JP2006339263A - Z-axis adjustment mechanism and micromotion stage - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a Z-axis adjustment mechanism for improving stiffness in a Z-axis direction, and to provide a micromotion stage utilizing the Z-axis adjustment mechanism. <P>SOLUTION: The Z-axis adjustment mechanism 22 supports a stage 25 arranged on a base plate 21, and adjusts the arrangement relationship to the base plate of the stage in a Z-axis direction orthogonally crossing a main surface 21a of the base plate. The Z-axis adjustment mechanism 22 comprises a piezo actuator P4 that is arranged vertically on the base plate and expands and contracts in a Z-axis direction; a base member 50 that has a guide 52 extended in a Z-axis direction and is fixed on the main surface; and a support member 80 that is mounted to the tip of the piezo actuator and supports the stage, and then is slidably mounted to the guide in a Z-axis direction. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a Z-axis adjustment mechanism and a fine movement stage device using the Z-axis adjustment mechanism.

2. Description of the Related Art In an electron beam exposure apparatus that processes a semiconductor wafer or the like, a stage apparatus is employed for three-dimensionally adjusting the positional relationship of the wafer with respect to the mask. The stage apparatus is configured such that a fine movement stage apparatus that performs positioning of about several nanometers to 10 nm is disposed on a coarse movement stage apparatus that operates during transfer for wafer positioning or movement between chips. Since this fine movement stage device needs to be made of a non-magnetic material that operates at high vacuum (10 ⁻⁴ Pa), a piezo actuator is used as a drive mechanism.

  The fine movement stage device requires not only the wafer position adjustment in the horizontal plane but also the function of adjusting the position of the wafer relative to the mask in the Z-axis direction. In the electron beam exposure apparatus, the distance between the mask and the wafer is specified. Therefore, while the height in the Z-axis direction is limited, an actuator having a long stroke length is required because a large amount of displacement is required for adjusting the wafer position.

As a fine movement stage device that satisfies such a requirement, for example, a device described in Patent Document 1 is known. As shown in FIG. 6, in the Z-axis adjusting mechanisms 111 to 113 described in Patent Document 1, the expansion and contraction of the piezo actuator P <b> 5 arranged horizontally on the base plate 100 is converted in the Z-axis direction by the orthogonal conversion mechanism 120. . Accordingly, the height of the tilt hinge H provided on the orthogonal transformation mechanism 120 is adjusted according to the expansion and contraction of the piezo actuator P5, and the height and tilt of the stage supported by the tilt hinge H are adjusted. In this way, by placing the piezo actuator P5 sideways, a large movement stroke can be obtained, while miniaturization in the Z-axis direction is achieved.
JP 2004-363554 A

  In the fine movement stage device, the rigidity of each element on the path through which the drive stroke of the piezo actuator is transmitted to the stage affects the rigidity of the fine movement stage device in the Z-axis direction. In the conventional fine movement stage device, as shown in FIG. 6, since the piezo actuator P5 is placed horizontally on the base plate 100 and the orthogonal transformation mechanism is interposed, the components included in the orthogonal transformation mechanism (45 ° inclined surface is provided). A pair of guides, rollers, and structures that house them) affect the rigidity in the Z-axis direction. As a result, there is a possibility that the rigidity in the Z-axis direction is lowered, and the stop stability of the wafer mounting stage is also lowered.

  Accordingly, an object of the present invention is to provide a Z-axis adjusting mechanism in which the rigidity in the Z-axis direction is improved and a fine movement stage device using the same.

  A Z-axis adjustment mechanism according to the present invention is a Z-axis adjustment mechanism that supports a stage arranged on a base plate and adjusts the arrangement relationship of the stage with respect to the base plate in the Z-axis direction orthogonal to the main surface of the base plate. The piezo actuator is vertically placed on the base plate and has a piezo actuator that expands and contracts in the Z-axis direction, a guide portion that extends in the Z-axis direction, a base member that is fixed to the main surface, and is attached to the tip of the piezo actuator. And a support member that supports the stage and is slidably attached to the guide portion in the Z-axis direction.

