JP2006301691A - Ic card and ic card manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an easily manufacturable and inexpensive and highly reliable IC card in which the exposure of the connection edge of an antenna coil can be prevented from being defective and any cut waste can be prevented from being left and the arrangement position of an IC module on a card substrate can be made accurate. <P>SOLUTION: An IC module 2 is arranged in a window hole 15 formed in a first card substrate 11 so that the face of a contact interface can be exposed on the surface, and the both ends of an antenna coil 3 wired on the back face of the first card substrate are connected to an antenna terminal 22 of a non-contact interface, and the IC module is arranged in the window hole so as to be supported by the both ends of the antenna coil, and a chip 23 of the IC module is housed in an escape hole 16 formed in the second card substrate 12, and the second card substrate is adhered to the back face of the first card substrate so that the antenna coil can be covered, and a third card substrate 13 is adhered from the second card substrate. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an IC card (generally referred to as a “combination IC card”) in which an IC module having a contact interface and a non-contact interface is incorporated in a card substrate, and a method for manufacturing the IC card.

  2. Description of the Related Art Conventionally, there is known a combination IC card in which an IC module in which a contact interface is formed on one surface and an antenna terminal of a non-contact interface is formed on the other surface is incorporated in a card base (see Patent Document 1).

An outline of the method of manufacturing this combination IC card will be described.
First, an antenna sheet having an antenna coil and an antenna coil connection end formed on the surface of the core sheet is manufactured.
Next, after laminating this antenna sheet and other core sheets and oversheets, they are introduced into a heat press machine, integrated (laminated), and then punched out to a card size, before the IC module is mounted. Manufacturing.
Next, the concave portion for mounting the IC module is excavated using a counterbore machine, and at this time, the connection end portion of the antenna coil is exposed.
Next, the contact interface is exposed on the surface of the card base, and the IC module is loaded in the mounting recess so that the antenna terminal of the non-contact interface is connected to the connection end of the antenna coil.

  That is, a manufacturing method of excavating a mounting recess so as to expose the connection end of the antenna coil with a counterbore machine with a card base punched out in advance, and finally mounting an IC module in the mounting recess. Met.

However, in the conventional manufacturing method described above, the mounting recess is excavated so that the connection end of the antenna coil is exposed by the counterbore machine, so that high accuracy is required for the counterbore operation, and the manufacture is difficult.
Especially in the part where the mounting recess that exposes the antenna coil is dug, the cutting speed is slow and the yield is poor because the cutting is performed while detecting the thin film metal part of slightly over 30 microns that is the antenna part during the counterbore processing. Even in aged evaluation, reliability was poor, and more expensive counterbore processing devices were required, and many special rotary blades were required as consumables.

  When manufacturing an antenna coil, the antenna coil and antenna pattern are mainly printed and then etched by bonding a copper foil to a plastic sheet. In this method, the antenna coil is drawn with a single stroke. Is manufactured two-dimensionally, it is necessary to cross the coil somewhere, bonding metal foil with insulating film, etching on both sides of the plastic sheet and fastening with metal clips, It is necessary to be electrically connected, and the antenna sheet becomes very expensive.

  In addition, the mounting end of the antenna coil becomes poorly exposed due to heat distortion during hot pressing, etc., and IC chip is loaded into this mounting recess, such as cutting dust remaining in the mounting recess. In some cases, poor connection with the antenna coil may occur, and the module may not fit in the recess and protrude from the card surface.

  Also, it is a manufacturing method in which a card base is previously punched into a card size, a mounting recess is excavated in the card base, and an IC module is loaded into the mounting recess using an adhesive, and in addition, an antenna coil is connected. The assembly process or assembly device (implanter) is complicated because the two points connecting the end and the antenna terminal of the non-contact interface are joined using a conductive adhesive such as "silver paste" containing a lot of fine silver particles. However, considering the stress such as bending, twisting, and heat considering taking the card with you for several years as an application for identification, etc., it is not necessarily satisfactory for the high reliability required for IC cards. There was a problem that has not been resolved.

