JP2006303181A - Surface mounting photointerrupter and its fabrication process - Google Patents

Surface mounting photointerrupter and its fabrication process Download PDF

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JP2006303181A
JP2006303181A JP2005122766A JP2005122766A JP2006303181A JP 2006303181 A JP2006303181 A JP 2006303181A JP 2005122766 A JP2005122766 A JP 2005122766A JP 2005122766 A JP2005122766 A JP 2005122766A JP 2006303181 A JP2006303181 A JP 2006303181A
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light emitting
emitting element
light receiving
receiving element
hollow portion
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Nobuaki Suzuki
伸明 鈴木
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Rohm Co Ltd
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Rohm Co Ltd
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Priority to JP2005122766A priority Critical patent/JP2006303181A/en
Priority to TW094146246A priority patent/TWI373149B/en
Priority to US11/385,244 priority patent/US7459711B2/en
Priority to CN2006100661298A priority patent/CN1838436B/en
Publication of JP2006303181A publication Critical patent/JP2006303181A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

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  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To simplify fabrication process by sealing a light emitting element and a light receiving element easily with a transparent sealing body. <P>SOLUTION: In the photointerrupter where a first hollow section 5a for containing a light emitting element, a second hollow section 5b for containing a light receiving element, and a gap groove 5c for receiving an article to be detected between both hollow sections are provided in an opaque cap body 5 bonded onto the upper surface of an insulating substrate 2 mounting the light emitting element 3 and the light receiving element 4, a transparent sealing body 19 for the light emitting element in the first hollow section and a transparent sealing body 20 for the light receiving element in the second hollow section are provided by injecting transparent resin under liquid state from openings 5a' and 5b' provided in respective hollow sections. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は，発光部と受光部とを備え，その間における被検出物の有無を検出するようにしたフォトインタラプタのうち，プリント基板等に対して面実装できるように構成したフォトインタラプタと，その製造方法とに関するものである。   The present invention relates to a photointerrupter configured to be surface-mounted on a printed circuit board or the like among photointerrupters that include a light emitting unit and a light receiving unit and detect the presence or absence of an object to be detected between the light emitting unit and the light receiving unit, and the manufacture thereof. About the method.

一般に，この種のフォトインタラプタは，金属板製のリードフレームを使用した構成であったが，最近においては，プリント基板等に対して半田付けにて面実装できるように構成して成る面実装型のフォトインタラプタが開発されている。   In general, this type of photo interrupter has a configuration using a lead frame made of a metal plate, but recently, it is a surface mount type that is configured to be surface mounted by soldering on a printed circuit board or the like. A photo interrupter has been developed.

従来，この面実装型のフォトインタラプタは，例えば，特許文献１等に記載されているように，絶縁基板の上面に，発光素子と受光素子とを搭載して，これら発光素子及び受光素子の各々を別々の透明封止体にて密封する一方，前記絶縁基板の下面に，前記発光素子に対する一対の端子電極と，前記受光素子に対する一対の端子電極とを形成して，これらの端子電極にてプリント基板等に対して半田付け実装できるようにし，更に，前記絶縁基板の上面に，前記発光素子を透明封止体で封止した状態で収容する中空部と，前記受光素子を透明封止体で封止した状態で収容する中空部と，これら両中空部の間に被検出物が入るギャップ溝とを備え，更に，前記発光素子からの光を前記ギャップ溝を横切ったのち前記受光素子に到達するように構成して成る不透明体製のキャップ体を固着するという構成にしている。
特開平１１−２７４５５０号公報 Conventionally, this surface mount type photo-interrupter has a light emitting element and a light receiving element mounted on the upper surface of an insulating substrate as described in, for example, Patent Document 1 and the like. Are sealed with separate transparent sealing bodies, and a pair of terminal electrodes for the light emitting element and a pair of terminal electrodes for the light receiving element are formed on the lower surface of the insulating substrate. A hollow portion for accommodating the light emitting element in a state of being sealed with a transparent sealing body on the upper surface of the insulating substrate, and a transparent sealing body for receiving the light receiving element. And a gap groove for receiving an object to be detected between the hollow parts, and further, the light from the light emitting element crosses the gap groove and then enters the light receiving element. To reach And a configuration of fixing the opaque caps body formed by.
JP 11-274550 A

ところで，この種のフォトインタラプタにおける前記発光素子と，受光素子とは，これらの耐久性の向上を図ること等を主な目的として，透明封止体にて封止するという構成にされる。   By the way, the light emitting element and the light receiving element in this type of photo interrupter are configured to be sealed with a transparent sealing body mainly for the purpose of improving their durability.

