JP2006339240A - Carrier plate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a carrier plate which can avoid adhesion of a chip component. <P>SOLUTION: In a carrier plate 1, an electronic-component support medium 5 is formed with silicone rubber which has conductivity, especially silicone rubber with which a surface resistance value has the conductivity of 10<SP>6</SP>Ω/square or less. According to this carrier plate, the friction electrification can be made hard to generate when a chip component is inserted in an elastic hole 6, by forming an electronic-component support medium with silicone rubber which has conductivity. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a carrier plate suitable for applying a coating to the ends of many small electronic components.

  Conventionally, as a small electronic component, for example, a chip-shaped electronic component (hereinafter, referred to as a chip component) such as a resistor, a capacitor, and an LED chip is known. Such a chip component, for example, a multilayer ceramic capacitor which is a chip capacitor, is formed in a substantially rectangular shape, and terminals for use in electrical connection are respectively provided at both ends in the longitudinal direction. Is formed. These terminals are formed by applying a conductive coating such as silver or palladium to both ends in the longitudinal direction. When coating both ends of the chip component, a carrier plate capable of supporting a large number of chip components is used in order to efficiently coat the ends of the chip components.

  As such a carrier plate, a large number of through passages penetrating in the thickness direction of a metal rectangular plate body are formed in parallel with the plane of the plate body, and an elastic member is formed on the inner wall surface of each of these passages. With an elastic wall that serves as an electronic component support, that is, a configuration in which an electronic component support made of a rubber-like elastic body having a large number of elastic holes for supporting a large number of chip components in the plate body is provided. Is known (see, for example, Patent Document 1).

  Aluminum is often used for the plate body of this type of carrier plate, and silicone rubber is frequently used for the elastic member forming the electronic component support.

  A conventional carrier plate is formed by inserting a through hole forming pin disposed in a mold into a through passage of a plate body integrally formed with an outer peripheral frame, and then placing a low-viscosity room temperature curable liquid silicone rubber on an outer frame of the plate body. Cast in and cure at room temperature or cast a relatively low viscosity addition type silicone rubber into the outer frame of the plate body and heat at 150 ° C for about 30 minutes to mold and then polish the surface (For example, Patent Documents 2 and 3).

  In addition, the coating on the chip component is made by pushing the chip component having an outer diameter larger than the inner diameter of the elastic hole into the elastic hole of the electronic component support of the carrier plate until the tip protrudes, and elastically gripping the chip component. This is done by coating the ends with a conductive paste made of silver, palladium or the like and then heat-curing them (see, for example, Patent Documents 4 and 5).

Japanese Examined Patent Publication No. 62-011488 Japanese Patent Publication No. 03-076778 JP 2004-17549 A Japanese Examined Patent Publication No. 62-020585 Japanese Examined Patent Publication No. 62-029888

  By the way, when inserting the chip component into the elastic hole in the manufacture of the conventional chip component described above, a carrier plate having an elastic hole having an inner diameter smaller by about 20% than the outer diameter of the chip component is used as appropriate.

  That is, when the dimension of one side of the square cross section orthogonal to the longitudinal direction of the chip part formed in a substantially rectangular parallelepiped shape is 1.6 mm (the diagonal dimension is 2.26 mm), the inner diameter dimension of the carrier plate is 1.. The tip of the chip component is protruded by about 0.1 mm by being pushed into an elastic hole having a circular cross section formed to be about 9 mm and stably held.

  However, in recent years, the size of chip parts tends to be miniaturized, and in 0402 (0.4 mm × 0.2 mm × 0.2 mm) which is an extremely small chip part, the chip size is small like an insulator grain. When inserting the chip parts into the elastic holes of the carrier plate, frictional charging is generated, and a large amount of chip parts adhere to the surface of the carrier plate, more specifically, the surface of the electronic component support, which makes the operation extremely difficult. There was a bug.

  In order to avoid such electrical adhesion of the chip parts to the carrier plate, application of an antistatic agent or coating with a fluororesin has been attempted, but sufficient effects have not been obtained.

  This invention is made in view of this point, and it aims at providing the carrier plate which can avoid adhesion of chip components.

  As a result of diligent research to achieve the above object, the present inventors have found that frictional electrification is unlikely to occur when a chip component is inserted into a carrier plate by using a silicone rubber imparted with conductivity. The headline and the present invention were completed.

  That is, the feature of the carrier plate according to the present invention is used when a terminal coating is applied to the end of a small electronic component, and the plate main body has a large number of elastic holes for supporting a large number of small electronic components. In a carrier plate provided with an electronic component support made of a rubber-like elastic body, the electronic component support is formed of conductive silicone rubber.

In the carrier plate according to the present invention, it is important to set the surface resistance value of the silicone rubber to 10 ⁶ Ω / □ or less.

  According to the carrier plate of the present invention, the electronic component support is formed of conductive silicone rubber, so that it is difficult to generate frictional charging when the chip component is inserted into the elastic hole.

