JP2006310761A - Tray for chip electronic component, its manufacturing process, and process for manufacturing chip electronic component using it - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a tray for chip electronic component which can contain a large number of ceramic electronic components while reducing the clearance between a base board and a mesh body without touching the terminal electrodes to each other. <P>SOLUTION: A base board 2 is composed of a metal material and includes a flat surface 21 on one side. A mesh body 4 is woven of metal wires 41 and 42 and includes a large number of intersections 43 and meshes 45. The intersections 43 are formed by overlapping the metal wires 41 and 42 in the thickness direction of the mesh body 4. The meshes 45 form a component containing section surrounded by the intersections 43 and the metal wires 41 and 42. The base board 2 and the mesh body 4 are bonded to the intersections 43 by a diffusion joint 5. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a chip-shaped electronic component tray suitable for use in baking terminal electrodes of chip-shaped electronic components such as multilayer ceramic capacitors, a method for manufacturing the tray, and a method for manufacturing a chip-shaped electronic component using the tray. .

  A chip-shaped electronic component having an internal electrode has a terminal electrode (external electrode) at the end. A multilayer ceramic capacitor forms a green sheet laminate by alternately laminating internal electrodes and ceramic dielectric layers in a necessary number. Next, the green sheet laminate is cut into individual green chips and then fired.

  Next, an electrode paste containing a conductive component and an organic binder (conductor paste) is applied to both ends of the ceramic electronic component obtained by firing the green chip and electrically connected to the tomographic surface of the internal electrode by baking. The terminal electrode to be formed is formed. As the conductive component, for example, an electrode paste mixed with another composition in the form of copper powder is used, and after being applied to both end faces of the ceramic electronic component, it is baked to form a copper terminal electrode.

When baking the terminal electrode, a temperature range of 700 ° C. to 900 ° C. is performed in a nitrogen (N ₂ ) atmosphere, that is, in a neutral atmosphere so that the fault surface of the internal electrode is not oxidized and poor conduction with the terminal electrode occurs. It is baked in.

  In this baking process, a tunnel-type firing furnace is configured so that a mesh belt made of stainless steel wire (for example, SUS316) circulates, and a ceramic electronic component coated with electrode paste is made of a mesh made of stainless steel wire. The trays are stored in bulk at random, and this tray is placed on a frame made of stainless steel wire, and the frame is placed on a mesh belt and passed through a tunnel-shaped firing furnace.

  However, ceramic electronic components randomly stacked and accommodated in trays are baked in contact with each other when the terminal electrode to which the electrode paste is applied contacts the terminal electrode of another adjacent ceramic electronic component. It will stick. If you try to forcibly remove the ceramic electronic components that are attached to each other, either one of the terminal electrodes will be partially peeled off, so that uneven scratches remain on part of the terminal electrodes formed at both ends, and the terminal electrodes It becomes a factor which worsens a yield as a defect.

  In order to solve this problem, for example, Patent Document 1 discloses a tray in which a terminal electrode applied to a ceramic electronic component does not come into contact with a terminal electrode applied to another ceramic electronic component.

  In this tray, a net is fixed to a base plate, and one coated ceramic electronic component is accommodated and conveyed for each section of the tray mesh. For this reason, since the terminal electrode to which the electrode paste is applied does not come into contact with the terminal electrode of another adjacent ceramic electronic component, the above-described problem can be solved.

  However, this tray has a mesh body fixed to a base plate by spot welding (spot welding). According to the description of Patent Document 1, the interval and arrangement of spot welding are, for example, equal intervals in the vertical and horizontal directions. The base plate and the mesh body are fixed to the base plate where the mesh body is spot welded. However, a gap is likely to be generated between the base plate and the mesh body at the location where spot welding is not performed. The placement of spot welding is dense so that this gap does not widen inadequately when holding ceramic electronic components, but the location of spot welding cannot hold ceramic electronic components, so the location of spot welding is as small as possible. Thus, the number of ceramic electronic components accommodated is obtained.

Therefore, according to the technique described in Patent Document 1, the smaller the ceramic electronic component is, the more it is necessary to increase the number of spot welding points. As a result, the number of ceramic electronic components accommodated decreases.
Japanese Patent Laid-Open No. 2003-77776

  An object of the present invention is to provide a chip-shaped electronic component tray in which terminal electrodes of ceramic electronic components do not contact each other, a method for manufacturing the tray, and a method for manufacturing a chip-shaped electronic component using the tray. .

  Another object of the present invention is to provide a chip-shaped electronic component tray in which the gap between the base plate and the net is small and the chip-shaped electronic component does not enter the gap, a method for manufacturing the tray, and the tray. It is to provide a method for manufacturing the chip-shaped electronic component used.

