JP2006339581A - Fluorescent substance-containing led - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light emitting device which keeps the color rendering property more stable and is superior in heat resistance. <P>SOLUTION: The LED device containing a fluorescent substance 3 in at least a part of a molding. The fluorescent substance-containing molding contains silicone particles 4 dispersed for preventing the fluorescent substance from sedimentation. The LED device contains the silicone particles 4 and the fluorescent substance 3 mixed in the molding 6 and hence has a stable color rendering property, compared with the conventional LED device having a color rendering property varying in time. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an LED light-emitting device, and more specifically, a fluorescent material is mixed in a mold member (sealing member) by utilizing the property of a fluorescent material that shifts the wavelength of light to a longer wavelength side. The present invention relates to an LED light emitting device configured to convert an emission color.

  FIG. 3 shows the configuration of a conventional LED light emitting device of this type that contains a fluorescent material, and a translucent mold member 6 is provided to protect the LED chip 1 mounted on the package 5 from the external environment. The mold member 6 is mixed with the fluorescent material 3 in an appropriate weight ratio (for example, 0.3 to 30%). In the figure, 2 is a conductive wire.

  In such a conventional LED light-emitting device, it is possible to obtain an LED light-emitting device having a desired color rendering property by the weight ratio of the mixed fluorescent material.

  However, in the process of manufacturing such a light emitting device, it has been impossible to continuously produce a light emitting device having a stable color rendering property. Specifically, the mixed fluorescent material has a specific gravity larger than that of the translucent mold member, and therefore settles below the mold member with the passage of time. Therefore, when filling a mold member mixed with a fluorescent material into a package, the dispersion state of the fluorescent material in the mold member changes between the initial filling stage and the latter filling stage, and the originally designed color rendering property cannot be obtained. Has occurred.

  In addition, it is difficult to artificially control the sedimentation state of the fluorescent material, which causes a problem that a light-emitting device having a stable color rendering property cannot be obtained.

  Therefore, in order to obtain stable color rendering, development of a method in which a fluorescent material is uniformly dispersed without being settled in a mold member is desired.

  Accordingly, an object of the present invention is to provide a light-emitting device that eliminates the above-described drawbacks of the prior art, maintains more stable color rendering, and has excellent heat resistance.

  As a result of intensive studies in order to solve the above problems, the present inventors have obtained an LED that provides stable color rendering by dispersing silicone fine particles in a mold member (sealing member) containing a fluorescent material. The inventors have found that a light emitting device can be obtained, and have made the present invention.

Accordingly, the present invention provides a fluorescent material-containing LED light emitting device in which a fluorescent material is mixed in at least a part of a mold member, and the mold member containing the fluorescent material disperses silicone fine particles that prevent sedimentation of the fluorescent material. An LED light-emitting device containing a fluorescent material is provided. In this case, as silicone fine particles,
(I) having a specific gravity of 0.5 to 1.1 times the specific gravity of the mold member body;
(Ii) having an elastic modulus lower than that of the mold member main body,
(Iii) having a refractive index whose refractive index difference from the mold member body is within ± 50%;
(Iv) At least one of (i) to (iv) having an average particle diameter of 0.1 to 100 μm, preferably having all the characteristics, is suitably used, and silicone is used in the mold member. It is preferable that fine particles are dispersed at a concentration of 1 to 20% by mass. Furthermore, the mold member main body can be formed of an epoxy resin, a silicone resin, a urea resin, a fluororesin, or a polycarbonate resin.

  In the present invention, the mold member indicates a mold member main body, a fluorescent material, and silicone fine particles, and the mold member main body indicates a state that does not contain such a fluorescent material and silicone fine particles.

  The LED light-emitting device of the present invention is a LED light-emitting device containing a fluorescent material in which silicone fine particles are mixed together with a fluorescent material in a mold member. Conventionally, an LED light-emitting device whose color rendering properties have changed over time. On the other hand, it has stable color rendering.

  The LED light-emitting device of the present invention is an LED light-emitting device containing a fluorescent material in which a fluorescent material is mixed in at least a part of a mold member. The mold member containing the fluorescent material contains silicone fine particles that prevent sedimentation of the fluorescent material. It is something that is dispersed.

  FIG. 1 shows such an LED light emitting device containing a fluorescent material according to the present invention. This LED light emitting device includes an LED chip 1 mounted on a lead frame with a mold member 6 mixed with a fluorescent material 3. The covering is the same as that of the conventional example shown in FIG. 3 except that the silicone fine particles 4 are dispersed in the mold member 6 as an anti-settling agent.

