JP2006319014A - Electronic component for receiving high-frequency signal reception - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component for receiving a high-frequency signal which offers fine receiving performance and enables miniaturization and cost reduction. <P>SOLUTION: A semiconductor chip in the circuit for receiving a high-frequency signal circuit is sealed with a mold resin 4. The semiconductor chip is connected electrically to the inner leads of lead terminals 31 via wires, and the inner leads are also sealed with the mold resin 4. The outer leads of the mold resin 31 project out of the mold resin 4. A metal case 5A consists of two vessels 5Aa, 5Ab, which are combined together with their openings in face to face with each other. As a result, the mold resin 4 is stored in the metal case 5A to be enclosed three-dimensionally, at which the semiconductor chip is also enclosed three-dimensionally with the metal case 5A. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an electronic component for receiving a high-frequency signal, and more particularly to a technique for obtaining good reception performance by blocking interference radio waves such as external noise.

  FIG. 24 is a sectional view for explaining a conventional terrestrial broadcast receiving IC (Integrated Circuit) 1Z. As shown in FIG. 24, the IC 1Z includes a stage 6Z, a semiconductor chip 20Z mounted on the stage 6Z, a lead terminal 31Z, a wire 7Z connecting the semiconductor chip 20Z and the lead terminal 31Z, a semiconductor chip 20Z, and the like. It consists of a mold resin 4Z for sealing.

  Such a terrestrial broadcast receiving IC 1Z may be provided in the terrestrial broadcast receiver in a state of being built in the front end unit, or may be directly mounted on the motherboard of the receiver, that is, the mounting board, as an on-board IC. is there.

  In the front end unit, the circuit board of the unit (in which the IC 1Z is mounted) is generally accommodated in a metal shield case, and the shield case is used for interference radio waves such as mobile phone signals and other external noises. On the other hand, since it has a blocking effect, it is less susceptible to reception interference.

  On the other hand, when the terrestrial broadcast receiving IC 1Z is directly mounted on the mounting board of the receiver, the circuit components such as the IC 1Z are basically exposed, so that they are easily affected by the reception interference described above.

JP 2000-165084 A JP-A-5-95055 Japanese Utility Model Publication No. 5-411199 JP-A-6-151646 JP-A-10-270588

  When the terrestrial broadcast receiving IC 1Z is directly mounted on the mounting board of the receiver, there is a technique of covering the IC 1Z with an external shield cover as a countermeasure against jamming. However, since it is necessary to secure a place for the shield cover on the mounting board, the area occupied by the IC 1Z and the shield cover incidental to the IC 1Z increases, and as a result, the mounting board and further the receiver are increased in size. Will be invited. In addition, the above-described technique for externally attaching the shield cover increases the number of parts and the number of manufacturing processes in the mounting process, which increases the cost of the receiver.

  The present invention has been made in view of this point, and has good reception performance by blocking interference radio waves such as external noise, and compared with the case where a shield cover is placed on the electronic component on the mounting board described above. An object of the present invention is to provide a high-frequency signal receiving electronic component capable of reducing the size and cost of a mounting board or the like.

  To achieve the above object, the present invention provides a high frequency signal receiving electronic component comprising: a first semiconductor chip for a high frequency signal receiving circuit; a mold resin for sealing the first semiconductor chip; It is characterized by comprising a terminal electrically connected to the first semiconductor chip, and a metal case arranged so as to accommodate the first semiconductor chip inside.

  According to such a configuration, since the semiconductor chip is housed inside the metal case, the metal case blocks interference radio waves such as external noise with respect to the semiconductor chip (shield effect). Therefore, good reception performance can be obtained. Accordingly, it is possible to provide a high-performance high-frequency signal receiver that is unlikely to cause a reception failure even in a reception environment with a lot of external noise, and that can cope with a wider area and environment. Furthermore, since the electronic component itself includes a metal case, an electronic component having the same size as a conventional electronic component that does not have the metal case can be provided. For this reason, the mounting area can be reduced as compared with the case where the conventional electronic component is covered with the shield cover on the mounting substrate, so that the mounting substrate and further the equipment using the electronic component can be downsized. Can do. In addition, since the electronic component itself includes a metal case, and the metal case is incorporated as a part of the electronic component in the component manufacturing process (IC manufacturing process), the process is more effective than the case where the shield cover is covered in the mounting process. The cost is low due to the difference.

  The metal case preferably has a shape surrounding the first semiconductor chip three-dimensionally. According to such a configuration, even if the external noise or the like enters from various directions, it is possible to block the jamming radio wave, and thus it is possible to provide a high-frequency signal receiving electronic component having a high shielding effect.

  Moreover, it is preferable that the said metal case is arrange | positioned on the outer side of the said mold resin. According to such a configuration, since the metal case is easily grounded, the shielding effect can be ensured.

  Moreover, it is preferable that the said metal case is latched by the said mold resin. According to such a configuration, the metal case can be easily attached by the locking structure.

  Moreover, it is preferable to further include a heat conductive member disposed between the metal case and the mold resin. According to such a configuration, heat generated in the semiconductor chip is efficiently transmitted to the metal case, and the metal case can be effectively used as a heat radiating member. Electronic components can be provided.

  The metal case is preferably embedded in the mold resin. According to such a configuration, the metal case that is a conductive member can be prevented from coming into contact with an adjacent component on the mounting substrate, so that the adjacent component can be brought close to the electronic component for receiving a high-frequency signal. . For this reason, it is possible to reduce the size of the mounting substrate and the device to which the high-frequency signal receiving electronic component is applied.

  In addition, it is preferable to further include a grounding terminal electrically connected to the metal case. According to such a configuration, since the potential of the metal case can be stably set to the ground potential by connecting the grounding terminal to the ground potential, a shielding effect can be reliably obtained, and heat generation of the semiconductor chip can be achieved. Since heat can be radiated to the outside through the metal case and the terminal, it is possible to provide a high-frequency signal receiving electronic component that can be stably operated thermally.

  The metal case is preferably exposed from the mold resin on the side facing the mounting substrate. According to such a configuration, since the potential of the metal case can be stably set to the ground potential by connecting the metal case to the grounding wiring of the mounting substrate, a shielding effect can be reliably obtained.

  Moreover, it is preferable that the said metal case is exposed from the said mold resin in the opposite side to a mounting board | substrate. According to such a configuration, since the heat generated by the semiconductor chip transmitted to the metal case is dissipated from the exposed surface of the metal case, it is possible to provide a high-frequency signal receiving electronic component that can be stably operated thermally.

  Further, the metal case is composed of a container-like member embedded in the mold resin, and the high-frequency signal receiving electronic component is disposed inside the mold resin but disposed outside the metal case. It is preferable to further include a second semiconductor chip for the high-frequency signal receiving circuit.