  Still another object of the present invention is to provide a chip-shaped electronic component tray having a large quantity of ceramic electronic components, a method for manufacturing the tray, and a method for manufacturing a chip-shaped electronic component using the tray.

  In order to solve the above-described problems, the present invention discloses a chip-shaped electronic component tray, a method for manufacturing the tray, and a method for manufacturing a chip-shaped electronic component using the tray.

1. Chip-shaped electronic component tray The chip-shaped electronic component tray according to the present invention includes a base plate and a net. The base plate is made of a metal material and includes a flat plate surface on one side. The mesh body is woven with metal wires, and includes a large number of metal wire intersections and a large number of meshes. The base plate and the net are fixed to the intersecting portion by diffusion bonding on the flat plate surface.

2. Manufacturing method of chip-shaped electronic components (Tray usage method)
In the chip-shaped electronic component manufacturing method according to the present invention, the above-described chip-shaped electronic component tray is used, and the ceramic electronic component with a coating film is accommodated in the mesh of the chip-shaped electronic component tray. And the said ceramic electronic component with a coating film accommodated in the said tray for chip-shaped electronic components is heated, and a terminal electrode is baked.

  Here, in the tray for chip-shaped electronic components according to the present invention, the mesh body is woven with metal wires, and includes a large number of metal wire intersections and a large number of meshes. Accordingly, since one mesh is used as an accommodating section for one chip-shaped electronic component, and one ceramic electronic component can be accommodated in each mesh, the terminal electrodes of the ceramic electronic component are not in contact with each other. Tray can be provided.

  Since the base plate and the net are fixed to the crossing portion by diffusion bonding on the flat plate surface, the crossing portion is fixed to the base plate over the entire surface of the net and the gap between the base plate and the net is kept small. Can do. Therefore, it is possible to prevent a problem that the chip-shaped electronic component enters the gap between the base plate and the net.

  Further, since the portion fixed to the base plate is a crossing portion of the mesh body, basically, all the meshes can be used as housing sections for chip-shaped electronic components. For this reason, the tray for chip-shaped electronic components with a large accommodation quantity of ceramic electronic components can be provided.

3. Manufacturing method of tray for chip-shaped electronic component The manufacturing method of the tray for chip-shaped electronic component according to the present invention, when manufacturing the above-described tray for chip-shaped electronic component, arranges the net body on one surface of the base plate, The base plate and the mesh body are pressurized and heated, and the base plate and the mesh body are fixed to the intersecting portion by diffusion bonding on the flat plate surface.

  In the above-described method for manufacturing a chip-shaped electronic component tray, when the mesh body is arranged on one surface of the base plate, the thickness of the intersecting portion is large, so that the intersecting portion contacts one surface of the base plate over the entire surface of the mesh body. In this state, the base plate and the net body are sandwiched from both sides, pressurized, and heated, so that the base plate and the net body can be fixed by diffusion bonding.

  According to the diffusion bonding described above, the intersecting portion is fixed to the base plate over the entire surface of the net body, and the gap between the base plate and the net body can be kept small. Therefore, it is possible to prevent a problem that the chip-shaped electronic component enters the gap between the base plate and the net.

  In addition, since the intersecting portion is formed by overlapping the metal wires in the thickness direction of the mesh body, the thickness of this portion is increased. For this reason, when a net is combined with the flat plate surface of the base plate, the crossing portion contacts the flat plate surface over the entire surface of the net.

  Therefore, by pressurizing and heating both, the contact portion over the entire surface of the net can be diffusion bonded to the flat plate surface of the base plate.

  Furthermore, since the portion fixed to the base plate is the intersection of the mesh body, basically, all the meshes can be used as the accommodating section for the chip-shaped electronic component. For this reason, the tray for chip-shaped electronic components with a large accommodation quantity of ceramic electronic components can be provided.

  Other objects, configurations and advantages of the present invention will be described in more detail with reference to the accompanying drawings. However, the attached drawings are merely examples.

As described above, according to the present invention, the following effects can be obtained.
(A) It is possible to provide a chip-shaped electronic component tray in which terminal electrodes of ceramic electronic components do not contact each other, a method for manufacturing the tray, and a method for manufacturing a chip-shaped electronic component using the tray.
(B) A chip-shaped electronic component tray in which a gap between the base plate and the net is small and no chip-shaped electronic component enters the gap, a method for manufacturing the tray, and a chip-shaped electronic component using the tray The manufacturing method of can be provided.
(C) It is possible to provide a chip-shaped electronic component tray having a large quantity of ceramic electronic components, a method for manufacturing the tray, and a method for manufacturing a chip-shaped electronic component using the tray.

