JP2006303955A - Image-taking device and electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To simplify structure to thereby realize a reduction in cost. <P>SOLUTION: An Imaging device 100 includes a family of imaging lenses 1 for providing an optical image of a photographic subject, an imaging element 3 for converting the optical image provided by the family of the imaging lenses 1 into electrical signals, and a housing main body 6 formed from resin so as to include an imaging element mounting portion 61a mounted with the imaging element 3 and a driving unit mounting portion 61c mounted with a lens driving unit 4 for moving the imaging lenses 1a in the optical-axis direction X. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an imaging apparatus that can be mounted on an electronic device such as a mobile phone or a mobile computer, and an electronic device including the same.

2. Description of the Related Art Conventionally, a small and high-performance imaging device that can be mounted on an electronic device such as a mobile phone or a mobile computer is known. Examples of such an imaging device include an imaging lens and an optical image formed by the imaging lens. A device having an image sensor for converting the signal into an electric signal has been developed.
In recent years, a hollow package formed by resin molding has been proposed as a means for protecting an image pickup device from impact or the like (see, for example, Patent Document 1).

By the way, as a conventional imaging device 600, for example, as shown in FIG. 13, in a case 601 in which a case cover member 608 having an opening 608a on the subject side (upper side in FIG. 13) is attached. The imaging lens group 602 is accommodated so as to expose the optical surface through the opening 608a, and the housing 601 is located on the opposite side of the subject (lower side in FIG. 13) than the imaging lens group 602. A substrate 604 on which the image sensor 603 is mounted is attached to the lower part of the substrate.
Furthermore, the imaging apparatus 600 includes a lens driving unit 606 that moves a lens holding member 605 that holds the imaging lens group 602 in the optical axis direction. The lens driving unit 606 is provided with a housing 601 via a driving unit mounting member 606a. It is attached to the underside. Further, a guide shaft 607 that guides the movement of the lens holding member 605 in the optical axis direction X and restricts the rotation of the lens holding member 605 around the axis in the optical axis direction X is attached to the housing 601. Yes.
JP 2005-5353 A

However, when the lens driving unit is attached to the housing via the driving unit attaching member or the guide shaft is attached to the housing as in the conventional imaging device, the structure of the housing of the imaging device is complicated. There is a problem that the cost of the image pickup apparatus is increased because the number of parts constituting the image pickup apparatus increases. Furthermore, in order to sufficiently secure the impact resistance of the image pickup device, if the image pickup device is manufactured with high accuracy and robustness to improve the assembly strength between the component parts, the cost of the image pickup device will increase. There is also a problem.
In addition, since the imaging element is attached via a substrate, it is not easy to accurately position the imaging element with respect to the imaging lens. Here, when the accuracy of positioning of the image sensor is lowered, there is a problem that an optical axis shift, an image tilt, a one-sided blur, and the like occur.

  SUMMARY OF THE INVENTION An object of the present invention is to provide an imaging device and an electronic device including the imaging device that can simplify the structure and thereby reduce the cost.

In order to solve the above problem, an imaging apparatus according to claim 1 is provided.
An imaging lens that forms an optical image of the subject;
An image sensor that converts an optical image formed by the imaging lens into an electrical signal;
A housing formed by resin molding so as to have an imaging device mounting portion to which the imaging device is mounted and a driving unit mounting portion to which a lens driving unit that moves the imaging lens in the optical axis direction;
It is characterized by having.

The imaging device of the invention according to claim 2
An imaging lens that forms an optical image of the subject;
An image sensor that converts an optical image formed by the imaging lens into an electrical signal;
A housing formed by resin molding so as to have an image sensor mounting portion to which the image sensor is mounted and a rotation restricting portion for restricting the rotation of the imaging lens around the optical axis direction;
It is characterized by having.

The imaging device of the invention according to claim 3
An imaging lens movable in the optical axis direction for forming an optical image of a subject;
An image sensor that converts an optical image formed by the imaging lens into an electrical signal;
A housing formed by resin molding so as to have an image sensor mounting portion to which the image sensor is mounted and a position detection member mounting portion to which a position detection member for detecting the position of the imaging lens in the optical axis direction is mounted;
It is characterized by having.

Invention of Claim 4 is an imaging device as described in any one of Claims 1-3,
The image sensor is bonded to the image sensor mounting portion with an adhesive,
The image pickup device mounting portion is provided with an adhesive reservoir for storing the adhesive.

Invention of Claim 5 is an imaging device as described in any one of Claims 1-4,
It has an external connection terminal that is electrically connected to an external connection terminal,
The external connection terminal and the housing are integrally formed.

An electronic device according to a sixth aspect of the present invention is
The imaging apparatus according to any one of claims 1 to 5 is provided in a device main body.

The invention according to claim 7 is the electronic apparatus according to claim 6,
A housing holding portion that engages with a part of the outer surface of the housing and detachably holds the housing is provided.

