JP2006324295A - Soldering iron - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent soldering bridges when modifying wiring to a chip component, or the like especially having a narrow-pitch pin, and to cope with an object to be soldered even if the object varies in shape and dimensions. <P>SOLUTION: An elastic support rod 3 is mounted at the lower of the body of a soldering iron 1. The support rod 3 is extended slantingly downward nearly by the same length as an iron head 2 toward a printed board, and is branched in a U shape at a tip section. A tool 4 is mounted at the branched end of the support rod. The tool 4 is planar, has a symmetrical dogleg shape so that the tip becomes vertical to the printed board, and forms a slit with the branched end of the support rod 3. In soldering, the iron head 2 is inserted into the slit. The tool 4 should be characterized by preventing solder from adhering easily, and has heat resistance. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a soldering iron used for connecting fine electronic components.

  This type of soldering iron is suitable for soldering a contact portion made of a conductor exposed from an end portion of a flat flexible wiring board (FFC) to a circuit board wiring pattern, in the vicinity of the tip of the tip. In addition, a pressing member is supported in a cantilevered manner by a soldering iron body via an elastic support member so that a pressing member for pressing the vicinity of the substrate of the contact portion against the circuit board is disposed. It is known (see, for example, Patent Document 1).

  Also, a slit is formed at the tip of the tip, and the tip is separated into two parts. By pressing the tip partition plate into the slit or fixing by spot welding, a solder bridge is generated or solder debris is generated. It is prevented that it accumulates (for example, refer patent document 2).

JP-A-8-2158378 (first page, FIG. 5) Japanese Utility Model Publication 5-39757 (first page, FIG. 1)

  However, in the soldering iron described in Patent Document 1, it is possible to prevent the contact portion from being lifted by pressing the FFC with the pressing member, but since there is no work on the tip, the distance between the component pins is particularly small. For semiconductor elements and chip parts that support high-density mounting, it is difficult to modify the wiring due to the narrow pitch, and there is a solder bridge in which molten solder remains on the pins adjacent to the component pins to be soldered. There is a problem that it is likely to occur.

  Further, the soldering iron described in Patent Document 2 has a first problem in that the soldering iron itself is slitted, so that the shape of the tip is complicated and the machining cost is increased. Further, there is a second problem that a soldering iron provided with a slit shaped to match the soldering object must be prepared. Further, since the partition plate is provided at the tip of the soldering iron, the heat resistance thereof, and further, the object to be soldered and the soldering iron are in contact only through the soldering iron, so the hand holding the soldering iron is used. There is a concern that it will be difficult to prevent solder bridging if there is blurring, and that it is possible to prevent solder bridging only with slits and partition plates, especially during fine soldering operations.

  SUMMARY OF THE INVENTION Accordingly, a first object of the present invention is to provide a soldering iron that does not cause a solder bridge even when a wiring is modified to a semiconductor element such as an LSI having a pin with a narrow pitch, a chip part, or the like. The purpose is to improve the efficiency and reliability of the rework work of the printed circuit board by remodeling.

  A second object of the present invention is to provide a soldering iron that can easily cope with various shapes and dimensions of objects to be soldered.

  The soldering iron according to claim 1 is a soldering iron for soldering semiconductor elements such as LSI, chip parts, wiring, etc. to a printed circuit board. Because the tip of the iron enters between the elastic support bar that extends diagonally downward toward the printed circuit board until it becomes the same length and branches into two at the tip, and the branch point of the support bar attached to the branch point of the support bar And a heat-resistant jig that is difficult to attach solder having slits formed thereon.

  The soldering iron according to claim 2 is the soldering iron according to claim 1, wherein the support bar branches in a U-shape at the tip, and a jig is attached to each of the branch destinations, and the jig is attached to the printed board. It is characterized by a plate shape which is bent symmetrically so as to be vertical and forms a slit.

  The soldering iron according to claim 1 is the soldering iron according to claim 1, wherein the support bar is bifurcated so as to spread slightly at the tip, and a jig is attached to each of the branch destinations, and the tip of the jig is a printed circuit board. It is a plate-like shape that is bent symmetrically so as to be perpendicular to each other to form a slit and forms a slit, and shields the body portion of the semiconductor element or chip part from the solder at the tips of the two jigs. It is characterized in that a partition plate sufficient for the above is provided.

  3. The soldering iron according to claim 1, wherein the support bar branches in a U shape at the tip and has an opening toward the slit so as to face the U shape. The jig is characterized in that a slit is formed by bending the inner side into a “<” shape so that the tip is perpendicular to the printed circuit board.

  According to a third aspect of the present invention, in the soldering iron according to any one of the first to fourth aspects, a slit interval adjusting portion for changing the width of the slit is provided at a branching portion of the support bar. It is characterized by that.

