JP2006305734A - Printing material for stencil process printing and manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an easy-to-handle printing material for stencil process printing which is free from the generation of a print non-uniformity due to the hindrance of an ink passage by the fiber of a support without any adverse effect upon print sharpness by fibrous mesh and does not waste a large amount of energy required for film perforation by a thermal head, and a method for manufacturing the printing material. <P>SOLUTION: This printing material is structured of an ink-permeable support layer 2 and a film layer 3 with the outer surface exposed as a perforated side surface 3a. In addition, numerous microrecesses 4 are formed on a joint side surface 3b where the film layer 3 joins the support layer 2. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a plate material for stencil printing and a manufacturing method, and is a technique related to the structure of a plate material perforated in a film.

  A conventional stencil printing plate has a multilayer structure of a film layer for forming a stencil by perforation and a support layer for ensuring strength. In general, the film forming the film layer is a thermoplastic resin film having a thickness of about 1.5 μm, and is made of polyester, polyethylene terephthalate, polyethylene, polyvinylidene chloride, polypropylene, or the like, and forms a support layer. The body is Japanese paper, non-woven fabric, thin paper, cocoon, etc. with a thickness of about 30 to 40 μm, and ink is permeable. Natural fiber, chemical fiber, synthetic fiber, or a mixture of these, and the film and support are adhesive. It is glued with. The film layer is perforated by thermal perforation by heating the film with a thermal head.

  Moreover, there exists a thing described in patent document 1 in the plate material for stencil printing. This is a heat-sensitive stencil printing plate material having a substantially single-layer structure, in which a large number of minute recesses are formed on one surface of a thermoplastic resin film having a predetermined thickness. This thermoplastic resin film has a thickness of 1.5 μm or more and 20 μm or less, polyester resin, polyethylene terephthalate resin, polyethylene resin, polyvinyl chloride resin, polyvinylidene chloride resin, polymethylpentene resin, polypropylene resin, polyethylene naphthalate resin, It consists of polyvinyl alcohol resin.

  Moreover, there exists a thing described in patent document 2 in the plate material for stencil printing. This is a heat-sensitive stencil printing plate, and comprises a base paper (plate material) only with a thermoplastic film, and the thickness of the film is 1.5 μm or more and 20 μm or less. As the thermoplastic film, a stretched polyethylene terephthalate (PET) film or a low melting point film obtained by copolymerization of stretched polyethylene terephthalate (PET) and polybutylene terephthalate (PBT) is used. A large number of minute recesses are formed on one surface of the film by embossing.

As another prior art document, there is Patent Document 3, which discloses a technique regarding a heater size and applied energy of a thermal head used in plate making of a stencil printing plate.
JP 2001-213065 A JP 2003-39844 A JP 2003-112402 A

  In the above-described configuration, in a stencil printing plate having a multilayer structure in which a film and a support are bonded with an adhesive, perforations reaching from the film surface to the support layer are formed in the film layer by thermal perforation.

  However, there is an adhesive that bonds the support and the film at the joint surface portion between the film and the support, and this adhesive may adversely affect thermal perforation at the joint surface portion, resulting in a defect in the perforation. When the perforated state is poor, the ink is prevented from passing through the joint surface portion, and printing unevenness with non-uniform printing density is likely to occur.

  Further, the fibers of the support itself prevent the ink from passing through, and printing unevenness occurs, the fibers of the support appear as blank fiber patterns on the printed matter, and the print sharpness decreases.

In order to solve such a problem, Patent Documents 1 to 3 propose stencil printing plates having a single layer structure described above.
By the way, the stencil printing plate material needs flexibility for mounting on a printing drum or screen of a printing apparatus, and has an appropriate rigidity for maintaining a state in which wrinkles and bending do not occur during handling, so-called waist. is required. For this reason, when the stencil printing plate has a single layer structure, the thermoplastic film itself forming the film layer is required to have rigidity and strength as a stencil printing plate.

