JP2006319256A - Airtight terminal for optical semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a thin airtight terminal having excellent heat dissipation at low cost as an airtight terminal mounted with an optical semiconductor element such as a laser diode. <P>SOLUTION: The airtight terminal for the optical semiconductor device is constituted by joining a heat radiating body with an optical semiconductor element fitting portion and an external frame portion where an optical semiconductor element fitting reference is arranged, and a base body with a lead terminal formed while insulated by glass together by using a metal-based soldering material. The optical semiconductor element fitting portion is raised by bending a thin plate and partially connected to the external frame which has two edges formed in a blade shape at least on the left and right sides of the base body. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an airtight terminal for an optical semiconductor device, and more particularly to a thin airtight terminal for an optical semiconductor laser device which is used for an optical pickup or the like and is excellent in heat dissipation.

  As a required characteristic of an airtight terminal for a semiconductor laser device used for an optical pickup or the like, heat dissipation that dissipates heat generated by the light emitting element of the semiconductor laser to the outside of the terminal is one of the important characteristics, and this is particularly the recording of CD and DVD. When used in systems, it is required to increase the output of the semiconductor laser, and the accompanying heat generation of the light emitting element increases. This heat generation makes it difficult to guarantee the characteristics of the semiconductor laser device. Ingenuity is indispensable.

  In recent years, optical disk drives equipped with optical pickups have become slimmer, and suitable semiconductor laser devices are used for optical pickups used for 12.7 mm slim drives and 9.5 mm ultra slims. The airtight terminal to be configured needs a small and thin airtight terminal. Therefore, the size of the hermetic terminal for semiconductor laser devices has been proposed to be reduced to 3.0 mm by partially cutting the base of the hermetic terminal having an outer diameter of φ5.6 mm, which is often used in slim drives. Yes. Furthermore, airtight terminals having outer diameters such as φ3.3 mm, φ3.5 mm, and φ3.8 mm, in which φφ5.6 mm is entirely reduced, have been proposed. However, in order to reduce the size and thickness, the heat dissipating part serving as the light emitting element mounting part erected on the base of the hermetic terminal inevitably tends to be reduced in size, and the heat dissipation is insufficient.

For the reasons described above, the hermetic terminal shown in FIG. 4 has been proposed as a hermetic terminal that is thin and aims to improve heat dissipation (Patent Document 1). 4A is a top view of the hermetic terminal, and FIG. 4B is a cross-sectional view taken along line ff ′ of FIG. 4A. The airtight terminal is provided with an eyelet portion 201 in which a lead sealing hole 207 is formed and an eyelet portion 202 in which a heat sink 203 to which a light emitting element is attached is divided into left and right. A lead 206 is hermetically sealed with glass 205 in the lead sealing hole 207. Here, since the eyelet portion 201 is made of mild steel, the eyelet portion 201 has a structure capable of applying a sufficient compressive stress to hermetically seal the lead. Further, since the eyelet portion 202 is made of a high thermal conductivity material made of copper or a copper alloy, heat generated from the light emitting element can be efficiently dissipated. Further, the eyelet portion 202 is not limited to the eyelet portion in which the lead sealing hole 207 is formed, and the heat sink 203 can be formed on the large heat sink 203, and heat generated from the light emitting element can be efficiently dissipated. In the above-described airtight terminal, a clad formed by integrally joining a material for forming the eyelet part 201 in which the lead sealing hole 207 is formed and a material for forming the eyelet part 202 in which the heat sink 203 is formed. It is preferable that the eyelet is made of a material. As a result, the airtight terminal for a semiconductor device represented by FIG. 4 formed with the above-described structure has improved heat dissipation, and can be mounted in a state where it is laid sideways inside a thin electronic device. Yes.
Japanese Patent Laid-Open No. 11-260952

  However, in the case of adopting the above-described configuration, when the cap is bonded to the cap seal area provided on the eyelet, it is difficult to adopt the conventional resistance welding method because the cap is composed of different eyelets. In addition, it is necessary to take a bonding method for a metal brazing material or the like, and the process can be complicated. In addition, when the material of the eyelet portion 201 and the material of the eyelet portion 202 described above are made of a clad material, it can be said that the clad material has a higher material cost than a single material such as mild steel or copper. On the other hand, there is a merit of improving heat dissipation, but demerits were considered in cap sealing and cost. Accordingly, the present invention has been made in view of the above-described points, and an object of the present invention is to provide a low-cost thin hermetic terminal for an optical semiconductor device having good heat dissipation.