The invention according to claim 8 is the electronic device according to claim 7,
The housing holding unit includes an imaging device connection terminal for electrical connection with the imaging device,
The imaging device is provided so as to be exposed from the outer surface of the housing, and includes an external connection terminal for electrically connecting to the imaging device connection terminal,
The imaging apparatus connection terminal and the external connection terminal are electrically connected to each other when the casing is held by the casing holding unit.

According to the first aspect of the present invention, the lens driving section can be attached to the driving section mounting section provided in the resin-molded casing, and the lens driving section is attached to the casing via the driving section mounting member. Compared with the case of attaching the housing, the structure of the housing can be simplified and the number of parts constituting the imaging apparatus can be reduced. Thereby, the cost of the imaging device can be reduced.
In addition, the impact resistance can be easily secured by reducing the number of component parts, and in order to ensure sufficient impact resistance, the increase in the assembly strength of the parts causes an increase in cost. Disappears.
Furthermore, the image pickup device can be attached to the image pickup device attachment portion provided in the housing, and the attachment accuracy of the image pickup device can be improved. Further, the positioning of the image pickup element and the guide for guiding the movement of the image pickup lens in the optical axis direction becomes accurate, and the optical axis shift, one-sided blur, and the like can be suppressed.

According to the second aspect of the present invention, the structure of the housing can be simplified and the number of parts constituting the imaging device can be reduced as compared with the case where the rotation restricting member is attached to the housing as a separate body. be able to. Thereby, the cost of the imaging device can be reduced.
In addition, the impact resistance can be easily secured by reducing the number of component parts, and in order to ensure sufficient impact resistance, the increase in the assembly strength of the parts causes an increase in cost. Disappears.
Furthermore, the image pickup device can be attached to the image pickup device mounting portion provided in the casing, and the accuracy of mounting the image pickup device is improved, the positioning of the image pickup device becomes accurate, and the optical axis deviation is suppressed. it can.

According to the third aspect of the present invention, the image sensor can be accurately attached to the image sensor attachment portion provided on the resin-molded casing, and the image sensor can be positioned with high accuracy with respect to the image pickup lens. It can be done easily. Further, by attaching the position detection member to the position detection member attachment portion, the positional relationship between the image sensor and the position detection member can be made highly accurate. Therefore, the imaging lens can be properly positioned in the optical axis direction using the position detection member, and in this state, an optical image can be appropriately formed on the imaging area of the imaging element.
Further, the structure of the housing can be simplified, and the cost of the imaging device can be reduced.

  According to the invention described in claim 4, it is needless to say that the same effect as that of the invention described in claims 1 to 3 can be obtained. In particular, it is unnecessary when the image pickup device is bonded to the image pickup device mounting portion. Since the adhesive is stored in the adhesive storage part, it is possible to prevent the image pickup device from being inclined or floating from the surface of the image pickup device attachment portion and being mounted on the image pickup device attachment portion.

  According to the fifth aspect of the present invention, the same effects as those of the first to fourth aspects of the invention can be obtained, especially when the housing and the external connection terminal are provided as separate members. In comparison, the manufacturing process of the imaging device can be simplified, and the cost of the imaging device can be further reduced.

  According to the invention described in claim 6, even if the electronic apparatus includes the imaging device according to claims 1 to 5 in the apparatus body, the imaging is performed in the same manner as the invention according to claims 1 to 5. Since the structure of the housing of the apparatus can be simplified, the cost of the imaging apparatus can be reduced. As a result, it is possible to reduce the cost of the electronic device on which the imaging device is mounted.

  According to the seventh aspect of the present invention, it is possible to obtain the same effect as the sixth aspect of the invention, and in particular, the case holding part provided in the electronic device is detachably held. As a result, the handleability of the imaging apparatus can be improved.

  According to the invention described in claim 8, it is natural that the same effect as that of the invention described in claim 7 can be obtained. The terminal and the external connection terminal can be electrically connected, and the electrical connection between the imaging device and the apparatus main body can be easily performed.

  Hereinafter, specific embodiments of the present invention will be described with reference to the drawings. However, the scope of the invention is not limited to the illustrated examples.

[Embodiment 1]
FIG. 1 is a cross-sectional view showing an imaging apparatus 100 according to Embodiment 1 to which the present invention is applied.
As shown in FIG. 1, an imaging apparatus 100 according to Embodiment 1 includes a lens holding member 2 that holds an imaging lens group 1 and an imaging element that converts an optical image of a subject formed by the imaging lens group 1 into an electrical signal. 3, a lens driving unit 4 that moves the lens holding member 2 while guiding the lens holding member 2 in the optical axis direction X, a guide shaft 5 that regulates the rotation of the lens holding member 2 around the axis in the optical axis direction X, and an imaging device 3. Cover the case body 6 to which the lens drive unit 4 and the guide shaft 5 are attached and the end (right end in FIG. 1) of the case body 6 to which the lens drive unit 4 is attached from the subject side. A first housing cover member 71 and a second housing cover member 72 that covers an end portion (left end portion in FIG. 1) to which the guide shaft 5 of the housing body 6 is attached from the subject side. Yes.

