JP2000351284A - Stencil for screen printing - Google Patents

Stencil for screen printing

Info

Publication number
JP2000351284A
JP2000351284A JP16662499A JP16662499A JP2000351284A JP 2000351284 A JP2000351284 A JP 2000351284A JP 16662499 A JP16662499 A JP 16662499A JP 16662499 A JP16662499 A JP 16662499A JP 2000351284 A JP2000351284 A JP 2000351284A
Authority
JP
Japan
Prior art keywords
porous support
perforation
film
thermoplastic resin
stencil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16662499A
Other languages
Japanese (ja)
Inventor
Masatoshi Sato
正寿 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tohoku Ricoh Co Ltd
Original Assignee
Tohoku Ricoh Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tohoku Ricoh Co Ltd filed Critical Tohoku Ricoh Co Ltd
Priority to JP16662499A priority Critical patent/JP2000351284A/en
Publication of JP2000351284A publication Critical patent/JP2000351284A/en
Pending legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To obtain a printed material of high picture quality by uniform passage of ink through a stencil when printing is carried out in the case of plate- making printing. SOLUTION: The stencil for screen printing has a perforation having an opening area of 1-320 μm2 and an opening ratio of 20-95%, and a porous supporting body comprising a film-shaped material having a thickness of 5-20 μm is provided. In this case, the porous supporting body is preferably laminated to a thermoplastic resin film for perforation.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、感熱孔版印刷用原
紙に関し、詳しくは、キセノンランプ等からの閃光照
射、レーザー発振素子からのパルス的な熱エネルギー照
射、又は微細で且つ多数の加熱体を有するサーマルヘッ
ドでの加熱で製版される感熱孔版印刷用原紙における薄
葉材料(多孔性支持体)に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat-sensitive stencil sheet, and more particularly, to irradiating flash light from a xenon lamp or the like, irradiating pulsed heat energy from a laser oscillation element, or using a fine and large number of heating elements. The present invention relates to a thin sheet material (porous support) in a heat-sensitive stencil sheet made by heating with a thermal head.

【0002】[0002]

【従来の技術】従来より、ポリエステル系フィルム、塩
化ビニリデン系フィルム等の熱可塑性樹脂フィルム(穿
孔用熱可塑性樹脂フィルム)と、天然繊維及び/又は化
学繊維を主成分とする薄葉紙、不織布、紗等の多孔性支
持体とを、各種の接着剤で貼り合わせた構造の感熱孔版
印刷用原紙が知られている(特開昭59−138497
号公報、特開平4−7198号公報、特開昭51−15
449号公報、特開昭61−102296号公報、特開
昭52−40809号公報、特開昭63−207694
号公報、特開平4−239694号公報、特開平4−2
39693号公報、特開平4−221698号公報、特
開平6−99677号公報)。
2. Description of the Related Art Conventionally, a thermoplastic resin film (thermoplastic resin film for perforation) such as a polyester film or a vinylidene chloride film, and a thin paper, a nonwoven fabric, a gauze, etc. mainly composed of natural fibers and / or chemical fibers. A heat-sensitive stencil sheet having a structure in which a porous support is bonded with various adhesives is known (JP-A-59-138497).
JP, JP-A-4-7198, JP-A-51-15
449, JP-A-61-102296, JP-A-52-40809, and JP-A-63-207694.
JP, JP-A-4-239694, JP-A-4-24-2
39693, JP-A-4-221698, JP-A-6-99677).