  Here, the mold member main body 6a in which the fluorescent substance 3 and the silicone fine particles 4 are dispersed can be formed from a known sealing material, and cured with epoxy resin, silicone resin (silicone rubber, silicone gel or other organopolysiloxane) Products (including cross-linked products), urea resins, fluororesins, or polycarbonate resins.

  Moreover, a well-known thing can also be used for a fluorescent substance, for example, the YAG type fluorescent substance etc. which doped the rare earth element are common.

  The content of the fluorescent substance is preferably 0.3 to 30% by mass, particularly 0.5 to 25% by mass in the mold member.

In the present invention, silicone fine particles (that is, organopolysiloxane cured fine particles) are dispersed in the mold member.
(I) having a specific gravity of 0.5 to 1.1 times the specific gravity of the mold member body;
(Ii) having an elastic modulus lower than that of the mold member main body,
(Iii) having a refractive index whose refractive index difference from the mold member body is within ± 50%;
(Iv) At least one of (i) to (iv) having an average particle diameter of 0.1 to 100 μm, preferably having all the characteristics, is preferably used.

  Here, if the specific gravity of the silicone fine particles exceeds 1.1 times the specific gravity of the mold member, the silicone fine particles settle by their own weight, and the dispersibility in the mold member may be deteriorated. Therefore, the specific gravity of the silicone fine particles is preferably in the range of 0.5 to 1.1 times the specific gravity of the mold member. More preferably, it is 0.8 to 1.0 times.

  Further, by using silicone fine particles having a lower elastic modulus than the elastic modulus of the mold member body as the silicone fine particles, the stress of the mold member can be reduced and the heat resistance of the LED light emitting device can be improved. The crack resistance of the mold member during heating can be improved. In this case, the elastic modulus of the mold member main body is usually 1 MPa or more (for example, 1 to 10 MPa), preferably about 1 to 5 MPa, although it varies depending on the type of resin used. On the other hand, the elastic modulus of the silicone fine particles is usually about 0.1 to 5 MPa, particularly about 0.1 to 3 MPa, but the elastic modulus of the silicone fine particles is 1/10 to less than 1, more particularly 1 / less than the elastic modulus of the mold member body. It is preferably as low as about 5 to 4/5.

  With respect to the refractive index of the silicone fine particles, in order to ensure transparency with the mold member, the difference in refractive index from the mold member is preferably within ± 50%, particularly preferably within ± 20%.

Further, the average particle size of the silicone fine particles is preferably 0.1 to 100 μm, more preferably 0.2 to 50 μm, and still more preferably 0.5 to 20 μm from the viewpoint of the anti-settling property of the fluorescent substance. The average particle diameter is a value measured as a mass average value D ₅₀ (that is, a particle diameter or a median diameter when the cumulative mass is 50%) in the particle size distribution measurement by the laser light diffraction method.

  Here, the reason why the addition of the silicone fine particles prevents the sedimentation of the fluorescent material and the stable color rendering can be obtained. The silicone fine particles are silica fine particles having a larger specific gravity than the conventionally used mold members. Unlike the anti-settling agent, etc., the specific gravity is equal to or smaller than that of the mold member. Therefore, the anti-settling agent can be uniformly dispersed without settling in the mold member. For this reason, the same mixed fluorescent substance is prevented from sedimentation due to its own weight due to the presence of uniformly dispersed silicone fine particles. Accordingly, the fluorescent substance can be uniformly dispersed in the mold member, and the LED chip emission color is uniformly converted throughout the mold member, so that an LED light-emitting device having a constant color rendering property can be always obtained. It is done.

  In the present invention, as described above, in order to prevent sedimentation of the fluorescent material together with the fluorescent material in the mold member, the fine particles are precipitated by uniformly dispersing the silicone fine particles in the mold member. In this method, the fluorescent material is uniformly dispersed in the mold member. Silicone fine particles are preferably contained in the mold member in an amount of 1 to 20% by mass, particularly 2 to 10% by mass.

  The graph shown in FIG. 2 shows that the sedimentation property of the fluorescent material is dispersed in the silicone resin used as the mold member main body by changing the mixing degree of the fluorescent material (10% by mass) and the silicone fine particles, and 1 hour after the start of mixing. The degree of sedimentation of the fluorescent material was measured.