  In the above configuration, since the piezo actuator is vertically placed in the Z-axis direction and expands and contracts in the Z-axis direction, the support member slides along the guide portion in the Z-axis direction according to the expansion and contraction of the piezo actuator. Thereby, it is possible to adjust the arrangement relationship of the base plates of the stage supported by the support member. Since the expansion / contraction direction of the piezo actuator and the Z-axis direction substantially coincide with each other as described above, for example, a mechanism for converting the expansion / contraction direction to the Z-axis direction is not required. As a result, it is possible to improve the rigidity of the Z-axis adjusting mechanism in the Z-axis direction.

  By the way, by placing the piezo actuator vertically and supporting the stage, a load is applied to the piezo actuator in a direction orthogonal to the Z axis, which has not occurred in the past. On the other hand, in the Z-axis adjusting mechanism having the above-described configuration, the support member is attached to the base member via the guide portion, so that the guide portion and the base member also receive a load generated in a direction perpendicular to the Z-axis. Become. As a result, the load on the piezoelectric actuator is reduced, and the piezoelectric actuator is protected.

  Furthermore, it is preferable that the Z-axis adjusting mechanism according to the present invention further includes attachment means for connecting the tip portion of the piezoelectric actuator and the support member. Since the piezo actuator and the support member are connected by the attachment means, the support member moves in the Z-axis direction reliably and with good responsiveness according to the expansion and contraction of the piezo actuator.

  In the Z-axis adjustment mechanism according to the present invention, it is also effective to further include a tilt hinge provided on the support member, and the support member supports the stage via the tilt hinge.

  Furthermore, it is preferable that the Z-axis adjusting mechanism according to the present invention further includes a position adjusting unit that holds the piezo actuator and adjusts the position of the piezo actuator in the Z-axis direction.

  In the above configuration, after the position of the piezo actuator in the Z-axis direction is adjusted by the position adjusting means, the piezo actuator is further expanded and contracted to further widen the movement range of the support member. For example, when a plurality of Z-axis adjusting mechanisms are provided on the base plate, the stage can be made substantially parallel to the base plate by using the position adjusting means.

  Furthermore, the position adjusting means of the Z-axis adjusting mechanism according to the present invention is disposed between the adjuster plate that holds the piezo actuator, the adjuster plate and the base plate, and is screwed into one of the adjuster plate and the base plate. And an adjuster bolt having an end.

  In this case, the distance between the adjuster plate and the base plate can be adjusted by rotating the adjuster bolt, and as a result, the position of the piezo actuator in the Z-axis direction can be adjusted.

  The Z-axis adjusting mechanism further includes a piezo case having a housing portion that houses the piezo actuator and a projecting portion that projects outward from the tip of the housing portion, and the adjuster plate is connected to the piezo actuator via the piezo case. The adjuster plate is preferably disposed between the projecting portion and the base plate and is fixed to the projecting portion via a shim.

  As described above, the piezo actuator can be reliably protected by fixing the piezo case and the adjuster plate with the shim interposed therebetween.

  Furthermore, the fine movement stage device according to the present invention is characterized in that a plurality of the Z-axis adjusting mechanisms according to the present invention described above are provided on the base plate. Thereby, not only the position of the stage in the Z-axis direction but also the tilt of the stage can be adjusted.

  Furthermore, in the fine movement stage device according to the present invention, a plurality of Z-axis adjustment mechanisms according to the present invention having adjuster bolts are provided on the base plate, and at least one Z-axis adjustment mechanism among the plurality of Z-axis adjustment mechanisms is provided. It is preferable that the adjuster bolt to be provided faces the outside of the base plate with respect to the base member. Thereby, not only the position of the stage in the Z-axis direction but also the tilt of the stage can be adjusted. Further, since the adjuster bolt faces outward, it is easy to adjust the position of the piezo actuator in the Z-axis direction using the adjuster bolt.