  In order to solve the above-described problems, in the present invention, a radiator having a light emitting element mounting portion and an outer frame portion in which a notch serving as a light emitting element mounting reference is arranged is provided on a base having a lead terminal insulated by glass. In an airtight terminal for an optical semiconductor device joined by a brazing material, the heat radiator is formed upright by bending from a thin plate, the light emitting element mounting portion and the outer frame are partially connected, and the outer frame faces each other. Two sides are left, at least one side is open, and among the remaining outer frames, two sides where the cutouts serving as the light emitting element mounting reference are opposed to each other are formed on the left and right sides of the base in a wing shape. It is a feature.

  According to this, the heat generated from the light emitting element is conducted through the connecting portion to the outer frame which is a heat radiating portion, so that heat can be efficiently radiated to the outside. Furthermore, since one or two directions of the outer frame are open, there is no restriction on the length of the light-emitting element mounting portion that is cut out and bent, so that the light-emitting element can be mounted sufficiently even if the hermetic terminal is thin. An area can be secured. In addition, the light emitting element mounting portion, which is a heat radiator, does not need to be raised and raised by a conventional complicated press, and is low in cost. However, it is convenient because the height of the light emitting element mounting portion can be easily changed. In terms of cap sealability, since a cap seal area is provided in a base made of mild steel suitable for cap welding, the cap sealability equivalent to that of a hermetic terminal for semiconductor laser devices having an outer diameter of φ5.6 is obtained. It is done.

  Embodiments of the present invention will be described below with reference to the drawings.

(Embodiment)
1A and 1B are diagrams according to Embodiment 1 of the present invention, in which FIG. 1A is a plan view and FIG. 1B is a cross-sectional view taken along the line dd ′ of FIG. FIG. 1C is a perspective view of the shape of the heat dissipation body after bending, and FIG. 1D is a front view with a semiconductor laser cap attached.

  In FIG. 1, 1 is a base, 2 is a heat radiating portion (outer frame), 3 is a light emitting element mounting portion insertion hole, 4 is a heat radiating portion (light emitting element mounting portion), 5 is a heat radiating portion (connecting portion), and 6 is a lead terminal. , 7 is an insulating glass, 8 is an element mounting portion for monitoring, 9 is a gap, 10a and 10b are notches for attaching a light emitting element, 11 is an open portion of a heat radiating portion (outer frame), 12 is a cap metal frame, 13 is It is a light transmission glass window.

  A detailed configuration will be described. (C) in FIG. 1 is a heat dissipation body after being bent and made of a metal having high thermal conductivity, for example, copper having a thermal conductivity of 394 W / m · k, and a thin plate having a thickness of 0.8 mm. It is formed in the form of FIG. 1C by pressing and bending. Here, the outer frame of the heat dissipating body is provided with an open portion 11 in order to make the light emitting element mounting portion 4 arbitrarily long. Furthermore, the light emitting element mounting portion 4 is bent vertically with high accuracy with respect to the upper surface of the outer frame and the light emitting element mounting reference cutouts 10a and 10b arranged on the left and right sides of the outer frame. Usually, the light emitting element mounting portion 4 is required to have an accuracy of 90 ° ± 1 ° with respect to the reference surface, and the light emitting element mounting portion is connected to a line connecting the light emitting element mounting reference notches arranged on the left and right sides of the outer frame. 4 must be within 0 ° ± 1 °. In addition, regarding formation of a heat radiator, it is good to give a groove | channel to a bending part beforehand so that bending can be implemented effectively.

  According to this, since a heat radiator does not require a complicated metal mold | die, it can form at low cost. Further, heat generated from the light emitting element is efficiently conducted from the heat radiating portion (light emitting element mounting portion) 4 to the heat radiating portion (outer frame) 2 via the heat radiating portion (connecting portion) 5, and further effectively from the outer frame 2. It can dissipate heat to the outside. In addition, the light emitting element mounting portion 4 formed by bending has a degree of freedom in the height direction while being thin, and not only the element is attached to the light emitting element mounting portion 4 but also a substrate such as an electronic circuit is attached. Can be attached.