  The soldering iron according to claim 6 is the soldering iron according to claim 4, wherein the slit interval adjustment portion includes a movable portion attached substantially perpendicular to each of the U-shaped or bifurcated portions of the support rod, It is characterized by comprising a gear that meshes with a projection provided on the movable part and moves each movable part in parallel by an adjustment knob.

  When soldering wires such as wiring for remodeling to semiconductor elements such as LSIs and chip parts that have component pins with a narrow pitch, especially for high-density mounting, mounted on a printed circuit board It is possible to prevent a solder bridge in which molten solder is placed on the component pins. The reason is that by attaching two jigs in the form of sandwiching a component pin to be soldered at the tip of the support rod attached to the soldering iron body of the present invention, a boundary with other adjacent pins can be created, This is because unintended molten solder can be prevented from adhering to other adjacent pins.

  In addition, according to the present invention, the distance between the two jigs at the tip of the support rod attached to the soldering iron body may be determined in accordance with the distance between the component pins. Therefore, the above effect can be obtained with an inexpensive soldering iron. Moreover, it is possible to deal with various parts and component pin intervals by simply changing the jig and using the same soldering iron body. Furthermore, since the jig is isolated from the iron tip, it is not necessary to pay attention to the heat resistance of the jig.

  The soldering iron of the present invention is a soldering iron for soldering semiconductor elements such as LSIs, chip parts, wirings, etc. to a printed circuit board, and is attached obliquely downward to the printed circuit board and attached to the lower side of the soldering iron body. An elastic support bar is provided that extends substantially the same length as the tip of the iron and branches into a U shape at the tip.

  A jig is attached to the branching point of the support bar. The jig is plate-shaped, and the tip of the support bar is symmetrically bent into a “<” shape so that it is perpendicular to the printed circuit board. A slit is formed with the tip. When soldering, the tip of the iron enters this slit. The jig is made of a heat-resistant material that is difficult to solder.

  FIG. 1 shows a side view of a soldering iron of Example 1 of the present invention. A support bar 3 is attached to the lower side of the main body of the soldering iron 1 (printed circuit board 9 side). The support bar 3 extends obliquely downward in the direction of the printed circuit board 9 until it has a length substantially equal to the tip 2. The soldering iron mounting side of the support bar 3 has an elastic leaf spring material like a tweezers joint.

  A jig 4 is provided at the tip of the support bar 3. The jig 4 is installed at a position including the tip portion of the iron tip 2, and the jig 4 can be easily moved to the vicinity of the iron tip 2 due to the elasticity of the leaf spring material of the support bar 3.

  FIG. 2 is a plan view of the jig 4. The support bar 3 is divided into a U shape in the vicinity of the jig 4, and a left jig 4 a and a right jig 4 b constituting the jig 4 are provided at the tip thereof. The jig 4 has a heat resistance and has a property that it is difficult to attach a molten solder. The material is stainless steel, aluminum, Teflon (registered trademark), or the like.

  The left jig 4a and the right jig 4b are plate-shaped, and are bent and extended downward in a “<” shape on opposite sides, and a slit is formed between the left jig 4a and the right jig 4b. The character “<” stands perpendicular to the printed circuit board 9. The distance between the slits is a distance at which one pin of a component pin such as a semiconductor element such as an LSI or a chip component can be sandwiched, and a jig that matches a pin pitch of a component to be soldered, for example, 0.5 mm, 1.0 mm, or 1.5 mm. 4 is prepared and attached to the main body of the soldering iron 1 according to the pitch interval of the component pins to be soldered.

  The support bar 3 and the jig 4 can be attached to and detached from the soldering iron 1 and can be replaced and mounted with jigs having various slit intervals suitable for the shape and dimensions of the object to be soldered. For this reason, the same body can be used for the soldering iron 1.

  Next, a method for using the soldering iron 1 of the present invention will be described. FIG. 3 shows a state in which a wire rod such as a wire is soldered to the component pin 6 of the semiconductor element 5 such as an LSI mounted on the printed circuit board 9 using the soldering iron 1. In this example, the component pin 6 and the wire are soldering objects.

  When soldering a wire rod such as a wire, a component pin 6 to be soldered is sandwiched between a jig 4 that is attached to a soldering iron 1 and connected by a resilient support bar 3 in the vicinity of a tip 2. It is pressed on the printed circuit board 9 in the form. At that time, a leaf spring material such as tweezers provided on the mounting side of the support bar 3 by pushing the front end portion a of the resin soldering iron 1 having insulation and heat resistance downward (toward the printed circuit board 9). When a downward force is applied to the support rod 3 and the jig 4 is pushed downward, the jig 4 and the printed board 9 are brought into close contact with each other.