  According to the Z-axis adjusting mechanism of the present invention, it is possible to improve the rigidity in the Z-axis direction. Further, according to the fine movement stage device using the Z-axis adjustment mechanism, the rigidity in the Z-axis direction is improved, and the stop stability in the X-axis direction and the Y-axis direction orthogonal to the Z-axis direction of the stage is improved. Can be planned.

  A preferred embodiment of a Z-axis adjustment mechanism and a fine movement stage device using the same according to the present invention will be described below with reference to the drawings. In the description of the drawings, the same components are denoted by the same reference numerals, and redundant description is omitted.

As shown in FIG. 1, the stage apparatus 1 is applied to an electron beam exposure apparatus for processing a semiconductor wafer (hereinafter simply referred to as “wafer”) W. Therefore, each component constituting the stage apparatus 1 is made of a nonmagnetic material that can be suitably applied in a high vacuum (10 ⁻⁴ Pa) environment. In the electron beam exposure apparatus, the wafer W is processed by exposing the wafer W with an electron beam through a mask (not shown). In order to process the wafer W into a desired shape, the stage apparatus 1 adjusts the positional relationship of the wafer W with respect to the mask.

  The stage apparatus 1 includes a coarse movement stage apparatus 10 that adjusts the position of the wafer W with a large stroke in the X-axis direction and the Y-axis direction shown in FIG. The coarse movement stage apparatus 10 includes an X table 13 provided on a base plate 11 and movable along a pair of guides 12 and 12 extending in the X-axis direction, and a pair of guides 14 provided on the X table 13 and extending in the Y-axis direction. , 14 and a Y table 15 movable along the line 14. The coarse stage device 10 moves the X table 13 in the X-axis direction with respect to the base plate 11 and moves the Y table 15 in the Y-axis direction with respect to the X table 13 to thereby move the wafer W in the XY plane. The position is adjusted with a large stroke in the X-axis direction and the Y-axis direction. The positional relationship between the X table 13 and the Y table 15 may be reversed. Each component of coarse movement stage device 10 is made of a non-magnetic material that is suitable for a high vacuum environment and has high specific rigidity.

  On the Y table 15 of the coarse movement stage apparatus 10, a part of the stage apparatus 1 is configured, and a fine movement stage apparatus 20 for finely adjusting the positional relationship of the wafer W with respect to the mask is provided.

  The fine movement stage device 20 is configured such that a wafer mounting stage 25 is arranged on a main surface 21 a of a base plate 21 via three Z-axis adjusting mechanisms 22, 23, 24, and the base plate 21 is fixed to the Y table 15. As a result, it is mounted on the coarse movement stage device 10. The stage 25 translates the wafer W in the X axis direction and the Y axis direction and rotates it around the Z axis. In the present embodiment, a three-dimensional coordinate system is set with the direction orthogonal to the main surface 21a, which is the surface on the stage 25 side, of the base plate 21 as the Z-axis direction.

  As shown in FIGS. 1 and 2, the stage 25 includes a tilt plate 30 having an opening 31 penetrating in the center in the Z-axis direction, an XY plate 41 having the same shape as the opening 31, and a wafer W. And a top table 42 for mounting. The XY plate 41 is fixed to the lower surface of the top table 42, and the stage 25 is assembled by inserting the XY plate 41 into the opening 31.

  The tilt plate 30 is provided with a piezo actuator P1 extending in the Y-axis direction and piezo actuators P2 and P3 extending in the X-axis direction, and the end portions of the piezo actuators P1 to P3 on the opening 31 side. Is held in contact with the XY plate 41 to hold the XY plate 41.

