JP2006308856A - Color filter substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To completely remove a creeping transparent conductive thin film creeping to the side surface of a transparent substrate and onto a colored filter layer when at least the colored filter layer is formed on one surface of the transparent substrate and then a transparent conductive film is formed by sputtering on the other surface of a the transparent substrate. <P>SOLUTION: When at least the colored filter layer 30 is formed on the one surface of the transparent substrate 11 and then the transparent conductive film is formed on the other surface of the transparent substrate 11, the transparent conductive film 71 is formed by sputtering and then the transparent conductive film 71 and the creeping transparent conductive thin film creeping to the side surface of the transparent substrate 11 and onto the colored filter layer 30 are simultaneously etched and removed by using an etching liquid consisting essentially of oxalic acid to obtain a color filter substrate 100. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a color filter substrate in which a colored filter layer composed of a plurality of color filters is formed on one surface of a transparent substrate and a transparent electrode is formed on the other surface, and in particular, a transparent conductive film is formed on the other surface of the transparent substrate. The present invention relates to a color filter substrate in which a transparent conductive thin film that has wrapped around a side surface and a colored filter layer surface is completely removed.

In recent years, with the increase in large color televisions, notebook computers, and portable electronic devices, there has been a remarkable increase in demand for liquid crystal displays, particularly color liquid crystal display panels.
In general, the most widely used liquid crystal cell driving method in the liquid crystal display panel is a vertical electric field driving type using a TN (twisted nematic) method and an STN (super twisted nematic) method. Development of a liquid crystal cell driving system by IPS) is also in progress.

  A color filter substrate used for a color liquid crystal display panel is obtained by forming a colored filter layer and a layer including a black matrix, a red filter, a green filter, and a blue filter on a transparent substrate.

Hereinafter, a method for manufacturing the color filter substrate will be described.
FIGS. 3A to 3E and FIGS. 4F to 4H are schematic cross-sectional views illustrating an example of a method for manufacturing a color filter substrate.
First, a black photosensitive resin in which carbon black is dispersed in an acrylic resin is applied on a transparent substrate 11 with a spinner to form a black photosensitive resin layer 21 (see FIG. 3A), pattern exposure, and development. The black matrix 21b and the light shielding layer frame 21a are formed by performing a patterning process such as (see FIG. 3B).

  Next, a red photosensitive resin solution in which a color pigment (for example, dianthraquinone pigment) is dispersed in an acrylic photosensitive resin is applied onto a transparent substrate on which the black matrix 21b and the light shielding layer frame 21a are formed using a spinner. Then, a red photosensitive resin layer is formed, and a series of patterning processes such as exposure and development are performed using a predetermined exposure mask to form a red filter 31R (see FIG. 3C).

  Next, a green photosensitive resin solution in which a color pigment (for example, phthalocyanine green pigment) is dispersed in an acrylic photosensitive resin is used to form a black matrix 21b, a light shielding layer frame 21a, and a red filter 31R using a spinner. The green filter 31G is formed by applying on a substrate, forming a green photosensitive resin layer, and performing a series of patterning processes such as exposure and development using a predetermined exposure mask.

  Next, a blue photosensitive resin solution in which a color pigment (for example, phthalocyanine blue pigment) is dispersed in an acrylic photosensitive resin is used to form a black matrix 21b, a light shielding layer frame 21a, a red filter 31R, and a green filter 31G using a spinner. A blue photosensitive resin layer is formed by coating on the formed transparent substrate, and a series of patterning processes such as exposure and development are performed using a predetermined exposure mask to form a blue filter 31B, and the black matrix 21b and A colored filter layer 30 including a red filter 31R, a green filter 31G, and a green filter 31B is formed on the transparent substrate on which the light shielding layer frame 21a is formed (see FIG. 3D).

