JP2006292955A - Scan exposure method and apparatus - Google Patents

Scan exposure method and apparatus Download PDF

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JP2006292955A
JP2006292955A JP2005112480A JP2005112480A JP2006292955A JP 2006292955 A JP2006292955 A JP 2006292955A JP 2005112480 A JP2005112480 A JP 2005112480A JP 2005112480 A JP2005112480 A JP 2005112480A JP 2006292955 A JP2006292955 A JP 2006292955A
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substrate
exposure
position
mask
direction
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JP4777682B2 (en
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Koichi Kajiyama
Takuro Takeshita
康一 梶山
琢郎 竹下
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Integrated Solutions:Kk
V Technology Co Ltd
株式会社 インテグレイテッド ソリューションズ
株式会社ブイ・テクノロジー
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<P>PROBLEM TO BE SOLVED: To efficiently expose a substrate having a large exposure region to exposure light in a stable state by using a small mask. <P>SOLUTION: A substrate 4 being conveyed in a fixed direction at a constant speed by a substrate conveying means 5 is irradiated with exposure light from a lamp 9 (continuous light source) through an aperture 11a of a mask 11 disposed in an exposure optical system 3 to transfer an image of the aperture 11a onto the substrate 4. In this process, a pixel (reference pattern) 18 preliminarily formed on the substrate 4 is photographed by an imaging means 6; when the photographed pixel 18 is moved from the imaging position F to an exposure start position K, the mask 11 is started to move in the proceeding direction (1) as synchronized with conveyance of the substrate 4, and irradiation of the substrate 4 with exposure light is simultaneously started; when the pixel 18 is moved to an exposure stop position J, irradiation of the substrate 4 with the exposure light is stopped and movement of the mask 11 is simultaneously stopped and returned to the exposure start position K; and these operations are repeated. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、液晶パネル用カラーフィルタ等を製造する際に用いられるスキャン露光方法およびスキャン露光装置に関するものである。 The present invention relates to scanning exposure method and a scanning exposure apparatus used for manufacturing a liquid crystal panel for color filters and the like.

従来、液晶パネル用カラーフィルタの製造において、ブラックマトリックスを形成した基板上に赤(R)、緑(G)、青(B)の着色層を形成するにあたり、基板を載置した基板ステージを露光部に搬送して位置決めし、該露光部において光源部からの露光光を基板の面積より小さいフォトマスクを通して基板上の所定領域に照射して第1回目の露光を行い、次に、前記基板ステージを所定距離だけステップ移動させて基板を露光部に再度位置決めした後に、第1回目に露光できなかった領域に第2回目の露光を行い、これを繰り返して大型の基板上の全面にフォトマスクのパターンを転写するようにした露光方法または露光装置が知られている(例えば、特許文献1、特許文献2参照)。 Conventionally, in the manufacture of color liquid crystal panel filter, red (R) on a substrate formed with the black matrix, green (G), and in forming a colored layer of blue (B), exposing the substrate stage mounted with the substrate and positioned transported to part, the exposure light from the light source unit performs the first exposure is irradiated on a predetermined region on the substrate through a small photomask than the area of ​​the substrate in the exposure section, then the substrate stage the after positioning only again exposed portion of the substrate by step movement a predetermined distance, a region that can not be exposed to the first-time exposure is performed for the second time, the entire surface of the photo mask on a large substrate by repeating this exposure method or the exposure apparatus so as to transfer the pattern are known (e.g., refer to Patent Document 1, Patent Document 2).
また、ロールに巻かれたシート状基材(基板)を露光部に繰り出して位置決めし、該露光部において光源部からの露光光を単位基板に相当する大きさのフォトマスクを通してシート状基材上の所定領域に照射してフォトマスクのパターンを転写し、次いで、前記シート状基材を単位基板の相当分だけ前記露光部に繰り出して位置決めし、同様な露光操作を繰り返すことにより、順次、シート状基材の長手方向にフォトマスクのパターンを転写していくようにした露光方法または露光装置が知られている(例えば、特許文献3、特許文献4参照)。 The sheet-like substrate wound in a roll and positioned feeding (substrate) in the exposure section, the sheet-like base material on through the size of the photomask corresponding to exposure light unit substrate from the light source unit in the exposure unit of by irradiating a predetermined region to transfer the pattern of the photomask, then, the base material sheet by an amount corresponding unit substrate feeding to the exposure portion positioned, by repeating a similar exposure operation, sequentially, the sheet the exposure method or exposure apparatus longitudinally and to continue to transfer the pattern of the photomask Jomotozai are known (e.g., Patent Document 3, Patent Document 4).
特開平9−127702号公報 JP-9-127702 discloses 特開2000−347020号公報 JP 2000-347020 JP 特開2004−341280号公報 JP 2004-341280 JP 特開2001−264999号公報 JP 2001-264999 JP