  The housing body 6 is formed by, for example, flowing a predetermined resin into a housing body molding die (not shown) and being cured. A standing surface portion 62 formed so as to stand substantially perpendicularly from the end portion of the bottom surface portion 61 with respect to the bottom surface portion 61 is integrally formed.

  An image sensor mounting portion 61a to which the image sensor 3 is attached is provided at a substantially central portion of the surface (subject side surface) of the bottom surface portion 61, and around the image sensor mounting portion 61a with respect to the image sensor mounting portion 61a. An imaging element cover member mounting portion 61b formed at substantially the same height is provided, and the outer surface of the imaging element cover member mounting portion 61b is on the right side in FIG. A driving portion attaching portion 61c formed in a flat shape is provided, and a guide shaft attaching portion 61d is provided on the left side in FIG. 1 with respect to the imaging element cover member attaching portion 61b.

The imaging element mounting portion 61a has, for example, a surface that is formed in a concavo-convex shape. The image sensor 3 is supported by the convex portion of the image sensor, and unnecessary adhesive when the image sensor 3 is bonded to the image sensor mounting portion 61a is stored in the recess a1 as an adhesive reservoir. Yes.
That is, when the back surface of the image sensor 3 is adhered to the surface of the convex portion of the image sensor mounting portion 61a with an adhesive, an unnecessary adhesive unnecessary for adhesion flows out between the convex portion and the image sensor 3 into the concave portion a1. As a result, the adhesive is stored in the recess a1. Therefore, it is possible to prevent the image pickup device 3 from being inclined or being floated from the surface of the image pickup device attachment portion 61a and being mounted on the image pickup device attachment portion 61a.

  As for the standing surface part 62, a part of the outer surface is notched inside from the surface of the standing surface part 62, and the notch part 62a is formed. A biasing member E1 of a housing holding portion 10d (described later) is freely engageable with the cutout portion 62a, whereby the imaging device 100 is detachably held by an electronic device such as the mobile phone T. (Details will be described later).

Further, the housing body 6 is connected to the image pickup device 3 via a connection line (not shown) such as a wire, and a lead frame (not shown) connected to the lead frame and external connection terminals (see FIG. 3). The external connection terminal 8 such as the piezoelectric element connection terminal 4c (described later) and the like electrically connected to each other are formed by insert molding.
More specifically, the external connection terminal 8 is connected to the back surface of the bottom surface portion 61 so that the external connection terminal 8 is exposed from the back surface side (opposite to the subject) of the bottom surface portion 61 of the housing body 6. They are arranged substantially flush.

  In addition, as resin in which the housing body 6 is formed, for example, thermosetting epoxy resin, room temperature curable epoxy resin, or the like can be applied. Specifically, bisphenol (A · S · F) is used as the main agent. ) Type, phenol novolac type, and the like, and latent curing agents such as amine-based and acid anhydrides can be used as the curing agent.

The image pickup device 3 has an image pickup device attachment portion 61a on the subject (light source) side so that a photoelectric conversion portion (image pickup region) 3a for converting an optical image of the subject formed by the image pickup lens group 1 into an electric signal is disposed. Is attached. Here, the imaging device 3 is composed of, for example, a CMOS image sensor, a CCD image sensor, or the like, and has an outer shape formed in a substantially rectangular thin plate shape.
Further, an image sensor cover member 9 for preventing dust and the like from adhering to the image sensor 3 is provided on the subject side of the image sensor 3.

  The image sensor cover member 9 is bonded to, for example, the image sensor cover member mounting portion 61b with a predetermined adhesive. Further, the image sensor cover member 9 may have a function as a filter that cuts off infrared rays or the like incident on the image sensor 3, for example.

  The imaging lens group 1 is disposed closer to the subject than the imaging element cover member 9, and includes a predetermined number (two in FIG. 1) of imaging lenses 1a that form an optical image of the subject on the imaging element 3. These imaging lenses 1 a are held by the lens holding member 2 along the optical axis direction X.

  For example, the lens holding member 2 is connected to a shaft portion 4d (described later) of the lens driving unit 4 at the right end in FIG. 1 so as to sandwich the lens holding unit 2a holding the imaging lens 1a. A driving force transmitting portion 2b that transmits the driving force is provided, and a guide shaft engaging portion 2c that is engaged with the guide shaft 5 is provided at the left end in FIG.

The guide shaft engaging portion 2c is a member formed in a bifurcated shape so as to sandwich the guide shaft 5 along a direction substantially orthogonal to the optical axis direction X, for example, and the optical axis direction of the lens holding member 2 The movement of X is guided and the rotation of the lens holding member 2 around the axis in the optical axis direction X is restricted.
The guide shaft 5 is a member attached to the guide shaft attachment portion 61d so as to extend substantially parallel to the optical axis direction X.

  The driving force transmission unit 2b sandwiches the shaft unit 4d of the lens driving unit 4 along the direction (right and left direction in FIG. 1) substantially orthogonal to the optical axis direction X together with the driving unit clamping member 63 attached to the housing body unit 6. It is like that.