Moreover, according to the carrier plate which concerns on this invention, adhesion of a chip component can be avoided by making the surface resistance value of a silicone rubber into 10 < ⁶ > ohm / square or less.

  The present invention will be described below with reference to embodiments shown in the drawings.

  FIG. 1 is a partially cut perspective view showing a main part of an embodiment of a carrier plate according to the present invention.

  As shown in FIG. 1, the carrier plate 1 of the present embodiment has a plate body 2 formed in a substantially rectangular plane. A large number of plate through holes 3 penetrating in the thickness direction are arranged in the central portion of the plate body 2 in a matrix shape or a staggered shape. In addition, a pair of upper and lower positioning holes 4 penetrating in the thickness direction are formed outside the region of the plate body 2 where the plate through holes 3 are formed.

  An electronic component support 5 made of a rubber-like elastic body is disposed inside each plate through hole 3. The electronic component support 5 is supported by a chip component (not shown) as a small electronic component to be used for coating, and the supported chip component is forced to pass therethrough. An elastic hole 6 penetrating through is formed.

  That is, the inner wall of each plate through hole 3 formed in the plate body 2 is configured to be covered with the electronic component support 5.

  The material of the plate body 2 is not limited, but is generally formed of aluminum from the viewpoints of heat resistance, cost, weight, strength, and the like. Examples of aluminum include wrought materials such as 2000 series alloys, 5000 series alloys, 6000 series alloys, and 7000 series alloys, but 7000 series alloys such as 7075, 7050, and 7N01 having high strength are desirable. In addition, since the mechanical properties of aluminum alloys change due to tempering operations such as heat treatment, it is desirable to apply a treatment to increase the strength. For 7000 series alloys, T6, T651, T6511, T7651 and the like are preferable. Annealing treatment is not preferable because the strength is lowered.

  As the material for the electronic component support 5, conductive silicone rubber is used.

  As the silicone rubber, a peroxide vulcanization type silicone rubber or an addition type silicone rubber composed of a vinyl group-containing polyorganosiloxane and a hydrodiene polysiloxane is used.

  The rubber hardness of the silicone rubber is designed from the functional aspect, and is usually arbitrarily determined between about 25 to 70 degrees (JIS A).

  The silicone rubber can be made conductive by a conductivity-imparting agent. Examples of these conductivity-imparting agents include conductive carbon black such as acetylene black and ketjen black, metal powder such as graphite, silver, copper, and nickel, Examples include conductive zinc white, conductive calcium carbonate, and carbon fiber, but carbon black is common.

  The conductive carbon black may be added in an amount of about 1 to 10% by weight with respect to 100 parts by weight of the silicone rubber. If this addition amount is 1 part by weight or less, conductivity cannot be imparted, and if it exceeds 10 parts by weight, the viscosity of the rubber becomes high.

  Of course, since the conductivity of the conductive metal oxide is poor and the effect cannot be expected unless the number of added parts is increased, the addition amount can be determined appropriately depending on the type of the conductive filler.

In addition, it is important to set the amount of the conductive filler so that the surface resistance value is 10 ⁶ Ω / □ or less.

  This could be confirmed by experiments.

  In the experiment, an addition-type liquid silicone rubber (KE1950-35A / B: trade name, manufactured by Shin-Etsu Chemical Co., Ltd.) was used as a base, and vulcanization was performed using a known vulcanization molding machine with the composition shown in Table 1 below. Then, a test piece having a thickness of 2 mm was prepared in accordance with JIS K 6250, and the electrical resistance value was measured with Hiresta IP (trade name, manufactured by Mitsubishi Chemical Corporation). Next, a carrier plate 1 of 8 cm × 14 cm × 0.2 cm was prepared according to the formulation shown in Table 1. As the carrier plate 1, an elastic hole 6 having a diameter of 0.20 mm and a number of holes of 1344 was used. A ceramic chip having a size of 0.4 mm × 0.2 mm × 0.2 mm is inserted into the carrier plate 1 using a dedicated load plate, a conductive paste is applied, and the carrier plate 1 is dried at 200 ° C. for 10 minutes. After the paste is fixed, the ceramic chip is pushed out from the carrier plate 1 by leaving it under conditions of a temperature of 15 ° C. and a humidity of 10%, and the ceramic chip adheres to the surface of the carrier plate 1 by frictional charging with the electronic component support 5. Whether or not to do so was visually judged and evaluated.

  Table 1 shows the blending ratio and test results in the experiment.

As shown in Table 1, by using conductive silicone rubber, especially silicone rubber having a surface resistance of 10 ⁶ Ω / □ or less, friction is caused when the ceramic chip is pushed out of the carrier plate 1. It was found that the ceramic chip was not charged and the ceramic chip did not adhere to the surface of the carrier plate 1 (No adhesion of No. 5 to 7 chips in Table 1).