  As a result of this measurement, in the range where the contamination concentration was less than 1% by mass, the effect of the silicone fine particles as an anti-settling agent was rapidly lost and precipitation of the fluorescent substance was observed. Further, if the mixing concentration exceeds 20% by mass, the light transmittance decreases due to the shielding action by the silicone fine particles, and the luminous intensity as the LED light emitting device emitted to the outside is impaired. 20 mass% is preferable.

Next, the silicone fine particles used in the present invention will be described in more detail. The silicone fine particles used in the present invention can be selected from various types such as silicone rubber fine particles and silicone resin (polyorganosilsesquioxane resin) fine particles. Known and commercially available products can be used, but the average particle size is 0. .Silicon rubber elastic layer (core layer) and polyorganosilsesquioxane resin layer (that is, from a three-dimensional network silicone resin) obtained by coating 1-100 μm silicone rubber spherical fine particles with polyorganosilsesquioxane resin The surface layer is preferably a so-called core-shell type composite fine particle, and as a production method thereof, an alkaline substance is added to an aqueous dispersion of silicone rubber spherical fine particles having an average particle size of 0.1 to 100 μm. Alternatively, an alkaline aqueous solution and organotrialkoxysilane are added to hydrolyze the organotrialkoxysilane. It is preferable to carry out a decomposition condensation reaction, and by this method, a product suitable for the present invention can be produced. This silicone rubber spherical fine particle has the following general formula (1)
-(R ¹ ₂ SiO) _a- (1)
Wherein R ¹ is an alkyl group such as a methyl group, an ethyl group, a propyl group or a butyl group, an aryl group such as a phenyl group or a tolyl group, an alkenyl group such as a vinyl group or an allyl group, a β-phenylethyl group, a β -Aralkyl groups such as phenylpropyl group, monovalent halogenated hydrocarbon groups such as chloromethyl group, 3,3,3-trifluoropropyl group, and further epoxy group, amino group, mercapto group, acryloxy group, methacryloxy group, etc. It is preferable that 90 mol% or more is a methyl group in which 1 type or 2 types or more of monovalent groups having 1 to 20 carbon atoms are selected from organic groups containing reactive groups. If the ratio is less than 5, the characteristics of the linear organopolysiloxane cannot be sufficiently obtained, so that the effects of lowering internal stress and improving lubricity cannot be obtained sufficiently. However, if it is actually larger than 5,000, it becomes difficult to produce silicone rubber spherical fine particles. Therefore, a is a linear organopolysiloxane block represented by a number of 5 to 5,000, preferably 10 to 1,000. It consists of a spherical cured product with rubber elasticity of molecules having

  In addition, the silicone rubber spherical fine particles may contain silicone oil, organosilane, inorganic powder, organic powder, etc. in the particles, but the spherical fine particles have a particle size of less than 0.1 μm. The fluidity becomes low, the cohesiveness becomes high, and if it exceeds 100 μm, the moldability of the epoxy resin and the properties of the epoxy resin may be impaired. Therefore, the average particle diameter of the spherical fine particles may be 0.1 to 100 μm. A more preferable range is 1 to 30 μm.

（式中、Ｒ¹は上記と同じ、ｂ及びｃは０、１、２又は３、かつｂ＋ｃ＝３であり、ｄは正数、ｅは０又は正数、かつ２ｂ＋ｅ≧２である。）

（式中、Ｒ¹は上記と同じ、ｆは２以上の整数、ｇは０又は正の整数、かつｆ＋ｇ＝４〜８である。）

（式中、Ｒ¹は上記と同じ、ｈは１、２又は３、ｉは０、１又は２、かつｈ＋ｉ＝３であり、ｊ、ｋ及びＬは正数である。）
などで示されるものが挙げられるが、上述したようにビニル基を２個以上有するものである。 As a crosslinking method in the production of the silicone rubber spherical fine particles, a condensation reaction of a methoxysilyl group (≡SiOCH ₃ ) and a hydroxysilyl group (≡SiOH), a mercaptosilyl group (≡SiSH) and a vinylsilyl group (≡SiCH═CH ₂ )), radical reaction with vinylsilyl group (≡SiCH═CH ₂ ) and ≡SiH group, etc. are exemplified, but from the viewpoint of reactivity and reaction process, the reaction by addition reaction is preferable. For this, it is preferable to use a composition in which (a) a vinyl group-containing organopolysiloxane and (b) an organohydrogenpolysiloxane are added and reacted in the presence of (c) a platinum-based catalyst. The component (a) is a main component of organopolysiloxane that gives the silicone rubber spherical fine particles, and is a component that is cured by addition reaction with the component (b) by the catalytic action of the component (c). The component (a) needs to have at least two vinyl groups bonded to silicon atoms in one molecule, and these vinyl groups may exist in any part of the molecule, but exist at least at the end of the molecule. It is preferable. Examples of the organic group bonded to the silicon atom other than the vinyl group include those selected from the same monovalent organic groups as those described above for R ^1, and 90 mol% or more of them is preferably a methyl group. Further, the molecular structure of this component may be linear or a mixture of a small amount of branches, and the molecular weight of this component is not particularly limited. As the component (a), for example, the following general formula