【0003】しかし、こうした従来の感熱孔版印刷用原
紙を用いて製版し、印刷に供した場合は、原紙にて構成
される穿孔、繊維間の隙間等が不均一であり、良好な印
刷物を得るには難がある。また、その構成繊維は、複数
本が束になって存在し、それらが熱可塑性樹脂フィルム
(穿孔用熱可塑性樹脂フィルム)と貼り合わされている
ため、その接着部ではサーマルヘッドでの穿孔の際に
は、未穿孔部になったりする。また、発泡材料を用いて
多孔質を作成する場合でも、孔の径は均一にならず、こ
の場合も印刷画像は、細部の鮮明さが劣る。
[0003] However, when a plate is made using such a conventional heat-sensitive stencil sheet and is used for printing, the perforations formed in the base sheet, the gaps between the fibers and the like are not uniform, and a good printed matter is obtained. Have difficulty. In addition, the constituent fibers are present in a bundle of a plurality of fibers, which are bonded to a thermoplastic resin film (thermoplastic resin film for perforation). May be unperforated. Further, even when a porous material is formed using a foam material, the diameter of the holes is not uniform, and in this case, the printed image is inferior in detail.

【0004】[0004]

【発明が解決しようとする課題】従って、本発明の課題
は、上記の不具合を解消するものであって、製版印刷に
おける上記の、印刷による画像品質のバラツキを解消す
る感熱孔版印刷用原紙を提供することにある。
SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to solve the above-mentioned problems and to provide a heat-sensitive stencil sheet for stencil printing which eliminates the above-mentioned variation in image quality due to printing in plate-making printing. Is to do.

【0005】[0005]

【課題を解決するための手段】本発明者は、近年の高精
細印刷(画素密度600dpi)用の感熱孔版印刷用原
紙について、色々な角度から検討を行なってきた結果、
感熱孔版印刷用原紙の多孔性支持体として、開口面積が
1μm2〜320μm2で開口率が20%〜95%の微細
な多孔性支持体を用いたものが有効であることを見出し
た。この多孔性支持体に熱可塑性樹脂フィルム(穿孔用
熱可塑性樹脂フィルム)を貼り合わせることによって、
穿孔後は全ての孔から均一にインキが通過する様にな
り、印刷の画像品質が向上することが確認された。
The present inventor has studied the heat-sensitive stencil printing paper for high-definition printing (pixel density 600 dpi) in recent years from various angles.
As the porous support of the thermal stencil sheet, the opening area has been found that the aperture ratio in 1μm 2 ~320μm 2 is valid that with 20% to 95% of a fine porous support. By bonding a thermoplastic resin film (thermoplastic resin film for perforation) to this porous support,
After the perforation, the ink passed through all the holes uniformly, and it was confirmed that the image quality of printing was improved.

【0006】即ち、本発明によれば、第一に、開口面積
が1μm2〜320μm2で開口率が20%〜95%の穿
孔部を有し、且つ厚さが5μm〜20μmのフィルム状
材料からなる多孔性支持体を具備することを特徴とする
孔版印刷用原紙が提供される。
That is, according to the present invention, first, a film material having a perforated portion having an opening area of 1 μm 2 to 320 μm 2 , an aperture ratio of 20% to 95%, and a thickness of 5 μm to 20 μm. Stencil printing paper comprising a porous support comprising:

【0007】第二に、前記多孔性支持体を構成するフィ
ルム状材料が熱可塑性樹脂からなることを特徴とする上
記第一に記載した孔版印刷用原紙が提供される。
Secondly, there is provided the stencil printing stencil according to the first aspect, wherein the film-like material constituting the porous support comprises a thermoplastic resin.

【0008】第三に、前記多孔性支持体と穿孔用熱可塑
性樹脂フィルムとを張り合わせたことを特徴とする上記
第一又は第二に記載した孔版印刷用原紙が提供される。
Thirdly, there is provided the stencil printing paper according to the first or second aspect, wherein the porous support is bonded to a thermoplastic resin film for perforation.

【0009】第四に、前記多孔性支持体を構成するフィ
ルム状材料の融点が、穿孔用熱可塑性樹脂材料の融点よ
り高いことを特徴とする上記第三に記載した孔版印刷用
原紙が提供される。
Fourthly, there is provided the stencil printing stencil according to the third aspect, wherein the melting point of the film material constituting the porous support is higher than the melting point of the thermoplastic resin material for perforation. You.