  However, when the thickness of the film is increased, the heat energy necessary for perforating the film becomes great, and the load on the thermal head increases. For this reason, it is possible to perforate with less heat energy by forming a large number of minute recesses on one surface of a thermoplastic resin film having a predetermined thickness, but the thickness of the film is 1.5 μm or more and 20 μm or less. Is an appropriate range, and the rigidity and strength as a stencil printing plate material cannot be sufficiently ensured, and there is a problem that wrinkles and bends occur during transportation and other handling.

In the case of a stencil printing plate material having a single layer structure, heat shrinkage may occur due to thermal perforation, and a special device is required for applying tension to the plate material during thermal perforation.
The present invention solves the above-described problems, and the fibers of the support do not disturb the passage of the ink to cause printing unevenness, and the fiber mesh does not affect the sharpness of printing. It is an object of the present invention to provide a stencil printing plate material and a manufacturing method that can be handled easily without increasing the heat energy required for perforating a film.

  In order to solve the above-described problems, the stencil printing plate material of the present invention is formed by laminating an ink-permeable support layer and a film layer whose outer surface is a perforated side surface, and the film layer is bonded to the support layer. It has a large number of minute recesses on the joining side surface.

  The plate material for stencil printing of the present invention has a shape in which the minute recess is deepened from the opening on the joining side toward the perforated side, and the diameter is reduced as the depth increases, and the thickness is reduced between the lower end of the minute recess and the perforated side. It has a film layer.

  The plate material for stencil printing of the present invention has a shape in which the minute recesses are deepened from the opening on the bonding side surface toward the perforation side surface, and the diameter is reduced as the depth increases, and the minute recesses are opened to the extent that the ink does not pass through the perforation side surface. It forms a through hole.

  The plate material for stencil printing according to the present invention has a shape in which the minute recesses are deepened to 60 to 100% of the film layer thickness from the opening on the joining side surface toward the perforation side surface, and the diameter is reduced as the depth increases.

  The plate material for stencil printing of the present invention comprises a film layer made of a thermoplastic resin film, a support layer made of a support made of fibers, and the thermoplastic resin film and the support bonded together with an adhesive. is there.

  In the stencil printing plate material of the present invention, the film layer is made of a thermoplastic resin film, the support layer is made of a porous film, and the thermoplastic resin film and the porous film are bonded together with an adhesive.

In the plate material for stencil printing of the present invention, the film layer has a thickness of 20 μm or less.
In the stencil printing plate material of the present invention, the support layer has a thickness of 100 μm or less.
The method for producing a stencil printing plate material of the present invention is a method of joining a film layer made of a thermoplastic resin film and a support made of a fiber or a support made of a porous film. A large number of minute recesses are formed on the surface, an adhesive is applied to the bonding surface of the support layer, and the film layer and the support layer are bonded to each other at the bonding surface.

  According to the present invention, the stencil printing plate has a structure in which a support made of a fiber or a support layer made of a porous film and a film layer made of a thermoplastic resin film are laminated, and the film layer is a thermal head. By providing heat-sensitive perforation and providing perforations that communicate with the minute recesses from the perforated side surface, through holes that allow ink to pass from the bonding surface side to the perforated side surface are formed in the film layer to make a stencil for printing.

  For this reason, the thermal perforation of the film layer by the thermal head does not need to be performed from the side of the perforation to the side of the joint, so that troublesome perforation due to the adhesive that bonds the film layer and the support layer does not occur. The thermal energy required for thermal drilling is reduced and the load on the thermal head is reduced.

  In addition, the strength and rigidity required for stencil printing plates, the so-called waist, can be secured by the support layer, not the film layer, so that no wrinkles or bending can be maintained during transport and other handling, and the thickness A thin film layer having a thickness of, for example, 20 μm or less can be employed, and there is no fear of thermal shrinkage due to thermal perforation, and no special device is required for applying tension to the plate material during thermal perforation.

  In the plate-making stencil, the ink supplied to the support made of fiber or the support layer made of a porous film passes through the support layer and flows into the minute recesses of the film layer. And transferred to the paper surface of the printing paper.