1. 1 is a plan view showing an embodiment of a chip-shaped electronic component tray according to the present invention, FIG. 2 is an enlarged plan view of an arrow A portion shown in FIG. 1, and FIG. FIG. 3 is a sectional view taken along line 3-3. The illustrated chip-shaped electronic component tray includes a base plate 2 and a net body 4. The base plate 2 is made of a metal material and includes a flat plate surface 21 on one surface.

  Referring to FIG. 3, the mesh body 4 is woven with vertical metal wires 41 and horizontal metal wires 42, and includes a large number of intersections 43 and a large number of meshes 45. The intersecting portion 43 is formed by overlapping the metal wires 41 and 42 in the thickness direction of the net body 4. More specifically, the intersecting portion 43 is a portion adjacent to each other, and is alternately woven so that the upper and lower sides of the metal wires 41 and 42 are alternated. The form of the mesh body 4 is not limited to the present embodiment, and any form may be employed as long as the intersecting portion 43 is formed so as to overlap in the thickness direction of the mesh body 4. Moreover, if the intersection part 43 exists for every component storage section, the diffusion joining 5 can be performed for every component storage section, and the clearance gap between the base board 2 and the net body 4 can be kept small.

  The mesh 45 forms a component storage section surrounded by the intersecting portion 43 and the metal wires 41 and 42. The base plate 2 and the net 4 are fixed to each other on the flat plate surface 21 by the intersection 43 and the diffusion bonding 5. The mesh 45 preferably has a square shape with an aspect ratio of 1: 1 to 3: 4, and has an aspect ratio in which the longitudinal direction of the ceramic electronic component 1 cannot enter the lateral direction.

  When the height of the mesh 45 is too low, the accommodated ceramic electronic component 1 is likely to drop off, and when it is too high, it is difficult to accommodate the ceramic electronic component. Therefore, the height of the mesh 45 is set to a height that does not cause the above-described problems in consideration of the height dimension of the ceramic electronic component 1. Since the height of the mesh 45 is mainly determined by the diameters of the metal wires 41 and 42 constituting the mesh body 4, the diameter of the metal wires 41 and 42 is selected when setting the height of the mesh 45.

  As the material of the mesh body 4, since the terminal electrode is baked in a temperature range of 700 ° C. to 900 ° C., a material which is stable at a high temperature, for example, SUS304 (Fe-18Cr-Ni), MN (63Ni-30Cu) , Ha (Ni—Cr—Mo), titanium and the like are preferable. Titanium is particularly preferable. Titanium is extremely convenient because it does not adhere to ceramic electronic components at the time of terminal electrode baking. When titanium is used, the base plate 2 and the mesh body 4 may be formed of titanium, or may be formed as a titanium coating film on the surface of stainless steel by means such as plating or coating. The material of the base plate 2 and the net body 4 is preferably the same material for ensuring diffusion bonding. Note that MN (63Ni-30Cu) indicates that the alloy MN contains 63% or more of Ni and about 30% of Cu as material components.

2. Manufacturing method of chip-shaped electronic components (Tray usage method)
In the manufacturing method of the chip-shaped electronic component according to the present invention, the above-described tray is used in the terminal electrode baking process of the chip-shaped electronic component. FIG. 4 is a partial cross-sectional view showing a state in which the ceramic electronic component 1 is accommodated in the chip-shaped electronic component tray shown in FIG. 3 when the terminal electrode of the chip-shaped electronic component is baked. The ceramic electronic component 1 is provided with a terminal electrode coating film 10 before baking. If the ceramic electronic component 1 is, for example, a multilayer ceramic capacitor, the terminal electrode coating film 10 is applied to both ends of the ceramic electronic component 1 in the longitudinal direction.

  The ceramic electronic component 1 having the terminal electrode coating film 10 is manufactured by a known manufacturing method. The terminal electrode coating film 10 includes, for example, a conductive component mainly composed of a metal powder such as copper and an organic binder, and a paste prepared by mixing these is applied to the ceramic body and dried. To obtain. The kind of terminal electrode coating film that can be used is not particularly limited, and any conventionally known terminal electrode coating film can be arbitrarily used according to the application.

  In FIG. 4, the ceramic electronic components 1 are accommodated one by one in the mesh 45. When the ceramic electronic component 1 is a general-purpose multilayer ceramic capacitor, if the mesh 45 has a square shape with an aspect ratio of 1: 1 to 3: 4, the longitudinal direction of the ceramic electronic component 1 cannot enter sideways. . Therefore, the ceramic electronic component 1 with a coating film is accommodated in the mesh 45 with the longitudinal direction as the height direction, and a plurality of ceramic electronic components 1 are not accommodated in one mesh 45.