For example, SIDM (Smooth Impact Drive Mechanism) or the like is applied as the lens driving unit 4. Specifically, the SIDM includes a SIDM weight unit 4 a that is attached to the driving unit attachment unit 61 c with a predetermined adhesive, and a SIDM. A piezoelectric element portion 4b that is connected to the weight portion 4a and expands and contracts in the optical axis direction X when energized, a piezoelectric element connection terminal 4c (external connection terminal) that is electrically connected to the piezoelectric element portion 4b, and a piezoelectric element portion And a shaft portion 4d that is long in the optical axis direction X and connected to 4b.
The lens driving unit 4 holds the lens via the driving force transmission unit 2b connected to the shaft unit 4d by expanding and contracting the piezoelectric element unit 4b in the optical axis direction X based on energization control by a control unit (not shown). A driving force is transmitted to the member 2 to move the lens holding member 2 in the optical axis direction X.

  The first housing cover member 71 is disposed so that the driving force transmission portion 2b of the lens holding member 2 and the driving portion clamping member 63 sandwich the shaft portion 4d of the lens driving portion 4, and then the shaft portion 4d. Is a member attached to the housing body 6 so as to be inserted through the first through hole 71a.

  The second housing cover member 72 is arranged so that the guide shaft 5 is inserted into the second through hole 72a after the lens holding member 2 is disposed so as to sandwich the guide shaft 5 at the guide shaft engaging portion 2c. The member is attached to the housing body 6.

Next, an electronic apparatus equipped with the imaging device 100 of the present invention will be described taking the imaging device 100 as an example.
As shown in FIG. 2, the electronic device is, for example, a foldable mobile phone T, and an upper case 10 a as a case with a display screen D and a lower case 10 b with an operation button P are hinged. It is connected via the part 10c. The imaging device 100 is built below the display screen D on the inner surface side (the side having the display screen D) of the upper housing 10a, and the imaging device 100 can capture light from the outer surface of the upper housing 10a. Has been.
Note that other components of the mobile phone T are well known and will not be described.

Further, the cellular phone T is provided with a housing holding portion 10d that detachably holds the housing main body portion 6 of the imaging device 100 at a predetermined position inside the mobile phone T (see FIG. 3).
Hereinafter, the housing holding portion 10d will be described in detail with reference to FIG.
As shown in FIG. 3, the housing holding portion 10 d is biased inward and includes a holding mechanism portion 10 e having a biasing member E <b> 1 that engages with the notch 62 a of the housing holding portion 10 d, and the external connection terminal 8. An electrical connection portion 10f having an imaging device connection terminal F1 for electrical connection with the holding mechanism portion 10e and the electrical connection portion 10f is formed in a concave shape as a whole.
Then, when the imaging device 100 is pushed into the housing holding portion 10d from the upper side in FIG. 3, the urging member E1 of the holding mechanism portion 10e is engaged with the cutout portion 62a, and the housing main body portion 6 is engaged. Is held, and the imaging device connection terminal F1 and the external connection terminal 8 of the electrical connection portion 10f are electrically connected.

  The urging of the urging member E1 with respect to the notch 62a is released, so that the imaging device 100 can be detached from the housing holding part 10d. As described above, the housing holding unit 10d is configured to removably hold the housing main body 6 of the imaging device 100.

As described above, according to the imaging apparatus 100 of the first embodiment, the SIDM can be attached as the lens driving unit 4 to the driving unit mounting part 61c provided in the housing main body 6 formed of resin. Thus, the structure of the housing body 6 can be simplified and the number of components constituting the imaging device 100 can be reduced as compared with the case where the SIDM is attached to the housing body 6 via the drive part mounting member. be able to. Further, since the external connection terminal 8 and the housing main body 6 are integrally formed, the imaging device 100 can be compared with the case where the housing main body 6 and the external connection terminal 8 are provided as separate members. The manufacturing process can be simplified. Thereby, the cost of the imaging device 100 can be reduced.
In addition, the impact resistance can be easily secured by reducing the number of components, and in order to secure sufficient impact resistance, the increase in cost due to the improvement of the assembly strength between parts can be suppressed. Can do.
Furthermore, the image pickup device 3 can be attached to the image pickup device attachment portion 61 a provided in the housing body 6, and the attachment accuracy of the image pickup device 3 can be improved. Further, the positioning of the shaft portion 4d of the lens driving unit 4 as a guide for guiding the movement of the lens holding member that holds the imaging lens 1 in the optical axis direction X and the imaging element 3 becomes accurate, and the optical axis shift, Blur and the like can be suppressed.

