JP2006301257A - Imaging apparatus and electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To achieve the reduction of cost and the simplification of a manufacture stage by simplifying structure. <P>SOLUTION: The imaging apparatus 100 is equipped with: an imaging lens group 1 forming the optical image of an object; an imaging device 2 converting the optical image formed by the imaging lens group 1 into an electric signal; and an imaging device package 3 molded of resin so as to have an imaging device attaching part 31a to which the imaging device 2 is attached and a lens supporting part 32a which supports the imaging lens group 1. A cam part 32b for displacing the imaging lens group 1 in an optical axis direction X with respect to the imaging device 2 is provided to the lens supporting part 32a of the imaging device package 3, and a lens leg part 1g abutting on the cam part 32b is provided to the third lens 1c of the imaging lens group 1. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an imaging apparatus that can be mounted on an electronic device such as a mobile phone or a mobile computer, and an electronic device including the same.

2. Description of the Related Art Conventionally, a small and high-performance imaging device that can be mounted on an electronic device such as a mobile phone or a mobile computer is known. Examples of such an imaging device include an imaging lens and an optical image formed by the imaging lens. A device having an image sensor for converting the signal into an electric signal has been developed.
In recent years, a hollow package formed by resin molding has been proposed as a means for protecting an image pickup device from impact or the like (see, for example, Patent Document 1).

Incidentally, as a conventional imaging apparatus 200, for example, as shown in FIG. 5, there is an imaging apparatus in which an imaging lens 201 is movable in an optical axis direction X. Specifically, in the imaging apparatus 200, three imaging lenses 201,... Are arranged in a housing 202 side by side in the optical axis direction X, and these imaging lenses 201,. The lens leg portion 201a is supported so as to contact the cam portion 203a of the lens base 203. Then, based on a predetermined operation of the rotating member 204 attached to the casing 202, the lens leg 201a is cammed by rotating the imaging lens 201 around the axis in the optical axis direction X with respect to the lens base 203. The image pickup lens 201 is displaced in the optical axis direction X by moving while contacting the portion 203a.
In the imaging apparatus 200, the lens base leg 203b formed on the lower side of the lens base 203 is brought into contact with a predetermined position around the imaging region (photoelectric conversion unit) 205a of the image sensor 205, thereby The positioning of the imaging lens 201 with respect to the imaging element 205 is performed.
JP 2005-5353 A

However, when the lens pedestal is brought into contact with the surface of the image sensor as described above, there is a problem in that the surface of the image sensor is damaged by the lens pedestal. There is a problem that it is difficult to reduce the size of the image pickup element because it is necessary to provide a space for the lens base leg to abut in a region other than the above.
Furthermore, since the imaging lens is positioned with respect to the imaging device via a lens base that supports the imaging lens, the number of parts constituting the imaging device increases, and thus the imaging device of the imaging lens. It is not easy to perform positioning with respect to. In addition, an increase in the number of components of the imaging apparatus causes an increase in the cost of the imaging apparatus, and there is a problem that the manufacturing process of the imaging apparatus becomes complicated and cannot be easily manufactured.

  SUMMARY OF THE INVENTION An object of the present invention is to provide an imaging device and an electronic apparatus including the imaging device, to reduce the size of the imaging device, and to simplify the structure of the imaging device. The aim is to improve the positioning accuracy, reduce the cost of the imaging device, and simplify the manufacturing process.

In order to solve the above problem, an imaging apparatus according to claim 1 is provided.
An imaging lens that forms an optical image of the subject;
An imaging device having a photoelectric conversion unit that converts an optical image formed by the imaging lens into an electrical signal;
An image pickup device holding member formed by resin molding so as to have an image pickup device mounting portion to which the image pickup device is attached and a lens support portion for supporting the image pickup lens;
One of the imaging lens and the lens support portion is provided with a cam portion for displacing the imaging lens with respect to the imaging element in the optical axis direction, and the other is in contact with the cam portion. It is characterized in that a part is provided.