  According to such a configuration, since the metal case is embedded in the mold resin, it is possible to prevent the metal case, which is a conductive member, from contacting an adjacent component on the mounting substrate. For this reason, an adjacent component can be made to adjoin to the said high frequency signal receiving electronic component, As a result, size reduction of the mounting substrate and apparatus to which the said high frequency signal receiving electronic component was applied can be achieved. Further, since the metal case is provided on some of the semiconductor chips in the structure including a plurality of semiconductor chips, the metal case can be small, and the material of the metal case can be saved.

  Moreover, it is preferable that the said metal case contains the container-shaped part embed | buried in the said mold resin, and the said terminal is accommodated in the said container-shaped part. According to such a configuration, since the metal case is embedded in the mold resin, it is possible to prevent the metal case, which is a conductive member, from contacting an adjacent component on the mounting substrate. For this reason, an adjacent component can be made to adjoin to the said high frequency signal receiving electronic component, As a result, size reduction of the mounting substrate and apparatus to which the said high frequency signal receiving electronic component was applied can be achieved. Furthermore, since the terminal is accommodated in the container-like part of the metal case, it is possible to suppress external noise and the like from entering from the terminal, thereby enhancing the shielding effect.

  Moreover, it is preferable that the said metal case further contains the collar part extended from the edge of the opening of the said container-shaped part to the outer side of the said opening. According to such a configuration, since the potential of the metal case can be stably set to the ground potential by grounding the collar portion of the metal case, a shielding effect can be reliably obtained.

  Moreover, it is preferable that the said metal case is comprised by the grid | lattice-like surface. According to such a configuration, it is possible to substantially reduce the material by re-working and using the metal pieces cut as the lattice-shaped holes, and this effect is costly when the metal case is made of a noble metal. It contributes greatly as a reduction. In addition, the resin can be uniformly injected into the metal case through the lattice-shaped holes, so that even if the metal case is embedded in the mold resin, the semiconductor chip can be sealed more reliably. it can.

  The metal case is preferably made of copper. According to such a configuration, it is possible to provide a high-frequency signal receiving electronic component that can be stably operated thermally by excellent heat conduction of copper.

  The high-frequency signal receiving circuit is preferably a terrestrial broadcast receiving circuit. According to such a configuration, the above-described effect is exhibited in the terrestrial broadcast receiving circuit that requires strict reception sensitivity as compared with the high-frequency signal receiving circuit for other uses such as a cellular phone, so that the broadcasting can be performed well. Can be received.

  In the present invention, the “metal case” refers to a metal member in the shape of a container or a container (with or without a lid), and the “electronic component” is an individual component mounted on a mounting board. It is an article at the component or element level and is different from a so-called “unit” which is an assembly of electronic components and the like.

  Here, when comparing the high-frequency signal receiving electronic component of the present invention with the above-described front end unit, the metal case provided in the electronic component of the present invention is disposed closer to the semiconductor chip than the shield case of the front end unit. Is done. Furthermore, according to the electronic component of the present invention, the metal case can be embedded only in a specific chip by embedding the metal case in the mold resin. For this reason, due to the difference in distance from the semiconductor chip, the electronic component of the present invention has a higher shielding effect. If the electronic component of the present invention is applied to the front end unit, a higher shielding effect can be obtained by the double structure of the metal case and the shielding case. Since the metal case exhibits a shielding effect against the jamming waves generated in, good reception performance can be obtained.

  In the high-frequency circuit package of Patent Document 1, the high-frequency circuit is not sealed with mold resin. On the other hand, in the electronic component for receiving high-frequency signals according to the present invention, the semiconductor chip is sealed with a mold resin, and therefore, it is considered that the electronic component is easier to handle and has higher reliability.

  In the semiconductor integrated circuit disclosed in Patent Document 2, the sealing resin layer is composed of three layers, and a resin containing a material having high conductivity and magnetic permeability is used as the second layer. On the other hand, the electronic component for receiving high-frequency signals according to the present invention uses a metal case made of, for example, copper, and therefore has a higher shielding effect due to the higher conductivity due to the metal compared to the second resin layer. Can be obtained. Further, according to the metal case, it is not necessary to inject the resin into a plurality of times, so that it is considered that the electronic component can be easily manufactured.

  Moreover, in the said patent document 3, the electronic component attachment structure where the shield bar straddles the minimold semiconductor is disclosed. The shield bar is a “bar (bar-shaped body)” and is different in shape from the metal case provided in the high-frequency signal receiving electronic component of the present invention. Due to the difference in shape, the metal case is considered to have a higher shielding effect because there are more shielding surfaces (surfaces facing the semiconductor chip side). In addition, the electronic component mounting structure of Patent Document 3 is applied to a hybrid IC in which various components are mixed on a substrate, whereas the high frequency signal receiving electronic component of the present invention is housed inside a metal case. Is a semiconductor chip. Since the thickness of the semiconductor chip is substantially constant, for example, in the electronic component (corresponding to a so-called multi-chip IC) including the first and second semiconductor chips described above, the metal case can be brought close to the semiconductor chip. The shielding effect is also expected to increase.

  In the IC package of Patent Document 4, a conductor layer is formed by plating or painting so as to cover the IC package. While it is considered that it is difficult to ensure the thickness of such a conductive layer by plating or painting, it is easy to ensure the thickness according to the metal case of the electronic component for receiving high-frequency signals of the present invention, and the internal resistance. Therefore, it is considered that the electronic component of the present invention can provide a better shielding effect.

  Further, in the above-mentioned Patent Document 5, “the current IC has integrated circuit elements on the upper surface of the silicon chip, and electromagnetic noise is also generated in the upper surface direction of the IC”, and a metal plate is arranged on the upper surface of the chip. An IC package is disclosed. The said metal plate of the said IC package is a plate-shaped object, and a shape differs from the metal case with which the electronic component for high frequency signal reception of this invention is equipped. Due to the difference in shape, the metal case is considered to have a higher shielding effect because there are more shielding surfaces.

  Note that FIG. 10 of Patent Document 5 discloses a shield structure in which a lead frame made larger than a plastic package covers a package by folding back a portion protruding from the plastic package (Patent Document 5 discloses a shield structure). This structure is disclosed in Japanese Patent Laid-Open No. 6-252335). However, it is considered that this shield structure does not have the shape of a container or container like the metal case provided in the electronic component for receiving high-frequency signals of the present invention, and therefore the metal case has more shield surfaces. It is considered that the shielding effect is high.

  According to the present invention, the reception performance is good by blocking interference radio waves such as external noise, and the mounting substrate and the electronic component are used compared to the case where the electronic component is covered with the shield cover on the mounting substrate. Thus, it is possible to obtain a high-frequency signal receiving electronic component capable of reducing the size and cost of the equipment.

  First, FIG. 1 shows a circuit block diagram for explaining a terrestrial broadcast receiving circuit 200 (hereinafter also simply referred to as “circuit 200”) as an example of a high-frequency signal receiving circuit. In general, the reception band of the terrestrial broadcast receiving circuit is three bands (UHF, VHF-H, and VHF-L), but here, for simplicity, only one band of UHF is illustrated.