In addition, as described above, the structure of the housing main body 6 of the imaging device 100 can be simplified, and the cost of the imaging device 100 can be reduced. As a result, the imaging device 100 can be reduced. The cost of the mobile phone T to be mounted can be reduced.
Furthermore, since the housing main body 6 can be detachably held by the housing holding portion 10d, the handleability of the imaging apparatus 100 can be improved. At this time, it is possible to electrically connect the imaging device connection terminal F1 and the external connection terminal 8 simply by holding the housing main body portion 6 in the housing holding portion 10d, and the imaging device 100 and the mobile phone can be electrically connected. Electrical connection with the main body can be easily performed. In particular, since the housing body 6 is a resin-molded member, the housing body 6 has better dimensional accuracy, and the electrical connection between the imaging device 100 and the mobile phone body is ensured. It can be carried out.

<Modification 1>
As shown in FIG. 4, the imaging device 200 according to the first modification includes a housing main body 206 and a guide shaft portion 205 that are integrally formed.
That is, the housing main body 206 is a lens holding member that holds the imaging element mounting portion 61a and the imaging lens group 1 by allowing resin to flow into a predetermined housing main body molding die (not shown) and curing. 2 is formed by resin molding so as to have a guide shaft portion 205 as a rotation restricting portion that restricts rotation around the axis in the optical axis direction X.

Therefore, according to the imaging device 200 of the first modification, the structure of the housing main body 206 can be simplified and the imaging device 200 is configured as compared with the case where the guide shaft is separately attached to the housing main body. The number of parts to be reduced can be reduced. Thereby, the cost of the imaging device 200 can be reduced.
In addition, the image pickup device 3 can be attached to the image pickup device attachment portion 61a of the housing main body 206, so that the attachment accuracy of the image pickup device 3 is improved, the positioning of the image pickup device 3 becomes accurate, and the optical axis shift is reduced. Can be suppressed.

<Modification 2>
As shown in FIG. 5, the imaging apparatus 300 of Modification 2 includes a photo interrupter (position detection member) 311 that detects the position of the lens holding member 2 that holds the imaging lens group 1 in the optical axis direction X. A position detection member attaching portion 361e to which the interrupter 311 is attached is provided in the housing main body portion 306.
That is, the housing main body 306 is attached to a position detection member to which the image sensor mounting portion 61a and the photointerrupter 311 are attached when resin is poured into a predetermined housing main body molding die (not shown) and cured. It is formed by resin molding so as to have a portion 361e. Further, a photointerrupter connection terminal (external connection terminal) 311a that is electrically connected to the photointerrupter 311, a control unit (not shown), or the like is insert-molded in the housing body 306.

Further, a detection wing member 2 d for detecting the position of the lens holding member 2 in the optical axis direction X by a photo interrupter 311 is disposed at a predetermined position of the lens holding member 2.
The pulse signal output from the photo interrupter 311 to the control unit based on the relative height difference between the detection wing member 2d and the photo interrupter 311 is changed from a low level (L level) to a high level (H level). By switching to, the position of the lens holding member 2 in the optical axis direction X is calculated and detected by the control unit.

Therefore, according to the imaging device 300 of the second modification, the imaging device 3 can be accurately attached to the imaging device attachment portion 61a provided in the housing main body 306 formed of resin. Positioning with respect to the imaging lens group 1 can be easily performed with high accuracy. Further, by attaching the photo interrupter 311 to the position detection member attaching portion 361e, the positional relationship between the image sensor 3 and the photo interrupter 311 can be made highly accurate. Accordingly, the imaging lens group 1 is appropriately positioned in the optical axis direction X using the photo interrupter 311, and an optical image is appropriately formed in the imaging region of the imaging element 3 by the imaging lens group 1 in this state. Can do.
In addition, the structure of the housing body 306 can be simplified, and the cost of the imaging device 300 can be reduced.

  In the second modification, the position detection member attaching portion 361e is provided at a predetermined position of the housing main body 306. However, the present invention is not limited to this. For example, the photo interrupter 311 is inserted into the housing main body 306. You may shape | mold, and, thereby, the attachment precision of the photo interrupter 311 can be improved more appropriately.

  In the second modification, the photo interrupter 311 is exemplified as the position detection member. However, the present invention is not limited to this. For example, a photo reflector, a hall element, an MR element, a leaf switch, a push switch, or the like is appropriately applied. You may do it.

  In the first embodiment and the first and second modifications, the first housing cover member 71 and the second housing cover member 72 are configured as separate members. However, the present invention is not limited to this. For example, these may be constituted by a predetermined member.

[Embodiment 2]
Below, the imaging device 400 of Embodiment 2 is demonstrated with reference to FIGS.
Here, FIG. 6 is a plan view showing the imaging apparatus 400 according to the second embodiment to which the present invention is applied. 7 is a cross-sectional view of the imaging device 400 taken along the line VII-VII in FIG. 6, FIG. 8 is a diagram showing the imaging device 400 viewed in the direction of the arrow VIII, and FIG. It is sectional drawing of the imaging device 400 in an IX-IX line. In addition, in FIG. 6, illustration of the housing main body cover member 413 is omitted.
In addition, among the components constituting the imaging apparatus 400 of the second embodiment, the same reference numerals are given to the same configurations as those of the first embodiment, and the description thereof is omitted.