The invention according to claim 2 is the imaging apparatus according to claim 1,
The image sensor is bonded to the image sensor mounting portion with an adhesive,
The image pickup device mounting portion is provided with an adhesive reservoir for storing the adhesive.

  An electronic apparatus according to a third aspect of the invention is characterized in that the imaging apparatus according to the first or second aspect is provided in a main body of the apparatus.

The invention according to claim 4 is the electronic device according to claim 3,
An attachment reference portion serving as a reference for attaching the imaging device to the device main body is provided on the opposite side of the imaging element holding member from the imaging lens.

According to the first aspect of the present invention, in the imaging apparatus configured to displace the imaging lens in the optical axis direction with respect to the imaging element, the imaging lens is supported by the lens support portion of the imaging element holding member formed by resin molding. As a result, it is possible to reduce the number of parts constituting the image pickup apparatus and to position the image pickup lens with respect to the image pickup element attached to the image pickup element mounting portion as compared with the case where the image pickup lens is supported using a lens base. Can be performed with high accuracy. In addition, the structure of the imaging device can be simplified by reducing the number of components, and the cost of the imaging device can be reduced and the manufacturing process can be simplified.
Further, unlike the prior art, there is no need to provide a space for abutting the lens base portion on the surface of the image sensor other than the photoelectric conversion unit, and the image sensor can be miniaturized.

  According to the second aspect of the present invention, it is needless to say that the same effect as that of the first aspect of the invention can be obtained, and in particular, an adhesive that is unnecessary when the image pickup element is bonded to the image pickup element mounting portion. Is stored in the adhesive reservoir, and the image pickup device can be prevented from being inclined or floating from the surface of the image pickup device attachment portion and being mounted on the image pickup device attachment portion.

  According to the third aspect of the present invention, even in the case of an electronic device provided with the image pickup apparatus according to the first or second aspect within the device main body, the image pickup is performed in the same manner as the first or second aspect of the invention. The number of parts constituting the apparatus can be reduced, and the imaging lens can be accurately positioned with respect to the imaging element attached to the imaging element attachment portion. Further, the structure of the imaging device can be simplified by reducing the number of component parts, and the cost of the imaging device can be reduced and the manufacturing process can be simplified. Furthermore, it is possible to reduce the size of the image pickup element mounted on the image pickup apparatus. As a result, it is possible to reduce the cost of the electronic device on which the imaging device is mounted.

  According to the fourth aspect of the present invention, it is possible to obtain the same effect as that of the third aspect of the invention, and in particular, the image pickup apparatus can be obtained by using the attachment reference portion of the image pickup element holding member as a reference. It can be easily and accurately attached to the device body.

Hereinafter, specific embodiments of the present invention will be described with reference to the drawings. However, the scope of the invention is not limited to the illustrated examples.
Here, FIG. 1 and FIG. 3 are cross-sectional views showing an imaging apparatus 100 of a preferred embodiment to which the present invention is applied. FIG. 2 is a plan view showing the image pickup device package 3 provided in the image pickup apparatus 100. In FIG. 2, the lens leg portion 1 g of the third lens 1 c that is in contact with the cam portion 32 b of the image pickup device package 3 is schematically indicated by a broken line.

  The imaging apparatus 100 according to the present embodiment is configured to be able to displace the imaging lens group 1 in the optical axis direction X based on the operation of the rotating member 5. Specifically, as shown in FIGS. An imaging lens group 1 that forms an optical image, an imaging device 2 that converts an optical image formed by the imaging lens group 1 into an electrical signal, and an imaging device to which the imaging device 2 is attached and supports the imaging lens group 1 An element package (imaging element holding member) 3, an outer frame member 4 that is provided closer to the subject than the imaging element package 3 and encloses the imaging lens group 1, and is rotatably attached to the outer peripheral surface of the outer frame member 4. And a lid member 6 attached to the outer frame member 4 from the subject side.