【0010】第五に、前記多孔性支持体の開口がエキシ
マレーザー装置を用いて穿孔されたことを特徴とする上
記第一〜第四のいずれかに記載した孔版印刷用原紙が提
供される。
Fifth, there is provided the stencil printing paper according to any one of the first to fourth aspects, wherein the opening of the porous support is perforated by using an excimer laser device.

【0011】本発明の孔版印刷用原紙は、開口面積が1
μm2〜320μm2で開口率が20%〜95%の穿孔部
を有し、且つ厚さが5μm〜20μmのフィルム状材料
からなる多孔性支持体を備えたことから、均一なインキ
通過が保証され、印刷時の画像品質のバラツキを生じな
いものとなる。(なお、ここで言う開口面積とは、一つ
の穿孔の面積を意味する。)特に、上記多孔性支持体と
穿孔用熱可塑性樹脂フィルムとの張り合わせ構造からな
るものとし、更に多孔性支持体材料として、融点が穿孔
用熱可塑性樹脂フィルムの融点より高いものを使用する
ことにより、製版において(穿孔時に)熱可塑性フィル
ムに熱が加わっても、多孔性支持体の穿孔部分が変化し
ないものとなる。
The stencil printing paper of the present invention has an opening area of 1
μm 2 ~320μm 2 aperture ratio has a perforated portion of 20% to 95% in and since having a porous support having a thickness of a film like material 5Myuemu~20myuemu, uniform ink passage is guaranteed As a result, there is no variation in image quality at the time of printing. (Note that the opening area referred to herein means the area of one perforation.) In particular, it is assumed that the porous support has a laminated structure of the perforated thermoplastic resin film and further has a porous support material. By using a material whose melting point is higher than the melting point of the thermoplastic resin film for perforation, even if heat is applied to the thermoplastic film during plate making (during perforation), the perforated portion of the porous support does not change. .

【0012】[0012]

【発明の実施の形態】以下、本発明を更に詳細に説明す
る。図1は、本発明の孔版印刷用原紙の多孔性支持体の
模式断面図である。図1において、1は多孔性支持体、
2は支持体材料、3は孔部(開口部)をそれぞれ示す。
該支持体は、一般に穿孔用熱可塑性フィルムより融点の
高い材料を用いる。この多孔性支持体を得るには、一定
の規則性をもたせて開口部を形成した金属の版を前もっ
て製作し、穿孔する支持体材料用フイルムに重ね合わ
せ、金属版側からエキシマレーザーを照射することによ
り行われる。この際、開口面積が1μm 2〜320μm2
で開口率が20%〜95%になる様に金属版の開口面積
を加工する。図2に示す様に、開口部の形状は円[図2
−(a)]、楕円[図2−(b)]、四角形[図2−
(c)]、三角形[図2−(d)]、あるいはこれら
円、楕円、四角形、三角形の混合したもの[図2−
(e)]などでも構わない。[図2−(e)]の混合型
はモアレ防止に有用である。支持体材料用フィルムの厚
さは、5μm〜20μmが適当である。
BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described below in more detail.
You. FIG. 1 shows the porous support of the stencil sheet of the present invention.
It is a schematic cross section. In FIG. 1, 1 is a porous support,
2 indicates a support material, and 3 indicates a hole (opening).
The support generally has a melting point higher than that of the perforated thermoplastic film.
Use expensive materials. To obtain this porous support, a constant
A metal plate with an opening formed with a regular pattern.
Superimposed on the support material film
Irradiate an excimer laser from the metal plate side.
Is performed. At this time, the opening area is 1 μm Two~ 320 μmTwo
Area of the metal plate so that the aperture ratio becomes 20% to 95%
To process. As shown in FIG. 2, the shape of the opening is a circle [FIG.
-(A)], ellipse [Fig. 2- (b)], square [Fig.
(C)], triangle [Fig. 2- (d)], or these
A mixture of circles, ellipses, squares, and triangles [Figure 2-
(E)]. Mixed type of [Fig. 2- (e)]
Is useful for preventing moiré. Thickness of film for support material
The appropriate length is 5 μm to 20 μm.