  As shown in FIG. 1, a circuit 200 includes a high-pass filter 201, an RF booster amplifier 202, an RF single tuning circuit (bandpass filter) 203, a variable gain amplifier 204, a double tuning circuit (bandpass filter) 205, and RF amplifier 211, mixer circuit 221, IF amplifier 212, IF level detector (denoted as “DET” in the figure) 213, AGC control circuit 214, VCO circuit (oscillator) 222, PLL A circuit 233 and a low-pass filter 234 are included.

  Specifically, the RF signal input to the circuit 200 via the RF signal input terminal 251 is first removed from the reception band (here, UHF) by the high-pass filter 201 and then amplified by the RF booster amplifier 202. Is done. From the amplified signal, signals other than the channel selection channel are removed by the single tuning circuit 203, the level is adjusted by the variable gain amplifier 204, and signals other than the channel selection channel are removed by the double tuning circuit 205. The signal processed by the double tuning circuit 205 is amplified by the RF amplifier 211 and input to the mixer circuit 221 together with a local signal described later.

  The local signal is generated when the oscillation signal from the VCO circuit 222 is frequency controlled by the PLL circuit 233 and the low-pass filter 234. Note that the frequency controlled by the PLL circuit 233 is set by data and a clock input from the data input terminal 253 and the clock input terminal 254.

  The local signal is mixed with the output signal (RF signal) from the RF amplifier 211 by the mixer circuit 221, and the frequency is down-converted to an IF frequency. The IF signal is amplified by the IF amplifier 212 and output from the IF output terminal 252.

  The IF signal amplified by the IF amplifier 212 is input to the IF level detector 213, and the AGC control circuit 214 generates an AGC control voltage signal based on the signal level detected by the IF level detector 213. The gain of the variable gain amplifier 204 is controlled by the signal.

  In general, an IC incorporating a mixer circuit, an oscillator, and a PLL circuit of a terrestrial broadcast receiving circuit is called a MOP IC (Mixer Oscillator PLL IC). In the circuit 200 described above, the circuit 220 including the RF amplifier 211, the mixer circuit 221, the IF amplifier 212, the IF level detector 213, the AGC control circuit 214, the VCO circuit 222, and the PLL circuit 233 is integrated. It is made into a circuit (IC) to form a MOP IC 220.

  Next, FIG. 2 and FIG. 3 are a cross-sectional view and a perspective view for explaining a first terrestrial broadcast receiving electronic component (hereinafter also simply referred to as “electronic component”) 1A according to the embodiment. In addition, in order to avoid complication of drawing, illustration of the thickness of metal case 5A mentioned later is abbreviate | omitted in the perspective view, and such an illustration method is also the same also in drawing mentioned later.

  As shown in FIGS. 2 and 3, an electronic component 1A includes a stage (also called a die pad or an island) 6, a (first) semiconductor chip 20 corresponding to the MOP IC 220, a lead terminal 31, a wire 7, and a mold resin. 4, a metal case 5 </ b> A made of, for example, copper, and an adhesive 8.

  In the electronic component 1A, the configuration excluding the metal case 5A and the adhesive 8 corresponds to a so-called DIP (Dual Inline Package) type IC. That is, the semiconductor chip 20 is disposed on the stage 6, and the semiconductor chip 20 is electrically connected to the inner lead 31a of the lead terminal 31 by the wire 7 made of, for example, gold (Au). The semiconductor chip 20, the stage 6, the wire 7, and the inner lead 31a are covered and sealed with the mold resin 4. At this time, the lead terminal 31 is electrically connected to the semiconductor chip 20 in the inner lead 31a in the mold resin 4, while the outer lead 31b of the lead terminal 31 protrudes out of the mold resin 4 (drawn out). ing).

  In particular, in the electronic component 1 </ b> A, the metal case 5 </ b> A is disposed outside the mold resin 4 and surrounds the mold resin 4 three-dimensionally. The metal case 5 </ b> A is a hollow member having an internal space that is substantially the same shape as the outer shape of the mold resin 4, and is provided with a hole 51 for allowing the lead terminal 31 to pass therethrough. In the example of FIGS. 2 and 3, the mold resin 4 has an octagonal pillar (it can be regarded as a laid-down form in the drawing), and the metal case 5A has an outer shape substantially the same (slightly larger) as the octagonal pillar. It is hollow. And in the mold resin 4, the lead terminal 31 protrudes from the two opposite side surfaces of the octagonal column, and the metal case 5A is provided with a hole 51 around the base of the outer lead 31b correspondingly, Outer leads 31b of the lead terminals 31 protrude from the holes 51 to the outside of the metal case 5A (drawn out). The hole 51 is formed in a size and shape so that the metal case 5A and the lead terminal 31 are not short-circuited.

  Specifically, the metal case 5A is composed of two parts 5Aa and 5Ab each having a container shape, and the parts 5Aa and 5Ab are obtained by vertically dividing the above-described hollow octagonal column in the example of FIGS. One member. The two parts 5Aa and 5Ab are arranged with their container-like openings facing each other and their opening edges in contact with each other. The mold resin 4 is wrapped by the two parts 5Aa and 5Ab arranged in this way. Thereby, the mold resin 4 is three-dimensionally surrounded by the metal case 5A composed of the two portions 5Aa and 5Ab.

  The hole 51 through which the lead terminal 31 is passed is formed by combining notches 52 at the opening edges of the two container-like portions 5Aa and 5Ab. In addition, you may comprise so that the notch 52 may be provided only in one of vessel-shaped part 5Aa and 5Ab. As described above, the opening edges of both the parts 5Aa and 5Ab are in contact with each other at the part where the lead terminal 31 does not protrude.

  Such a metal case 5A, that is, the container-like portions 5Aa and 5Ab can be manufactured by, for example, press molding of a copper plate.

  An insulating adhesive 8 is applied to the hole 51 of the metal case 5 </ b> A, whereby the vessel-shaped portions 5 </ b> Aa and 5 </ b> Ab are fixed to the mold resin 4 and the lead terminal 31. The container-like part 5Aa and / or the container-like part 5Ab may be fixed to the mold resin 4 with the adhesive 8 or other adhesive.

  According to the electronic component 1A, since the mold resin 4 is accommodated inside the metal case 5A, the semiconductor chip 20 is accommodated inside the metal case 5A. For this reason, the metal case 5 </ b> A blocks interference radio waves such as external noise with respect to the semiconductor chip 20 (shield effect). Therefore, good reception performance can be obtained. As a result, it is possible to provide a high-performance terrestrial broadcast receiver that is unlikely to cause a reception failure even in a reception environment with a lot of external noise, and that can cope with a wider area and environment. Furthermore, since the electronic component 1A itself is provided with the metal case 5A, the electronic component 1A is provided with the same size as the conventional IC 1Z (see FIG. 24) that does not have such a metal case 5A. Can do. For this reason, since the mounting area can be reduced as compared with the case where the conventional IC 1Z is covered with the shield cover on the mounting board, downsizing of the mounting board and further the terrestrial broadcasting receiver using the electronic component 1A is possible. Can be achieved. Further, the electronic component 1A itself is provided with a metal case 5A, and the metal case 5A is incorporated as a part of the electronic component 1A in the component manufacturing process (IC manufacturing process), so that the shield cover is covered in the mounting process. However, the cost can be reduced due to the difference in the process.