(Wherein R ¹ is the same as above, b and c are 0, 1, 2 or 3, and b + c = 3, d is a positive number, e is 0 or a positive number, and 2b + e ≧ 2.)

(In the formula, R ¹ is the same as above, f is an integer of 2 or more, g is 0 or a positive integer, and f + g = 4 to 8).

(In the formula, R ¹ is the same as above, h is 1, 2 or 3, i is 0, 1 or 2, and h + i = 3, and j, k and L are positive numbers.)
As mentioned above, it has two or more vinyl groups.

Next, the component (b) is a crosslinking agent of the component (a), and the hydrogen atom (SiH group) bonded to the silicon atom in the component is converted into the component (a) by the catalytic action of the component (c). Cures by addition reaction with vinyl group. Therefore, the component (b) needs to have at least two hydrogen atoms bonded to a silicon atom in one molecule, and the organic group bonded to the silicon atom other than the hydrogen atom is the same as the above-described R ¹ . Although it is selected from monovalent organic groups, it is preferable that 90 mol% or more thereof is a methyl group. The molecular structure of the component (b) is not particularly limited, and may be linear, branched or cyclic, or a mixture thereof, and the molecular weight is not particularly limited, In order to improve the compatibility with the component (a), the viscosity at 25 ° C. is preferably 1 to 10,000 mPa · s.

（式中、Ｒ¹は上記と同じ、ｍは０又は１、ｎは２又は３、かつｍ＋ｎ＝３であり、ｐは０又は正数、ｑは０又は正数、かつ２ｍ＋ｑ≧２である。）

（式中、Ｒ¹は上記と同じ、ｒは２以上の整数、ｓは０又は正の整数、かつｒ＋ｓ＝４〜８である。）

（式中、Ｒ¹は上記と同じ、ｔは１、２又は３、ｕは０、１又は２、かつｔ＋ｕ＝３であり、ｖ、ｗ及びｘは正数である。）
などで示されるものが挙げられるが、ＳｉＨ基を２個以上、特に３個以上有するものである。 In addition, when the amount of this component is such that the number of hydrogen atoms bonded to the silicon atom of this component is less than 0.5 per one vinyl group in component (a), good curability is obtained. When the amount is more than 20 hydrogen atoms, the physical properties of the rubber after curing deteriorate, so that 0.5 to 20 hydrogen atoms, preferably 0.5 to 5 hydrogen atoms. It may be the amount that becomes. As the component (b), for example, the following general formula

(In the formula, R ¹ is the same as above, m is 0 or 1, n is 2 or 3, and m + n = 3, p is 0 or a positive number, q is 0 or a positive number, and 2m + q ≧ 2. .)

(In the formula, R ¹ is the same as above, r is an integer of 2 or more, s is 0 or a positive integer, and r + s = 4 to 8).

(In the formula, R ¹ is the same as above, t is 1, 2 or 3, u is 0, 1 or 2, and t + u = 3, and v, w and x are positive numbers.)
And the like are those having 2 or more, particularly 3 or more SiH groups.

  Component (c) is a catalyst for addition reaction of a vinyl group bonded to a silicon atom and a hydrogen atom bonded to a silicon atom. For example, platinum-supported carbon or silica, chloroplatinic acid, platinum-olefin complex, platinum-alcohol Complexes, platinum-phosphorus complexes, platinum coordination compounds and the like can be mentioned. The amount of this component used is less than 1 ppm of platinum atoms relative to component (a), and curing is slow and susceptible to the effects of catalyst poisons. This is not preferable in terms of economy because it cannot be performed, and a range of 1 to 100 ppm is preferable.