  Next, the above-described light emitting element mounting portion 4 of the radiator is inserted into the light emitting element mounting portion insertion hole 3 of the base body 1 in which the lead terminals 6 are hermetically sealed with the insulating glass 7 in advance and held horizontally by the connecting portion. In this state, the periphery of the insertion hole and the connecting portion are fixed with a metal brazing material such as silver brazing (not shown). Here, the outer periphery of the substrate 1 and the heat radiating portion (outer frame) 2 may or may not be brazed, but due to the difference in the linear thermal expansion coefficient between the material of the substrate 1 and the material of the radiator. When fixing by attaching, it is difficult to generate distortion or to obtain accuracy. Therefore, in the embodiment, the gap 9 is provided for convenience.

  In addition, since the base 1 formed in advance is hermetically sealed with the lead terminals 6 with the glass 7, since this method employs a compression sealing method which is a known metal-glass hermetic sealing technology, Detailed description is omitted.

  2A and 2B are diagrams according to the second embodiment of the present invention, in which FIG. 2A is a plan view and FIG. 2B is a cross-sectional view taken along line e-e ′ of FIG. FIG. 2 (c) is a perspective view of the shape of the radiator after bending, and FIG. 2 (d) is a front view with a semiconductor laser cap attached. The basic configuration is the same as that of the first embodiment described above, and at the stage of forming the heat dissipating part (outer frame) 2 and the heat dissipating part (light emitting element attaching part) 4, the light emitting element attaching reference cutting of the heat dissipating part (outer frame) 2 is performed. A connecting portion with the heat radiating portion (light emitting element attaching portion) 4 is arranged on the two sides where the notches 10a and 10b are arranged, and two sides other than the two sides where the light emitting element attaching reference notches 10a and 10b are arranged are arranged. The shape is open. According to this, since one side is further eliminated, the thickness can be further reduced in the direction perpendicular to the element mounting surface.

  3A and 3B are diagrams according to Embodiment 3 of the present invention, in which FIG. 3A is a plan view and FIG. 3B is a top view. FIG. 3C is a perspective view of the shape of the radiator after bending, and FIG. 3D is a front view with a semiconductor laser cap attached. The basic configuration is the same as in the first and second embodiments described above, but the details will be described with reference to the drawings.

  In FIG. 3, 101 is a base, 102 is a heat radiating portion (outer frame), 103 is a light emitting element mounting portion insertion hole, 104 is a heat radiating portion (light emitting element mounting portion), 105 is a heat radiating portion (connecting portion), and 106 is a lead terminal. 107 is an insulating glass, 108 is an open portion of a heat radiating portion (outer frame), and 110a and 110b are notches for attaching light emitting elements.

  A detailed configuration will be described. (C) in FIG. 3 shows the shape of the heat dissipation body after being bent and is made of a metal having high thermal conductivity, for example, copper having a thermal conductivity of 394 W / m · k, and a thin plate having a thickness of 0.8 mm. Then, it is formed in the form of the heat radiating body of FIG. Here, the outer frame 102 of the heat dissipating body is provided with an open portion 108 so that the light emitting element mounting portion 104 can be arbitrarily lengthened. Here, the light emitting element mounting portion 104 is bent vertically with high accuracy with respect to the outer frame 102, and is further bent with high accuracy with respect to the light emitting element mounting reference cutouts 110a and 110b arranged on the left and right sides of the outer frame. ing. Usually, the heat radiating portion 104 is required to have a tolerance of ± 0.03 mm with respect to a reference surface, and further, a horizontal degree of 0 ° ± 1 ° and a vertical degree of 90 ° ± 1 ° are required. In addition, regarding formation of a heat radiator, it is good to give a groove | channel to a bending part beforehand so that bending can be implemented effectively.

  According to this, since a heat radiator does not require a complicated metal mold | die, it can form at low cost. Further, heat generated from the light emitting element is efficiently conducted from the heat radiating portion (light emitting element mounting portion) 104 to the heat radiating portion (outer frame) 102 via the heat radiating portion (connecting portion) 105, and further effectively from the outer frame 102. It can dissipate heat to the outside. In addition, the light emitting element mounting portion 104 formed by bending has a degree of freedom in the height direction while being thin, and not only the element is attached to the light emitting element mounting surface but also a substrate such as an electronic circuit is attached. Is possible.