しかし，前記した従来の面実装型フォトインタラプタにおいては，絶縁基板の上面における発光素子及び受光素子の各々を別々の透明封止体にて封止するに際して，前記絶縁基板の上面における全体に透明樹脂層を，発光素子及び受光素子を覆う厚さにして形成し，この透明樹脂層を，縦方向及び横方向の二つの方向へのダイシング加工にて，前記発光素子に対する透明封止体と，前記受光素子に対する透明封止体とに分断するという構成にしている。   However, in the conventional surface mount photointerrupter described above, when each of the light emitting element and the light receiving element on the upper surface of the insulating substrate is sealed with a separate transparent sealing body, a transparent resin is entirely formed on the upper surface of the insulating substrate. The transparent resin layer is formed with a thickness covering the light emitting element and the light receiving element, and the transparent resin layer is formed by dicing in two directions, the vertical direction and the horizontal direction, The light-receiving element is divided into a transparent sealing body.

従って，前記発光素子及び受光素子を，その各々透明封止体にて別々に封止することに多大の手数を必要とするから，コストが大幅にアップするという問題があるばかりか，二つの方向にダイシング加工するときに，前記絶縁基板の上面に形成されている導体パターンを損傷するおそれが大きくて，不良品の発生率が高いという問題があった。   Therefore, since it takes a great deal of labor to separately seal the light emitting element and the light receiving element with each transparent sealing body, there is a problem that the cost is greatly increased, and there are two directions. In the dicing process, the conductor pattern formed on the upper surface of the insulating substrate is liable to be damaged, and there is a problem that the incidence of defective products is high.

本発明は，これらの問題を解消した面実装型フォトインタラプタと，その製造方法とを提供することを技術的課題とするものである。   An object of the present invention is to provide a surface mount type photo interrupter which solves these problems and a method for manufacturing the same.

この技術的課題を達成するため本発明は，請求項１に記載したように，
「絶縁基板の上面に，発光素子及び受光素子を搭載し，前記絶縁基板の下面に，前記発光素子に対する一対の端子電極及び前記受光素子に対する一対の端子電極を形成し，更に，前記絶縁基板の上面に固着した不透明体製のキャップ体に，前記発光素子を収容する第１中空部と，前記受光素子を収容する第２中空部と，これら両中空部の間に被検出物が入るギャップ溝とを設けて，前記発光素子からの光が前記ギャップ溝を横切ったのち前記受光素子に到達するように構成して成るフォトインタラプタにおいて，
前記キャップ体における第１中空部内に，前記発光素子に対する透明封止体が，当該第１中空部に設けた開口部より透明樹脂を注入することによって設けられ，前記キャップ体における第２中空部内に，前記受光素子に対する透明封止体が，当該第２中空部に設けた開口部より透明樹脂を注入することによって設けられている。」
ことを特徴としている。 In order to achieve this technical problem, the present invention as described in claim 1,
“A light emitting element and a light receiving element are mounted on the upper surface of the insulating substrate, and a pair of terminal electrodes for the light emitting element and a pair of terminal electrodes for the light receiving element are formed on the lower surface of the insulating substrate. An opaque cap member fixed to the upper surface, a first hollow portion for accommodating the light emitting element, a second hollow portion for accommodating the light receiving element, and a gap groove into which an object to be detected enters between these hollow portions In a photointerrupter configured so that light from the light emitting element reaches the light receiving element after crossing the gap groove,
A transparent sealing body for the light emitting element is provided in the first hollow portion of the cap body by injecting a transparent resin from an opening provided in the first hollow portion, and in the second hollow portion of the cap body. A transparent sealing body for the light receiving element is provided by injecting a transparent resin from an opening provided in the second hollow portion. "
It is characterized by that.

次に，本発明の製造方法は，請求項２に記載したように，
「絶縁基板には，その上面に発光素子及び受光素子を搭載し，その下面に前記発光素子に対する一対の端子電極及び前記受光素子に対する一対の端子電極を形成する工程，
前記絶縁基板の上面に，前記発光素子を収容する第１中空部と，前記受光素子を収容する第２中空部と，これら両中空部の間に被検出物が入るギャップ溝とを備え，且つ，前記発光素子からの光が前記ギャップ溝を横切ったのち前記受光素子に到達するように構成して成る不透明体製のキャップ体を固着する工程，
前記キャップ体における第１中空部内に，これに設けた開口部より透明樹脂を注入することによって前記発光素子に対する透明封止体を設ける工程，
前記キャップ体における第２中空部内に，これに設けた開口部より透明樹脂を注入することによって前記受光素子に対する透明封止体を設ける工程，
を備えている。」
ことを特徴としている。 Next, the manufacturing method of the present invention, as described in claim 2,
“A step of mounting a light emitting element and a light receiving element on the upper surface of the insulating substrate and forming a pair of terminal electrodes for the light emitting element and a pair of terminal electrodes for the light receiving element on the lower surface thereof;
A first hollow part for accommodating the light emitting element, a second hollow part for accommodating the light receiving element, and a gap groove for receiving an object to be detected between the two hollow parts on the upper surface of the insulating substrate; Fixing a non-transparent cap body configured to allow light from the light emitting element to reach the light receiving element after crossing the gap groove;
A step of providing a transparent sealing body for the light emitting element by injecting a transparent resin into the first hollow portion of the cap body from an opening provided therein;
A step of providing a transparent sealing body for the light receiving element by injecting a transparent resin into the second hollow portion of the cap body from an opening provided therein;
It has. "
It is characterized by that.