  Further, since the metal case 5A has a shape that surrounds the semiconductor chip 20 in a three-dimensional manner, even if the external noise or the like enters from various directions, it is possible to block the jamming radio wave. As a result, a high shielding effect can be obtained.

  Further, since the metal case 5A is disposed outside the mold resin 4, the metal case 5A can be easily grounded, and the shielding effect can be ensured by such grounding.

  Next, FIG. 4 shows a cross-sectional view for explaining the second electronic component 1B according to the embodiment, and FIG. 5 shows an enlarged view of a portion 5 surrounded by a broken line in FIG. As shown in FIGS. 4 and 5, the electronic component 1B has a configuration in which the metal case 5A is replaced with a metal case 5B made of, for example, copper and the adhesive 8 is removed in the above-described electronic component 1A (see FIGS. 2 and 3). Have.

  The metal case 5B includes container-like parts 5Ba and 5Bb corresponding to the shape in which the claw 53 is provided at the opening edge of the container-like parts 5Aa and 5Ab (see FIGS. 2 and 3). Specifically, the claw 53 of the container-like part 5Ba is formed by bending the opening edges at the opposing positions in the above-mentioned container-like part 5Aa so as to face each other, in other words, toward the mold resin 4 side, The same applies to the claw 53 of the other vessel-shaped portion 5Bb. In the vessel-like portions 5Ba and 5Bb, a claw 53 is formed in a portion of a notch 52 (see FIG. 3) that forms the hole 51. Correspondingly, the claw 53 is formed in the mold resin 4 of the electronic component 1B. A depression 43 is formed around the base of the outer lead 31b so as to be hooked.

  As described above, in the electronic component 1 </ b> B, the claw 53 is caught in the recess 43, whereby the container-like portions 5 </ b> Ba and 5 </ b> Bb, that is, the metal case 5 </ b> B is locked to the mold resin 4. According to such a locking structure, the metal case 5B can be easily attached. In addition, if the size and shape of the vessel-like portions 5Ba and 5Bb are designed so that the spring action that the nail 53 tries to bite into the depression 43 works in the state where the nail 53 is caught in the depression 43, it is strong. It is locked and more preferable.

  Moreover, according to the electronic component 1B, the same effect as the above-described electronic component 1A can be obtained. That is, according to the electronic component 1B, since the semiconductor chip 20 is accommodated in the metal case 5B, the metal case 5B exhibits a shielding effect and good reception performance is obtained. Furthermore, since the electronic component 1B itself includes the metal case 5B, the mounting area can be reduced, and the size of the terrestrial broadcast receiver can be reduced, and the cost can be reduced. Further, since the metal case 5B has a shape surrounding the semiconductor chip 20 three-dimensionally, a high shielding effect can be obtained. Further, since the metal case 5B is disposed outside the mold resin 4, the grounding of the metal case 5B is simple, and the shielding effect can be ensured by such grounding.

  Next, FIG. 6 shows a cross-sectional view for explaining the third electronic component 1C according to the embodiment. As shown in FIG. 6, the electronic component 1 </ b> C is a heat conductive member (a member having a higher thermal conductivity than air) between the metal case 5 </ b> B and the mold resin 4 in the above-described electronic component 1 </ b> B (see FIG. 4). The heat dissipation sheet 9C is added. Specifically, the heat dissipation sheet 9C is disposed between the container-like part 5Ba and the mold resin 4 so as to come into contact with both elements 5Ba, 4 and between the container-like part 5Bb and the mold resin 4 It arrange | positions so that element 5Bb and 4 may be contacted. The heat radiation sheet 9C may be fixed with a heat conductive adhesive or the like, or may be fixed by being sandwiched between the metal case 5B and the mold resin 4.

  According to the electronic component 1C, the same effects as those of the above-described electronic component 1B (see FIGS. 4 and 5) can be obtained, and the following effects can also be obtained. That is, the heat generated by the semiconductor chip 20 and transmitted to the mold resin 4 by the heat dissipation sheet 9C compared to the electronic component 1B having a gap between the metal case 5B and the mold resin 4, in other words, an air layer. Can be efficiently transmitted to the metal case 5B. For this reason, since the metal case 5B can be used effectively as a heat radiating member, the electronic component 1C can be stably operated thermally.

  Next, FIG. 7 shows a cross-sectional view for explaining a fourth electronic component 1D according to the embodiment. As shown in FIG. 7, the electronic component 1 </ b> D has a configuration in which the heat radiating sheet 9 </ b> C is replaced with heat radiating grease 9 </ b> D that is a heat conductive member in the electronic component 1 </ b> C (see FIG. 6). Specifically, the heat dissipating grease 9D is disposed (filled) between the container-like part 5Ba and the mold resin 4 so as to come into contact with both the elements 5Ba and 4 and is filled with the container-like part 5Bb and the mold resin. 4 is arranged so as to contact both elements 5Bb and 4 (filled).

  The heat dissipating grease 9D has the same operations and effects as the above-described heat dissipating sheet 9C (see FIG. 6). Therefore, according to the electronic component 1D, the same effect as the above-described electronic component 1C can be obtained.

  Next, FIG. 8 shows a cross-sectional view for explaining a fifth electronic component 1E according to the embodiment. As shown in FIG. 8, the electronic component 1E has a configuration in which the metal case 5A is replaced with a metal case 5E made of, for example, copper and the adhesive 8 is removed in the electronic component 1A (see FIGS. 2 and 3). In particular, the entire metal case 5 </ b> E is embedded in the mold resin 4.

  Here, FIG. 9 shows a perspective view for explaining the metal case 5E. The metal case 5E has a hollow rectangular parallelepiped shape. As shown in FIG. 9, the metal case 5E is composed of two rectangular container portions 5Ea and 5Eb. In the example of FIG. 9, the lower vessel-like portion 5Eb is deeper. The two parts 5Ea and 5Eb are arranged with their container-like openings facing each other and their opening edges in contact with each other, thereby forming the above-described hollow rectangular parallelepiped. Inside the metal case 5E, the semiconductor chip 20 and the stage 6 are accommodated as shown in FIG. Therefore, the semiconductor chip 20 is three-dimensionally surrounded by the metal case 5E.