  In this configuration, by driving the piezo actuators P1 to P3, the XY plate 41 can be translated in the X-axis direction and the Y-axis direction, and further, can be rotated around the Z-axis. is there. As a result, fine adjustment of the position of the wafer W mounted on the top table 42 with respect to the X-axis direction and the Y-axis direction and fine adjustment of the position around the Z-axis are possible.

  The Z-axis adjusting mechanisms 22 to 24 supporting the stage 25 adjust the positional relationship of the wafer W with respect to the mask in the Z-axis direction.

  As shown in FIGS. 1 and 3 to 5, the Z-axis adjusting mechanism 22 has a base member 50 fixed to the main surface 21 a of the base plate 21, and the base member 50 is a plate erected on the base plate 21. The guide member 51 has a shape. A stepped recess 51a is formed in the guide member 51, and a linear guide (guide portion) 52 that extends in the Z-axis direction and constitutes a part of the base member 50 is fixed in the stepped recess 51a. ing.

  The base member 50 has a pair of fixing arm portions extending from two corners of the guide member 51 on the base plate 21 side along the base plate 21 in a direction perpendicular to the guide member 51 (Y-axis direction in FIG. 4). 53, 53. Each fixing arm portion 53 has a first portion 53a and a second portion 53b having different lengths (heights) in the Z-axis direction, and an adjuster plate, which will be described later, is disposed on the wall surface of the first portion 53a. A screw hole for fixing 71 is formed. The fixing arm 53 and the guide member 51 are integrally formed from a nonmagnetic material (for example, alumina) that is suitable for a high vacuum environment and has high specific rigidity.

  A columnar piezo actuator P4 fixed to the piezo case 60 is disposed between the pair of fixing arm portions 53, 53. The piezo actuator P4 is provided with respect to the base plate 21 so that the extending direction thereof coincides with the Z-axis direction, and expands and contracts in the Z-axis direction by a piezo effect. The maximum stroke length of the piezo actuator P4 is, for example, about 100 μm. Thus, the fact that the extending direction is provided with respect to the base plate 21 so as to coincide with the Z-axis direction is also referred to as “vertical placement”.

  The piezo case 60 is made of, for example, a nonmagnetic material (for example, alumina) that is suitable for a high vacuum environment and has high specific rigidity, and a housing portion 61 that extends in the Z-axis direction for housing the piezo actuator P4. And a plate-like projecting portion 62 projecting outward from the upper end portion of the housing portion 61. In the accommodating portion 61, the curvature of the inner surface 61a forming the accommodating space of the piezo actuator P4 is substantially equal to the curvature of the outer surface of the piezo actuator P4, and the outer surface of the piezo actuator P4 and the inner surface 61a of the accommodating portion 61 are in contact with each other. The piezo actuator P4 is fixed to the piezo case 60 by, for example, being screwed to the bottom of the housing portion 61.

  An opening 21b penetrating in the Z-axis direction is formed in the base plate 21 between the fixing arm portions 53 and 53, and the piezo actuator P4 accommodated in the piezo case 60 is disposed in the opening 21b. . As a result, the distance between the base plate 21 and the tilt plate 30 can be used within the electron beam exposure apparatus even when the piezo actuator P4 having a maximum stroke length of about 100 μm is placed vertically. Note that the length of the piezo actuator P4 protruding from the back surface side of the base plate 21 may be as long as it does not reach the X table 13.

  The piezo actuator P4 fixed to the piezo case 60 is fixed to the base plate 21 via the position adjusting means 70 for adjusting the position of the piezo actuator P4 in the Z-axis direction and the fixing arm portion 53.

  The position adjusting means 70 is an adjuster plate 71 screwed to the back surface side (base plate 11 side) of the overhang portion 62 of the piezo case 60 and an adjuster for adjusting the height (position in the Z-axis direction) of the adjuster plate 71. And a bolt 72.