【0013】開口面積が、1μm2未満の場合は穿孔個
数が少ない場合は、インキ供給量が不十分で良好な印刷
が出来ない。また、単純に1μm2未満の孔を多数穿孔
すると、フィルムの強度が低下してしまい、印刷におい
て搬送・耐刷不足等の不具合を生じる。320μm2
り大きく穿孔すると、サーマルヘッドで穿孔した部分ヘ
インキを適当量供給することが出来ず、インキ出過ぎの
状況になり、多孔性支持体でのインキ供給機能を活かせ
ない。開口率が20%未満ではインキ供給量が不十分で
あり、95%より多いとインキ通過量が多すぎてしま
う。また、支持体材料用フイルムの厚さの規定では、5
μm未満では孔版印刷用原紙の製版印刷機での搬送に不
具合が生じ、20μmより厚くなるとエキシマレーザー
で穿孔させる場合に、数度のレーザー照射穿孔作業を行
なう必要が生じ、不具合が生じる。
When the opening area is less than 1 μm 2 , when the number of perforations is small, the ink supply is insufficient and good printing cannot be performed. Further, if a large number of holes having a diameter of less than 1 μm 2 are simply formed, the strength of the film is reduced, and problems such as insufficient conveyance and printing durability occur in printing. If the perforations are larger than 320 μm 2, it is impossible to supply an appropriate amount of ink to the portion perforated by the thermal head, resulting in a situation where ink is excessively discharged, and the ink supply function of the porous support cannot be utilized. If the aperture ratio is less than 20%, the ink supply amount is insufficient, and if it is more than 95%, the ink passage amount is too large. In addition, the thickness of the support material film is defined as 5
When the thickness is less than μm, there is a problem in transporting the stencil sheet for the stencil printing machine, and when the thickness is more than 20 μm, it is necessary to perform several times of laser irradiation and perforation when excimer laser is used.

【0014】多孔性支持体を構成するフィルム状材料と
しては、熱可塑性樹脂が好ましく、例えばポリ酢酸ビニ
ル、ポリビニルブチラール、塩化ビニル−酢酸ビニルコ
ポリマー、塩化ビニル−塩化ビニリデンコポリマー、塩
化ビニル−アクリロニトリルコポリマー、スチレン−ア
クリロニトリルコポリマー等のようなビニル系樹脂、ポ
リブチレン、ナイロン等のポリアミド、ポリフェニレン
オキサイド、(メタ)アクリル酸エステル、ポリカーボ
ネート、アセチルセルロース、アセチルブチルセルロー
ス、アセチルプロピルセルロース等のセルロース誘導
体、ポリウレタン等が挙げられる。これらの各樹脂材料
は単独のみならず2種以上を混合して用いても良い。
As the film-like material constituting the porous support, a thermoplastic resin is preferable. For example, polyvinyl acetate, polyvinyl butyral, vinyl chloride-vinyl acetate copolymer, vinyl chloride-vinylidene chloride copolymer, vinyl chloride-acrylonitrile copolymer, Examples include vinyl resins such as styrene-acrylonitrile copolymer, polyamides such as polybutylene and nylon, polyphenylene oxide, (meth) acrylate, polycarbonate, cellulose derivatives such as acetylcellulose, acetylbutylcellulose, and acetylpropylcellulose, and polyurethane. Can be These resin materials may be used alone or in combination of two or more.