  Next, the ceramic electronic component 1 with a coating film housed in the chip-shaped electronic component tray is placed in a baking furnace together with the chip-shaped electronic component tray, and is heated to about 700 ° C. to 900 ° C. to be subjected to terminal electrode baking. Is called. At this time, a binder removal process for removing the organic binder from the terminal electrode coating film 10 applied to the ceramic electronic component 1 is performed. The binder removal process is performed through a gap G <b> 1 formed by steps between the intersecting portions 43 on the four surfaces around the mesh 45 and the metal wires 41 and 42. Since the gap G1 exists evenly over the entire surface of the net body 4, the binder removal process can be performed satisfactorily, and the baking temperature and the baking atmosphere can be made uniform. Moreover, as shown in FIG. 4, if the through hole 23 is provided in the thickness direction of the base plate 2, the binder removal process, the uniform baking temperature, and the uniform baking atmosphere can be further improved.

  Further, the mesh body 4 is woven with the metal wires 41 and 42 and includes a large number of metal wire intersections 43 and a large number of meshes 45, so that one mesh 45 is accommodated in one chip-shaped electronic component. One ceramic electronic component 1 can be accommodated in each mesh 45. Therefore, the terminal electrode coating films 10 of the ceramic electronic component 1 do not contact each other.

  Further, since the base plate 2 and the mesh body 4 are fixed to the intersecting portion 43 and the diffusion bonding 5 on the flat plate surface 21, the intersecting portion 43 is secured to the base plate 2 over the entire surface of the mesh body 4. The gap between the net body 4 can be kept small. Therefore, it is possible to prevent a problem that the chip-shaped electronic component enters the gap between the base plate 2 and the net body 4.

  Moreover, since the portion fixed to the base plate 2 is the intersecting portion 43 of the mesh body 4, basically, all the meshes 45 can be used as the component storage section. For this reason, the tray for chip-shaped electronic components with a large accommodation quantity of the ceramic electronic components 1 can be provided.

  Next, Table 1 shows the results of baking experiments for each material of the mesh body 4. In Table 1, the adhesion rate (%) indicates the adhesion rate (N = 10,000) of the terminal electrode coating film (Cu film) 10 to the net 4. However, even if the adhesion rate is high, there is no problem if the terminal electrode coating film 10 is not damaged or peeled off. In Table 1, what produced the defect of the terminal electrode coating film 10 is displayed as a defective adhesion rate (%).

  Referring to Table 1, there is a difference in the adhesion rate regardless of whether the network 4 is made of SUS304 (Fe-18Cr-Ni), MN (63Ni-30Cu), HA (Ni-Cr-Mo), or titanium. Even in this case, the adhesion failure rate is 0.00 (%), and it can be seen that any material can be used. In particular, when Ti is used, the adhesion rate is 0.37 (%), which is significantly lower than other materials. This means that when the net 4 is formed using Ti, the adhesion rate becomes extremely low, and damage to the terminal electrode coating film 10 due to adhesion is minimized. Similar results were obtained when a titanium coating film was formed on the surface of stainless steel by means such as plating or coating.

3. Manufacturing Method of Chip-shaped Electronic Component Tray FIG. 5 is a cross-sectional view for explaining the process of combining the base plate and the net body, and FIG. The chip-shaped electronic component tray manufacturing method according to the present invention is a method for manufacturing the chip-shaped electronic component tray shown in FIGS.

  First, as shown in FIG. 5, a base plate 2 and a net 4 are prepared. The base plate 2 is made of a metal material such as a stainless steel plate, for example, and includes a flat plate surface 21 on one surface. The mesh body 4 is woven with metal wires 41 and 42 such as stainless steel wires, for example, and includes a large number of metal wire intersections 43 and a large number of meshes 45. The intersecting portion 43 is formed by overlapping the metal wires 41 and 42 in the thickness direction of the net body 4. The mesh 45 forms a component storage section surrounded by the intersecting portion 43 and the metal wires 41 and 42.

  The prepared base plate 2 and net 4 are overlapped with each other as shown in FIG. When the base plate 2 and the mesh body 4 are combined in this way, the intersection 43 in the mesh body 4 is thick, so that the intersection 43 contacts the flat plate surface 21 of the base plate 2 over the entire surface of the mesh body 4. The base plate 2 and the net 4 are transferred to the pressurizing, heating, and diffusion bonding processes in this superposed state.