  The adjuster plate 71 has substantially the same width as the width of the base member 50 (the length in the X-axis direction in FIG. 4), and has a base portion 71 a provided with a recess that receives the housing portion 61 of the piezo case 60. The base portion 71a is disposed on the back side of the overhang portion 62 and outside the first portion 53a of the fixing arm portion 53 (that is, on the second portion 53b). It is screwed to the base member 50 using a screw hole formed in the wall surface of 53a. The piezo case 60 is fixed to the base portion 71a by, for example, screwing the protruding portion 62 to the adjuster plate 71 fixed to the base member 50, and the piezo actuator P4 is held by the adjuster plate 71. .

  The adjuster plate 71 has a protruding portion 71b that protrudes outward from the central portion of the base portion 71a. An adjuster bolt 72 is disposed between the protruding portion 71 b and the main surface 21 a of the base plate 21. An end 72 a of the adjuster bolt 72 is screwed into a hole 71 c formed on the back surface side of the protrusion 71 b, and the other end 72 b is in contact with the base plate 21. Therefore, by rotating the adjuster bolt 72, the height of the adjuster plate 71 in the Z-axis direction can be changed. The height of the piezoelectric actuator P in the Z-axis direction can be adjusted by fixing the adjuster plate 71 to the base member 50 at a desired height position.

  In order to more accurately adjust the position of the piezo actuator P4 by the position adjusting means 70, when the base 71a and the overhang 62 are fixed using, for example, screws, the base 71a and the overhang It is preferable to insert a gap adjusting shim C between the first and second members 62. The adjustment shim C has a thin plate shape, and is formed of phosphor bronze, for example.

  If the center line of the piezo actuator P4 and the center line of the housing portion 61 (the line connecting the center of curvature of the inner surface) do not necessarily match due to manufacturing errors of the piezo actuator P4 or the piezo case 60, the center line of the piezo actuator P4 If the piezo actuator P4 is arranged so as to coincide with the Z-axis, the piezo case 60 is inclined with respect to the adjuster plate 71, and a gap may be generated between the lower surface of the overhanging portion 62 and the upper surface of the base portion 71a. In such a case, if the gap is forcibly filled, the piezo actuator P4 may be damaged.

  On the other hand, the piezoelectric actuator P4 can be protected by using the shim C as described above.

  In addition, a slide bracket 80 as a support member for supporting the stage 25 is fixed to the distal end portion of the piezo actuator P4 using a clamp-type attachment means 90. The slide bracket 80 includes an upper wall portion 81 that supports the tilt plate 30 via a tilt hinge H provided on an upper surface thereof, a pair of side wall portions 82 that are erected downward from the upper wall portion 81 and face each other, and an upper wall. The rear wall portion 83 extends downward so as to connect the portion 81 and the side wall portion 82.

  A mounting member receiver 91 is integrally fixed to the inner surface of the upper wall 81 inside the slide bracket 80. The attachment member receiver 91 constitutes attachment means 90 together with a pair of attachment members 92. The attachment member receiver 91 and the attachment member 92 are made of phosphor bronze, for example. The attachment means 90 sandwiches the distal end portion (movable part) of the piezo actuator P4 between the attachment member 92 and the attachment member receiver 91, and screws the attachment member 92 to the attachment member receiver 91, whereby the piezo actuator P4 is attached to the slide bracket 80. To fix.

  Thus, since the piezo actuator P4 is fixed by screwing the attachment member 91 to the attachment member receiver 92, the slide bracket 80 is surely and responsive in the Z-axis direction according to the expansion and contraction of the piezo actuator P4. Will rise or fall. Further, since the piezo actuator P4 and the slide bracket 80 are detachable by using the attachment means 90, for example, even when the piezo actuator P4 fails, the piezo actuator P4 can be easily replaced.