また，本発明の製造方法は，請求項３に記載したように，
「一つのフォトインタラプタを構成する絶縁基板の複数個を縦横に並べて一体して成る素材基板を製造する工程，
前記素材基板には，その上面における各絶縁基板の箇所に発光素子及び受光素子を搭載し，その下面における各絶縁基板の箇所に前記発光素子に対する一対の端子電極及び前記受光素子に対する一対の端子電極を形成する工程，
前記素材基板の上面における各絶縁基板の箇所に，前記発光素子を収容する第１中空部と，前記受光素子を収容する第２中空部と，これら両中空部の間に被検出物が入るギャップ溝とを備え，且つ，前記発光素子からの光が前記ギャップ溝を横切ったのち前記受光素子に到達するように構成して成る不透明体製のキャップ体を固着する工程，
前記各キャップ体における第１中空部内に，これに設けた開口部より透明樹脂を注入することによって前記発光素子に対する透明封止体を設ける工程，
前記各キャップ体における第２中空部内に，これに設けた開口部より透明樹脂を注入することによって前記受光素子に対する透明封止体を設ける工程，
これらの工程に次いで，前記素材基板を，縦方向の切断線に沿ってのダイシング加工及び横方向の切断線に沿ってのダイシング加工にて，前記一つの絶縁基板ごとに分割する工程，
を備えている。」
ことを特徴としている。 Further, the manufacturing method of the present invention, as described in claim 3,
“Process for manufacturing a material substrate that consists of a plurality of insulating substrates that constitute a single photo interrupter arranged vertically and horizontally,
A light emitting element and a light receiving element are mounted on the insulating substrate on the upper surface of the material substrate, and a pair of terminal electrodes for the light emitting element and a pair of terminal electrodes for the light receiving element are mounted on the insulating substrate on the lower surface. Forming a process,
A first hollow portion that houses the light emitting element, a second hollow portion that houses the light receiving element, and a gap in which an object to be detected enters between the two hollow portions at each insulating substrate on the upper surface of the material substrate. A step of fixing an opaque cap body comprising a groove and configured so that light from the light emitting element reaches the light receiving element after traversing the gap groove;
A step of providing a transparent sealing body for the light emitting element by injecting a transparent resin into the first hollow portion of each cap body from an opening provided therein;
Providing a transparent sealing body for the light receiving element by injecting a transparent resin into the second hollow part of each cap body from an opening provided in the cap part;
Subsequent to these steps, the material substrate is divided for each one of the insulating substrates by dicing along a vertical cutting line and dicing along a horizontal cutting line.
It has. "
It is characterized by that.

更にまた，本発明の製造方法は，請求項４に記載したように，
「前記請求項３の記載において，前記素材基板の各絶縁基板における前記キャップ体を，隣接する複数個について一体化して，前記ダイシング加工にて，各キャップ体ごとに分割する。」
ことを特徴としている。 Furthermore, the manufacturing method of the present invention, as described in claim 4,
“In the description of claim 3, the cap bodies in each insulating substrate of the material substrate are integrated for a plurality of adjacent ones, and divided into each cap body by the dicing process.”
It is characterized by that.

本発明は，前記したように，キャップ体における第１中空内の発光素子及び第２中空部内の受光素子の各々に対する透明封止体を，前記両中空部内に透明樹脂を当該両中空部における開口部から注入することによって設けるものであり，これにより，前記従来のように，発光素子及び受光素子の各々を別々の透明封止体にて封止することのためのダイシング加工を必要としないから，製造工程が簡単になって，低コストが提供できるとともに，絶縁基板の上面における各種の導体パターンを損傷することが少なくて，不良品の発生率を大幅に低減できる。   As described above, the present invention provides a transparent sealing body for each of the light emitting element in the first hollow and the light receiving element in the second hollow portion of the cap body, and the transparent resin in the hollow portions and the openings in the hollow portions. Since this is provided by injecting from the portion, dicing processing for sealing each of the light emitting element and the light receiving element with separate transparent sealing bodies is not required as in the conventional case. The manufacturing process becomes simple and low cost can be provided, and various conductor patterns on the upper surface of the insulating substrate are hardly damaged, and the incidence of defective products can be greatly reduced.

しかも，両中空部内への透明樹脂の注入にて設けた透明封止体が，キャップ体の絶縁基板に対する固着に寄与するので，その固着強度を向上することができる。   In addition, since the transparent sealing body provided by injecting the transparent resin into both the hollow portions contributes to the fixing of the cap body to the insulating substrate, the fixing strength can be improved.

特に，請求項３に記載した製造方法によると，一枚の素材基板を使用して複数個を同時に製造することができるから，製造コストを低減を図ることができる。   In particular, according to the manufacturing method described in claim 3, a plurality of materials can be manufactured simultaneously using a single material substrate, so that the manufacturing cost can be reduced.

