JP2006294722A - Electronic component and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component which has good electric characteristics even if it cannot be treated at a high temperature. <P>SOLUTION: The electronic component comprises terminal electrodes 103 formed in a necessary shape by a conductive paste on the element assembly of the component, the conductive portions 102 of the element assembly of the electronic component which are not covered by the terminal electrodes, and plating 104 which covers the terminal electrodes and the conductive portions of the element assembly. Since the plating 104 and the conductive portions 102 of the element assembly of the component are in direct contact, the electronic component becomes not affected by the electric properties of the conductive paste. Even if the element assembly of the electronic component cannot be treated at a high temperature, the electronic component with the terminals which have good and stable electric characteristics can be fabricated by using a resin curing conductive paste. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a small-sized electronic component for surface mounting and a manufacturing method thereof.

  The conventional terminal structure of electronic components for small surface mounting is made of a conductive paste such as silver paste that covers the conductive part on the electronic component body and forms a terminal electrode. In addition, a plating layer is formed to ensure solder wettability. FIG. 3 shows a terminal structure of a conventional electronic component.

  In FIG. 3, a terminal electrode 103 is formed on the electronic component element body 101 with a conductive paste so as to cover the conductive portion 102 on the electronic component element body, and a plating layer 104 is formed on the terminal electrode. Configured terminals.

As prior art document information related to the invention of this application, for example, Patent Document 1 is known.
JP 2003-303734 A

  However, the conventional configuration has the following problems in forming terminals using the respective conductive pastes.

  There are roughly two types of conductive pastes used for forming terminal electrodes.

  One is a sintered type in which after application and temporary drying, firing is performed at a high temperature of about 700 ° C. to 900 ° C. to sinter the metal particles to ensure shape retention and conduction.

  Another type is a resin-curing type in which the resin contained in the paste is cured and shrunk at a relatively low temperature of about 100 ° C. to 200 ° C. to ensure shape retention and conduction.

  When a sintered type conductive paste is used, the electrical characteristics such as resistance value are good, but since the processing temperature is high, the types of electronic components that can be used and the process are limited.

  When a resin-cured conductive paste is used, the processing temperature is low and it can be used for almost all electronic component bodies, but there are problems in electrical characteristics such as resistance. Resin-curing type conductive paste uses resin as a binder to bring metal powders into contact with each other to obtain electrical continuity. Therefore, the resistance value increases due to contact resistance, or deformation or cracks occur in the resin that is the binder due to external force. This is because the contact state between the metal powders changes and the resistance value fluctuates.

  An object of the present invention is to solve the above-described conventional problems and to provide a terminal of an electronic component having good electrical characteristics even for an electronic component that cannot be processed at high temperatures.

  In order to solve the conventional problem, a terminal structure of an electronic component according to claim 1 of the present invention includes a terminal electrode formed in a necessary shape with a conductive paste on an electronic component element body, and the terminal electrode. A conductive portion of the electronic component body that is not covered with, and plating that covers the terminal electrode and the conductive portion of the electronic component body, and the conductive portion of the electronic component body is not provided with a conductive paste. The terminal electrode surface is plated and electrically conductive.

  This configuration realizes terminals with good electrical characteristics that are not affected by the characteristics of the conductive paste, even when a resin-cured paste is used as the conductive paste for an electronic component element that cannot be processed at high temperatures. Can do.

  According to a second aspect of the present invention, there is provided a method of manufacturing an electronic component, comprising: applying a conductive paste on an electronic component element body to form a terminal electrode; The conductive paste is removed by pressing against the part of the substrate to expose all or part of the conductive part on the electronic component body, and then the conductive paste is cured, and the terminal electrode and the conductive part are plated. Accordingly, it is possible to realize an electronic component having good electrical characteristics that are not influenced by the conductive paste characteristics.

  According to the electronic component of the present invention and the manufacturing method thereof, good and stable electrical characteristics can be obtained while using a resin-cured conductive paste even for an electronic component element that cannot be processed at high temperatures. An electronic component having a terminal can be realized.

  The best mode for carrying out the present invention will be described below with reference to the drawings.

(Embodiment 1)
1 is a cross-sectional view of a terminal structure of an electronic component according to Embodiment 1 of the present invention. In FIG. 1, the same components as those in FIG.

  In FIG. 1, the conductive portion 102 on the electronic component body 101 is not completely covered by the terminal electrode 103 made of a conductive paste, and a part thereof is in direct contact with the plating 104.

  According to such a configuration, the conductive part 102 on the electronic component body is not affected by the electrical characteristics of the conductive paste by directly contacting the plating 104, and even an electronic component that cannot be processed at a high temperature, A terminal structure having good and stable electrical characteristics can be obtained while using a resin-cured conductive paste.

  FIG. 2 illustrates a method for forming the terminal shape according to the first embodiment of the present invention. 2, the same components as those in FIGS. 1 and 3 are denoted by the same reference numerals, and the description thereof is omitted.

  In FIG. 2, FIG. 2A shows a state in which a terminal electrode 103 made of a conductive paste is applied on the electronic component body 101. At this time, the conductive portion 102 on the electronic component body is covered with the terminal electrode 103.

  FIG. 2B shows a state in which the jig 201 is pressed against the electronic component.

  FIG. 2C shows a state in which the pressed jig 201 is released. At this time, a part 202 of the conductive paste of the terminal electrode 103 is transferred onto the jig 201, and the conductive portion 102 on the electronic component body is exposed. At this time, a better result can be obtained if the material of the jig 201 is an elastic body and has an appropriate adhesiveness on the surface. In this state, the terminal electrode 103 made of a conductive paste is cured.

  FIG. 2D shows a state in which the terminal electrode is plated.

  According to such a construction method, the conductive portion 102 on the electronic component body is in direct contact with the plating layer 104, so that the resin-cured conductive paste is used even for the electronic component body that cannot be processed at a high temperature. However, an electronic component having a terminal structure with good and stable electrical characteristics can be realized.

  The electronic component and the manufacturing method thereof according to the present invention can form a terminal having good electrical characteristics even for an electronic component element that cannot be processed at high temperatures. Alternatively, it is useful as a terminal structure of an electronic component or the like that requires reliability.

Sectional drawing of the electrode structure in Embodiment 1 of this invention Process drawing for forming Embodiment 1 of the present invention Sectional view of the electrode structure of a conventional electronic component

Explanation of symbols

DESCRIPTION OF SYMBOLS 101 Electronic component body 102 Conductive part on electronic component body 103 Terminal electrode formed with conductive paste 104 Plating layer 201 Jig 202 Conductive paste transferred to jig

Claims (2)

A terminal electrode formed in a necessary shape with a conductive paste on the electronic component body, and a conductive portion of the electronic component body not covered with the terminal electrode;
An electronic component comprising the terminal electrode and plating covering the conductive part of the electronic component element body. After applying the conductive paste on the electronic component body and forming the terminal electrode,
Before the conductive paste is cured, an adhesive jig is pressed against a part of the terminal electrode to remove the conductive paste to expose all or a part of the conductive part on the electronic component body, and then conductive A method of manufacturing an electronic component, comprising: curing a paste and plating the terminal electrode and the conductive portion to form a terminal.

Images