Next, a resin solution containing an acrylic resin as a main component is applied onto the colored filter layer 30 with a spinner, and is heated and cured to form the overcoat layer 51.
Further, a photosensitive resin mainly composed of an acrylic resin is applied with a spinner, a transparent resin photosensitive layer is formed, a series of patterning processes such as pattern exposure and development are performed, and heat curing is performed to form the spacer column 61. (See FIG. 3E).

Next, an indium tin oxide-based alloy target is sputtered on the other surface of the transparent substrate 11 (see FIG. 4F), and a transparent conductive film having a predetermined thickness made of an indium tin oxide film is formed on the other surface of the transparent substrate 11. A film 71 is formed (see FIG. 4G).
Next, the transparent conductive film 71 is heated to form a transparent electrode 71 a, and the black matrix 21 b, the colored filter layer 30, and the light-shielding frame 21 a are transparent on the other surface of the transparent substrate 11. A color filter substrate on which the electrode 71a is formed can be obtained (see FIG. 4H).

However, when the transparent conductive film 61 made of an indium tin oxide film is formed on the other surface of the transparent substrate 11 by sputtering, the side surfaces of the transparent substrate 11 and the colored filter layer 30 and the light-shielding frame 21 on one surface of the transparent substrate. It turns out that a transparent conductive thin film is formed.
If the side surface of the transparent substrate and the colored filter layer 30 on one side of the transparent substrate and the wrapping transparent conductive thin film that wraps around the light shielding frame 21 are formed, a color liquid crystal panel is formed using the color filter substrate. There is a problem that the electrical characteristics of the color liquid crystal panel are defective, and the wrapping transparent conductive thin film that wraps around the colored filter layer 30 and the light shielding frame 21 on the side surface of the transparent substrate and one surface of the transparent substrate is removed. There is a need.

As an etching solution and an etching method for accurately etching a transparent conductive film made of indium tin oxide (ITO) formed by sputtering or the like, an etching solution composition and an etching method have been proposed (for example, see Patent Document 1). ).
Japanese Patent Application No. 2004-000981

  The present invention has been devised in view of the above problems, and after forming a black matrix, a colored filter layer, a light-shielding frame, an overcoat layer, and spacer columns on one surface of a transparent substrate, sputtering is performed on the other surface of the transparent substrate. When forming a transparent conductive film, a color filter substrate is provided in which the transparent conductive thin film that completely wraps around the side surface of the transparent substrate, the colored filter layer, the light shielding frame, the overcoat layer, and the spacer column is completely removed. Objective.

  In order to achieve the above object in the present invention, first, in claim 1, a color filter in which a colored filter layer composed of a plurality of color filters is formed on one surface of a transparent substrate and a transparent electrode is formed on the other surface. In the substrate, after forming a colored filter layer 30 composed of at least a plurality of color filters on one surface of the transparent substrate 11, a transparent conductive film 71 composed of an indium tin oxide film is formed on the other surface of the transparent substrate 11 by sputtering. At the time of forming, the transparent conductive film 71 and the side surface of the transparent substrate 11 and the surrounding transparent conductive thin film that has wrapped around the colored filter layer 30 are simultaneously etched with an etching solution containing oxalic acid as a main component. 11 and the surrounding transparent conductive thin film that wraps around the colored filter layer 30 is removed and heat-treated, and only the other surface of the transparent substrate 11 is removed. Is obtained by a color filter substrate, characterized in that the formation of the transparent electrode 71a.

According to a second aspect of the present invention, a colored filter layer composed of a plurality of color filters is formed on one surface of the transparent substrate, and the other of the transparent substrate on which one of the light shielding layer and the overcoat layer is formed. 2. The color filter substrate according to claim 1, wherein an indium tin oxide film is formed on the surface by sputtering.