  Further, a slider S is fixed to the rear surface side (guide member 51 side) of the rear wall portion 83. The slider S is attached to the linear guide 52 so as to be slidable in the Z-axis direction by, for example, a roller. Thus, the slide bracket 80 slides in the Z-axis direction while being guided by the linear guide 52 in accordance with the expansion and contraction of the piezo actuator P4.

  The configurations of the Z-axis adjustment mechanisms 23 and 24 are the same as the configuration of the Z-axis adjustment mechanism 22, and thus the description thereof is omitted. In the fine movement stage device 20, the Z-axis adjusting mechanisms 22 to 24 are arranged at the edge of the base plate 21 so that the adjuster bolts 72 face outward as shown in FIG. Thereby, since the adjuster bolt 72 can be easily rotated, the position of the piezo actuator P4 in the Z-axis direction can be easily adjusted.

  Since the tilt plate 30 is supported at three locations using the three Z-axis adjusting mechanisms 22 to 24, the stage 25 is moved to the Z-axis when the piezo actuator P4 of the Z-axis adjusting mechanisms 22 to 24 is driven with the same stroke. Translate in the direction. Further, by adjusting the amount of displacement of the Z-axis adjusting mechanisms 22 to 24, the stage 25 performs a rotational motion around the X axis and a rotational motion around the Y axis, so that the tilt of the stage 25 can be finely adjusted.

  Next, a stage adjustment method in the Z-axis direction by the fine movement stage device 20 will be described. First, the stage 25 is placed on the tilt hinge H of the three Z-axis adjusting mechanisms 22 to 24 provided on the base plate 21, and is fixed by a set screw.

  Next, the adjuster bolt 72 included in each of the Z-axis adjusting mechanisms 22 to 24 is turned to make the stage 25 horizontal (a state parallel to the XY plane). Then, the adjuster plate 71 is fixed to the first portion 53a in a state where the stage 25 is horizontal. As a result, the piezo actuator P4 is fixed to the base plate 21. Normally, this horizontal adjustment may be performed when the fine movement stage device 20 is assembled.

  Then, the positional relationship of the stage 25 with respect to the base plate 21 is finely adjusted so that the stage 25 is parallel to the mask by applying a voltage to the piezoelectric actuator P4 of each of the Z-axis adjusting mechanisms 22 to 24 to expand and contract. Since the three Z-axis adjusting mechanisms 22 to 24 are provided, the height and the tilt can be adjusted by each Z-axis adjusting mechanism 22 to 24.

  In the fine movement stage device 20 using the Z-axis adjusting mechanisms 22 to 24, the piezo actuator P4 of the Z-axis adjusting mechanisms 22 to 24 is placed vertically on the base plate 21 and expands and contracts in the Z-axis direction. Therefore, unlike the conventional Z-axis adjustment mechanisms 111 to 113 shown in FIG. 6, the orthogonal conversion mechanism 120 that converts the expansion and contraction of the piezoelectric actuator P5 in the Z-axis direction is not required. Therefore, the influence of the rigidity of each element constituting the orthogonal transformation mechanism that has influenced the overall rigidity of the conventional Z-axis adjustment mechanism is eliminated. As a result, the overall rigidity in the Z-axis direction of the Z-axis adjusting mechanisms 22 to 24 is improved. Further, the material of the piezo case 60 and the base member 50 that receives the load of the stage 25 and the reaction force of the piezo actuator P4 can be suitably used in a vacuum environment, and a nonmagnetic and high specific rigidity material (for example, alumina) is used. Therefore, the overall rigidity is further improved.

  Further, in order to adjust the position of the piezo actuator P4 in the Z-axis direction by the adjuster plate 71 and the adjuster bolt 72, the height of the tilt hinge H is adjusted with an accuracy of, for example, an adjustment range of ± 2 mm and a resolution of ± 2 μm. Is possible.

  Further, by providing an opening 21b in the base plate 21 and disposing the piezo actuator P4 so that the bottom of the piezo actuator P4 protrudes toward the Y table 15, the piezo actuator P4 having a long stroke length of, for example, 100 μm can be used. As a result, the wafer W can be appropriately arranged with respect to the mask.