加えて，請求項４に記載した製造方法によると，キャップ体の製造及び素材基板へのキャップ体の固着が，複数個のキャップ体について同時にできて，前記キャップ体の製造及び固着に要する手数を軽減できるから，製造コストを更に低減を図ることができる。   In addition, according to the manufacturing method of claim 4, the manufacture of the cap body and the fixation of the cap body to the material substrate can be performed simultaneously for a plurality of cap bodies, and the number of steps required for the manufacture and fixation of the cap body is reduced. Since it can be reduced, the manufacturing cost can be further reduced.

以下，本発明の実施の形態を，図面について説明する。   Hereinafter, embodiments of the present invention will be described with reference to the drawings.

図１〜図４は，本発明の実施の形態による面実装型フォトインタラプタ１を示す。   1 to 4 show a surface-mount photo interrupter 1 according to an embodiment of the present invention.

この面実装型フォトインタラプタ１は，ガラスエポキシ等のように耐熱絶縁体による絶縁基板２と，この絶縁基板２の上面に，左右方向に適宜距離を隔てて搭載した発光素子３及び受光素子４と，前記絶縁基板２の上面に固着した不透明合成樹脂製のキャップ体５とによって構成されている。   The surface-mount photo interrupter 1 includes an insulating substrate 2 made of a heat-resistant insulator such as glass epoxy, and a light emitting element 3 and a light receiving element 4 mounted on the upper surface of the insulating substrate 2 at an appropriate distance in the left-right direction. , And a cap body 5 made of an opaque synthetic resin fixed to the upper surface of the insulating substrate 2.

前記絶縁基板２の上面における前記発光素子３は，一対の導体パターン３ａ，３ｂと，この両導体パターン３ａ，３ｂのうち一方の導体パターン３ａにダイボンディングした発光ダイオードチップ３ｃと，この発光ダイオードチップ３ｃと他方の導体パターン３ｂとの間をワイヤボンディングした金属線３ｄとによって構成されている。   The light emitting element 3 on the upper surface of the insulating substrate 2 includes a pair of conductor patterns 3a and 3b, a light emitting diode chip 3c die-bonded to one of the conductor patterns 3a and 3b, and the light emitting diode chip. 3c and the other conductor pattern 3b are comprised by the metal wire 3d wire-bonded.

また，前記絶縁基板２の上面における前記受光素子４は，一対の導体パターン４ａ，４ｂと，この両導体パターン４ａ，４ｂのうち一方の導体パターン４ａにダイボンディングしたフォトトランジスター等の受光チップ４ｃと，この受光チップ４ｃと他方の導体パターン４ｂとの間をワイヤボンディングした金属線４ｄとによって構成されている。   The light receiving element 4 on the upper surface of the insulating substrate 2 includes a pair of conductor patterns 4a and 4b, and a light receiving chip 4c such as a phototransistor die-bonded to one of the conductor patterns 4a and 4b. The light receiving chip 4c and the other conductor pattern 4b are formed by a metal wire 4d wire-bonded.

前記絶縁基板２における下面のうち前記発光素子３の側の部分には，前記発光素子３における一方の導体パターン３ａにスルーホール６内の導体７を介して電気的に導通する端子電極８と，前記発光素子３における他方の導体パターン３ｂにスルーホール９内の導体１０を介して電気的に導通する端子電極１１とが形成されている。   A portion of the lower surface of the insulating substrate 2 on the light emitting element 3 side is provided with a terminal electrode 8 electrically connected to one conductor pattern 3a of the light emitting element 3 via a conductor 7 in a through hole 6; A terminal electrode 11 is formed on the other conductor pattern 3b of the light emitting element 3 and is electrically connected via the conductor 10 in the through hole 9.

また，前記絶縁基板２における下面のうち前記受光素子４の側の部分には，前記受光素子４における一方の導体パターン４ａにスルーホール１２内の導体１３を介して電気的に導通する端子電極１４と，前記前記受光素子４における他方の導体パターン４ｂにスルーホール１５内の導体１６を介して電気的に導通する端子電極１７とが形成されている。   A terminal electrode 14 electrically connected to one conductor pattern 4a of the light receiving element 4 through the conductor 13 in the through hole 12 is provided on the light receiving element 4 side of the lower surface of the insulating substrate 2. And a terminal electrode 17 that is electrically connected to the other conductor pattern 4b of the light receiving element 4 through the conductor 16 in the through hole 15.

一方，前記キャップ体５は，前記発光素子３を収容し，上面に開口部５ａ′を有するる第１中空部５ａと，前記受光素子４を収容し，上面に開口部を５ｂ′を有する第２中空部５ｂと，これら両中空部５ａ，５ｂの間に被検出物１８が入るギャップ溝５ｃとを備え，更に，前記第１中空部５ａにおける発光素子３から発射された光を，第１中空部５ａ内の反射面５ａ″で横向きに屈折し，一方のスリット５ｄから前記ギャップ溝５ｃを横切って他方のスリット５ｅから第２中空部５ｂ内に入り，この第２中空部５ｂ内の反射面５ｂ″で下向きに屈折して前記受光素子４に到達するように構成している。   On the other hand, the cap body 5 accommodates the light emitting element 3 and includes a first hollow part 5a having an opening 5a 'on the upper surface and the light receiving element 4 and an opening 5b' on the upper surface. 2 hollow portion 5b and gap groove 5c into which object 18 is inserted between both hollow portions 5a and 5b, and further, the light emitted from light emitting element 3 in the first hollow portion 5a The light is refracted laterally by the reflecting surface 5a ″ in the hollow portion 5a, crosses the gap groove 5c from one slit 5d, enters the second hollow portion 5b from the other slit 5e, and reflects in the second hollow portion 5b. The light is refracted downward on the surface 5b ″ and reaches the light receiving element 4.