  When the ink passes through the support, the ink layer is finely divided by passing between the fibers, but the diameter of the ink is reduced as the minute concave portion deepens, and the ink flowing into the minute concave portion is retained. The ink layer is united. For this reason, uneven printing due to the fibers of the support does not occur, and the fiber mesh does not affect the sharpness of printing.

  Embodiments of the present invention will be described with reference to the drawings. 1 to 3, a stencil printing plate 1 is formed by laminating an ink-permeable support layer 2 whose outer surface is an ink supply side surface 2a and a film layer 3 whose outer surface is a perforated side surface 3a. An adhesive (not shown) is applied to the bonding side surface 2b of the body layer 2, the bonding side surface 2b of the support layer 2 and the bonding side surface 3b of the film layer 3 are bonded together with an adhesive, and the film layer 3 is bonded to the bonding side surface. 3 b has a large number of minute recesses 4.

  The support layer 2 has a thickness of 100 μm or less. In the present embodiment, the support layer 2 is made of a support made of fibers having a thickness of about 30 to 40 μm. The support is a Japanese paper, nonwoven fabric, Thin paper, straw, etc., which are natural fibers, chemical fibers, synthetic fibers or a mixture of these.

  In addition, a porous film can be employed as the support layer 2. The porous film is made of the following resin materials, and each resin may be used alone or in combination of two or more.

Resin of the material Vinyl-based resin such as polyvinyl acetate, polyvinyl butyral, vinyl chloride-vinyl acetate polymer, vinyl chloride-vinylidene chloride copolymer, vinyl chloride-acrylonitrile polymer, styrene-acrylonitrile copolymer, polyamide such as polybutylene, nylon, etc. , Cellulose derivatives such as polyphenylene oxide, (meth) acrylic acid ester, polycarbonate, acetyl cellulose, acetyl butyl cellulose, acetyl propyl cellulose, etc. Also, the porous film has been described above for adjustment of strength, pore size, etc. It is also possible to add a powdery substance such as a pigment or a fibrous substance as an additive to the resin, and the same material as the film layer 3 may be made porous. The pore diameter of the porous film is 2 μm or more and 50 μm or less, preferably 5 μm or more and 30 μm or less. The thickness of the porous film is 5 μm or more and 100 μm or less, preferably 6 μm or more and 50 μm or less.

  The film layer 3 has a thickness of 20 μm or less. In the present embodiment, the film layer 3 is made of a thermoplastic resin film having a thickness of about 1.5 μm. The thermoplastic resin film is made of polyester, polyethylene terephthalate, polyethylene, Vinylidene chloride, polypropylene and the like.

  In the present embodiment, the minute recess 4 has a shape that is deepened from the opening 4a of the bonding side surface 3b of the film layer 3 toward the perforated side surface 3a and is reduced in diameter as the depth increases. The thinned film layer 3 is provided between the perforated side surface 3a. The minute recess 4 may be a through hole that opens to the extent that the perforated side surface 3a does not transmit ink. Therefore, the micro recessed part 4 deepens to 60 to 100% of the thickness of the film layer 3 toward the perforated side surface 3a from the opening 4a in the joining side surface 3b.

  Hereinafter, the operation of the above-described configuration will be described. The stencil plate 1 is made as a stencil by thermally perforating the film layer 3 with a thermal head. In this thermal perforation, as shown in FIG. 2, a thinned film layer 3 between the lower end of the micro-recess 4 and the perforation side 3a is provided with a perforation 4b communicating with the micro-recess 4 from the perforation side 3a. Through holes are formed in the film layer 3 from the joining surface side 3b to the perforated side surface 3a.

  As shown in FIG. 3, in the stencil plate making, the ink 5 supplied to the support layer 2 from the ink supply side surface 2 a passes through the support layer 2 and flows into the minute recesses 4 of the film layer 3. And it permeate | transmits to the perforation side surface 3a through the perforation 4b, and is printed on the paper surface of printing object.