  In the pressurization, heating, and diffusion bonding steps, as shown in FIG. 6, a lower pressing plate 61 is applied to the lower side of the base plate 2, and an upper pressing plate 62 is applied to the upper side of the net body 4. Heating is performed at a temperature of about 1000 ° C. with a pressing force in the direction of the arrow F1 or F2. Thereby, the base plate 2 and the net 4 are fixed by the diffusion bonding 5. The pressing load, the overheating time, and the like can be determined empirically according to the material, shape, size, thickness, and the like of the base plate 2 and the net body 4.

  According to the diffusion bonding 5 described above, the intersecting portion 43 is fixed to the base plate 2 over the entire surface of the mesh body 4, and the gap between the base plate 2 and the mesh body 4 can be kept small. Therefore, it is possible to prevent a problem that the chip-shaped electronic component enters the gap between the base plate 2 and the net body 4.

  Further, since the crossing portion 43 is formed by overlapping the metal wires 41 and 42 in the thickness direction of the net body 4, the thickness of this portion is increased. For this reason, when the mesh body 4 is combined with the flat plate surface 21 of the base plate 2, the intersecting portion 43 contacts the flat plate surface 21 over the entire surface of the mesh body 4. Accordingly, by heating and pressurizing both, the contact portion over the entire surface of the mesh body 4 can be diffusion bonded 5 to the flat plate surface 21 of the base plate 2.

  The present invention has been described in detail with reference to the preferred embodiments. However, the present invention is not limited to these embodiments, and various modifications can be made by those skilled in the art based on the basic technical idea and teachings. It is self-evident that

The top view which shows one Example of the tray for chip-shaped electronic components which concerns on this invention. FIG. 2 is an enlarged plan view of an arrow A portion illustrated in FIG. 1. FIG. 3 is a cross-sectional view taken along line 3-3 in FIG. It is sectional drawing which shows the state which accommodated the ceramic electronic component with a coating film in the tray for chip-shaped electronic components shown in FIG. It is a figure which shows one process in the manufacturing method of the tray for chip-shaped electronic components which concerns on this invention. It is sectional drawing explaining the pressurization, heating, and diffusion bonding process after the process shown in FIG.

Explanation of symbols

1 Ceramic electronic parts 10 Paint film
2 Base plate 21 Flat plate surface
4 Mesh 41, 42 Metal wire 43 Intersection 45 Mesh
5 Diffusion bonding

Claims (10)

A tray including a base plate and a net, and used for processing chip-shaped electronic components,
The base plate is made of a metal material and includes a flat plate surface on one side,
The mesh body is woven with metal wires, and includes a large number of metal wire intersections and a large number of meshes,
The base plate and the net are fixed to the intersecting portion by diffusion bonding on the flat plate surface,
Chip-type electronic component tray.   It is a tray for chip-shaped electronic components described in Claim 1, Comprising: The said base board is a tray for chip-shaped electronic components which has a through-hole in the thickness direction.   3. The chip-shaped electronic component tray according to claim 1, wherein a material of the base plate and the net body is titanium.   3. The chip-shaped electronic component tray according to claim 1, wherein the base plate and the net body are coated with titanium.   3. The chip-shaped electronic component tray according to claim 1, wherein a material of the base plate and the mesh body is stainless steel as a main component. 4.   3. The chip-shaped electronic component tray according to claim 1, wherein a material of the base plate and the mesh body is 63Ni-30Cu as a main component. 4.   3. The chip-shaped electronic component tray according to claim 1, wherein a material of the base plate and the net is mainly Ni—Cr—Mo. 4.   The tray for chip-shaped electronic components according to any one of claims 1 to 7, wherein the mesh has a square shape with an aspect ratio of 1: 1 to 3: 4, and is a longitudinal direction of the chip-shaped electronic component. Chip-shaped electronic component tray that is configured to have a size that cannot enter sideways. A method for producing a tray for a chip-shaped electronic component according to any one of claims 1 to 8,
Placing the net on one side of the base plate;
A method of manufacturing a tray for chip-like electronic parts, comprising: pressing and heating the base plate and the net body, and fixing the base plate and the net body to the intersecting portion by diffusion bonding on the flat plate surface. . A method of manufacturing a chip-shaped electronic component including a terminal electrode baking formation step,
Using the chip-shaped electronic component tray according to any one of claims 1 to 8, containing a coated ceramic electronic component in the mesh of the chip-shaped electronic component tray,
A method for manufacturing a chip-shaped electronic component, comprising heating the coated ceramic electronic component housed in the chip-shaped electronic component tray and baking the terminal electrode.

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