JP2006319345A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2006319345A5 JP2006319345A5 JP2006149488A JP2006149488A JP2006319345A5 JP 2006319345 A5 JP2006319345 A5 JP 2006319345A5 JP 2006149488 A JP2006149488 A JP 2006149488A JP 2006149488 A JP2006149488 A JP 2006149488A JP 2006319345 A5 JP2006319345 A5 JP 2006319345A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- suction
- edge
- support
- stage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 27
- 230000032258 transport Effects 0.000 claims 13
- 238000002788 crimping Methods 0.000 claims 2
- 238000000034 method Methods 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 1
- 238000001179 sorption measurement Methods 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006149488A JP4084393B2 (ja) | 2000-01-31 | 2006-05-30 | 部品実装装置および部品実装方法 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000021491 | 2000-01-31 | ||
| JP2006149488A JP4084393B2 (ja) | 2000-01-31 | 2006-05-30 | 部品実装装置および部品実装方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001557351A Division JP3828808B2 (ja) | 2000-01-31 | 2001-01-31 | 部品実装装置および部品実装方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006319345A JP2006319345A (ja) | 2006-11-24 |
| JP2006319345A5 true JP2006319345A5 (cg-RX-API-DMAC10.html) | 2007-12-06 |
| JP4084393B2 JP4084393B2 (ja) | 2008-04-30 |
Family
ID=37539675
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006149488A Expired - Fee Related JP4084393B2 (ja) | 2000-01-31 | 2006-05-30 | 部品実装装置および部品実装方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4084393B2 (cg-RX-API-DMAC10.html) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008182111A (ja) * | 2007-01-25 | 2008-08-07 | Juki Corp | 基板固定装置 |
| JP5062204B2 (ja) * | 2009-03-10 | 2012-10-31 | パナソニック株式会社 | 部品実装基板の検査方法と装置及び部品実装装置 |
| US8962084B2 (en) * | 2012-05-31 | 2015-02-24 | Corning Incorporated | Methods of applying a layer of material to a non-planar glass sheet |
| JP6413078B2 (ja) * | 2014-10-20 | 2018-10-31 | パナソニックIpマネジメント株式会社 | 部品搭載装置 |
| KR20180045666A (ko) * | 2016-10-26 | 2018-05-04 | 삼성전자주식회사 | 기판 제조 장치 |
| JP6461235B2 (ja) * | 2017-05-22 | 2019-01-30 | キヤノントッキ株式会社 | 基板載置装置、成膜装置、基板載置方法、成膜方法、および電子デバイスの製造方法 |
| CN116403929A (zh) * | 2021-12-28 | 2023-07-07 | 拓荆键科(海宁)半导体设备有限公司 | 调整卡盘形变的系统及装置 |
-
2006
- 2006-05-30 JP JP2006149488A patent/JP4084393B2/ja not_active Expired - Fee Related