JP2006303419A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2006303419A5 JP2006303419A5 JP2005343890A JP2005343890A JP2006303419A5 JP 2006303419 A5 JP2006303419 A5 JP 2006303419A5 JP 2005343890 A JP2005343890 A JP 2005343890A JP 2005343890 A JP2005343890 A JP 2005343890A JP 2006303419 A5 JP2006303419 A5 JP 2006303419A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- silver
- nickel
- metal
- ceramic substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 44
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 26
- 229910052709 silver Inorganic materials 0.000 claims description 26
- 239000004332 silver Substances 0.000 claims description 26
- 229910052759 nickel Inorganic materials 0.000 claims description 22
- 229910052751 metal Inorganic materials 0.000 claims description 19
- 239000002184 metal Substances 0.000 claims description 19
- 239000000758 substrate Substances 0.000 claims description 17
- 239000000919 ceramic Substances 0.000 claims description 15
- 239000004065 semiconductor Substances 0.000 claims description 5
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 229910052750 molybdenum Inorganic materials 0.000 claims 1
- 239000011733 molybdenum Substances 0.000 claims 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims 1
- 229910052721 tungsten Inorganic materials 0.000 claims 1
- 239000010937 tungsten Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005343890A JP2006303419A (ja) | 2004-12-03 | 2005-11-29 | セラミック基板 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004350927 | 2004-12-03 | ||
| JP2005084449 | 2005-03-23 | ||
| JP2005343890A JP2006303419A (ja) | 2004-12-03 | 2005-11-29 | セラミック基板 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009252854A Division JP5133963B2 (ja) | 2004-12-03 | 2009-11-04 | セラミック基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2006303419A JP2006303419A (ja) | 2006-11-02 |
| JP2006303419A5 true JP2006303419A5 (https=) | 2009-02-19 |
Family
ID=37471303
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005343890A Pending JP2006303419A (ja) | 2004-12-03 | 2005-11-29 | セラミック基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2006303419A (https=) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5345363B2 (ja) | 2008-06-24 | 2013-11-20 | シャープ株式会社 | 発光装置 |
| JP5450854B2 (ja) * | 2008-06-24 | 2014-03-26 | シャープ株式会社 | 発光装置 |
| KR102007404B1 (ko) * | 2012-12-14 | 2019-08-05 | 엘지이노텍 주식회사 | 발광소자 패키지 |
| CN108610083B (zh) * | 2018-05-28 | 2023-06-02 | 潮州三环(集团)股份有限公司 | 一种陶瓷封装体 |
| JP7500317B2 (ja) * | 2020-07-22 | 2024-06-17 | スタンレー電気株式会社 | 半導体発光装置 |
| CN115295504B (zh) * | 2022-07-25 | 2025-08-01 | 德阳三环科技有限公司 | 一种陶瓷封装基座 |
-
2005
- 2005-11-29 JP JP2005343890A patent/JP2006303419A/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP1670295A3 (en) | Ceramic substrate, ceramic package for housing light emitting element | |
| JP2016127018A5 (ja) | 表示パネル | |
| JP2005302747A5 (https=) | ||
| US7291922B2 (en) | Substrate with many via contact means disposed therein | |
| EP1701379A3 (en) | Semiconductor device and manufacturing method of the same | |
| JP2015207754A5 (https=) | ||
| TWI456721B (zh) | 導線架及其製造方法及受光發光裝置 | |
| JP2005033197A5 (https=) | ||
| JP2017038062A5 (https=) | ||
| JP2006189853A5 (https=) | ||
| JP2013145234A (ja) | セラミック要素を備える部材 | |
| JP2012096316A5 (https=) | ||
| JP2006165491A5 (https=) | ||
| JP2006303419A5 (https=) | ||
| JP2007142526A5 (https=) | ||
| JP2006245231A5 (https=) | ||
| JP4783647B2 (ja) | 半導体装置用パッケージ部品を用いた半導体装置 | |
| ATE537565T1 (de) | Lichtemittierende halbleitervorrichtung mit metallsubstrat | |
| JP2019533908A5 (https=) | ||
| JP2005276962A5 (https=) | ||
| JP2006310799A5 (https=) | ||
| JP7121027B2 (ja) | 電子素子搭載用基板および電子装置 | |
| JP2014146690A (ja) | セラミック電子部品及びテーピング電子部品連 | |
| JP2005317382A5 (https=) | ||
| JP2008047604A5 (https=) |