  Since the card is punched out with a press, counterbored, and assembled, the actual center position of the module with respect to the card is within 5/100 mm of the designed center position. Depth deviation may occur, and since the adhesive is used, it is necessary to process the recess larger than the module in order to prevent the adhesive from sticking out during bonding. It was difficult to determine and manage the location.

To attach the IC module to the counterbore recess on the card using an assembly device (implanter), a thermosetting adhesive is used. After placing the module in the recess, it is typically 200 degrees Although it is necessary to perform hot pressing for about 1 second and 2 times, there is a problem that the back side of the module of the card is distorted by this heat, and it is inevitable that the design and strength of the card are impaired.
JP 2004-355604 A

  The present invention is easy to manufacture, the connection end of the antenna coil does not become poorly exposed, and no cutting waste remains, and a counterbore processing device, a consumable drill, and an assembly processing device ( It is inexpensive because it does not require an implanter), does not require a conductive adhesive for bonding the IC module, and does not require an adhesive for bonding the IC module to the card depending on the selection of the card base. It is an object of the present invention to provide an IC card and an IC card manufacturing method that can accurately arrange the position of the IC module with respect to the module, have no unsightly appearance of a recess around the module, and have high reliability against bending twisting and heat.

In order to solve the above problems, an IC card of the present invention (Claim 1)
An IC module in which a contact interface is formed on one side and an antenna terminal of a non-contact interface is formed on the other side is an IC card incorporated in a card base having at least three layers,
A window hole is formed in the first card base, and the IC module is disposed in the window hole in a state where the surface of the contact interface is exposed on the surface, and both ends of the antenna coil wired on the back surface of the first card base are not By being connected to the antenna terminal of the contact interface, the IC module is arranged in the window hole in a state supported by both ends of the antenna coil,
A clearance hole is formed in the second card base, and the chip of the IC module is placed in the clearance hole, and the second card base is bonded to the back surface of the first card base so as to cover the antenna coil,
The basic structure is a structure in which the third card base is bonded to the second card base.

The IC card manufacturing method of the present invention (Claim 2)
An IC card manufacturing method in which an IC module in which a contact interface is formed on one side and an antenna terminal of a non-contact interface is formed on the other side is incorporated in a card base composed of at least three layers,
A plurality of card creation areas are set for each of the first sheet, the second sheet, and the third sheet.
An IC module is placed in each window hole formed in each card making area of the first sheet with the surface of the contact interface exposed on the surface,
Next, the antenna coil is wired on the back surface of each card creation area of the first sheet, and both ends of the antenna coil are connected to the antenna terminals of the non-contact interface of the IC module, whereby the IC module is connected to the antenna coil. It is placed in the window hole while being supported at both ends of the
Next, the IC module chip is placed in each clearance hole formed in each card creation area of the second sheet, and the second sheet is bonded to the back surface of the first sheet so as to cover the antenna coil.
And by laminating the third sheet on the second sheet, a module built-in sheet in which the first sheet, the second sheet, and the third sheet are laminated so that the respective card creation areas coincide with each other is created,
Next, the basic configuration is such that each card creation area of the module built-in sheet is punched one by one with a punching press to create IC cards one by one from the module built-in sheet.

In the present invention, the card base is actually a fourth, fourth, or the like by stacking bases with different sizes of escape holes to accommodate printing designs, transparent printing protection functions, and more complex module shapes. 5, including superposing a number of card bases on the sixth sheet.
In other words, the IC card of the present invention includes a card base composed of three or more layers depending on the design required for performance of the card.

  Since the IC card of the present invention places the IC module in the window hole formed in the first card base, unlike the conventional IC card, a high-precision work such as excavating the mounting recess with a counterbore is not required, Its manufacture is facilitated.

  The IC card of the present invention directly welds the antenna terminal of the non-contact interface of the IC module and the connection terminal of the antenna coil exposed by counterboring in the card recess, so that a conductive adhesive for joining is unnecessary. Therefore, it has high reliability for long-term bending torsion and heat.

  In addition, since the IC card manufacturing method of the present invention does not require excavation by counterbore, the connection end of the antenna coil does not become poorly exposed and cutting waste does not remain, resulting in poor connection with the antenna coil. An IC module can be incorporated without causing trouble.