  The imaging element 2 is provided with a photoelectric conversion unit (imaging region) 2a that converts an optical image of the subject formed by the imaging lens group 1 into an electric signal on the subject (light source) side. Further, the imaging device 2 is composed of, for example, a CMOS image sensor, a CCD image sensor, or the like, and has an outer shape formed in a substantially rectangular thin plate shape (see FIG. 2).

  The imaging lens group 1 includes a first lens 1a, a second lens 1b, and a third lens 1c (imaging lens) arranged in order from the subject (light source) side, and is between the first lens 1a and the second lens 1b. Between the second lens 1b and the third lens 1c, for example, diaphragm plates 1d and 1e for adjusting the amount of light are disposed, respectively. The first lens 1a, the second lens 1b, the third lens 1c, and the diaphragm plates 1d and 1e are fixed and integrated.

The third lens 1c is provided with an engaged portion 1f with which the engaging portion 51 of the rotating member 5 is engaged on the outer surface portion, and the engaged portion 51 is engaged with the engaged portion 1f. When the rotating member 5 rotates around the axis in the optical axis direction X, a driving force is transmitted through the engaging portion 51 and the engaged portion 1f, and the imaging lens group 1 is moved in the optical axis direction X axis. It is designed to rotate around the heart.
Further, at the lower end of the third lens 1c, three lens legs 1g (contact portions) that contact the lens support portion 32a of the image pickup device package 3 are provided at an interval of approximately 120 °.
Further, a biasing member 7 such as a compression coil spring is in contact with the surface of the third lens 1c on the subject side, and the imaging lens group 1 (third lens 1c) is made to be an imaging element by the biasing member 7. It is in a state of being constantly urged to the second side (the side opposite to the subject).

  The image pickup device package 3 is formed by, for example, flowing a predetermined resin into an image pickup device package molding die (not shown) and curing it. Specifically, the image pickup device package 3 has a bottom surface portion 31 and a bottom surface. A standing surface portion 32 formed so as to stand substantially vertically from the end portion of the portion 31 with respect to the bottom surface portion 31 is integrally formed.

An image sensor mounting portion 31a to which the image sensor 2 is mounted is provided at a substantially central portion of the surface (subject side surface) of the bottom surface portion 31.
The imaging element attachment portion 31a is formed in a plurality of, for example, parallel surfaces at substantially the same height when the surface is formed in an uneven shape and the imaging element 2 is bonded to the imaging element attachment portion 31a with a predetermined adhesive. The image sensor 2 is supported by the convex portion, and unnecessary adhesive when the image sensor 2 is bonded to the image sensor mounting portion 31a is stored in the recess a1 as an adhesive reservoir. Yes.
That is, when the back surface of the image sensor 2 is adhered to the surface of the convex portion of the image sensor mounting portion 31a with an adhesive, an unnecessary adhesive unnecessary for adhesion flows out between the convex portion and the image sensor 2 into the concave portion a1. As a result, the adhesive is stored in the recess a1. Accordingly, it is possible to prevent the image pickup device 2 from being inclined or being floated from the surface of the image pickup device attachment portion 31a and being mounted on the image pickup device attachment portion 31a.

  In addition, an attachment reference surface portion 31b that serves as a reference when the imaging apparatus 100 is attached to a device main body of an electronic device such as the mobile phone T is provided on the opposite side (lower side) of the bottom surface portion 31 to the subject. . Specifically, the attachment reference surface portion 31b is formed in a substantially planar shape extending in a direction substantially orthogonal to the optical axis direction X, for example.

  The standing surface portion 32 is provided with a lens support portion 32a that supports the third lens 1c at a substantially upper end portion thereof, and a cover member attachment portion 321 to which the imaging element cover member 8 is attached is provided inside the lens support portion 32a. Yes. Further, the outer frame member 4 is supported on the outer side portion of the lens support portion 32a of the standing surface portion 32 with its lower end portion in contact therewith.