そして，前記キャップ体５における第１中空部５ａ内には，当該第１中空部５ａに設けた開口部５ａ′より透明樹脂を注入することによって，前記発光素子３を密封するように構成して成る透明封止体１９が設けられ，前記キャップ体５における第２中空部５ｂ内には，当該第２中空部５ｂに設けた開口部５ｂ′より透明樹脂を注入することによって，前記受光素子４を封止するように構成して成る透明封止体２０が設けられている。   The light emitting element 3 is sealed by injecting a transparent resin into the first hollow portion 5a of the cap body 5 from an opening 5a 'provided in the first hollow portion 5a. A transparent sealing body 19 is provided, and a transparent resin is injected into the second hollow portion 5b of the cap body 5 from the opening 5b 'provided in the second hollow portion 5b, whereby the light receiving element 4 The transparent sealing body 20 comprised so that may be sealed is provided.

この構成のフォトインタラプタ１は，各種電気機器におけるプリント基板等に対して，その絶縁基板２の下面における各端子電極８，１１，１４，１７を半田付けすることによって実装される。   The photo interrupter 1 having this configuration is mounted by soldering the terminal electrodes 8, 11, 14, and 17 on the lower surface of the insulating substrate 2 to a printed circuit board or the like in various electric devices.

この実装した状態において，前記ギャップ溝５ｃ内に被検出物１８が存在しないときには，前記発光素子３における光は，前記ギャップ溝５ｃを横切って前記受光素子４に到達することになるが，前記ギャップ溝５ｃ内に被検出物１８が存在するときには，前記受光素子４への光の到達が前記被検出物１８にて遮られることになるから，これによって，前記ギャップ溝５ｃ内における被検出物１８の有無を検出することができる。   In this mounted state, when there is no object 18 to be detected in the gap groove 5c, the light in the light emitting element 3 reaches the light receiving element 4 across the gap groove 5c. When the detection object 18 exists in the groove 5c, the detection object 18 blocks the arrival of light to the light receiving element 4, and accordingly, the detection object 18 in the gap groove 5c. The presence or absence of can be detected.

この場合において，前記キャップ体５における第１中空部５ａ内の発光素子３及び第２中空部５ｂ内の受光素子４の各々に対する透明封止体１９，２０を，前記両中空部５ａ，５ｂ内に透明樹脂を当該両中空部における開口部５ａ′，５ｂ′から注入することによって設けるものであることにより，前記従来のように，発光素子３及び受光素子４の各々を別々の透明封止体にて封止することのためのダイシング加工を必要としないから，前記両透明封止体１９，２０を簡単に形成することができる。   In this case, the transparent sealing bodies 19 and 20 for the light emitting element 3 in the first hollow portion 5a and the light receiving element 4 in the second hollow portion 5b of the cap body 5 are respectively connected to the hollow portions 5a and 5b. The transparent resin is provided by injecting the transparent resin from the openings 5a 'and 5b' in the hollow portions, so that each of the light-emitting element 3 and the light-receiving element 4 is separated from the transparent sealing body as in the prior art. Since the dicing process for sealing is not required, both the transparent sealing bodies 19 and 20 can be easily formed.

次に，前記した構成の面実装型フォトインタラプタ１の製造方法について説明する。   Next, a manufacturing method of the surface mount photo interrupter 1 having the above-described configuration will be described.

先ず，図５〜図８に示すように，前記絶縁基板２の複数個を縦及び横に並べて一体化して成る素材基板Ａを，例えば，ガラスエポキシ等の耐熱絶縁体板に製作する。   First, as shown in FIGS. 5 to 8, a material substrate A formed by integrating a plurality of the insulating substrates 2 vertically and horizontally is manufactured on a heat-resistant insulating plate such as glass epoxy.

なお，この素材基板Ａは，詳しくは後述するように，縦方向の切断線Ｂ１及び横方向の切断線Ｂ２に沿ってのダイシング加工によって，前記各絶縁基板２ごとに分割される。   As will be described in detail later, the material substrate A is divided for each insulating substrate 2 by dicing along the vertical cutting line B1 and the horizontal cutting line B2.

前記素材基板Ａのうち前記各絶縁基板２の箇所ごとに，その上面における導体パターン３ａ，３ｂ，４ａ，４ｂの形成，及び，その下面における各端子電極８，１１，１４，１７の形成，並びに，スルーホール６，９，１２，１５の穿設とその内部の導体７，１０，１３，１６の形成を行う。   For each portion of the insulating substrate 2 in the material substrate A, formation of the conductor patterns 3a, 3b, 4a, 4b on the upper surface thereof, formation of the terminal electrodes 8, 11, 14, 17 on the lower surface thereof, and , Through holes 6, 9, 12, and 15 are formed and conductors 7, 10, 13, and 16 are formed therein.