  Furthermore, in claim 3, after forming a transparent conductive film 72 made of an indium tin oxide film on one surface of the transparent substrate 11 by sputtering, the transparent conductive film 72 formed on one surface of the transparent substrate 11. And the transparent conductive thin film that has wrapped around the side surface and the other surface of the transparent substrate 11 are simultaneously etched with an etching solution mainly composed of oxalic acid, and the wrap around the side surface and the back surface of the transparent substrate 11. The transparent conductive thin film is removed and heat-treated to form the transparent electrode 72a on the other surface of the transparent substrate 11, and then the colored filter layer 30 composed of at least a plurality of color filters is formed on the other surface of the transparent substrate 11. The color filter substrate is characterized by the above.

In the color filter substrate according to the first aspect of the present invention, when the color filter substrate is used to form a liquid crystal panel, it is possible to prevent a drive failure due to the surrounding transparent conductive thin film.
Moreover, the residue by the transparent conductive thin film which goes around to the colored filter layer can be removed.

Hereinafter, embodiments of the present invention will be described.
As shown in FIG. 1, the color filter substrate of the present invention according to claim 1 is a colored filter layer 30 comprising a black matrix 21b, a red filter 31R, a green filter 31G, and a blue filter 31B on one surface of a transparent substrate 11. The light shielding layer frame 21 a, the overcoat layer 51, and the spacer pillar 61 are formed by forming the transparent electrode 71 a on the other surface of the transparent substrate 11.

When forming the transparent electrode 71a on the other surface of the transparent substrate 11, after forming the transparent conductive film 71 on the other surface of the transparent substrate 11 by sputtering, the transparent conductive film 71 and the transparent substrate on the other surface of the transparent substrate 11 are formed. 11 and the colored filter layer 30 on one side of the transparent substrate 11, the light shielding layer frame 21a, the overcoat layer 51, and the transparent conductive thin film that wraps around the spacer column 61 as a main component. The color filter substrate 100 in which the transparent electrode 71a is formed by performing simultaneous etching with the etching solution to remove the transparent conductive thin film and heat-treating at 230 to 240 ° C. for 30 minutes.
When this color filter substrate is used to form a liquid crystal panel, it is possible to prevent drive operation failure due to the surrounding transparent conductive thin film.
Further, since the transparent conductive thin film is removed by simultaneous etching of the transparent conductive film 71 and the transparent conductive thin film, the colored filter layer 30, the light shielding layer frame 21a, the overcoat layer 51, and the spacer column are removed. The residue from the transparent conductive thin film that runs around 61 can be removed.

  As shown in FIG. 2, the color filter substrate of the present invention according to claim 2 is a colored filter layer 30 comprising a black matrix 21b, a red filter 31R, a green filter 31G, and a blue filter 31B on one surface of the transparent substrate 11. The light shielding layer frame 21 a, the overcoat layer 51, and the spacer pillar 61 are formed by forming the transparent electrode 72 a on the other surface of the transparent substrate 11.

In the color filter substrate 200, a transparent conductive film 72 is formed on one surface of the transparent substrate 11 by sputtering, and the transparent conductive film 72 on one surface of the transparent substrate 11 and the side and back surfaces of the transparent substrate 11 are wrapped around. The transparent conductive thin film is simultaneously etched with an etching solution containing oxalic acid as a main component, and the transparent conductive thin film that has wrapped around the side surface and the back surface of the transparent substrate 11 is removed to remove one surface of the transparent substrate 11. After forming the transparent electrode 72a on the other side of the transparent substrate 11, the black matrix 21b, the colored filter layer 30 composed of the red filter 31R, the green filter 31G, and the blue filter 31B, the light shielding layer frame 21a, and the overcoat layer 51 and spacer columns 61 are formed.

Hereinafter, a method for producing the color filter substrate of the present invention will be described.
3 (a) to 3 (e) and FIGS. 4 (f) to 4 (h) are schematic cross-sectional views showing an embodiment of the method for producing a color filter substrate according to the first aspect of the present invention.
First, a black photosensitive resin in which carbon black or the like is dispersed in an acrylic resin is applied on a transparent substrate 11 with a spinner to form a black photosensitive resin layer 21 (see FIG. 3A), pattern exposure, A black matrix 21b and a light shielding layer frame 21a are formed by performing a patterning process such as development (see FIG. 3B).
Here, as the transparent substrate 11, a glass substrate such as low expansion glass, non-alkali glass, or quartz glass, a plastic film, or the like can be used.