  As shown in FIG. 8, a hole 51 is provided in the metal case 5 </ b> E, and the wire 7 connects the semiconductor chip 20 and the inner lead 31 a of the lead terminal 31 through the hole 51. In the example of FIGS. 8 and 9, the hole 51 is formed by combining the notch 52 at the opening edge of the upper vessel-shaped portion 5Ea and the opening edge of the lower vessel-like portion 5Eb. At this time, the hole 51 is formed in a size, shape, and position so that the metal case 5A and the wire 7 are not short-circuited. A positioning projection 54 is provided at a position corresponding to the end of the notch 52 of the upper instrumental portion 5Ea at the opening edge of the lower instrumental portion 5Eb. The two vessel-like parts 5Ea and 5Eb are positioned relative to each other by contact or engagement. Further, the upper vessel-shaped portion 5Ea is provided with a hole 55 for guiding the mold resin 4 into the metal case 5E in the sealing step. Such a metal case 5E, that is, the vessel-shaped portions 5Ea and 5Eb can be manufactured by, for example, press molding or drilling of a copper plate. The holes 51 and 55 and the positioning method are not limited to the above example.

  Such a metal case 5E is embedded in the mold resin 4 as follows. First, the lead frame (having the stage 6 and the lead terminal 31) is set so that the stage 6 in a state where the semiconductor chip 20 is mounted is placed in the deeper vessel-like portion 5Eb on the lower side. And the upper vessel-shaped part 5Ea is covered. In such a state, the mold resin 4 is poured by the resin sealing device. As a result, the metal case 5E is embedded in the mold resin 4, and the resin flows into the metal case 5E from the hole 55, so that the semiconductor chip 20 is sealed. The wire 7 may be connected before the upper vessel-shaped portion 5Ea is covered, and may be either before or after the semiconductor chip 20 and the stage 6 are placed in the lower vessel-like portion 5Eb.

  In such an electronic component 1E, the semiconductor chip 20 is accommodated in the metal case 5E and the semiconductor chip 20 is three-dimensionally surrounded by the metal case 5E. (See FIG. 2). Therefore, according to the electronic component 1E, the metal case 5E exhibits a high shielding effect and good reception performance is obtained, and the mounting area is small, and the terrestrial broadcast receiver and the like can be downsized. Also, the cost can be reduced.

  In particular, in the electronic component 1E, since the metal case 5E is embedded in the mold resin 4, it is possible to prevent the metal case 5E, which is a conductive member, from contacting an adjacent component on the mounting board. For this reason, since adjacent components can be brought close to the electronic component 1E, it is possible to reduce the size of the mounting substrate to which the electronic component 1E is applied, and further the terrestrial broadcast receiver and the like.

  Next, FIGS. 10 to 12 are sectional views for explaining the sixth electronic components 1F1 to 1F3 according to the embodiment.

  First, as shown in FIG. 10, the electronic component 1F1 has a configuration in which the metal case 5E is replaced with a metal case 5F made of, for example, copper in the above-described electronic component 1E (see FIG. 8). The entire metal case 5E is embedded in the mold resin 4. The metal case 5F is formed by adding terminal connection projections 56 to the metal case 5E composed of the above-described vessel-shaped portions 5Ea and 5Eb by welding or the like, for example. In the example of FIG. 10, the terminal connection projection 56 is provided to protrude outside the metal case 5 </ b> F at the lower instrumental portion 5 </ b> Eb, and the ground terminal 31 </ b> G among the lead terminals 31 is provided on the terminal connection projection 56. The protrusion 56 and the grounding terminal 31G are electrically connected to each other.

  As described above, since the metal case 5F uses the metal case 5E (see FIG. 8), the electronic component 1F1 can provide the same effects as those of the electronic component 1E (see FIG. 8). In particular, in the electronic component 1F1, since the metal case 5F and the grounding terminal 31G are electrically connected by the protrusion 56, the potential of the metal case 5F is stably grounded by connecting the terminal 31G to the ground potential. Can be. For this reason, the shielding effect is obtained reliably. In addition, since the heat generated by the semiconductor chip 20 can be radiated to the outside through the metal case 1F and the terminal 31G, a thermally stable operation is possible.

  Note that the terminal connection protrusion 56 of the metal case 5F may be electrically connected to the grounding terminal 31G by the wire 7 as in the electronic component 1F2 shown in FIG. In this case, in view of the workability of wire bonding, it is preferable to arrange the protrusions 56 so that the wire bonding surfaces of the terminal connection protrusions 56 and the grounding terminal 31G are at the same level as shown in FIG. Such an electronic component 1F2 can provide the same effects as those of the electronic component 1F1 described above.

  Further, like the electronic component 1F3 shown in FIG. 12, by attaching the grounding terminal 31G to the metal case 5E by, for example, welding or the like in the electronic component 1E (see FIG. 8), the metal case 5E and the grounding terminal 31G are attached. And may be electrically connected. In the example of FIG. 12, the grounding terminal 31 is connected to the lower container-like portion 5Eb. Such an electronic component 1F3 can provide the same effects as those of the electronic component 1F1 described above.

  Next, FIG. 13 shows a cross-sectional view for explaining a seventh electronic component 1G according to the embodiment. FIG. 13 shows a mounting substrate 90 having wirings 92 and 92G on the substrate 91 for the sake of explanation.

  As shown in FIG. 13, the electronic component 1G has a configuration in which the metal case 5E is replaced with a metal case 5G made of, for example, copper in the electronic component 1E (see FIG. 8). The metal case 5G is common to the metal case 5E in that it is embedded in the mold resin 4, but is different from the metal case 5E in that a part thereof is exposed from the mold resin 4. In particular, the metal case 5G is exposed from the mold resin 4 on the bottom surface, that is, on the side facing the mounting substrate 90.

  Specifically, the metal case 1G has a shape in which the surface facing the mounting substrate 90 is raised outward in the metal case 5E (see FIG. 8) described above, and the raised portion is exposed from the mold resin 4. In the example of FIG. 13, the metal case 1G is composed of a container-like part 5Gb in which the lower container-like part 5Eb (see FIG. 8) of the metal case 1E is raised and an upper instrument-like part 5Ea of the metal case 1E. Composed. The vessel-like portion 5Gb having such a bulge can be manufactured by press molding or the like.

  As shown in FIG. 13, the raised portion is in direct contact with the grounding wiring 92G of the mounting substrate 90 without any gap (in other words, the raised portion and the outer lead 31b of the terminal 31 are on the same surface. Unlike the example of FIG. 13, it may be formed so as to provide a gap with the grounding wiring 92G. At this time, if a gap is provided, the metal case 1G and the ground wiring 92G may be electrically connected by solder or the like, and conversely, according to the above-described form of direct contact, mounting is not required. The process is simple.

  Since the metal case 5G uses the above-described metal case 5E (see FIG. 8), according to the electronic component 1G, the same effect as the above-described electronic component 1E can be obtained. In particular, in the electronic component 1G, since the metal case 5G is exposed from the mold resin 4 on the side facing the mounting substrate 90, the potential of the metal case 5G is connected by connecting the metal case 5G to the ground wiring 92G of the mounting substrate 90. Can be stably set to the ground potential. As a result, a shielding effect can be reliably obtained.

  Next, FIG. 14 shows a sectional view for explaining an eighth electronic component 1H according to the embodiment. FIG. 14 shows a mounting substrate 90 for explanation.