次いで，前記素材基板Ａにおける上面のうち前記各絶縁基板２の箇所に，図９に示すように，発光素子３及び受光素子４の搭載，つまり，チップ３ｃ，４ｃのダイボンディング及び金属線３ｄ，４ｄによるワイヤボンディングを行う。   Next, as shown in FIG. 9, the light emitting element 3 and the light receiving element 4 are mounted on the insulating substrate 2 in the upper surface of the material substrate A, that is, die bonding of the chips 3c and 4c and the metal wire 3d, Wire bonding by 4d is performed.

一方，図１０及び図１１に示すように，前記キャップ体５を，前記した構成にして，不透明の合成樹脂にて成形する。   On the other hand, as shown in FIGS. 10 and 11, the cap body 5 is formed of an opaque synthetic resin having the above-described configuration.

次いで，このキャップ体５を，図１２及び図１３に示すように，前記素材基板Ａにおける上面のうち前記各絶縁基板２の箇所ごとに供給して，図示しない接着剤等にて固着する。   Next, as shown in FIGS. 12 and 13, the cap body 5 is supplied to each portion of the insulating substrate 2 on the upper surface of the material substrate A, and is fixed with an adhesive (not shown).

次いで，前記各キャップ体５における両中空部５ａ，５ｂ内に，透明樹脂を，液体の状態で，その開口部５ａ′，５ｂ′より注入したのち乾燥又は硬化することにより，図１４及び図１５に示すように，第１中空部５ａ内に，発光素子３に対する透明封止体１９を，第２中空部５ｂ内に，受光素子４に対する透明封止体２０を各々形成する。   Next, transparent resin is injected into the hollow portions 5a and 5b of each cap body 5 in the liquid state from the openings 5a 'and 5b', and then dried or hardened. As shown, the transparent sealing body 19 for the light emitting element 3 is formed in the first hollow portion 5a, and the transparent sealing body 20 for the light receiving element 4 is formed in the second hollow portion 5b.

なお，前記透明封止体１９，２０の形成に際しては，図１６に示すように，両中空部５ａ，５ｂ内に，その各々におけるスリット５ｄ，５ｅを剥離可能なテープＣ等にて塞いだ状態で，透明樹脂の液体を一杯に充填するように構成しても良い。   When forming the transparent sealing bodies 19 and 20, as shown in FIG. 16, the slits 5d and 5e in each of the hollow portions 5a and 5b are closed with a peelable tape C or the like. Thus, the liquid of the transparent resin may be filled up.

次いで，前記素材基板Ａを，図１７及び図１８に示すように，縦方向の切断線Ｂ１に沿ってのダイシング加工にて切断するとともに，横方向の切断線Ｂ２に沿ってのダイシング加工にて切断することにより，前記図１〜図４に示す構成通りの面実装型フォトインタラプタ１の複数個を同時に得ることができる。   Next, as shown in FIGS. 17 and 18, the material substrate A is cut by dicing along a vertical cutting line B1 and by dicing along a horizontal cutting line B2. By cutting, a plurality of surface mount photo interrupters 1 having the configuration shown in FIGS. 1 to 4 can be obtained simultaneously.

また，別の製造方法においては，図１９及び図２０に示すように，各キャップ体５を，縦方向に隣接する複数個，又は横方向に隣接する複数個，或いは縦及び横方向に隣接する複数個を一体化して，この一体化した状態で，合成樹脂による成形，及び，素材基板Ａへの固着を行い，そして，縦方向の切断線Ｂ１に沿ってのダイシング加工による切断と，横方向の切断線Ｂ２に沿ってのダイシング加工による切断とによって，個々の面実装型フォトインタラプタ１に分割するようにすることができる。   In another manufacturing method, as shown in FIGS. 19 and 20, the cap bodies 5 are adjacent to each other in the vertical direction, in the vertical direction, in the horizontal direction, or in the vertical and horizontal directions. A plurality of pieces are integrated, and in this integrated state, molding with a synthetic resin and fixation to the material substrate A are performed, and cutting by dicing along the vertical cutting line B1 and lateral direction are performed. Each surface mount type photo interrupter 1 can be divided by cutting by dicing along the cutting line B2.

この方法によると，キャップ体の合成樹脂による成形及び素材基板Ａへの固着が，複数個のキャップ体について行うことができることにより，これらに要する手数を低減できる利点がある。   According to this method, the cap body can be molded with the synthetic resin and fixed to the material substrate A with respect to the plurality of cap bodies, and there is an advantage that the labor required for these can be reduced.