  When the ink 5 passes through the support layer 2, the ink layer is finely divided by passing between the fibers of the support (micropores in the case of a porous film). However, by forming the shape so that the diameter of the micro-recess 4 is reduced as the micro-recess 4 is deepened, the ink 5 stays in the micro-recess 4 and the ink layer is fused. For this reason, printing unevenness caused by the fibers of the support does not occur, and the fiber mesh does not affect the sharpness of printing. Conventionally, when porous thin paper or nonwoven fabric is used for the support layer 2, the fibers are obstructed to pass through the ink, or the fibers appear in the printing. However, even if coarse fibers are used, conventional problems are not caused, and therefore, it is possible to use a support made of coarse fibers for the support layer 2.

  Since the thermal perforation of the film layer 3 by the thermal head is performed on the thinned film layer 3 between the lower end of the minute recess 4 and the perforated side surface 3a, there is no need to perform from the perforated side surface 3a to the joining side surface 3b. Troublesome perforations due to the adhesive bonding the layer 3 and the support layer 2 do not occur. Moreover, the thermal energy required for thermal perforation by the thermal head is reduced, and the load on the thermal head is reduced.

  Since the adhesive applied to the bonding side surface 2b of the support layer 2 adheres to the fibers of the support and penetrates into the support body, the bonding side surface 3b of the film layer 3 and the bonding side surface of the support layer 2 2b is not bonded at a portion corresponding to the opening 4a of the minute recess 4, but is bonded with an adhesive at a portion other than the opening 4a. Therefore, the adhesive does not affect the ink bleeding.

  Further, since the strength and rigidity required for the stencil printing plate material 1, so-called waist, is secured not by the film layer 3 but by the support layer 2, it is possible to maintain a state in which wrinkles and bending do not occur during transportation and other handling. A thin film layer 3 can be employed.

1 is a perspective cross-sectional view showing a stencil printing plate according to an embodiment of the present invention. Sectional drawing which shows the plate material for stencil printing in the same embodiment Sectional drawing which shows the state which supplied the ink to the plate material for stencil printing in the embodiment

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Plate | plate material for stencil printing 2 Support body layer 2a Ink supply side surface 2b Joining side surface 3 Film layer 3a Perforation side surface 3b Joining side surface 4 Micro recessed part 4a Opening 4b Perforation 5 Ink

Claims (9)

A stencil printing plate characterized by laminating an ink-permeable support layer and a film layer whose outer surface is a perforated side surface, and the film layer has a large number of minute recesses on the joining side surface that joins the support layer. . The micro concave portion is deepened from the opening on the bonding side surface toward the perforated side surface, has a shape that decreases in diameter as it deepens, and has a thin film layer between the lower end of the micro concave portion and the perforated side surface. The plate material for stencil printing according to claim 1. The micro concave portion is deepened from the opening on the bonding side surface toward the perforated side surface, and has a shape that decreases in diameter as it deepens, and the micro concave portion forms a through hole that opens to the extent that the ink does not pass through the perforated side surface. The plate material for stencil printing according to claim 1. 2. The stencil printing method according to claim 1, wherein the minute concave portion is deepened to 60 to 100% of the film layer thickness from the opening on the joining side surface toward the perforating side surface, and the diameter is reduced as the depth is deepened. Plate material. The film layer is composed of a thermoplastic resin film, the support layer is composed of a support made of fibers, and the thermoplastic resin film and the support are bonded together with an adhesive. 2. A stencil printing plate material according to item 1. The film layer is made of a thermoplastic resin film, the support layer is made of a porous film, and the thermoplastic resin film and the porous film are bonded together with an adhesive. 2. A plate material for stencil printing as described in 1. The stencil printing plate according to any one of claims 1 to 6, wherein the film layer has a thickness of 20 µm or less. The stencil printing plate according to any one of claims 1 to 6, wherein the support layer has a thickness of 100 µm or less. A film layer made of a thermoplastic resin film and a support made of a fiber or a support layer made of a porous film are joined, and a large number of minute recesses are formed on the joining surface of the film layer, and the support layer A method for producing a plate material for stencil printing, comprising: applying an adhesive to the joint surface, and bonding the film layer and the support layer together with an adhesive on both joint surfaces.

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