  As shown in FIGS. 6 to 9, the imaging apparatus 400 according to the second embodiment applies a SMA wire 404 made of a shape memory alloy (SMA) as a lens driving unit, and is controlled by a control unit (not shown). The lens holding member 402 is configured to be movable in the optical axis direction X by expanding and contracting the SMA wire 404 based on energization control.

The lens holding member 402 is provided with a guide portion engaging portion 402b that engages with a guide portion 461f provided integrally with the housing main body portion 406 at the right end in FIG. 7 so as to sandwich the lens holding portion 402a. In addition, a cylindrical portion 402c into which a guide shaft 405 attached to the housing body 406 is inserted is provided at the left end in FIG. 7 (see FIG. 7).
The cylindrical portion 402c is disposed, for example, so as to be positioned at one end portion of the casing main body portion 406 having a substantially rectangular shape in plan view (see FIG. 6), and the optical axis direction X by the biasing member 412 such as a compression spring. Is biased to the opposite side of the subject (see FIG. 7). Further, the cylindrical portion 402c is provided with a convex portion c1 protruding from the outer surface thereof in a direction substantially perpendicular to the optical axis direction X, and the substantially central portion of the SMA wire 404 is opposite to the subject on the convex portion c1 ( It is wound from the lower side of FIG. 8 (see FIGS. 8 and 9).

The housing main body 406 is an end different from the end provided with the cylindrical portion 402c, and the SMA wire is disposed on each of the two ends disposed so as to sandwich the lens holding portion 402a. A wire attachment portion (drive portion attachment portion) 461c to which both ends of 404 are attached is provided (see FIGS. 6 and 9), and the SMA wire wound around the convex portion c1 of the tubular portion 402c up to the wire attachment portion 461c. A wire guide portion 461g is provided for guiding 404 by changing the angle (see FIG. 9).
Further, a housing body portion cover member 413 is attached to the housing body portion 406 so as to cover the wire attachment portion 461c, the wire guide portion 461g, the lens holding member 402, and the like from the subject side (FIGS. 7 and 7). 9).

The end of the SMA wire 404 is electrically connected to the external connection terminal 408 (see FIG. 9), and the SMA wire 404 generates heat based on energization control by a control unit (not shown). It changes (shrinks) in a direction that shortens its overall length. As a result, the lens holding member 402 moves toward the subject along the optical axis direction X while being guided by the guide shaft 405 and the guide portion 461f against the biasing member 412, and the focus of the imaging lens group 1 is closer. It can be adjusted to the distance.
On the other hand, the SMA wire 404 is expanded based on the temperature drop of the SMA wire 404, whereby the lens holding member 402 is opposed to the subject along the optical axis direction X while being urged by the urging member 412. Will move to the side.

  As described above, according to the imaging device 400 of the second embodiment, the SMA wire 404 can be attached to the wire attachment portion 461c provided in the housing body portion 406 formed by resin molding. And the number of parts constituting the imaging apparatus 400 can be reduced. Thereby, the cost of the imaging device 400 can be reduced.

In the second embodiment, the housing body 406 or the housing body cover member 413 is provided with a notch, and the notch engages with a housing holding part provided in a predetermined electronic device such as a mobile phone. Thus, the imaging apparatus 400 may be configured to be detachably held.
Here, the housing holding portion may have any configuration as long as it can engage with a part of the outer surface of the housing main body portion 406 and detachably hold the housing main body portion 406. Further, a biasing member formed in a concave shape so as to engage with a protruding portion protruding from the outer surface of the housing main body portion may be provided.

[Embodiment 3]
Below, the imaging device 500 of Embodiment 3 is demonstrated with reference to FIGS.
Here, FIGS. 10 and 12 are cross-sectional views showing an imaging apparatus 500 according to Embodiment 3 to which the present invention is applied. FIG. 11 is a plan view showing an image pickup device package 514 provided in the image pickup apparatus 500. In FIG. 11, the lens leg portion 501g of the third lens 501c that is in contact with the cam portion 142b of the image pickup device package 514 is schematically indicated by a broken line.
In addition, among the components constituting the imaging apparatus 500 of the third embodiment, the same reference numerals are given to the same components as those of the first and second embodiments, and the description thereof will be omitted.

  The imaging apparatus 500 according to the third embodiment is configured to be able to displace the imaging lens group 501 in the optical axis direction X based on the operation of the rotating member 516. Specifically, as shown in FIGS. A lens group 501, an imaging element 3 for converting an optical image formed by the imaging lens group 501 into an electrical signal, an imaging element package 514 to which the imaging element 3 is attached and supporting the imaging lens group 501, and an imaging element package An outer frame member 515 that is provided closer to the subject than 514 and encloses the imaging lens group 501, a rotating member 516 that is rotatably attached to the outer peripheral surface of the outer frame member 515, and a subject side on the outer frame member 515. And a lid member 517 attached from above.