  The IC card of the present invention does not require an assembly device (implanter), there is no thermal distortion on the back of the module part of the card, and if the IC module and card base are selected correctly, the IC module and card base Since a thermosetting resin or the like to be bonded is not required, both low manufacturing costs and high reliability are achieved.

  In particular, in the IC card manufacturing method of the present invention, a module assembly sheet in which an IC module and an antenna coil are incorporated in advance in a plurality of card creation areas is created, and finally each card creation area of the module incorporation sheet is provided one by one. A feature is that the IC cards are created one by one by punching with a press.

At this time, since the surface of the contact interface of the IC module is exposed from the window hole formed in the first sheet, the exposed surface is photographed by the camera, and the image is read to the control device as the reading position image of the IC module. The input position image is compared with the basic position image stored in advance in the control device, and the IC card is punched one by one while correcting the position of the module built-in sheet according to the displacement of the image. I try to pull it out.
In this way, in the last process, the IC card is punched out one by one from the module built-in sheet, so that the IC module can be accurately placed on the card base, and a highly reliable IC card can be obtained. Can be manufactured.

  FIG. 1 is an exploded perspective view showing an embodiment of the IC card (combination IC card) of the present invention, and FIG. 2 is a cross-sectional view taken along the line AA of FIG.

  The IC card 1 has a card base 10 in which a first card base 11, a second card base 12, and a third card base 13 formed in the same size are stacked, and a contact interface 21 is formed on one side. The IC module 2 (combination IC module) in which the antenna terminal 22 of the non-contact interface is formed on the surface is incorporated.

The first card base 11 is formed with a window hole 15 that is slightly larger than the outer shape of the IC module 2 (a size that creates a gap of about 0.1 mm around the IC module 2).
The IC module 2 is disposed in the window hole 15 in a state where the surface of the contact interface 21 is exposed on the surface.

Further, on the back surface of the first card base 11, an antenna coil 3 in which an enamel wire is drawn and formed by welding with ultrasonic waves or heat from a heater is wired, and both ends 30, 30 of the antenna coil 3 are The antenna terminals 22 and 22 of the non-contact interface of the IC module 2 disposed in the window hole 15 are connected by thermal welding by TC bonding.
Thus, since both ends 30 and 30 of the antenna coil 3 are connected to the antenna terminals 22 and 22 of the non-contact interface, the IC module 2 is supported by the both ends 30 and 30 of the antenna coil 3, and the IC module 2 can be arranged in a floating state in the window hole 15.

  A clearance hole 16 that is slightly larger than the chip 23 of the IC module 2 is formed through the second card base 12. The chip 23 of the IC module 2 is accommodated in the clearance hole 16, and the antenna coil 3 is mounted on the second card base 12. The second card base 12 is bonded to the back surface of the first card base 11 so as to cover it.

Then, the third card base 13 is bonded to the second card base 12 to form the IC card 1 in which the IC module 2 and the antenna coil 3 are incorporated in the card base 10.
In this case, the IC module 2 is exposed on the surface of the IC card 1 through the window hole 15, and the contact interface 21 is formed on the exposed surface.
Note that the back surface of the IC card 1 is completely covered by the third card base 13, and the antenna coil 3 is not exposed.

When the second card base 12 is bonded to the back surface of the first card base 11, the chip 23 is accommodated in the clearance hole 16 with as little space as possible, and the space S is held above the antenna terminals 22 and 22. Thus, it is formed so as to be covered with the second card base 12.
In this case, the second card base 12 is bonded to the first card base 11 while being heated, and the heat at this time causes the second card base 12 to melt, and this melting causes both ends 30 of the antenna coil 3 to be melted. 30 and the antenna terminals 22 and 22 are covered, and the entire IC module is bonded to the card substrate by using the melted card substrate itself as glue. However, when it is necessary to select a material having a weak bonding force between the IC module material and the card substrate, a thermosetting adhesive may be applied to the IC module, or a thermosetting adhesive film may be laminated.