  Next, a red photosensitive resin solution in which a color pigment (for example, dianthraquinone pigment) is dispersed in an acrylic photosensitive resin is applied onto a transparent substrate on which the black matrix 21b and the light shielding layer frame 21a are formed using a spinner. Then, a red photosensitive resin layer is formed, and a series of patterning processes such as exposure and development are performed using a predetermined exposure mask to form a red filter 31R (see FIG. 3C).

  Next, a green photosensitive resin solution in which a color pigment (for example, phthalocyanine green pigment) is dispersed in an acrylic photosensitive resin is used to form a black matrix 21b, a light shielding layer frame 21a, and a red filter 31R using a spinner. The green filter 31G is formed by applying on a substrate, forming a green photosensitive resin layer, and performing a series of patterning processes such as exposure and development using a predetermined exposure mask.

  Next, a blue photosensitive resin solution in which a color pigment (for example, phthalocyanine blue pigment) is dispersed in an acrylic photosensitive resin is used to form a black matrix 21b, a light shielding layer frame 21a, a red filter 31R, and a green filter 31G using a spinner. A blue photosensitive resin layer is formed by coating on the formed transparent substrate, and a series of patterning processes such as exposure and development are performed using a predetermined exposure mask to form a blue filter 31B, and the black matrix 21b and A colored filter layer 30 including a red filter 31R, a green filter 31G, and a green filter 31B is formed on the transparent substrate on which the light shielding layer frame 21a is formed (see FIG. 3D).

Next, a resin solution containing an acrylic resin as a main component is applied onto the colored filter layer 30 and the light shielding layer frame 21a with a spinner, and is heated and cured to form the overcoat layer 51.
Further, a photosensitive resin mainly composed of an acrylic resin is applied with a spinner, a transparent resin photosensitive layer is formed, a series of patterning processes such as pattern exposure and development are performed, and heat curing is performed to form the spacer column 61. (See FIG. 3E).

Next, sputtering is performed using an indium tin oxide alloy target (see FIG. 4F), and a transparent conductive film 71 having a predetermined thickness made of an indium tin oxide film is formed on the other surface of the transparent substrate 11 ( (Refer FIG.4 (g)).
The film thickness of the transparent conductive film 71 is about 1000 mm.

Next, the transparent conductive film 51 on the other surface of the transparent substrate 11, the side of the transparent substrate 11 and the colored filter layer 30 on one surface of the transparent substrate 11, the overcoat layer 51, and the spacer column 61 surface The transparent conductive thin film (not shown in particular) is dip etched (simultaneous etching on both sides) for 15 seconds with an etching solution mainly composed of oxalic acid at a liquid temperature of 23 ° C. The transparent conductive thin film that wraps around the colored filter layer 30, the overcoat layer 51, and the spacer column 61 on one surface of the substrate 11 is removed, and heat treatment is performed at 230 to 240 ° C. for 30 minutes to A transparent electrode 71a is formed on the other surface (see FIG. 4H).
Here, the oxalic acid concentration of the etching liquid mainly composed of oxalic acid is 3.4%, and the etching conditions for 15 seconds at a liquid temperature of 23 ° C. are when the thickness of the transparent conductive thin film is 200 mm. . If the thickness of the surrounding transparent conductive thin film is different, the etching conditions also change.
In addition, since the etching rate is slow under the above etching conditions, the resistance value fluctuation of the transparent conductive film 71 formed on the other surface of the transparent substrate 11 is hardly affected.