  The imaging lens group 501 includes a first lens 501a, a second lens 501b, and a third lens 501c (imaging lens) that are arranged in order from the subject (light source) side, and between the first lens 501a and the second lens 501b. Between the second lens 501b and the third lens 501c, for example, diaphragm plates 501d and 501e for adjusting the amount of light are disposed, respectively. The first lens 501a, the second lens 501b, the third lens 501c, and the diaphragm plates 501d and 501e are fixed and integrated.

The third lens 501c is provided with an engaged portion 501f to which the engaging portion 516a of the rotating member 516 is engaged on the outer surface portion, and the engaged portion 516a is engaged with the engaged portion 501f. When the rotation member 516 rotates around the axis in the optical axis direction X, a driving force is transmitted through the engaging portion 516a and the engaged portion 501f, and the imaging lens group 501 is moved in the optical axis direction X axis. It is designed to rotate around the heart.
Further, at the lower end of the third lens 501c, three lens leg portions (contact portions) 501g that are in contact with the lens support portion 142a of the image pickup device package 514 are provided at approximately 120 ° intervals.
Further, a biasing member 512 such as a compression coil spring is in contact with the subject side surface of the third lens 501c, and the imaging lens group 501 (third lens 501c) is made to be an imaging element by the biasing member 512. It is in a state of being constantly biased to the 3 side (the side opposite to the subject).

  The image pickup device package 514 is formed by, for example, flowing a predetermined resin into an image pickup device package molding die (not shown) and curing it. Specifically, the image pickup device package 514 has a bottom surface portion 141 and a bottom surface. A standing surface portion 142 is formed integrally with the bottom portion 141 so as to stand upright from the end portion of the portion 141 with respect to the bottom surface portion 141.

An image sensor mounting portion 141a to which the image sensor 3 is mounted is provided at a substantially central portion of the surface (subject side surface) of the bottom surface portion 141.
In addition, an attachment reference surface portion 141b that serves as a reference when the imaging device 100 is attached to a device main body of an electronic device such as the mobile phone T is provided on the bottom surface portion 141 opposite to the subject (lower side). Specifically, the attachment reference surface portion 141b is formed in a substantially planar shape so as to extend in a direction substantially orthogonal to the optical axis direction X, for example.

  The upright surface portion 142 is provided with a lens support portion 142a for supporting the third lens 501c at a substantially upper end portion thereof, the image sensor cover member 9 is attached to the inside of the lens support portion 142a, and the outside of the lens support portion 142a. The outer frame member 515 is supported by the portion with its lower end being brought into contact therewith.

The lens support part 142 a is provided with a cam part 142 b for displacing the imaging lens group 501 in the optical axis direction X with respect to the imaging element 3. For example, the cam portion 142b has a horizontal plane extending in a direction substantially perpendicular to the optical axis direction X, and a normal cam surface b1 in which the imaging lens group 501 is positioned in the optical axis direction X in a normal state. A macro cam surface b2 having a horizontal plane higher than the normal cam surface b1 and in which the imaging lens group 501 is positioned in the optical axis direction X in the macro state (see FIG. 12); An inclined surface b3 that continuously connects the surface b1 and the macro-time cam surface b2 is formed at an interval of approximately 120 ° (see FIG. 11). Thereby, the cam part 142b supports the imaging lens group 501 at three points.
Then, when the imaging lens group 501 rotates around the axis in the optical axis direction X based on a predetermined operation of the rotating member 516, the lens leg portion 501g of the third lens 501c slides on the surface of the cam portion 142b. However, the imaging lens group 501 is displaced in the optical axis direction X with respect to the imaging element 3 due to the movement along the surface.

  Although illustration is omitted, the image pickup device package 514 is formed by insert molding a lead frame (not shown) or the like electrically connected to the image pickup device 3 via a connection line (not shown) such as a wire. It may be formed integrally.

On the outer peripheral surface of the outer frame member 515, the engaging portion 516a is engaged with the engaged portion 501f of the third lens 501c of the imaging lens group 501 disposed inside the outer frame member 515. A rotating member 516 is attached.
Further, a lid member 517 is attached to the upper end portion of the outer frame member 515, and a translucent member 517 a is arranged at a substantially central portion of the lid member 517 so as to be positioned closer to the subject side than the imaging lens group 501. It is installed.

As described above, according to the imaging device 500 of the third embodiment, the imaging device package 514 formed by resin molding in the imaging device 500 configured to displace the imaging lens group 501 in the optical axis direction X with respect to the imaging device 3. The imaging lens group 501 can be supported by the lens support portion 142a, and the number of components constituting the imaging apparatus 500 can be reduced as compared with the conventional case where the imaging lens group 501 is supported using a lens base. Therefore, the imaging lens group 501 can be accurately positioned with respect to the imaging device 3. In addition, the structure of the imaging device 500 can be simplified by reducing the number of components, and the cost of the imaging device 500 can be reduced and the manufacturing process can be simplified.
Further, unlike the prior art, it is not necessary to provide a space for contacting the lens base leg to a region other than the photoelectric conversion portion 3a on the surface of the image pickup device 3, and the image pickup device 3 can be downsized. At the same time, the surface of the image sensor 3 can be prevented from being damaged.