  Next, the solder is melted in the inside of the jig 4 (on the component pin 6) by the tip 2 to connect the wiring. The melted solder is surely guided to the soldering object through a space between the left jig 4a and the right jig 4b, which extends downwardly facing the right jig 4b. After sufficient solder is supplied to the object to be soldered, the tip 2 is separated from the component pins 6 until the jig 4 is not separated from the printed board 9, and the molten solder is fixed.

  After the solder is solidified, the tip 2 and the jig 4 are separated from the printed board 9. At the time of soldering, the soldering tip 2 is just in the form between the left jig 4a and the right jig 4b constituting the jig 4 in FIG.

  FIG. 4 shows a cross-sectional view seen from the front when the jig 4 is brought into close contact with the printed circuit board 9. The above-mentioned “ku” shape is revealed. A component pin 6 to be soldered is pressed against the printed circuit board 9 in a slit between the left jig 4a and the right jig 4b so as to be brought into close contact therewith. The slit interval between the left jig 4a and the right jig 4b is adjusted to the pitch interval of the component pins 6.

  In FIG. 4, since the left jig 4a and the right jig 4b have a shape that sandwiches the component pin 6 to be soldered, a partition can be formed between other adjacent component pins 6, so that It is possible to prevent unintended molten solder from adhering to the component pins 6. Further, since the jig 4 has heat resistance and has a property that it is difficult to attach the molten solder, even if the tip 2 or the molten solder touches the jig 4, the solder does not adhere.

  FIG. 5 is a plan view showing a state in which a wire material such as a wire 8 is soldered to a component pin 6 of a QFP (Quad Flat Package) type semiconductor element 5 such as a surface mount LSI. The same applies to SOP (Small Outline Package) type semiconductor elements.

  6, 7 and 8 show a second embodiment of the soldering iron of the present invention. 6 is a plan view of the jig 4, FIG. 7 is a cross-sectional view of the jig 4, and FIG. 8 shows a state in which soldering is performed on the component pins 10 a of the chip components 10 such as resistors and capacitors on the printed circuit board 9. FIG. The material and slits of the support rod 3 and the jig 4 may be considered in the same manner as in the first embodiment. Further, the basic soldering method using the present soldering iron 1 is the same as that of the first embodiment, so that the description thereof is omitted.

  As shown in FIG. 6, the jig 4 of the soldering iron 1 of the present embodiment has a left jig 4a and a right jig 4b attached to the tip of a support bar 3 that is divided into two branches so as to spread slightly at the tip. The jig 4a and the right jig 4b are bent downward in the shape of a "<" on the opposite side and extend to form a slit. Referring to FIG. 7, the left jig 4 a and the right jig 4 b in the shape of “<” are revealed.

  A partition plate 4c of the same material is provided between the slits of the left jig 4a and the right jig 4b, and a component pin 10a is formed in a U-shaped space formed by the left jig 4a, the right jig 4b, and the partition plate 4c. Place the jig 4 so that is positioned.

  When the partition plate 4 c is soldered to the component pin 10 a of the chip component 10, the partition plate 4 c is positioned at a position perpendicular to the chip component 10 between the other component pin 10 b on the other side of the same chip component 10. Thus, a shield by the partition 4c is provided between the component pin 10a to be soldered and the component pin 10b not to be soldered.

  This prevents unintended molten solder from adhering to the component pin 10b side where soldering is not performed. Further, the left jig 4a and the right jig 4b prevent unintended molten solder from adhering to the component pins 10a of other chip components 10 mounted adjacent to each other.

  FIG. 8 is a plan view showing a state in which the wire 8 is soldered to the component pin 10a of the chip component 10 such as a resistor or a capacitor. The central black portion of the chip component 10 indicates the resistor body, the lower white portion indicates the component pin 10a, the upper white portion indicates the component pin 10b, and the partition 4c shields the body.

  9, 10 and 11 show Embodiment 3 of the soldering iron of the present invention. FIG. 9 is a plan view of the jig 4, FIG. 10 is a plan view showing a state in which a wire rod such as a wire 8 is soldered to the component pin 6, and FIG. 11 is a component pin 6 of a type that penetrates the printed circuit board 9. It is a side view at the time of soldering wires, such as the wiring 8, to the component pin 6 of the component 5 mounted in (1). The material and slits of the support rod 3 and the jig 4 may be considered in the same manner as in the first embodiment. Further, the basic soldering method using the present soldering iron 1 is the same as that of the first embodiment, so that the description thereof is omitted.

  As shown in FIG. 9, the jig 4 of the soldering iron 1 of the present embodiment is attached to the tip of a support bar 3 whose tip is divided in a U-shape, and has an opening in a shape facing the U-shape. It has a disk shape. The inside of the disk shape is bent downward, and the jig 4 is placed so that the component pin 6 is positioned in a semicircular space formed there.

