation apparatus used for the optical disk manufacturing apparatus 200 concerning this invention. It is a figure which shows the process (A)-(E) which manufactures the optical disk corresponding to a high density recording which has two signal layers using the optical disk manufacturing apparatus 200 based on this invention. It is a figure which shows process (F)-(I) which manufactures the optical disk corresponding to a high density recording which has two signal layers using the optical disk manufacturing apparatus 200 concerning this invention. It is a figure which shows the process (J)-(L) which manufactures the optical disk corresponding to a high density recording which has two signal layers using the optical disk manufacturing apparatus 200 which concerns on this invention. It is a figure which shows an example of the mounting base used with the optical disk manufacturing apparatus 200 concerning this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Injection molding machine 3 ... Disk board | substrate taking-out mechanism 5 ... Cooling mechanism 7 ... Transfer mechanism 9 ... Aging mechanism 11 ... Intermittent rotation mechanism 13 ... Front-back inversion mechanism 15. ..Transfer mechanism 17... Transfer line of the first transport mechanism 19... Deposition apparatus 20... Disc storage unit 21. Spacer supply mechanism 27: transfer mechanism 29 ... first transfer line of second transfer mechanism 31 ... light transmission film forming unit 33 ... simultaneous transfer mechanism 35 ... liquid supply mechanism 37... Rotation processing device 39... Transfer mechanism 41... Cap accumulation mechanism 42... Cap cleaning mechanism 43 and 45. Simultaneous transfer mechanism 47 and 49. ... Mask moving mechanism 53 ... Common fixing Material 55 ... Curing light irradiation device 57 ... Curing light irradiation device 58 ... Shutter member 59 ... Disc storage part 61 ... Second transport line 63 in second transport mechanism 63 ... Transfer Loading mechanism 65 ... Liquid substance supply mechanism 67 ... Rotation processing unit 69 ... Simultaneous transfer mechanism 71 ... Rotation processing device 73 ... Curing light irradiation device 75 ... Transfer mechanism 77 ... Turntable mechanism 79: Front / back reversing mechanism 81 ... Film forming apparatus 83 ... Relay stand 85 ... Transfer mechanism 87 ... Inspection section 89 ... Relay stand 91 ... Transfer mechanism 93: Non-defective product stacking mechanism 95: Defective product stacking mechanism 96: Spacer accumulating unit 97 ... Simultaneous transfer mechanism 101 ... Injection molding machine 103 ... Disc ejecting mechanism 105 ... Cooling mechanism 107 ... Transfer mechanism 109 ... Aging mechanism 111 ... Intermittent rotation mechanism 113 ... Front / back reversing mechanism 115 ... Transfer mechanism 117 ... Transfer line of transfer transfer mechanism 119 ... Light transmission film forming part 121 ... Simultaneous transfer Mechanism 123 ... Transfer mechanism 125 ... Liquid supply mechanism 127 ... Transfer mechanism 129 ... Cap storage mechanism 131 ... Cap cleaning mechanism 133 ... Transfer mechanism 135 ... Turn table mechanism 137... Transport line of third transport mechanism 139... Liquid substance supply mechanism 141... Rotation processing unit 143... Simultaneous transfer mechanism 145. ... Curing light irradiation device 151 ... Transfer mechanism 153 ... Front / back reversing mechanism 155 ... Mounting table 157 ... Transfer mechanism 159 ... Turntable mechanism 161 ... True Empty bonding apparatus 163... Transfer mechanism 165... Turntable mechanism 167... Curing light irradiation apparatus 169... Front / back reversing mechanism 171. DESCRIPTION OF SYMBOLS 179 ... Stripping apparatus 181, 183 ... Transfer disk removal mechanism Ma ... Mask member Ca ... Cap member

Claims (9)

A liquid material supply mechanism for supplying a liquid material to the disk substrate; a first rotation processing device for spreading the liquid material supplied to the disk substrate by a centrifugal force to form a light transmissive film; and the light transmissive film. A second rotation processing device for rotating the disk substrate formed thereon, a first curing light irradiation device for irradiating the disk substrate mounted on the second rotation processing device with curing light, An optical disc manufacturing apparatus comprising a second curing light irradiation device,
An annular mask made of a light shielding material that does not substantially transmit the curing light and having an inner diameter that exceeds 90% of the outer diameter of the disk substrate and an outer diameter that is larger than the outer diameter of the disk substrate Members,
When the first curing light irradiation device irradiates curing light, the mask member is moved to a set position near the surface of the disk substrate, and 90% of the light transmission film spread on the disk substrate. A mask moving mechanism that substantially prevents the curing light from being applied to the outer peripheral portion beyond the mask, and moves to another position from the set position after irradiation of the curing light;
An optical disc manufacturing apparatus comprising: In claim 1,
The optical disk manufacturing apparatus, wherein the mask moving mechanism moves the mask member to a predetermined position near the surface of the disk substrate before the second rotation processing device performs the rotation processing. In claim 1 or claim 2,
The mask moving mechanism is
A mask support for supporting the mask member;
A base portion fixed to a fixed structure;
A vertical movement part fixed to the base part and movable in a direction perpendicular to the base part to move the mask support part up and down;
A turning drive part for turning the mask support part;
An optical disc manufacturing apparatus comprising: In any one of Claims 1 thru | or 3,
Around the liquid substance supply mechanism,
A cap mounting table on which a plurality of cap members covering the center hole of the disk are mounted;
A cap transfer device that covers the cap member mounted on the cap mounting table over a central hole of the disk substrate mounted on the first rotation processing device;
Is provided,
2. The optical disk manufacturing apparatus according to claim 1, wherein the liquid material supply mechanism supplies the liquid material to the center or the vicinity of the center of the cap member covering the center hole of the disk substrate. In claim 4,
The cap transfer device replaces the cap member placed in the central hole of the disc substrate with another cap member newly placed on the cap placement table for each disc substrate. An optical disc manufacturing apparatus. In any one of Claims 1 thru | or 5,
An optical disc manufacturing apparatus, wherein a rotation processing speed of the second rotation processing device is lower than a rotation processing speed of the first rotation processing device. In any one of Claims 1 thru | or 6,
Two second rotation processing devices are provided at an equal distance from one first curing light irradiation device,
The optical disk manufacturing apparatus, wherein the first curing light irradiation apparatus alternately irradiates curing light to the disk substrate mounted on each of the two second rotation processing apparatuses. In any one of Claims 1 thru | or 7,
The second curing light irradiation device is provided above a conveyance line for conveying the disk substrate on which the light transmission film is formed,
An optical disk manufacturing apparatus comprising: a shutter member that prevents the curing light from the second curing light irradiation apparatus from being irradiated to the transport line. In any one of Claims 1 thru | or 8,
The optical disc manufacturing apparatus, wherein the disc substrate is a disc substrate on which a signal layer is formed or a transfer disc substrate on which a signal layer to be transferred is formed.

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