【0015】なお、多孔性支持体の形成、強度、孔径の
大きさ、コシ等を調節するために、多孔性支持体中に必
要に応じてフィラーなどの添加剤を添加することが好ま
しい。ここにおいてフィラーとは顔料、粉体や繊維状物
質も含まれる概念である。その中で特に針状、板状もし
くは繊維状のフィラーが好ましい。その具体例として
は、ケイ酸マグネシウム、セピオライト、チタン酸カリ
ウム、ウオラストナイト、ゾノトライト、石膏繊維等の
鉱物系針状フィラー、非酸化物系針状ウイスカ、酸化物
系ウイスカ、複酸化物系ウイスカ等の人工鉱物系針状フ
ィラー、マイカ、ガラスフレーク、タルク等の板状フィ
ラー、カーボンファイバー、ポリエステル繊維、ガラス
繊維、ビニロン繊維、ナイロン繊維、アクリル繊維等の
天然又は合成の繊維状フィラーがあげられる。
In order to control the formation, strength, pore size, stiffness and the like of the porous support, it is preferable to add an additive such as a filler to the porous support as needed. Here, the filler is a concept including pigments, powders, and fibrous substances. Among them, needle-like, plate-like or fibrous fillers are particularly preferred. Specific examples include magnesium silicate, sepiolite, potassium titanate, wollastonite, zonotolite, mineral needle fillers such as gypsum fiber, non-oxide needle whiskers, oxide whiskers, and double oxide whiskers. Artificial mineral needle fillers such as mica, glass flakes, talc, etc., and natural or synthetic fibrous fillers such as carbon fiber, polyester fiber, glass fiber, vinylon fiber, nylon fiber, and acrylic fiber. .

【0016】顔料は無機のみならず有機の顔料、あるい
はポリ酢酸ビニル、ポリ塩化ビニル、ポリアクリル酸メ
チル等の有機ポリマー粒子そして酸化亜鉛、二酸化チタ
ン、炭酸カルシウム、シリカである。松本油脂製薬社製
のマイクロカプセル、マツモトマイクロスフイアーも有
効に利用できる。これら添加剤の添加量としては好まし
くは樹脂に対して8%〜20%である。8%以下では添
加剤を加えることによる曲げ剛度が向上しにくくなる。
逆に20%以上になると多孔性支持体と穿孔用熱可塑性
樹脂フィルムとの接着性が落ちてくる傾向にある。
The pigment is not only an inorganic pigment but also an organic pigment, organic polymer particles such as polyvinyl acetate, polyvinyl chloride and polymethyl acrylate, and zinc oxide, titanium dioxide, calcium carbonate and silica. Matsumoto Yushi Pharmaceutical's microcapsules and Matsumoto Microsphere can also be used effectively. The addition amount of these additives is preferably 8% to 20% based on the resin. If it is 8% or less, it is difficult to improve the bending rigidity by adding the additive.
Conversely, if it is 20% or more, the adhesiveness between the porous support and the thermoplastic resin film for perforation tends to decrease.

【0017】更に、本発明の多孔性支持体には、本発明
の効果を阻害しない範囲内で帯電防止剤、スティック防
止剤、界面活性剤、防腐剤、消泡剤などを併用すること
ができる。
Further, an antistatic agent, an anti-stick agent, a surfactant, a preservative, an antifoaming agent and the like can be used in combination with the porous support of the present invention as long as the effects of the present invention are not impaired. .

【0018】図3は、上記多孔性支持体1と穿孔用熱可
塑性樹脂フィルム4とを貼り合わせた場合の模式断面図
を示す。穿孔用熱可塑性樹脂フィルムとしては、この分
野において知られている熱可塑性樹脂フィルムがいずれ
でも使用できる。例えば、ポリエステル、ナイロン、ポ
リエチレン、ポリプロピレン、ポリ塩化ビニリデン、ポ
リ弗化ビニリデン又はこれらの光重合体等が挙げられ
る。穿孔用熱可塑性樹脂フイルムの厚さは、1μm〜
4.0μmが適当である。このフィルムがの厚さ、1μ
mより薄いと支持体フィルムとの張り合わせ作業に不具
合が生じ、4μmより厚いとサーマルヘッドによる穿孔
に多大なエネルギーが必要になり、穿孔性が悪化する。
FIG. 3 is a schematic sectional view showing a case where the porous support 1 and the thermoplastic resin film 4 for perforation are bonded together. As the thermoplastic resin film for perforation, any thermoplastic resin film known in this field can be used. For example, polyester, nylon, polyethylene, polypropylene, polyvinylidene chloride, polyvinylidene fluoride, or a photopolymer thereof may be used. The thickness of the thermoplastic resin film for perforation is 1 μm
4.0 μm is appropriate. This film has a thickness of 1μ
If the thickness is smaller than m, the work of laminating with the support film will be inconvenient.