  Through the above steps, the black matrix 21b, the colored filter layer 30 including the red filter 31R, the green filter 31G, and the blue filter 31B, the light shielding layer frame 21a, the overcoat layer 51, and the spacer column are formed on one surface of the transparent substrate 11. 61, the color filter substrate 100 having the transparent electrode 71a formed on the other surface can be obtained (see FIG. 4 (i)).

5 (a) to 5 (e) and FIGS. 6 (f) to (h) are schematic cross-sectional views showing an embodiment of the method for producing a color filter substrate according to the second aspect of the present invention.
First, by using an indium tin oxide based alloy target (see FIG. 5A), a transparent conductive film 72 having a predetermined thickness made of an indium tin oxide film is formed on one surface of the transparent substrate 11 (see FIG. 5A). (Refer FIG.5 (b)).
The film thickness of the transparent conductive film 72 is about 1400 mm.

Further, the transparent conductive film 72 on one surface of the transparent substrate 11 and the transparent conductive thin film (not shown in particular) that wraps around the side surface of the transparent substrate 11 and the other surface of the transparent substrate 11 are mixed with oxalic acid. A transparent conductive thin film that wraps around the side surface of the transparent substrate 11 and the other surface of the transparent substrate 11 by performing dip etching (simultaneous etching on both sides) for 15 seconds at an etching temperature of 23 ° C. with an etchant as a main component. It removes and heat-processes at 230-240 degreeC for 30 minutes, The transparent electrode 72a is formed in the other surface of the transparent substrate 11 (refer FIG.5 (c)). .
Here, the oxalic acid concentration of the etching liquid mainly composed of oxalic acid is 3.4%, and the etching conditions for 15 seconds at a liquid temperature of 23 ° C. are when the thickness of the transparent conductive thin film is 300 mm. . If the thickness of the surrounding transparent conductive thin film is different, the etching conditions also change.
Further, under the above etching conditions, the etching rate is also slow, so that the resistance value fluctuation of the transparent conductive film 52 is hardly affected.

Next, a black photosensitive resin in which carbon black or the like is dispersed in an acrylic resin is applied onto the transparent substrate 11 with a spinner to form a black photosensitive resin layer 21 (see FIG. 5D), and pattern exposure. Then, patterning processing such as development is performed to form the black matrix 21b and the light shielding layer frame 21a (see FIG. 5E).
Here, as the transparent substrate 11, a glass substrate such as low expansion glass, non-alkali glass, or quartz glass, a plastic film, or the like can be used.

  Next, a red photosensitive resin solution in which a color pigment (for example, dianthraquinone pigment) is dispersed in an acrylic photosensitive resin is applied onto a transparent substrate on which the black matrix 21b and the light shielding layer frame 21a are formed using a spinner. Then, in the state where the red photosensitive resin layer is formed and the transparent conductive film 52 is grounded, a series of patterning processes such as exposure and development are performed using a predetermined exposure mask to form the red filter 31R (FIG. 6). (Refer to (f)).

Next, a green photosensitive resin solution in which a color pigment (for example, phthalocyanine green pigment) is dispersed in an acrylic photosensitive resin is used to form a black matrix 21b, a light shielding layer frame 21a, and a red filter 31R using a spinner. Coating on the substrate, forming a green photosensitive resin layer, with a transparent conductive film 52 grounded, performing a series of patterning processes such as exposure and development using a predetermined exposure mask to form a green filter 31G To do.

  Next, a blue photosensitive resin solution in which a color pigment (for example, phthalocyanine blue pigment) is dispersed in an acrylic photosensitive resin is used to form a black matrix 21b, a light shielding layer frame 21a, a red filter 31R, and a green filter 31G using a spinner. A blue photosensitive resin layer is formed by coating on the formed transparent substrate, and a series of patterning processes such as exposure and development are performed using a predetermined exposure mask in a state where the transparent conductive film 52 is grounded. The filter 31B is formed, and the colored filter layer 30 including the red filter 31R, the green filter 31G, and the green filter 31B is formed on the transparent substrate on which the black matrix 21b and the light shielding layer frame 21a are formed (see FIG. 6G). .