  In addition, an attachment reference surface portion 141b that serves as a reference when the imaging apparatus 500 is attached to the electronic device main body is provided on the back surface of the bottom surface portion 141 of the image pickup device package 514. Therefore, the attachment reference surface portion 141b is used as a reference. Thus, the imaging apparatus 500 can be easily and accurately attached to the electronic device main body.

The present invention is not limited to the above-described embodiment, and various improvements and design changes may be made without departing from the spirit of the present invention.
For example, in the first to third embodiments, the image sensor mounting portions 61a and 141a are provided with the adhesive reservoir (recessed portion) a1, but the present invention is not limited to this, and the adhesive reservoir a1 is provided. Whether it is provided or not can be changed as appropriate.

  In the first embodiment or the second embodiment, two imaging lenses 1a are arranged. In the third embodiment, three imaging lenses are arranged. However, the imaging lens 1a is arranged. The number of sheets is not limited to that exemplified above, and can be changed as appropriate.

  Furthermore, in the above-described embodiment, the mobile phone T is exemplified as the electronic device. However, the present invention is not limited to this, and any electronic device that can incorporate the imaging devices 100, 200, 300, 400, and 500 can be used. Of course, it may be present.

It is sectional drawing which shows the imaging device of Embodiment 1 to which this invention is applied. It is the front view and back view which show an example of the mobile telephone carrying the imaging device which concerns on this invention. It is sectional drawing which shows the state with which the imaging device of FIG. 1 was attached to the apparatus attachment part. It is sectional drawing which shows the imaging device of the modification 1. It is sectional drawing which shows the imaging device of the modification 2. It is a top view which shows the imaging device of Embodiment 2 to which this invention is applied. It is sectional drawing of the imaging device in the VII-VII line of FIG. It is the figure which looked at the imaging device of FIG. 6 seeing in the arrow VIII direction. It is sectional drawing of the imaging device in the IX-IX line of FIG. It is sectional drawing which shows the imaging device of Embodiment 3 to which this invention is applied. It is a top view which shows the image pick-up element package with which the imaging device of FIG. 10 is equipped. It is sectional drawing which shows the imaging device of FIG. It is sectional drawing which shows the conventional imaging device.

Explanation of symbols

100, 200, 300, 400, 500 Imaging device 1a Imaging lens 3 Imaging element 4, 404 Lens drive unit 4c Piezoelectric element connection terminal (external connection terminal)
6, 206, 306, 406 Case body (housing)
a1 Concave part (adhesive storage part)
61a Image sensor mounting part 61c, 461c Drive part mounting part 62a Notch (part)
8 External connection terminal 205 Guide shaft (rotation restricting portion)
311 Photointerrupter 311a Photointerrupter connection terminal (external connection terminal)
361e Position detection member mounting portion T Mobile phone (electronic device)
10d Housing holding part F1 Imaging device connection terminal

Claims (8)

An imaging lens that forms an optical image of the subject;
An image sensor that converts an optical image formed by the imaging lens into an electrical signal;
A housing formed by resin molding so as to have an imaging device mounting portion to which the imaging device is mounted and a driving unit mounting portion to which a lens driving unit that moves the imaging lens in the optical axis direction;
An imaging apparatus comprising: An imaging lens that forms an optical image of the subject;
An image sensor that converts an optical image formed by the imaging lens into an electrical signal;
A housing formed by resin molding so as to have an image sensor mounting portion to which the image sensor is mounted and a rotation restricting portion for restricting the rotation of the imaging lens around the optical axis direction;
An imaging apparatus comprising: An imaging lens movable in the optical axis direction for forming an optical image of a subject;
An image sensor that converts an optical image formed by the imaging lens into an electrical signal;
A housing formed by resin molding so as to have an image sensor mounting portion to which the image sensor is mounted and a position detection member mounting portion to which a position detection member for detecting the position of the imaging lens in the optical axis direction is mounted;
An imaging apparatus comprising: The image sensor is bonded to the image sensor mounting portion with an adhesive,
The imaging device according to any one of claims 1 to 3, wherein the imaging element mounting portion is provided with an adhesive reservoir for storing the adhesive. It has an external connection terminal that is electrically connected to an external connection terminal,
The imaging apparatus according to claim 1, wherein the external connection terminal and the housing are integrally formed.   An electronic apparatus comprising the imaging apparatus according to claim 1 in an apparatus main body.   The electronic device according to claim 6, further comprising a housing holding portion that engages with a part of an outer surface of the housing and detachably holds the housing. The housing holding unit includes an imaging device connection terminal for electrical connection with the imaging device,
The imaging device is provided so as to be exposed from the outer surface of the housing, and includes an external connection terminal for electrically connecting to the imaging device connection terminal,
8. The imaging apparatus connection terminal and the external connection terminal are configured to be electrically connected by holding the casing in the casing holding section. The electronic device as described in.

Images