  As shown in FIG. 14, the electronic component 1H has a configuration in which the metal case 5E is replaced with, for example, a metal case 5H made of copper in the above-described electronic component 1E (see FIG. 8). The metal case 5H is common to the metal case 5E in that it is embedded in the mold resin 4, but is different from the metal case 5E in that a part thereof is exposed from the mold resin 4. In particular, the metal case 5 </ b> H is exposed from the mold resin 4 on the upper surface opposite to the mounting substrate 90.

  Specifically, the metal case 1H has a shape in which the surface opposite to the mounting substrate 90 is raised outward in the metal case 5E (see FIG. 8), and the raised portion is exposed from the mold resin 4. ing. In the example of FIG. 14, the metal case 1 </ b> H includes a container-like part 5 </ b> Ha in which the upper container-like part 5 </ b> Ea (see FIG. 8) of the metal case 1 </ b> E is raised and a lower container-like part 5 </ b> Eb of the metal case 1 </ b> E. Composed. The vessel-shaped portion 5Ha having such a bulge can be manufactured by press molding or the like.

  Since the metal case 5H uses the above-described metal case 5E (see FIG. 8), according to the electronic component 1H, the same effect as the above-described electronic component 1E can be obtained. In particular, in the electronic component 1H, since the metal case 5H is exposed from the mold resin 4 on the side opposite to the mounting substrate 90, the heat generated by the semiconductor chip 20 transmitted to the metal case 5H is dissipated from the exposed surface of the metal case 5H. Therefore, a thermally stable operation is possible.

  Next, FIGS. 15 and 16 are a sectional view and a perspective view for explaining the ninth electronic component 1J according to the embodiment. As shown in FIG. 15, in the electronic component 1J, in the electronic component 1E (see FIG. 8), the metal case 5E is replaced with a metal case 5J made of, for example, copper, and a single semiconductor chip 20 is replaced with a plurality of semiconductor chips 21. , 23. The plurality of semiconductor chips 21 and 23 generally correspond to the semiconductor chip 20 described above, that is, the MOP IC 220 (see FIG. 1). In the electronic component 1J, the (first) semiconductor chip 21 corresponds to the mixer circuit 221 (see FIG. 1), and the (second) semiconductor chip 23 corresponds to other circuits.

  Specifically, as shown in FIG. 16, the metal case 5J has a container shape, and in the example of FIG. 16, it is formed of a rectangular container member. In FIG. 16, the metal case 5 </ b> J is illustrated with the vessel-shaped opening facing upward to help understand the shape. Returning to FIG. 15, in the electronic component 1 </ b> J, such a metal case 5 </ b> J covers only the semiconductor chip 21 corresponding to the mixer circuit 221 among the plurality of semiconductor chips 21 and 23 mounted on the stage 6. The semiconductor chip 21 is accommodated in the metal case 5J. At this time, the semiconductor chips 21 and 23 are both arranged on the stage 6 in the mold resin 4, but the semiconductor chip 23 corresponding to the other circuit described above is arranged outside the metal case 5J.

  The entire metal case 5J is embedded in the mold resin 4. At this time, the metal case 5J has the same hole 55 as the above-described metal case 5E, and the mold resin 4 flows into the metal case 5J through the hole 55, so that the semiconductor in the metal case 5J. The chip 21 is sealed. In addition, in the example of FIG. 16, the hole 55 is provided in the vessel-shaped bottom surface (in the state covered with the semiconductor chip 21) of the metal case 5J. Such a metal case 5J can be manufactured by, for example, press molding of a copper plate, but the shape, the position of the hole 55, and the like are not limited to the examples of FIGS.

  According to such an electronic component 1J, since the semiconductor chip 23 is accommodated in the metal case 5J, the metal case 5J exhibits a high shielding effect and good reception performance is obtained, and the mounting area is small. It is possible to reduce the size of Tesumi terrestrial broadcast receivers and the like, and the cost can be reduced.

  Further, since the metal case 5J is embedded in the mold resin 4, the adjacent component can be brought close to the electronic component 1J on the mounting substrate in the same manner as the electronic component 1E (see FIG. 8). It is possible to reduce the size of the mounting substrate, the terrestrial broadcast receiver, and the like to which the electronic component 1J is applied.

  Furthermore, since the metal case 5J is provided on some of the semiconductor chips 21 in the electronic component 1J including the plurality of semiconductor chips 21 and 23, the metal case 5J is the metal case 5E described above (see FIG. 8) or the like. Therefore, the material of the metal case 5J can be saved.

  Here, when external noise enters the mixer circuit 221 (see FIG. 1), this noise is also mixed with the RF signal, so that a noise component is generated in the output signal, causing a reception failure. On the other hand, in the electronic component 1J, since the metal case 5J is put on the semiconductor chip 21 corresponding to the mixer circuit 221, such a reception failure can be reduced.

  Next, FIG. 17 shows a cross-sectional view for explaining a tenth electronic component 1K according to the embodiment. As shown in FIG. 17, the electronic component 1K includes a plurality of semiconductor chips 22 corresponding to the above-described semiconductor chip 20, that is, the MOP IC 220 (see FIG. 1) as a whole, like the electronic component 1J (see FIG. 15). , 24. In the electronic component 1J, the (first) semiconductor chip 22 corresponds to the VCO circuit 222 (see FIG. 1), and the (second) semiconductor chip 24 corresponds to other circuits.

  The electronic component 1K includes the above-described metal case 5J, and the metal case 5J covers only the semiconductor chip 22 corresponding to the VCO circuit 222 among the plurality of semiconductor chips 23 and 24 mounted on the stage 6. Thus, the semiconductor chip 22 is accommodated in the metal case 5J. At this time, the semiconductor chips 22 and 24 are both arranged on the stage 6 in the mold resin 4, but the semiconductor chip 24 corresponding to the other circuit described above is arranged outside the metal case 5J. Also in the electronic component 1 </ b> K, the entire metal case 5 </ b> J is embedded in the mold resin 4. The remaining configuration of the electronic component 1K is the same as that of the above-described electronic component 1J (see FIG. 15).

  Since the electronic component 1K is the same as the above-described electronic component 1J (see FIG. 15) except for the difference between the semiconductor chips 21 and 22 accommodated in the metal case 5J, the electronic component 1K has the same effect as the electronic component 1J.

  When external noise enters the VCO circuit 222 (see FIG. 1), a noise component is generated in the local signal generated by the VCO circuit 222, and this noise is generated by the mixer circuit 221 (see FIG. 1) as an RF signal. Therefore, a noise component is generated in the output signal, which causes a reception failure. On the other hand, in the electronic component 1K, since the metal case 5J is put on the semiconductor chip 22 corresponding to the VCO circuit 222, it is possible to reduce such a reception failure.