The lens support portion 32 a is provided with a cam portion 32 b for displacing the imaging lens group 1 with respect to the imaging device 2 in the optical axis direction X. The cam portion 32b has, for example, a normal cam surface b1 that has a horizontal plane extending in a direction substantially orthogonal to the optical axis direction X, and the imaging lens group 1 is positioned in the optical axis direction X in a normal state. A macro-time cam surface b2 having a horizontal plane higher than the normal-time cam surface b1 and in which the imaging lens group 1 is positioned in the optical axis direction X in the macro state (see FIG. 3); An inclined surface b3 that continuously connects the surface b1 and the macro time cam surface b2 is formed with an interval of approximately 120 ° (see FIG. 2). Thereby, the cam part 32b supports the imaging lens group 1 at three points.
Then, the imaging lens group 1 rotates around the axis in the optical axis direction X based on a predetermined operation of the rotating member 5, whereby the lens leg portion 1g of the third lens 1c slides on the surface of the cam portion 32b. However, the imaging lens group 1 is displaced in the optical axis direction X with respect to the imaging element 2 by moving along the surface.

  The cover member attaching portion 321 is formed integrally with the upright surface portion 32, and thereby, the image sensor cover member 8 can be attached with high accuracy via the cover member attaching portion 321.

  Although illustration is omitted, the image pickup device package 3 is formed by insert molding a lead frame (not shown) or the like that is electrically connected to the image pickup device 2 via a connection line (not shown) such as a wire. It may be formed integrally.

  In addition, as resin in which the image pick-up element package 3 is formed, for example, thermosetting epoxy resin, room temperature curable epoxy resin, or the like can be applied. Specifically, bisphenol (A · S · F) is used as the main agent. Type, phenol novolac type and the like, and latent curing agents such as amines and acid anhydrides can be used as the curing agent.

  The image sensor cover member 8 is for preventing dust and the like from adhering to the image sensor 2. Further, the image sensor cover member 8 may have a function as a filter that cuts infrared rays incident on the image sensor 2, for example.

On the outer peripheral surface of the outer frame member 4, the engaging portion 51 is engaged with the engaged portion 1 f of the third lens 1 c of the imaging lens group 1 disposed inside the outer frame member 4. A rotating member 5 is attached.
Further, a lid member 6 is attached to the upper end portion of the outer frame member 4, and a translucent member 9 is arranged at a substantially central portion of the lid member 6 so as to be positioned closer to the subject side than the imaging lens group 1. It is installed.
For example, the translucent member 9 may have a function as a filter that cuts infrared rays incident on the image pickup device 2.

Next, an electronic apparatus equipped with the imaging device 100 of the present invention will be described taking the imaging device 100 as an example.
As shown in FIG. 4, the electronic device is, for example, a foldable mobile phone T, and an upper case 10 a as a case with a display screen D and a lower case 10 b with an operation button P are hinged. It is connected via the part 10c. The imaging device 100 is built below the display screen D on the inner surface side (the side having the display screen D) of the upper housing 10a, and the imaging device 100 can capture light from the outer surface of the upper housing 10a. Has been.
A manual operation unit 10d that is mechanically connected to the rotation member 5 is disposed below the display screen D in the upper housing 10a, and is rotated in conjunction with a predetermined operation of the manual operation unit 10d. The moving member 5 is configured to rotate.
Note that other components of the mobile phone T are well known and will not be described.

As described above, according to the imaging device 100 of the present embodiment, the imaging device package 3 formed by resin molding in the imaging device 100 configured to displace the imaging lens group 1 in the optical axis direction X with respect to the imaging device 2. The imaging lens group 1 can be supported by the lens support portion 32a, and the number of components constituting the imaging apparatus 100 can be reduced as compared with the conventional case where the imaging lens group 1 is supported using a lens base. Therefore, it is possible to accurately position the imaging lens group 1 with respect to the imaging element 2. Moreover, the structure of the imaging device 100 can be simplified by reducing the number of components, and the cost of the imaging device 100 can be reduced and the manufacturing process can be simplified.
Further, unlike the prior art, it is not necessary to provide a space for contacting the lens base leg to a region other than the photoelectric conversion portion 2a on the surface of the image pickup device 2, and the size of the image pickup device 2 can be reduced. In addition, the surface of the image sensor 2 can be prevented from being damaged or broken.