Next, a method for manufacturing the IC card 1 will be described with reference to FIGS.
In this manufacturing method, in order to improve the productivity, a plurality of IC cards 1 are imposed from a single sheet material 60 and manufactured.
In this case, as shown in FIG. 3 as an example, the sheet material 60 includes a first sheet 61 as a material for the first card base 11, a second sheet 62 as a material for the second card base 12, and a third card base. The third sheet 63 is made of 13 materials, and each sheet 61, 62, 63 is formed with card making areas 61a, 62a, 63a in a total of four places, two rows in the vertical direction and two rows in the horizontal direction. ing. This imposition number may be increased depending on the required production quantity.

In the first sheet 61, a window hole 15 is formed through each card making area 61a by pressing.
Further, in the second sheet 62, relief holes 16 are formed through the respective card making regions 62a by pressing.
The third sheet 63 forms a bottom surface of the IC card 1 and is a flat sheet in which no hole is formed.

  Then, as shown in FIG. 3, the module built-in sheet 6 is manufactured by assembling the IC module 2 and the antenna coil 3 in each card production area of the sheet material 60, and each card production area is defined from the module built-in sheet 6. The IC cards 1 are made one by one by punching one by one with a press.

  That is, this manufacturing method includes a first step of creating the module built-in sheet 6 and a second step of creating the IC card 1 one by one from the module built-in sheet 6.

One embodiment of the first step is shown in FIG.
In the first step, first, as shown in FIG. 4A, the first sheet 61 in which the window holes 15 are formed is set on the fixed base 7.
The fixing base 7 is opened so as to face the window hole 15 and the substrate suction hole 70 for sucking air from the lower surface of the first sheet 61 to attract and fix the first sheet 61 on the fixing base 7. A module suction hole 71 is formed.

  Next, as shown in FIG. 4B, the IC module 2 is arranged in the window hole 15 with the surface of the contact interface 21 exposed on the surface. In this case, the air by the module suction hole 71 is arranged. The IC module 2 can be sucked and fixed onto the fixing base 7 by suction.

Next, as shown in FIG. 4C, on the back surface of the first sheet 61, an enamel wire is welded to each card creation region by TC bonding to wire the antenna coil 3, and both ends of the antenna coil 3 are connected. 30 and 30 are connected to the antenna terminals 22 and 22 of the non-contact interface of the IC module 2 by heat welding.
Accordingly, the IC module 2 can be disposed in the window hole 15 in a state where the IC module 2 is supported by both ends 30 and 30 of the antenna coil 3.

  Next, as shown in FIG. 4 (d), the chip 23 of the IC module 2 is placed in each relief hole 16 formed in each card creation area of the second sheet 62, and the antenna coil 3 is covered. In addition, the second sheet 62 is bonded to the back surface of the first sheet 61.

  Then, as shown in FIG. 4E, the first sheet 61, the second sheet 62, and the third sheet 63 are respectively attached to the second sheet 62 by attaching the third sheet 63 to the card creation area. And the IC module 2 and the antenna coil 3 are incorporated, and the module assembly sheet 6 in which the surface of the contact interface 21 of the IC module 2 is exposed from the window hole 15 is created.

Next, one embodiment of the second step is shown in FIGS.
In FIG. 5, reference numeral 8 denotes a conveyance device, which grips the module built-in sheet 6 at the standby position 80 and conveys it to the press position 81, and from the module built-in sheet 6 one by one by the press unit 82 provided at the press position 81. After punching out the card 1, the punching glass 69 is conveyed to the discharge position 83.

  Although not shown in the figure, the transport device 8 is formed so as to move while adsorbed to the ceiling plate and to freely modify the X direction, the Y direction, and the rotation angle by a linear servo motor controlled by the control device. ing.

  Further, a camera 84 is disposed at the standby position 80, and the IC module 2 exposed from the window hole 15 of the module built-in sheet 6 held by the transport device 8 is photographed by the camera 84. Yes.

  Then, an image photographed by the camera 84 is input to the control device as a reading position image of the IC module, and the reading position image is compared with a basic position image stored in advance in the control device. Accordingly, the X direction, the Y direction, and the rotation angle of the transfer device 8 are corrected and transferred to the press position 81.