  Next, FIGS. 18 and 19 are a cross-sectional view and a perspective view for explaining the eleventh electronic component 1L according to the embodiment. As shown in FIG. 18, the electronic component 1L has a configuration in which the metal case 5E is replaced with a metal case 5L made of copper, for example, in the electronic component 1E (see FIG. 8). The metal case 5L is composed of the above-described metal case 5E in a lattice-like (in other words, mesh-like) surface, and the above-described vessel-like portions 5Ea and 5Eb (see FIG. 9) are lattice-like (in other words, In this case, it is composed of vessel-like portions 5La and 5Lb constituted by a mesh-like surface. The arrangement of the metal case 5L is the same as that of the metal case 5E described above. Such a metal case 5L can be manufactured, for example, by drilling the above-described metal case 5E or by press-molding a grid-like copper plate.

  The metal case 5L is the same as the metal case 5E described above (see FIG. 8) except that the metal case 5L is composed of a lattice-like surface, and also has a shielding effect even on the lattice-like surface. According to the component 1L, the same effect as the electronic component 1E (see FIG. 8) described above can be obtained.

  In particular, since the metal case 5L is constituted by a lattice-like surface, the material can be substantially reduced by reworking and using the metal pieces cut as lattice-like holes. Such material reduction greatly contributes to cost reduction when the metal case 5L is made of a noble metal. In addition, since the resin can be uniformly injected into the metal case 5L through the lattice-shaped holes, the semiconductor chip 20 can be surely secured even if the metal case 5L is the electronic component 1L embedded in the mold resin 4. Can be sealed. Such an effect can also be obtained by configuring the above-described metal cases 5F to 5H, 5J, and 5K and metal cases 5M and 5N described later embedded in the mold resin 4 with a lattice-like surface.

  Next, FIG. 20 shows a cross-sectional view for explaining a twelfth electronic component 1M according to the embodiment. As shown in FIG. 20, the electronic component 1M has a configuration in which the metal case 5E is replaced with a metal case 5M made of copper, for example, and the lead terminal 31 is replaced with a terminal 32 in the electronic component 1E (see FIG. 8). ing. The metal case 5M is entirely embedded in the mold resin 4 in the same manner as the metal case 5E described above.

  In the electronic component 1M, the configuration excluding the metal case 5M corresponds to a so-called QFN (Quad Flat Non-Lead Package) type IC. That is, the terminal 32 is entirely embedded in the mold resin 4 and is exposed only on the bottom surface (the surface facing the mounting substrate) of the electronic component 1M. At this time, the terminal 32 does not protrude from the mold resin 4 unlike a DIP type IC (for example, see FIG. 8). The terminal 32 is electrically connected to the semiconductor chip 20 on the stage 6 and the wire 7 in the mold resin 4, and this point is the same as the lead terminal 31 described above (see, for example, FIG. 8).

  Here, FIG. 21 shows a perspective view for explaining the metal case 5M. In the example of FIG. 21, the metal case 5M is made of a rectangular vessel-like member (and thus includes a vessel-like portion), and has a hole 55 similar to that of the metal case 5E described above (see FIG. 9). . Such a metal case 5M can be manufactured, for example, by press molding of a copper plate.

  Referring back to FIG. 20, in the electronic component 1M, the metal case 5M is embedded in the mold resin 4, and not only the stage 6, the semiconductor chip 20 and the wires 7 thereon, but also the entire lead terminal 32 of the metal case 5M. Housed inside. At this time, the opening of the metal case 5M, that is, the opening of the container-like member is arranged so as to face the mounting substrate side, and as a result, the lead terminal 32 is placed on the bottom surface (surface facing the mounting substrate) of the electronic component 1M as described above. ) Only exposed. In addition, since the metal case 5M accommodates the whole wire 7 inside, it does not have the hole 51 (refer FIG. 8) for letting the wire 7 pass.

  Such a metal case 5M is embedded in the mold resin 4 as follows. First, the semiconductor chip 20 on the stage 6 is connected to the terminal 32 by the wire 7. Thereafter, the metal case 5M is covered, and the mold resin 4 is poured by the resin sealing device in such a state, whereby the metal case 5M is embedded in the mold resin 4 and the resin is introduced into the metal case 5M from the hole 55. The semiconductor chip 20 is sealed by flowing.

  According to such an electronic component 1M, since the semiconductor chip 20 is accommodated in the metal case 5M, the metal case 5M exhibits a high shielding effect as in the electronic component 1E (see FIG. 8) described above. Therefore, good reception performance can be obtained, the mounting area can be reduced, and the size of the terrestrial broadcast receiver can be reduced, and the cost can be reduced. Furthermore, since the metal case 5M is embedded in the mold resin 4, the adjacent component can be brought close to the electronic component 1M on the mounting board, as in the electronic component 1E described above. The mounting board to which 1M is applied and the terrestrial broadcast receiver can be downsized.

  In particular, since the terminal 32 is accommodated in the metal case 5M, it is possible to prevent external noise and the like from entering from the terminal 32, thereby enhancing the shielding effect.

  Next, FIG. 22 shows a cross-sectional view for explaining a thirteenth electronic component 1N according to the embodiment. Note that FIG. 22 shows a mounting substrate 90 for explanation. As shown in FIG. 22, the electronic component 1N has a configuration in which the metal case 5M is replaced with a metal case 5N made of, for example, copper in the above-described electronic component 1M (see FIG. 20).

  Here, FIG. 23 shows a perspective view for explaining the metal case 5N. As shown in FIGS. 22 and 23, the metal case 5N includes a container-like part 5Na composed of the metal case 5M (see FIG. 21) and a collar part extending from the opening edge of the container-like part 5Na to the outside of the opening. 5Nb. Similar to the metal case 5M described above, the container-like portion 5Na is entirely embedded in the mold resin 4 with the opening directed toward the mounting substrate 90, and inside the stage 6, the semiconductor chip 20, and the terminals 32 and wire 7 are accommodated. The flange portion 5Nb is exposed from the mold resin 4 and protrudes at an angle (here, 90 °) with respect to the side surface of the container-like portion 5Na so as to face and contact the grounding wiring 92G of the mounting substrate 90. ing. The metal case 5N has a hole 55 as in the case of the metal case 5M. The metal case 5N having such a shape can be manufactured by subjecting a copper plate to press molding, bending, drilling, or the like.

  In the example of FIG. 23, the collar portions 5Nb are provided at two opposing positions on the opening edge, but the collar portions 5Nb may be provided at each edge of the opening, and a single collar is provided over the entire circumference. The part 5Nb may be provided.

  Since the metal case 5N uses the above-described metal case 5M, the electronic component 1N can provide the same effects as the electronic component 1M (see FIG. 20). Furthermore, since the potential of the metal case 5N can be stably set to the ground potential by grounding the collar portion 5Nb of the metal case 5N, the electronic component 1M can reliably obtain a shielding effect.

  The metal case 5A and the like described above can be formed of various metals. In particular, by forming the metal case 5A or the like, an electronic component 1A or the like that can be stably operated thermally by excellent heat conduction of copper is obtained. Can do.