本発明の実施の形態による面実装型フォトインタラプタを示す縦断正面図である。It is a vertical front view which shows the surface mount type photo interrupter by embodiment of this invention. 図１のII−II視断面図である。FIG. 2 is a sectional view taken along line II-II in FIG. 1. 図１のIII −III 視断面図である。FIG. 3 is a sectional view taken along line III-III in FIG. 1. 図１のIV−IV視平断面図である。FIG. 4 is a sectional view taken along the line IV-IV in FIG. 1. 前記フォトインタラプタを製造する素材基板を示す斜視図である。It is a perspective view which shows the raw material board | substrate which manufactures the said photo interrupter. 図５のVI−VI視拡大断面図である。FIG. 6 is an enlarged sectional view taken along line VI-VI in FIG. 5. 図５のVII −VII 視拡大断面図である。FIG. 7 is an enlarged sectional view taken along the line VII-VII in FIG. 5. 図５のVIII−VIII視拡大断面図である。FIG. 8 is an enlarged sectional view taken along the line VIII-VIII in FIG. 5. 前記素材基板に発光素子と受光素子を搭載した状態を示す断面図である。It is sectional drawing which shows the state which mounted the light emitting element and the light receiving element on the said material substrate. キャップ体を示す斜視図である。It is a perspective view which shows a cap body. 図１０のXI−XI視断面図である。It is XI-XI sectional view taken on the line of FIG. 前記素材基板にキャップ体を固着した状態を示す断面図である。It is sectional drawing which shows the state which fixed the cap body to the said raw material board | substrate. 図１２のXIII−XIII視断面図である。FIG. 13 is a sectional view taken along line XIII-XIII in FIG. 12. 前記キャップ体に透明封止体を設けた状態を示す断面図である。It is sectional drawing which shows the state which provided the transparent sealing body in the said cap body. 図１４のXV−XV視断面図である。It is XV-XV view sectional drawing of FIG. 図１４の場合における変形例を示す断面図である。It is sectional drawing which shows the modification in the case of FIG. 複数個のフォトインタラプタに分割した状態を示す断面図である。It is sectional drawing which shows the state divided | segmented into the some photo interrupter. 図１７のXVIII −XVIII 視断面図である。FIG. 18 is a sectional view taken along line XVIII-XVIII in FIG. 17. 別の製造方法を示す断面図である。It is sectional drawing which shows another manufacturing method. 図１９のXX−XX視断面図である。FIG. 20 is a sectional view taken along line XX-XX in FIG. 19.

符号の説明Explanation of symbols

１ フォトインタラプタ
２ 絶縁基板
３ 発光素子
４ 受光素子
５ キャップ体
５ａ 第１中空部
５ｂ 第２中空部
５ｃ ギャップ溝
８，１１，１４，１７ 端子電極
１９，２０ 透明封止体
Ａ 素材基板
Ｂ１，Ｂ２ 切断線 DESCRIPTION OF SYMBOLS 1 Photo interrupter 2 Insulating substrate 3 Light emitting element 4 Light receiving element 5 Cap body 5a 1st hollow part 5b 2nd hollow part 5c Gap groove 8, 11, 14, 17 Terminal electrode 19, 20 Transparent sealing body A Material board B1, B2 Cutting line

Claims (4)