  Silicone rubber spherical fine particles can be produced by forming spherical fine particles when the component (a) is reacted with the component (b) in the presence of the component (c) and cured. There are a method of curing a mixture of the component, the component (b) and the component (c) in high temperature spray drying, a method of curing in an organic solvent, a method of curing after making an emulsion mixture, and the like. Among these, in the production of the silicone fine particles used in the present invention, it is preferable to use the silicone rubber spherical fine particles as an aqueous dispersion. Therefore, it is preferable to use a method in which the mixture is made into an emulsion and then cured in the emulsion particles. . In this method, first, an organopolysiloxane composition is prepared by mixing a predetermined amount of the above-described vinyl group-containing organopolysiloxane as the component (a) and the organohydrogenpolysiloxane as the component (b). Water and a surfactant are added to the resulting composition, and this is emulsified using a commercially available homomixer or the like. As the surfactant used here, nonionic surfactants such as polyoxyethylene alkylphenyl ether, polyoxyethylene alkyl ether, polyoxyethylene sorbitan fatty acid ester and glycerin fatty acid ester which have little adverse effect on the curing reaction are used. It is preferable to select.

  If the addition amount of the surfactant is less than 0.01 parts by mass with respect to 100 parts by mass of the emulsion, fine particles cannot be formed. If the addition amount is more than 20 parts by mass, the polyorganosilsesquioxane in the later step described later is used. Since it becomes difficult to coat the resin, the range of 0.01 to 20 parts by mass is necessary, but a preferable range is 0.05 to 10 parts by mass.

  In addition, the content of the vinyl group-containing organopolysiloxane as the component (a) and the organohydrogenpolysiloxane as the component (b) in the emulsion is less than 1 part by mass in 100 parts by mass of the emulsion. It becomes disadvantageous efficiently, and if it exceeds 80 parts by mass, it becomes impossible to make an emulsion of independent cured particles, so it is in the range of 1 to 80 parts by mass, more preferably in the range of 10 to 60 parts by mass. Is good. When the silicone rubber spherical fine particles contain silicone oil, silane, inorganic powder, organic powder, etc., the organopolysiloxane comprising the components (a) and (b) These may be mixed in the composition.

  The emulsion thus prepared is then added to a platinum-based catalyst as the component (c) to cure the organopolysiloxane to obtain a dispersion of a cured silicone rubber. A known reaction control agent may be added to the platinum-based catalyst, and when the platinum-based catalyst and the reaction control agent are difficult to disperse in water, it becomes possible to disperse in water using a surfactant. After that, it may be added. Thus, by curing organopolysiloxane with a catalyst, an aqueous dispersion of spherical silicone rubber fine particles having an average particle size of 0.1 to 100 μm can be obtained.

As the silicone fine particles used in the present invention, those obtained by coating the silicone rubber spherical fine particles with a polyorganosilsesquioxane resin are preferably used. The polyorganosilsesquioxane is represented by the following general formula (2).
R ² SiO _3/2 (2)
It is a resinous polymer having a siloxane unit represented by R ^{2 in} this formula is an alkyl group such as a methyl group, an ethyl group, a propyl group or a butyl group, an aryl group such as a phenyl group or a tolyl group, an alkenyl group such as a vinyl group or an allyl group, a β-phenylethyl group, a β -Aralkyl groups such as phenylpropyl group, monovalent halogenated hydrocarbon groups such as chloromethyl group, 3,3,3-trifluoropropyl group, and further epoxy group, amino group, mercapto group, acryloxy group, methacryloxy group, etc. It is a C1-C20 organic group which consists of 1 type, or 2 or more types selected from the monovalent organic group which has these reactive groups. In addition, it is preferable that 50 mol% or more of this R ² is a methyl group. In addition to the above R ² SiO _3/2 unit, a small amount of R ² ₂ SiO _2/2 unit is within the range not impairing its covering property. , R ² ₃ SiO _1/2 units and SiO ₂ units may be contained.

The polyorganosilsesquioxane resin may be uniformly coated on the entire surface of the silicone rubber spherical fine particles, or may be partially coated on the surface. When the amount is less than 1 part by mass with respect to 100 parts by mass of the silicone rubber spherical fine particles, the flowability and dispersibility of the silicone fine particles obtained and the dispersibility in the resin composition of the present invention are poor. Since the characteristics of the rubber spherical fine particles, that is, the effect of reducing the stress cannot be sufficiently exhibited, it is necessary to set the amount to 1 to 500 parts by mass, preferably 5 to 100 parts by mass.
In addition, a well-known method can be employ | adopted as a method of coat | covering a silicone rubber spherical fine particle with a polyorgano silsesquioxane resin.