  In addition, the cost of the mobile phone T on which the imaging device 100 is mounted can be reduced. Furthermore, since an attachment reference surface portion 31b is provided on the back surface of the bottom surface portion 31 of the image pickup device package 3 as a reference when the image pickup apparatus 100 is attached to the mobile phone body, the attachment reference surface portion 31b is used as a reference. Thus, the imaging device 100 can be easily and accurately attached to the mobile phone body.

The present invention is not limited to the above-described embodiment, and various improvements and design changes may be made without departing from the spirit of the present invention.
For example, in the above embodiment, the lens support portion 32a of the image pickup device package 3 is provided with the cam portion 32b, and the third lens 1c is provided with the lens leg portion 1g as the contact portion. However, the present invention is not limited to this. Instead, for example, a predetermined contact portion may be provided on the lens support portion 32a, and the cam portion 32b may be provided on the lower end of the third lens 1c.

Moreover, in the said embodiment, although the recessed part a1 as an adhesive agent storage part was provided in the image pick-up element attachment part 31a, it is not restricted to this, It is changing suitably whether an adhesive agent storage part is provided. Can do.
Furthermore, although three image pickup lenses are arranged, the number of image pickup lenses arranged is not limited to the above example, and can be changed as appropriate.

  In the above-described embodiment, the imaging lens group 1 is displaced in the optical axis direction X by the rotation member 5 being rotated in a predetermined direction based on an operation by the user. However, the present invention is not limited to this. Instead, for example, the imaging lens may be automatically displaced using a predetermined actuator.

  Furthermore, in the above-described embodiment, the mobile phone T is exemplified as the electronic device. However, the present invention is not limited to this, and any electronic device capable of incorporating the imaging device 100 may be used. It is.

It is sectional drawing which shows the imaging device of suitable one Embodiment to which this invention is applied. It is a top view which shows the image pick-up element package with which the imaging device of FIG. 1 is equipped. It is sectional drawing which shows the imaging device of FIG. It is the front view and back view which show an example of the mobile telephone carrying the imaging device which concerns on this invention. It is sectional drawing which shows the conventional imaging device.

Explanation of symbols

100 Imaging device 1a First lens (imaging lens)
1b Second lens (imaging lens)
1c Third lens (imaging lens)
1g Lens leg (contact part)
2 Image sensor 3 Image sensor package (image sensor holding member)
31a Image sensor attachment part a1 Concave part (adhesive storage part)
32a Lens support portion 32b Cam portion 31b Reference mounting surface portion T Mobile phone (electronic device)

Claims (4)

An imaging lens that forms an optical image of the subject;
An imaging device having a photoelectric conversion unit that converts an optical image formed by the imaging lens into an electrical signal;
An image pickup device holding member formed by resin molding so as to have an image pickup device mounting portion to which the image pickup device is attached and a lens support portion for supporting the image pickup lens;
One of the imaging lens and the lens support portion is provided with a cam portion for displacing the imaging lens with respect to the imaging element in the optical axis direction, and the other is in contact with the cam portion. An image pickup apparatus provided with a section. The image sensor is bonded to the image sensor mounting portion with an adhesive,
The imaging device according to claim 1, wherein the imaging element mounting portion is provided with an adhesive reservoir that stores the adhesive.   An electronic apparatus comprising the imaging apparatus according to claim 1 in an apparatus main body.   The electronic device according to claim 3, wherein an attachment reference portion serving as a reference for attachment of the imaging device to the device main body is provided on the opposite side of the imaging element holding member from the imaging lens.

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