絶縁基板の上面に，発光素子及び受光素子を搭載し，前記絶縁基板の下面に，前記発光素子に対する一対の端子電極及び前記受光素子に対する一対の端子電極を形成し，更に，前記絶縁基板の上面に固着した不透明体製のキャップ体に，前記発光素子を収容する第１中空部と，前記受光素子を収容する第２中空部と，これら両中空部の間に被検出物が入るギャップ溝とを設けて，前記発光素子からの光が前記ギャップ溝を横切ったのち前記受光素子に到達するように構成して成るフォトインタラプタにおいて，
前記キャップ体における第１中空部内に，前記発光素子に対する透明封止体が，当該第１中空部に設けた開口部より透明樹脂を注入することによって設けられ，前記キャップ体における第２中空部内に，前記受光素子に対する透明封止体が，当該第２中空部に設けた開口部より透明樹脂を注入することによって設けられていることを特徴とする面実装型フォトインタラプタ。 A light emitting element and a light receiving element are mounted on the upper surface of the insulating substrate, a pair of terminal electrodes for the light emitting element and a pair of terminal electrodes for the light receiving element are formed on the lower surface of the insulating substrate, and further, the upper surface of the insulating substrate is formed. A non-transparent cap body fixed to the first hollow portion for accommodating the light emitting element, a second hollow portion for accommodating the light receiving element, and a gap groove for receiving an object to be detected between the two hollow portions; In the photointerrupter configured so that light from the light emitting element reaches the light receiving element after crossing the gap groove,
A transparent sealing body for the light emitting element is provided in the first hollow portion of the cap body by injecting a transparent resin from an opening provided in the first hollow portion, and in the second hollow portion of the cap body. The surface mount type photo interrupter is characterized in that a transparent sealing body for the light receiving element is provided by injecting a transparent resin from an opening provided in the second hollow portion. 絶縁基板には，その上面に発光素子及び受光素子を搭載し，その下面に前記発光素子に対する一対の端子電極及び前記受光素子に対する一対の端子電極を形成する工程，
前記絶縁基板の上面に，前記発光素子を収容する第１中空部と，前記受光素子を収容する第２中空部と，これら両中空部の間に被検出物が入るギャップ溝とを備え，且つ，前記発光素子からの光が前記ギャップ溝を横切ったのち前記受光素子に到達するように構成して成る不透明体製のキャップ体を固着する工程，
前記キャップ体における第１中空部内に，これに設けた開口部より透明樹脂を注入することによって前記発光素子に対する透明封止体を設ける工程，
前記キャップ体における第２中空部内に，これに設けた開口部より透明樹脂を注入することによって前記受光素子に対する透明封止体を設ける工程，
を備えていることを特徴とする面実装型フォトインタラプタの製造方法。 A step of mounting a light emitting element and a light receiving element on the upper surface of the insulating substrate, and forming a pair of terminal electrodes for the light emitting element and a pair of terminal electrodes for the light receiving element on the lower surface;
A first hollow part for accommodating the light emitting element, a second hollow part for accommodating the light receiving element, and a gap groove for receiving an object to be detected between the two hollow parts on the upper surface of the insulating substrate; Fixing a non-transparent cap body configured to allow light from the light emitting element to reach the light receiving element after crossing the gap groove;
A step of providing a transparent sealing body for the light emitting element by injecting a transparent resin into the first hollow portion of the cap body from an opening provided therein;
A step of providing a transparent sealing body for the light receiving element by injecting a transparent resin into the second hollow portion of the cap body from an opening provided therein;
A method of manufacturing a surface mount photo interrupter, comprising: 一つのフォトインタラプタを構成する絶縁基板の複数個を縦横に並べて一体して成る素材基板を製造する工程，
前記素材基板には，その上面における各絶縁基板の箇所に発光素子及び受光素子を搭載し，その下面における各絶縁基板の箇所に前記発光素子に対する一対の端子電極及び前記受光素子に対する一対の端子電極を形成する工程，
前記素材基板の上面における各絶縁基板の箇所に，前記発光素子を収容する第１中空部と，前記受光素子を収容する第２中空部と，これら両中空部の間に被検出物が入るギャップ溝とを備え，且つ，前記発光素子からの光が前記ギャップ溝を横切ったのち前記受光素子に到達するように構成して成る不透明体製のキャップ体を固着する工程，
前記各キャップ体における第１中空部内に，これに設けた開口部より透明樹脂を注入することによって前記発光素子に対する透明封止体を設ける工程，
前記各キャップ体における第２中空部内に，これに設けた開口部より透明樹脂を注入することによって前記受光素子に対する透明封止体を設ける工程，
これらの工程に次いで，前記素材基板を，縦方向の切断線に沿ってのダイシング加工及び横方向の切断線に沿ってのダイシング加工にて，前記一つの絶縁基板ごとに分割する工程，
を備えていることを特徴とする面実装型フォトインタラプタの製造方法。 A process for producing a material substrate in which a plurality of insulating substrates constituting a single photo interrupter are arranged vertically and horizontally;
A light emitting element and a light receiving element are mounted on the insulating substrate on the upper surface of the material substrate, and a pair of terminal electrodes for the light emitting element and a pair of terminal electrodes for the light receiving element are mounted on the insulating substrate on the lower surface. Forming a process,
A first hollow portion that houses the light emitting element, a second hollow portion that houses the light receiving element, and a gap in which an object to be detected enters between the two hollow portions at each insulating substrate on the upper surface of the material substrate. A step of fixing an opaque cap body comprising a groove and configured so that light from the light emitting element reaches the light receiving element after traversing the gap groove;
A step of providing a transparent sealing body for the light emitting element by injecting a transparent resin into the first hollow portion of each cap body from an opening provided therein;
Providing a transparent sealing body for the light receiving element by injecting a transparent resin into the second hollow part of each cap body from an opening provided in the cap part;
Subsequent to these steps, the material substrate is divided for each one of the insulating substrates by dicing along a vertical cutting line and dicing along a horizontal cutting line.
A method of manufacturing a surface mount photo interrupter, comprising: 前記請求項３の記載において，前記素材基板の各絶縁基板における前記キャップ体を，隣接する複数個について一体化して，前記ダイシング加工にて，各キャップ体ごとに分割することを特徴とする面実装型フォトインタラプタの製造方法。   4. The surface mounting according to claim 3, wherein the cap bodies in each insulating substrate of the material substrate are integrated for a plurality of adjacent ones and divided into each cap body by the dicing process. Type photo interrupter manufacturing method.
JP2005122766A 2005-03-24 2005-04-20 Surface mounting photointerrupter and its fabrication process Pending JP2006303181A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2005122766A JP2006303181A (en) 2005-04-20 2005-04-20 Surface mounting photointerrupter and its fabrication process
TW094146246A TWI373149B (en) 2005-03-24 2005-12-23 Surface mount type photo interrupter and method for manufacturing the same
US11/385,244 US7459711B2 (en) 2005-03-24 2006-03-21 Surface mount type photo interrupter and method for manufacturing the same
CN2006100661298A CN1838436B (en) 2005-03-24 2006-03-24 Surface mount type photo interrupter and method for manufacturing the same

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