Next, a resin solution containing an acrylic resin as a main component is applied onto the colored filter layer 30 and the light shielding layer frame 21a with a spinner, and is heated and cured to form the overcoat layer 51.
Further, a photosensitive resin mainly composed of an acrylic resin is applied with a spinner, a transparent resin photosensitive layer is formed, a series of patterning processes such as pattern exposure and development are performed, and heat curing is performed to form the spacer column 61. (See FIG. 6 (h)).

  Through the above steps, the black matrix 21b, the colored filter layer 30 including the red filter 31R, the green filter 31G, and the blue filter 31B, the light shielding layer frame 21a, the overcoat layer 51, and the spacer column are formed on one surface of the transparent substrate 11. 61, a color filter substrate 200 having a transparent electrode 72a formed on the other surface can be obtained (see FIG. 6 (i)).

FIG. 2 is a schematic cross-sectional view showing an embodiment of a color filter substrate of the present invention according to claim 1. FIG. 5 is a schematic cross-sectional view showing an example of a color filter substrate according to a second aspect of the present invention. (A)-(e) is typical structure sectional drawing which shows a part of process of the manufacturing method of the color filter substrate of this invention which concerns on Claim 1. FIG. (F)-(i) is typical structure sectional drawing which shows a part of process of the manufacturing method of the color filter substrate of this invention which concerns on Claim 1. FIG. (A)-(e) is typical structure sectional drawing which shows a part of process of the manufacturing method of the color filter substrate of this invention which concerns on Claim 2. FIG. (F)-(i) is typical structure sectional drawing which shows a part of process of the manufacturing method of the color filter substrate of this invention which concerns on Claim 2. FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 ... Transparent substrate 21 ... Light shielding layer 21a ... Light shielding layer frame 21b ... Black matrix 30 ... Colored filter layer 31R ... Red filter 31G ... Green filter 31B ... Blue filter 51 ... Overcoat layer 61 ... ... spacer columns 71, 72 ... transparent conductive films 71a, 72a ... transparent electrodes 100, 200 ... color filter substrate

Claims (3)

  In a color filter substrate in which a colored filter layer comprising a plurality of color filters is formed on one surface of a transparent substrate and a transparent electrode is formed on the other surface, at least a plurality of color filters are formed on one surface of the transparent substrate (11). When forming a transparent conductive film (71) made of an indium tin oxide film by sputtering on the other surface of the transparent substrate (11) after forming the colored filter layer (30) to be formed, the transparent conductive film (71) The side surface of the transparent substrate (11) and the surrounding transparent conductive thin film that wraps around the colored filter layer (30) are simultaneously etched with an etchant containing oxalic acid as a main component, and the side surface of the transparent substrate (11) and The transparent conductive thin film that wraps around the colored filter layer (30) is removed and heat-treated to form a transparent electrode (71a) only on the other surface of the transparent substrate (11). A color filter substrate, characterized in that the.   A colored filter layer composed of a plurality of color filters is formed on one surface of the transparent substrate, and indium oxide is formed by sputtering on the other surface of the transparent substrate on which one of the light shielding layer and the overcoat layer is formed. The color filter substrate according to claim 1, wherein a tin film is formed.   After forming a transparent conductive film (72) made of an indium tin oxide film on one surface of the transparent substrate (11) by sputtering, the side surfaces of the transparent conductive film (72) and the transparent substrate (11) and the other surface are formed. The surrounding transparent conductive thin film is simultaneously etched with an etching solution containing oxalic acid as a main component to remove the surrounding transparent conductive thin film that has wrapped around the side and back surfaces of the transparent substrate (11), and heat treatment is performed. Then, after forming the transparent electrode (72a) on the other surface of the transparent substrate (11), the colored filter layer (30) composed of at least a plurality of color filters was formed on the other surface of the transparent substrate (11). A color filter substrate characterized by.

Images