  Further, in the Z-axis adjusting mechanisms 22 to 24, the slide bracket 80 is fixed to the end portion of the piezo actuator P4, and the slide bracket 80 is attached to the linear guide 52, whereby the horizontal load related to the slide bracket 80 is linearly guided. 52. As a result, the horizontal load on the piezoelectric actuator P4 generated by placing the piezoelectric actuator P4 vertically and supporting the stage 25 is reduced, thereby protecting the piezoelectric actuator P4.

  Further, since the slide bracket 80 is attached to the linear guide 52, the slide bracket 80 surely slides in the Z-axis direction, and more accurate adjustment is possible.

  Hereinafter, the operational effects of the Z-axis adjusting mechanisms 22 to 24 will be described more specifically based on analysis results and experimental results.

  In the fine movement stage device 20 shown in FIG. 1, if the eigenvalue of the vibration of the top table 42 in the Z-axis direction is calculated based on the rigidity of the piezo actuator P4, the tilt hinge H, the mounting means 90, the linear guide 52, and the base member 50, 243 Hz Met. Moreover, about 230 Hz was able to be implement | achieved when actually measured.

  On the other hand, when the conventional Z-axis adjusting mechanism shown in FIG. 6 is used instead of the Z-axis adjusting mechanisms 22 to 24 for comparison, the Z of the top table including each component constituting the orthogonal transformation mechanism 120 is used. When the eigenvalue of the vibration in the axial direction was calculated, it was 113 Hz, and the measured value was about 120 Hz.

  That is, it has been found that the eigenvalue of the vibration of the top table 42 is improved from about 120 Hz to about 230 Hz by using the Z-axis adjusting mechanisms 22 to 24 in which the piezo actuator P4 is placed vertically.

  FIG. 7 shows the measurement results of the stop stability of the top table 42 using the laser interferometer feedback control in the fine movement stage device 20 shown in FIG. The horizontal axis in FIG. 7 represents time, and the vertical axis represents the amount of displacement. FIG. 7 shows the result of measurement by laser interference measurement using mirrors arranged on the side surface extending in the X direction and the side surface extending in the Y direction of the top table 42, irradiating the mirror with laser light, and using the reflected light. . As shown in FIG. 7, the fluctuations in both the X-axis direction and the Y-axis direction could be suppressed within the range of 3 nm. On the other hand, when the conventional Z-axis adjusting mechanism shown in FIG. 6 is used instead of the Z-axis adjusting mechanisms 22 to 24 for comparison, the stop stability of the top table in the X and Y directions is about 10 nm. there were.

  That is, in the stop stability of the top table 42, the stop stability in the X-axis direction and the Y-axis direction can be improved to 1/3 of the conventional one by using the Z-axis adjusting mechanisms 22-24.

  As mentioned above, although preferred embodiment which concerns on this invention was described, this invention is not limited to the said embodiment. For example, although the position adjusting means 70 holds the piezo actuator P4 via the piezo case 60, the adjuster plate 71 may have the function of the piezo case 60. Further, the slide bracket 80 is attached to the linear guide 52 via the slider S. However, when the slide bracket 80 has the function of the slider S, the slide bracket 80 may be directly attached to the linear guide 52.

  Further, the base plate 21 has an opening 21b, and the piezoelectric actuator P4 is vertically placed in the opening 21b. However, the opening 21b does not necessarily have to be formed. .

  Further, although the Z-axis adjusting mechanisms 22 to 24 and the fine movement stage device 20 using the Z-axis adjusting mechanisms 22 are used in a vacuum environment in the electron beam exposure apparatus, they can be operated in the atmosphere of air or nitrogen. Therefore, the Z-axis adjusting mechanisms 22 to 24 and the fine movement stage device 20 can be applied to a semiconductor manufacturing apparatus, a liquid crystal manufacturing apparatus, etc. in addition to an electron beam exposure apparatus, and further, a laser processing apparatus, a machine tool, etc. It can be applied to all stage devices that require high-accuracy positioning in a very small range.