  Next, the present invention will be described in detail using examples and comparative examples, but the present invention is not limited to the examples.

[Examples 1 to 6]
As shown in FIG. 1, the LED chip used was a blue light emitting device having an emission wavelength of 430 nm, and three LED light emitting devices were formed in the package opening by sealing and curing with a silicone resin to form a mold member. In the silicone resin mold member main body, 3% by mass of a fluorescent substance and silicone fine particles (specific gravity equivalent to that of silicone resin) are dispersed and mixed at 3% by mass as an anti-settling agent (Example 1). Similarly, Examples 2 to 6 were prepared by dispersing and mixing at 1, 6, 9, 12, and 18% by mass, except for the mass ratio of the anti-settling agent.

Here, the silicone fine particle used is a silicone rubber elastic layer (core layer) coated with a polyorganosilsesquioxane resin layer, and has the following properties.
Average particle size: 0.8 μm
Specific gravity: 1.01
Elastic modulus: 1 MPa
Refractive index: 1.41 (25 ° C.)
On the other hand, the specific gravity of the silicone resin mold member main body was 1.02, the elastic modulus was 2 MPa, and the refractive index was 1.41 (25 ° C.).

[Comparative example]
A light emitting device was formed in the same manner as in the example except that no anti-settling agent was added when forming the mold member.

  In order to evaluate the color rendering properties of the produced light emitting devices, the chromaticity of each light emitting device was measured by Otsuka Electronics (LP-3400) (Table 1). Further, in order to evaluate the reliability of the LED light emitting device at a high temperature, IR reflow at 260 ° C. was performed, and an appearance inspection of the mold member was performed (Table 2).

  Table 1 shows the results of comparing the chromaticities of the light emitting devices of Examples 1 to 6 and the light emitting device of the comparative example. From Table 1, in the case of Examples 1-6, the shift | offset | difference of big chromaticity did not arise in each light-emitting device. In the comparative example, the chromaticity of the three light emitting devices is greatly different. Therefore, according to the present invention, the color rendering can be stabilized by mixing the silicone fine particles as an anti-settling agent.

  Table 2 shows the results of evaluating the reliability at high temperatures with the light emitting devices of Examples 1 to 6 and the light emitting device of the comparative example. From Table 2, in the case of Examples 1-6, appearance defects, such as a crack of a mold member and peeling of a mold member and a package, did not occur in each light emitting device. Moreover, in the comparative example, cracks in the mold member occurred in some devices, and stable reliability during high temperature overheating could not be obtained.

It is sectional drawing which shows typically embodiment of the LED light-emitting device containing a fluorescent substance which concerns on this invention. It is a figure which shows the relationship between a sedimentation inhibitor concentration and the sedimentation degree of a fluorescent substance. It is sectional drawing which shows a prior art example typically.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 LED chip 2 Conductive wire 3 Fluorescent substance 4 Silicone fine particle 5 Package 6 Mold member

Claims (7)

  In an LED light-emitting device containing a fluorescent material in which a fluorescent material is mixed in at least a part of the mold member, the mold member containing the fluorescent material has dispersed therein silicone fine particles that prevent sedimentation of the fluorescent material. LED light emitting device containing fluorescent material.   The light emitting device according to claim 1, wherein silicone fine particles having a specific gravity of 0.5 to 1.1 times the specific gravity of the mold member main body are dispersed.   The light-emitting device according to claim 1, wherein silicone fine particles having a low elastic modulus relative to an elastic modulus of the mold member main body are dispersed.   The light-emitting device according to claim 1, 2, or 3, wherein silicone fine particles having a refractive index difference with respect to the mold member main body within ± 50% are dispersed.   The light-emitting device according to claim 1, wherein silicone fine particles having an average particle diameter of 0.1 to 100 μm are dispersed in the mold member.   The light emitting device according to any one of claims 1 to 5, wherein the mold member has the silicone fine particles dispersed therein at a concentration of 1 to 20% by mass.   The light emitting device according to any one of claims 1 to 6, wherein the mold member body is made of an epoxy resin, a silicone resin, a urea resin, a fluororesin, or a polycarbonate resin.

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