  Therefore, according to the carrier plate 1 of the present embodiment, adhesion of the chip component to the carrier plate 1 due to frictional charging can be easily and reliably avoided. As a result, the workability when inserting the chip component into the elastic hole 6 of the carrier plate 1 is excellent.

  Various additives such as a filler, a bulking filler, and a heat-resistant agent can be added to the silicone rubber according to the purpose of use and design of the carrier plate 1.

  For example, the formulation of the filler with respect to the silicone rubber is not particularly limited, but usually about 10 to 300 parts by weight of the reinforcing filler and the bulking filler are added to 100 parts by weight of the base gum. As the reinforcing filler, wet silica and dry silica (fumed silica) are generally used.

The wet silica here is reinforcing silica made of silicon dioxide (SiO ₂ ), and the production method includes a direct method of directly decomposing sodium silicate with sulfuric acid, or reacting sodium silicate with salts. There are various methods such as an indirect method in which silicate is produced and then decomposed with sulfuric acid or carbon dioxide. Typical wet silicas include Nipsil VN3 (trade name, manufactured by Nippon Silica Industry Co., Ltd.), Carplex CS-5 (trade name, manufactured by Shionogi Pharmaceutical Co., Ltd.), Starsil S (trade name, manufactured by Kamijima Chemical Co., Ltd.), Toxeal. US (trade name, manufactured by Tokuyama Corporation), Shilton R-2 (trade name, manufactured by Mizusawa Chemical Co., Ltd.), Nipsil 223 (trade name, manufactured by PPG (USA)), Ultrasil VN3 (trade name, manufactured by Degussa (Germany)) Vulkasil S (trade name, manufactured by Bayer AG (Germany)) is exemplified, and grades having an average particle size of 30 μm or less, preferably 5 μm or less are used.

  In addition, dry silica is a reinforcement made of silicon dioxide produced by pyrolysis of silicon halides, heat reduction of silica sand, air oxidation of vaporized SiO, pyrolysis of organosilicon compounds, etc. Aerosil 200, Aerosil R972 (trade name, manufactured by Nippon Aerosil Co., Ltd.), Cab-O-Sil MS-5 (trade name, manufactured by Cabot Corporation (USA)), and Leorosil QS102 (trade name, manufactured by Tokuyama Corporation). Is done. In the present invention, if necessary, wet silica and dry silica may be used in combination in a timely manner. Furthermore, a lubricant (wetter) may be added for the purpose of preventing secondary bonds due to the activity on the silica surface. Examples of the lubricant include silicone resins, alkoxysilanes and siloxanes, hydroxysilanes and siloxanes, and silazanes. , Organic acid esters, polyhydric alcohols and the like.

  The bulking filler is a component necessary for maintaining the mechanical properties of the rubber, that is, the physical strength, rubber hardness, compression set, grindability, and other characteristics that are indispensable for the flexible member 2, such as calcium carbonate, Quartz powder, diatomaceous earth, zirconium silicate, clay (aluminum silicate), talc (hydrous magnesium silicate), wollastonite (calcium metasilicate), zinc oxide, magnesium oxide, alumina (aluminum oxide), aluminum sulfate , Barium sulfate, lithopone, mica (mica powder) and the like. Further, a heat-resistant agent such as cerium oxide may be added to the silicone rubber.

  The adhesion (vulcanization adhesion) between the plate body 2 and the electronic component support 5 is a silicone such as Chemlock 608 (trade name, manufactured by Lord Far East Co., Ltd.) if it is a peroxide vulcanized silicone rubber. Rubber adhesive can be applied. Examples of the addition-type silicone rubber include DY39-051A / B, DY39-067, DY39-115 (trade name, manufactured by Toray Dow Corning Silicone Co., Ltd.) and Primer No. 4. Primer No. By using an adhesive for addition-type silicone rubber such as 101A / B (trade name, manufactured by Shin-Etsu Chemical Co., Ltd.), stronger adhesion can be obtained. At this time, the plate body 2 is carbonized. After degreasing with a hydrogen-based cleaning agent or propyl bromide, an adhesive is applied, and if necessary, it is used after being baked at 100 ° C. for about 30 minutes.

  In addition, this invention is not limited to embodiment mentioned above, A various change is possible as needed.

The partially cut perspective view which shows the principal part of embodiment of the carrier plate which concerns on this invention

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Carrier plate 2 Plate main body 3 Plate through-hole 4 Positioning hole 5 Electronic component support body 6 Elastic hole

Claims (2)

An electronic component support body made of a rubber-like elastic body having a large number of elastic holes for supporting a large number of small electronic components is provided in the plate body, which is used when a terminal coating is applied to the end of the small electronic component. In the carrier plate
A carrier plate, wherein the electronic component support is made of conductive silicone rubber. The carrier plate according to claim 1, wherein the silicone rubber has a surface resistance value of 10 ⁶ Ω / □ or less.

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