  In this second step, as shown in FIG. 6A, the position of the IC module 2 is photographed by the camera 84 at the moment when the module built-in sheet 6 at the standby position 80 is gripped by the conveying device 8.

  Next, an image photographed by the camera 84 is compared with a basic position image as a reading position image, and before the conveying device 8 reaches the press position 81 as shown in FIG. The X direction, the Y direction, and the rotation angle are corrected, and the sheet is conveyed to the press position 81.

  At this press position 81, as shown in FIG. 6 (c) and FIG. 6 (d), each card making area 6a is sequentially punched one by one by the press unit 82 while moving the conveying device 8 vertically and horizontally. Thus, the IC cards 1 are created one by one from the module built-in sheet 6.

  Then, after punching the IC card 1 at the press position 81, the punching glass 69 is conveyed to the discharge position 83 as shown in FIG. ), The conveying device 8 returns to the standby position 80, and the same operation as described above is repeated to sequentially manufacture the IC cards 1 one by one.

In addition, the specific structure of this invention is not limited to an above-described Example.
In the embodiment, the punching glass 69 is transported to the discharge position 83. For example, if a punching glass discharging device is provided at the press position 81, the transport device can be quickly returned to the standby position. The operation time can be shortened.

The disassembled perspective view which shows the Example of the IC card of this invention. AA sectional drawing of FIG. The notch top view which shows a module built-in sheet | seat. The process drawing of the 1st process which creates a module built-in sheet in the example of the IC card manufacturing method of the present invention. In the Example of the IC card manufacturing method of this invention, process drawing of the 2nd process which produces the IC card 1 one sheet at a time from a module built-in sheet. Process explanatory drawing of a 2nd process.

Explanation of symbols

1 IC Card 10 Card Base 11 First Card Base 12 Second Card Base 13 Third Card Base 15 Window Hole 16 Escape Hole 2 IC Module 21 Contact Interface 22 Antenna Terminal 23 Chip 3 Antenna Coil 6 Module Assembly Sheet 6a Card Making Area 60 sheet material 61 first sheet 61a card creation area 62 second sheet 62a card creation area 63 third sheet 63a card creation area 69 punching glass 7 fixing base 70 substrate suction hole 71 module suction hole 8 transport device 80 standby position 81 Press position 82 Press unit 83 Discharge position 84 Camera S Space

Claims (2)

An IC module in which a contact interface is formed on one side and an antenna terminal of a non-contact interface is formed on the other side is an IC card incorporated in a card base having at least three layers,
A window hole is formed in the first card base, and the IC module is disposed in the window hole in a state where the surface of the contact interface is exposed on the surface, and both ends of the antenna coil wired on the back surface of the first card base are not By being connected to the antenna terminal of the contact interface, the IC module is arranged in the window hole in a state supported by both ends of the antenna coil,
A clearance hole is formed in the second card base, and the chip of the IC module is placed in the clearance hole, and the second card base is bonded to the back surface of the first card base so as to cover the antenna coil,
An IC card, wherein a third card base is bonded to the second card base. An IC card manufacturing method in which an IC module in which a contact interface is formed on one side and an antenna terminal of a non-contact interface is formed on the other side is incorporated in a card base composed of at least three layers,
A plurality of card creation areas are set for each of the first sheet, the second sheet, and the third sheet.
An IC module is placed in each window hole formed in each card making area of the first sheet with the surface of the contact interface exposed on the surface,
Next, the antenna coil is wired on the back surface of each card creation area of the first sheet, and both ends of the antenna coil are connected to the antenna terminals of the non-contact interface of the IC module, whereby the IC module is connected to the antenna coil. It is placed in the window hole while being supported at both ends of the
Next, the IC module chip is placed in each clearance hole formed in each card creation area of the second sheet, and the second sheet is bonded to the back surface of the first sheet so as to cover the antenna coil.
And by laminating the third sheet on the second sheet, a module built-in sheet in which the first sheet, the second sheet, and the third sheet are laminated so that the respective card creation areas coincide with each other is created,
Next, an IC card manufacturing method characterized in that an IC card is created one by one from the module built-in sheet by punching each card creating area of the module built-in sheet one by one with a punching press. .

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