  Next, the heat radiating portion (light emitting element mounting portion) is inserted into the insertion hole 103 of the heat radiating portion (light emitting element mounting portion) 104 of the base 101 in which the lead terminal 106 and the insulating glass 107 are hermetically sealed to the base 101 by a known technique in advance. 104 is inserted and fixed by metal brazing such as silver brazing. Here, the outer periphery of the base body 101 and the heat radiating portion (outer frame) 102 may or may not be brazed, but due to the difference in the coefficient of linear thermal expansion between the material of the base body 101 and the material of the heat sink. When fixing by attaching, it is difficult to generate distortion or to obtain accuracy. Therefore, in the embodiment, the gap 110 is provided for convenience.

  In addition, since the base 101 formed in advance is hermetically sealed with the lead terminal 106 by the insulating glass 107, since this method employs a compression sealing method that is a known hermetic sealing technique of metal and glass, Detailed description is omitted.

  In the above-described embodiment, the outer frame that is a heat radiator does not need to be configured with a straight line, and may be configured with a curve such as an arc. In addition, although an earth lead serving as a ground terminal is omitted in the drawing, it is desirable to adhere to the back surface of the substrate by resistance welding or brazing. Furthermore, although the thickness of the material forming the radiator is 0.8 mm, it goes without saying that it can be appropriately changed in consideration of the strength and workability of the radiator.

  The hermetic terminal for an optical semiconductor device of the present invention relates to an airtight terminal for an optical semiconductor device on which a light emitting element such as a laser diode is mounted, and aims to provide a thin hermetic terminal having good heat dissipation at low cost. It is useful as a miniaturization of an optical semiconductor device, and a semiconductor laser device used for an optical pickup is particularly suitable for slimming a CD or DVD drive.

1A is a plan view of an airtight terminal for an optical semiconductor device according to Embodiment 1 of the present invention, FIG. 1B is a cross-sectional view taken along the line dd ′ of FIG. 1A, and FIG. (D) Front view with a semiconductor laser cap attached (A) The top view of the airtight terminal for optical semiconductor devices in Embodiment 2 of this invention, (b) is sectional drawing along the ee 'line of Fig.2 (a), (c) is after bending formation. A perspective view of a radiator, (d) is a front view with a semiconductor laser cap attached. (A) The top view of the airtight terminal for optical semiconductor devices in Embodiment 3 of this invention, (b) is a top view, (c) is a perspective view of the heat sink after bending formation, (d) is a semiconductor laser cap. Installed front view FIG. 4A is a plan view for a conventional semiconductor device, and FIG. 4B is a cross-sectional view taken along line f-f ′ in FIG.

Explanation of symbols

1 Base 2 Heat dissipation part (outer frame)
3 Light emitting element mounting part insertion hole 4 Heat dissipation part (light emitting element mounting part)
5 Heat radiation part (connection part)
6 Lead terminal 7 Insulating glass 8 Monitor element mounting part 9 Clearance 10a, 10b Notch for light emitting element mounting reference 11 Open part of heat radiating part (outer frame) 12 Cap metal frame 13 Light transmission glass window 101 Base body 102 Heat radiating part (outside frame)
103 Light-Emitting Element Mounting Part Insertion Hole 104 Heat Dissipation Part (Light-Emitting Element Mounting Part)
105 Heat dissipating part (connecting part)
106 Lead terminal 107 Insulating glass 108 Opening part of heat radiating part (outer frame) 110a, 110b Notch for light emitting element mounting reference 111a, 110b Light emitting element mounting reference surface 113 Cap metal frame 114 Light transmitting glass window

Claims (3)

A heat dissipating body having a light emitting element mounting portion and an outer frame portion in which a notch serving as a light emitting element mounting reference is disposed;
A base body having a lead terminal insulated by insulating glass;
In an airtight terminal for an optical semiconductor device joined by a metal brazing material, the light emitting element mounting portion is formed upright by bending from a thin plate and is partially connected to the outer frame portion. Airtight terminal for semiconductor devices. 2. The hermetic terminal for an optical semiconductor device according to claim 1, wherein the outer frame portion of the heat dissipating member is bent in a state where the outer frame portion is opened in part or in two or more directions. The hermetic terminal for an optical semiconductor device according to claim 1, wherein the radiator is made of copper or a copper alloy.

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