  Furthermore, although the attachment means 90 is composed of the attachment member 92 and the attachment member receiver 91, there is no particular limitation as long as the piezo actuator P4 can be securely fixed to the slide bracket 80. Further, although the linear guide 52 is fixed to the guide member 51, for example, the guide member 51 and the linear guide 52 may be integrally formed.

  Further, although the adjuster bolt 72 is screwed to the adjuster plate 71, for example, the end 72b of the adjuster bolt 72 and the base plate 21 may be screwed.

1 is a side view of a stage apparatus to which an embodiment of a fine movement stage apparatus according to the present invention is applied. It is a disassembled perspective view of a stage. It is a figure which shows arrangement | positioning of a Z-axis adjustment mechanism. It is a perspective view of one embodiment of a Z-axis adjustment mechanism concerning the present invention. It is sectional drawing along the VV line of FIG. It is a perspective view of the conventional Z-axis adjustment mechanism. It is a figure which shows the stop stability of the XY direction of the stage shown in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 20 ... Fine movement stage apparatus, 21 ... Base plate, 21a ... Main surface, 22, 23, 24 ... Z-axis adjustment mechanism, 25 ... Stage, 50 ... Base member, 51 ... Guide member,
52 ... Linear guide (guide part), 60 ... Piezo case, 61 ... Storage part, 62 ... Overhang part, 70 ... Position adjusting means, 71 ... Adjuster plate, 72 ... Adjuster bolt, 80 ... Slide bracket (support member), 90: Mounting means, C: Shim for adjusting gap, H: Tilt hinge.

Claims (8)

A Z-axis adjusting mechanism that supports a stage arranged on the base plate and adjusts an arrangement relationship of the stage with respect to the base plate in a Z-axis direction orthogonal to a main surface of the base plate;
A piezoelectric actuator that is vertically placed on the base plate and expands and contracts in the Z-axis direction;
A base member extending in the Z-axis direction and fixed to the main surface;
A support member that is attached to the tip of the piezo actuator and supports the stage, and is slidably attached to the guide portion in the Z-axis direction;
A Z-axis adjustment mechanism comprising:   The Z-axis adjusting mechanism according to claim 1, further comprising attachment means for connecting a tip portion of the piezoelectric actuator and the support member. A tilt hinge provided on the support member;
The Z-axis adjusting mechanism according to claim 1, wherein the support member supports the stage via the tilt hinge.   The Z-axis adjusting mechanism according to claim 1, further comprising a position adjusting unit that holds the piezo actuator and adjusts a position of the piezo actuator in the Z-axis direction. The position adjusting means includes
An adjuster plate for holding the piezo actuator;
An adjuster bolt disposed between the adjuster plate and the base plate and having an end portion screwed into one of the adjuster plate and the base plate;
The Z-axis adjusting mechanism according to claim 4, comprising: A piezo case having a housing portion for housing the piezo actuator and a projecting portion projecting outward from a tip portion of the housing portion;
The adjuster plate holds the piezo actuator via the piezo case,
The Z-axis adjusting mechanism according to claim 5, wherein the adjuster plate is disposed between the projecting portion and the base plate, and is fixed to the projecting portion via a shim.   A fine movement stage apparatus, wherein a plurality of Z-axis adjustment mechanisms according to any one of claims 1 to 6 are provided on the base plate. A plurality of the Z-axis adjusting mechanisms according to claim 5 or 6 are provided on the base plate,
The fine movement stage device, wherein the adjuster bolt of at least one Z-axis adjusting mechanism among the plurality of Z-axis adjusting mechanisms is directed to the outside of the base plate with respect to the base member.

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