【0019】図4は、図2で示した本発明材料を、サー
マルヘッドで実際に穿孔させた場合で、穿孔側(穿孔用
熱可塑性樹脂フィルム側)から観察し、スケッチしたも
のである。
FIG. 4 is a sketch of the material of the present invention shown in FIG. 2 observed from the perforation side (the side of the thermoplastic resin film for perforation) when the material was actually perforated with a thermal head.

【0020】また、本発明の感熱孔版印刷用原紙の熱可
塑性樹脂フィルム(穿孔用熱可塑性樹脂フィルム)表面
には、必要に応じてシリコーン系又はフッ素系離型剤か
らなるスティック防止層が設けられる。このスティック
防止層は、多孔性支持体との貼り合わせ前又は貼り合わ
せ後に形成される。
A stick prevention layer made of a silicone-based or fluorine-based release agent is provided on the surface of the thermoplastic resin film (thermoplastic resin film for perforation) of the heat-sensitive stencil sheet of the present invention, if necessary. . This stick prevention layer is formed before or after lamination with the porous support.

【0021】本発明の原紙を用いた孔版印刷版で印刷を
行なうと、べた部でも均一なインキ通過により、高画質
の印刷を得ることが出来る。
When printing is performed on a stencil printing plate using the base paper of the present invention, high quality printing can be obtained even in a solid portion by uniform ink passage.

【0022】[0022]

【発明の効果】請求項1〜3の孔版印刷用原紙は、開口
面積が1μm2〜320μm2で開口率が20%〜95%
の穿孔部を有し、且つ厚さが5μm〜20μmのフィル
ム状材料からなる多孔性支持体を有することから、本原
紙を用いて製版印刷を行なった際に全ての孔から均一に
インキが通過し、高画質の印刷物を得ることができる。
The stencil printing paper according to claims 1 to 3 has an opening area of 1 μm 2 to 320 μm 2 and an opening ratio of 20% to 95%.
With a porous support made of a film material having a thickness of 5 μm to 20 μm, the ink uniformly passes through all the holes when plate making printing is performed using this base paper. Thus, a high-quality printed matter can be obtained.

【0023】請求項4の孔版印刷用原紙は、上記多孔性
支持体を構成するフィルム状材料の融点が、穿孔用熱可
塑性樹脂材料の融点より高いものとしたことから、本原
紙を用いて製版を行なった際に、穿孔時に穿孔用熱可塑
性樹脂フィルムに熱が加わっても、多孔性支持体の穿孔
部分が変化しないものとなる。
In the stencil printing paper according to the fourth aspect, the melting point of the film-like material constituting the porous support is higher than the melting point of the thermoplastic resin material for perforation. In this case, even if heat is applied to the perforated thermoplastic resin film during perforation, the perforated portion of the porous support does not change.

【0024】請求項5の孔版印刷用原紙は、多孔性支持
体が支持体フィルムにエキシマレーザー装置を用いて穿
孔したものであることから、容易に所望の穿孔が形成さ
れたものである。
In the stencil printing paper according to the fifth aspect, since the porous support is formed by perforating the support film using an excimer laser apparatus, desired perforations are easily formed.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明における多孔性支持体の1例を示す模式
断面図である。
FIG. 1 is a schematic sectional view showing one example of a porous support in the present invention.