  As a result, it is possible to mount the jig in a form that is not easily affected by other component pins not only in the parallel-parallel pin arrangement component 5 but also in the narrow-pitch component pins 6 such as a staggered structure. Further, the left and right shielding by the jig 4 can prevent unintended molten solder from being placed on other component pins 10 adjacent to the component pin 10a to be soldered.

  FIG. 12 is a plan view showing an essential part of a soldering iron of Example 4 of the present invention together with a perspective view. The present embodiment is an improved version of the second embodiment, and includes a mechanism capable of adjusting the slit interval instead of the partition plate 4c in the second embodiment.

  In FIG. 12, a slit interval adjusting portion 11 is provided at a position that is divided into two forks at the tip of the support rod 3. An adjustment knob 11a is attached to the slit interval adjusting unit 11, and the gear 13 in the slit interval adjusting unit 11 rotates in conjunction with the left and right by turning the adjustment knob 11a to the left and right.

  Due to the rotation, the movable portion 12 connected to the support rod 3 to which the jig 4 is connected meshes with the projection of the gear 13 and the movable portion 12 and translates left and right. As a result, the support rod 3 and the jig 4 connected to the movable portion 12 are moved in parallel to each other so that the slit interval of the jig 4 can be adjusted. The adjustment knob 11a and the gear 13 can be moved and fixed at a predetermined interval, for example, an interval of 0.5 mm between the slits.

  According to the present embodiment, it is not necessary to prepare jigs having various slit intervals, and it is possible to deal with component pins having various pitch intervals with one jig.

The side view which shows the soldering iron of Example 1 of this invention Plan view of the jig 4 in FIG. The side view which shows the mode of the 1st soldering by the soldering iron of Example 1 of this invention Sectional drawing seen from the front when the jig | tool 4 in Example 1 of this invention was stuck on the printed circuit board 9. FIG. The top view which shows the mode of the 2nd soldering by the soldering iron of Example 1 of this invention The top view of the jig in the soldering iron of Example 2 of this invention Sectional drawing of the jig in the soldering iron of Example 2 of this invention The top view which shows the mode of the soldering by the soldering iron of Example 2 of this invention The top view which shows the jig 4 in the soldering iron of Example 3 of this invention The top view which shows the mode of the 1st soldering by the soldering iron of Example 3 of this invention The side view which shows the mode of the 2nd soldering by the soldering iron of Example 3 of this invention The top view which shows the principal part of the soldering iron of Example 4 of this invention with a perspective view

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Soldering iron 2 Tip 3 Support rod 4 Jig 4a Left jig 4b Right jig 4c Partition board 5 Semiconductor element 6 Component pin 7 Molten solder 8 Wiring 9 Printed circuit board 10 Chip component 10a Component pin 10b Component pin 11 Slit space adjustment Part 11a Adjustment knob 12 Movable part 13 Gear

Claims (6)

In soldering irons for soldering semiconductor elements such as LSI, chip parts, wiring, etc. to printed circuit boards,
A resilient support rod attached to the lower side of the soldering iron body and extending obliquely downward toward the printed circuit board until it is substantially the same length as the tip of the solder iron, and branching into two at the tip;
A soldering iron provided with a heat-resistant jig that is attached to a branch destination of the support rod and that is difficult to attach solder having a slit for a tip to enter with the branch destination of the support rod. The support bar branches into a U shape at the tip, and the jig is attached to each of the branch destinations. The jig is symmetrically bent into a “<” shape so that the tip is perpendicular to the printed circuit board. The soldering iron according to claim 1, wherein the soldering iron has a plate shape that forms the slit. The support bar is bifurcated so that it slightly expands at the tip, and the jig is attached to each of the branch destinations, and the jig is symmetrically shaped like a “<” so that the tip is perpendicular to the printed circuit board. 2. A plate that is bent to form the slit, and a partition plate that is sufficient to shield the body portion of the semiconductor element or chip part from solder is provided at the tip of two jigs. Soldering iron as described in The support rod is attached to the disc-shaped jig having an opening toward the slit in a shape that is U-shaped and opposed to the U-shape, and the jig has a tip perpendicular to the printed circuit board. 2. The soldering iron according to claim 1, wherein the slit is formed by bending the inner side into a “<” shape. The soldering iron according to any one of claims 1 to 4, wherein a slit interval adjusting portion for making the width of the slit variable is provided at a branch portion of the support rod. The slit interval adjusting portion is engaged with a movable portion attached substantially orthogonal to each branch portion of the U-shaped or bifurcated portion of the support rod, and a protrusion provided on each movable portion, and each movable portion is adjusted by an adjustment knob. 6. The soldering iron according to claim 5, wherein the soldering iron is composed of a gear that moves in parallel.

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