  The metal cases 5A, 5B, 5E, 5F, 5G, 5H, and 5L are not limited to the DIP type, but may be an electronic component in which the terminal 31 protrudes from the side surface of the mold resin 4, such as a QFP (Quad Flat Package) type. Is also applicable. In addition to the QFN type, the metal cases 5M and 5N are electronic components of a type in which the terminal 32 is exposed or protrudes only on the bottom surface (the surface facing the mounting substrate) of the mold resin 4, for example, BGA (Ball Grid Array). Applicable to types. Further, the metal cases 5J and 5K can be applied to various types such as DIP, QFP, QFN, and BGA regardless of whether the terminal 31 protrudes from the side surface of the mold resin 4 or not.

  In the above description, the MOP IC 220 is exemplified, but the metal case 5A and the like can be applied to other terrestrial broadcast receiving circuits such as a down converter IC, a video / audio demodulation IC, an OFDM (Orthogonal Frequency Division Multiplexing) demodulation IC, and the like. is there. Furthermore, the metal case 5A or the like can be applied not only to a terrestrial broadcast receiving circuit but also to a high-frequency signal receiving circuit for all uses such as a cellular phone (with TV), a wireless LAN, and a transceiver. The high frequency signal including terrestrial broadcasting may be analog or digital. At this time, in a terrestrial broadcast receiving circuit that requires strict reception sensitivity compared to a high-frequency signal receiving circuit for other uses such as a cellular phone, the metal case 5A and the like exhibit good effects as described above. Broadcast reception can be realized.

These are the circuit block diagrams for demonstrating the terrestrial broadcast receiving circuit which concerns on embodiment. These are sectional drawings for demonstrating the 1st electronic component for terrestrial broadcasting reception which concerns on embodiment. These are the perspective views for demonstrating the 1st electronic component for terrestrial broadcast reception which concerns on embodiment. These are sectional drawings for demonstrating the 2nd electronic component for terrestrial broadcasting reception which concerns on embodiment. These are the enlarged views of the part 5 enclosed with the broken line in FIG. These are sectional drawings for demonstrating the 3rd electronic component for terrestrial broadcast reception which concerns on embodiment. These are sectional drawings for demonstrating the 4th electronic component for terrestrial broadcast reception which concerns on embodiment. These are sectional drawings for demonstrating the 5th electronic component for terrestrial broadcasting reception which concerns on embodiment. These are perspective views for demonstrating the metal case of the 5th electronic component for terrestrial broadcast reception which concerns on embodiment. These are sectional drawings for demonstrating the 1st structure of the 6th electronic component for terrestrial broadcast reception which concerns on embodiment. These are sectional drawings for demonstrating the 2nd structure of the 6th electronic component for terrestrial broadcast reception which concerns on embodiment. These are sectional drawings for demonstrating the 3rd structure of the 6th electronic component for terrestrial broadcast reception which concerns on embodiment. These are sectional drawings for demonstrating the 7th electronic component for terrestrial broadcast reception which concerns on embodiment. These are sectional drawings for demonstrating the 8th electronic component for terrestrial broadcasting reception which concerns on embodiment. These are sectional drawings for demonstrating the 9th electronic component for terrestrial broadcasting reception which concerns on embodiment. These are perspective views for demonstrating the 9th electronic component for terrestrial broadcast reception which concerns on embodiment. These are sectional drawings for demonstrating the 10th electronic component for terrestrial broadcast reception which concerns on embodiment. These are sectional drawings for demonstrating the eleventh terrestrial broadcast reception electronic component which concerns on embodiment. These are perspective views for demonstrating the metal case of the eleventh terrestrial broadcast receiving electronic component which concerns on embodiment. These are sectional drawings for demonstrating the 12th terrestrial broadcast reception electronic component which concerns on embodiment. These are the perspective views for demonstrating the metal case of the 12th terrestrial broadcast reception electronic component which concerns on embodiment. These are sectional views for explaining the thirteenth terrestrial broadcast receiving electronic component according to the embodiment. These are perspective views for demonstrating the metal case of the thirteenth terrestrial broadcast reception electronic component which concerns on embodiment. These are sectional drawings for demonstrating the conventional electronic component for terrestrial broadcasting reception.

Explanation of symbols

1A to 1E, 1F1 to 1F3, 1G, 1H, 1J to 1N Terrestrial broadcast receiving electronic components (high frequency signal receiving electronic components)
20-22 Semiconductor chip (first semiconductor chip)
23, 24 Semiconductor chip (second semiconductor chip)
31, 32 terminal 31G grounding terminal 4 mold resin 5A, 5B, 5E-5H, 5J-5N metal case 5Na instrumental part 5Nb collar part 9C heat dissipation sheet (thermally conductive member)
9D heat dissipation grease (thermally conductive member)
90 Mounting substrate 200 Terrestrial broadcast receiving circuit (high frequency signal receiving circuit)

Claims (15)

A first semiconductor chip for a high-frequency signal receiving circuit;
A mold resin for sealing the first semiconductor chip;
A terminal electrically connected to the first semiconductor chip in the mold resin;
An electronic component for receiving a high-frequency signal, comprising: a metal case disposed so as to accommodate the first semiconductor chip therein.   The high frequency signal receiving electronic component according to claim 1, wherein the metal case has a shape surrounding the first semiconductor chip three-dimensionally.   The high frequency signal receiving electronic component according to claim 1, wherein the metal case is disposed outside the mold resin.   The high frequency signal receiving electronic component according to claim 3, wherein the metal case is locked to the mold resin.   The high-frequency signal receiving electronic component according to claim 3, further comprising a heat conductive member disposed between the metal case and the mold resin.   The high frequency signal receiving electronic component according to claim 1, wherein the metal case is embedded in the mold resin.   The high frequency signal receiving electronic component according to claim 6, further comprising a grounding terminal electrically connected to the metal case.   The high frequency signal receiving electronic component according to claim 6, wherein the metal case is exposed from the mold resin on a side facing the mounting substrate.   The high frequency signal receiving electronic component according to claim 6, wherein the metal case is exposed from the mold resin on a side opposite to the mounting substrate. The metal case is composed of a container-like member embedded in the mold resin,
The high-frequency signal receiving electronic component further includes a second semiconductor chip for the high-frequency signal receiving circuit, which is disposed in the mold resin but disposed outside the metal case. Item 5. The electronic component for high-frequency signal reception according to Item 1. The metal case includes a container-like portion embedded in the mold resin,
The high frequency signal receiving electronic component according to claim 1, wherein the terminal is accommodated in the container-like portion.   The high frequency signal receiving electronic component according to claim 11, wherein the metal case further includes a collar portion extending from an edge of the opening of the vessel-shaped portion to the outside of the opening.   The high frequency signal receiving electronic component according to claim 6, wherein the metal case is configured by a lattice-like surface.   The high frequency signal receiving electronic component according to any one of claims 1 to 13, wherein the metal case is made of copper.   The high-frequency signal receiving electronic component according to claim 1, wherein the high-frequency signal receiving circuit is a terrestrial broadcast receiving circuit.

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