【図2】本発明における多孔性支持体の穿孔例を示す平
面図であり、(a)は円形穿孔の場合、(b)は楕円穿
孔の場合、(c)は四角形穿孔の場合、(d)は三角形
穿孔の場合、(e)は円、楕円、四角形、三角形混合穿
孔の場合をそれぞれ示す。
FIGS. 2A and 2B are plan views showing examples of perforation of a porous support in the present invention, wherein FIG. 2A shows a case of circular perforation, FIG. 2B shows a case of elliptical perforation, FIG. ) Shows the case of triangular perforation, and (e) shows the case of circular, elliptical, square, and triangular mixed perforations.

【図3】本発明の孔版印刷用原紙の1例を示す模式断面
図である。
FIG. 3 is a schematic cross-sectional view showing one example of a stencil sheet of the present invention.

【図4】本発明の孔版印刷用原紙をサーマルヘッドにて
穿孔用熱可塑性樹脂フィルムに穿孔した際の、穿孔側か
ら観察した図である。
FIG. 4 is a diagram observed from the perforation side when the stencil sheet of the present invention is perforated on a thermoplastic resin film for perforation by a thermal head.

【符号の説明】[Explanation of symbols]

1 多孔性支持体 2 支持体材料 3 多孔性支持体の孔部(開口部) 4 穿孔用熱可塑性樹脂フィルム DESCRIPTION OF SYMBOLS 1 Porous support 2 Support material 3 Porous part (opening) of a porous support 4 Thermoplastic resin film for perforation

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 開口面積が1μm2〜320μm2で開口
率が20%〜95%の穿孔部を有し、且つ厚さが5μm
〜20μmのフィルム状材料からなる多孔性支持体を具
備することを特徴とする孔版印刷用原紙。
1. A numerical aperture opening area in 1μm 2 ~320μm 2 has a perforation of 20% to 95%, and thickness of 5μm
A stencil printing paper comprising a porous support made of a film material having a thickness of about 20 μm.
【請求項2】 前記多孔性支持体を構成するフィルム状
材料が熱可塑性樹脂からなることを特徴とする請求項1
記載の孔版印刷用原紙。
2. The method according to claim 1, wherein the film-like material constituting the porous support comprises a thermoplastic resin.
The stencil sheet described in the above.
【請求項3】 前記多孔性支持体と穿孔用熱可塑性樹脂
フィルムとを貼り合わせたことを特徴とする請求項1又
は2記載の孔版印刷用原紙。
3. The stencil printing paper according to claim 1, wherein the porous support and the thermoplastic resin film for perforation are bonded together.
【請求項4】 前記多孔性支持体を構成するフイルム状
材料の融点が、穿孔用熱可塑性樹脂材料の融点より高い
ことを特徴とする請求項3記載の孔版印刷用原紙。
4. The stencil sheet according to claim 3, wherein the melting point of the film-like material constituting the porous support is higher than the melting point of the thermoplastic resin material for perforation.
【請求項5】 前記多孔性支持体の開口がエキシマレー
ザー装置を用いて穿孔されたことを特徴とする請求項1
〜4のいずれかに記載の孔版印刷用原紙。
5. The method according to claim 1, wherein the opening of the porous support is perforated by using an excimer laser device.
5. The stencil sheet according to any one of items 1 to 4.
JP16662499A 1999-06-14 1999-06-14 Stencil for screen printing Pending JP2000351284A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16662499A JP2000351284A (en) 1999-06-14 1999-06-14 Stencil for screen printing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16662499A JP2000351284A (en) 1999-06-14 1999-06-14 Stencil for screen printing

Publications (1)

Publication Number Publication Date
JP2000351284A true JP2000351284A (en) 2000-12-19

Family

ID=15834751

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16662499A Pending JP2000351284A (en) 1999-06-14 1999-06-14 Stencil for screen printing

Country Status (1)

Country Link
JP (1) JP2000351284A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007045097A (en) * 2005-08-12 2007-02-22 Asia Genshi Kk Plate material for thermal stencil printing plate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007045097A (en) * 2005-08-12 2007-02-22 Asia Genshi Kk Plate material for thermal stencil printing plate

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