しかし、前記露光方法または露光装置においては、前記基板(基材)の所定領域に対する露光が終了すると、一旦露光操作を終了してフォトマスクを基板(基材)に対して相対的にステップ移動させて、再度基板(基材)とフォトマスクとを位置合わせする操作を間欠的に繰り返す必要があるので、露光操作に時間が長くかかり、露光作業を効率的に行えない問題がある。 However, in the exposure method or the exposure apparatus, the exposure to a given region of the substrate (base material) is completed, relatively moved stepwise relative to the substrate (base material) The photomask is once stopped the exposure operation Te, it is necessary to intermittently repeat the operation for aligning the photomask to the substrate again (base material), time exposure operation takes a long, there is a problem that can not be performed exposure work efficiently. また、フォトマスクの大きさを自重による撓みを防止する観点からより小さくすると、大型の基板に対して露光操作を繰り返す回数が多くなり、その分露光時間が長くなり、前記問題が一層顕著となる。 Further, when less than from the viewpoint of preventing a deflection due to its own weight the size of the photomask, the number of times to repeat the exposure operation on a large substrate, correspondingly exposure time increases, the problem becomes more pronounced .
また、前記露光操作の繰り返し回数を減らすため、比較的大きなフォトマスクを使用した場合には、露光光に大きなエネルギーを必要とするので、光源部のパワーの限界から露光光の照射時間を長くしなけらばならず、結果的に露光時間を短縮することができない問題がある。 In order to reduce the number of repetitions of the exposure operation, when using a relatively large photomask, because it requires a large energy in the exposure light, a longer irradiation time of the exposure light from the power limit of a light source unit such must kicked, resulting in a problem that it is impossible to shorten the exposure time.
さらに、前記露光部において前記基板(基材)とフォトマスクの位置合わせを行うために、予め、前記基板(基材)とフォトマスクの双方にパターンとは別にアライメントマークを形成しておく必要があり、前記基板(基材)やフォトマスクの製造工程が煩雑となる問題がある。 Furthermore, in order to perform the alignment of the substrate (base material) and a photomask in the exposure unit, in advance, the substrate (base material) and is necessary to form a separate alignment mark pattern in both the photomask There, the substrate (base material) and photomask manufacturing process there is a problem that complicated.

本発明は、上記事情に鑑みてなされたものであって、小さなマスクを使用して広い露光領域を有する基板を、露光光を安定した状態で照射して効率的に露光することができる露光方法および露光装置を提供することを目的とする。 The present invention was made in view of the above circumstances, a substrate having a broad exposure area using a small mask is irradiated with exposure light in a stable state can be efficiently exposed exposure method Another object of the invention is to provide an exposure apparatus.

本発明は、前記課題を解決するために、以下の点を特徴としている。 The present invention, in order to solve the above problems, is characterized in the following points.
すなわち、請求項1に係るスキャン露光方法は、基板搬送手段によって一定速度で一定方向に搬送されている状態の基板に対して、露光部で連続光源からの露光光を露光光学系の光路上に設けたマスクの開口部を通して照射し、前記基板上に前記開口部の像を転写するスキャン露光方法において、 That is, the scanning exposure method according to claim 1, to the substrate in the state by the substrate transfer means being conveyed in a predetermined direction at a constant speed, the exposure light from the continuous light source into the optical path of the exposure optical system in the exposure unit in scanning exposure method irradiating through an opening of the provided mask to transfer an image of the opening portion on the substrate,
前記基板に予め形成された基準パターンを撮像手段で撮像し、この撮像された基準パターンが撮像位置から露光開始位置に移動した時に、前記マスクを基板の搬送に同期させて基板の進行方向へ前進移動を開始させると共に前記露光光の基板への照射を開始させ、前記基準パターンが露光停止位置に移動した時に、露光光の基板への照射を停止させると共にマスクの前進移動を停止させて前記露光開始位置に戻し、この動作を繰り返すことにより、前記基板の搬送方向に直角な方向に沿った露光予定領域を順次露光することを特徴としている。 The preformed reference pattern on the substrate and imaged by the imaging means, when the imaged reference pattern is moved to the exposure start position from the imaging position, advancing said mask in synchronization with the transportation of the substrate to the traveling direction of the substrate move to start irradiation of the substrate of the exposure light with to start, when the reference pattern is moved to the exposure stop position, the exposure to irradiation of the substrate as the exposure light to stop the forward movement of the mask with stops return to the starting position, by repeating this operation, it is characterized by sequentially exposing the expected exposure area along the direction perpendicular to the conveying direction of the substrate.

請求項2に係るスキャン露光装置は、基板を一定速度で一定方向に搬送する基板搬送手段と、該基板搬送手段によって搬送されている状態の基板に対して、露光部で連続光源からの露光光を光路上に設けたマスクの開口部を通して照射して前記開口部の像を基板上に転写する露光光学系とを設けたスキャン露光装置であって、 Scanning exposure apparatus according to claim 2, and a substrate conveying means for conveying in a certain direction of the substrate at a constant speed, with respect to the substrate in a state of being transported by the substrate transport means, the exposure light from the continuous light source in the exposure unit a scanning exposure apparatus provided with an exposure optical system for transferring onto a substrate an image of the opening portion is irradiated through the opening in the mask provided on the optical path, and
前記基板に予め形成された基準パターンを基板の移動中に撮像する撮像手段と、該撮像手段で撮像された基準パターンが撮像位置から露光開始位置に移動された時に、前記マスクを基板の搬送に同期させて基板の進行方向へ前進移動を開始させると共に前記露光光の基板への照射を開始させ、前記基準パターンが露光停止位置に移動した時に、露光光の基板への照射を停止させると共にマスクの前進移動を停止させて前記露光開始位置に戻すように制御する制御装置とを備えていることを特徴としている。 Imaging means for imaging a preformed reference pattern on the substrate during movement of the substrate, when the imaged reference pattern is moved to the exposure start position from the imaging position in the imaging means, the mask for transporting the substrate is synchronized to start irradiation of the substrate of the exposure light with starting the forward movement to the traveling direction of the substrate, when the reference pattern is moved to the exposure stop position, the mask stops the irradiation of the substrate as the exposure light it is characterized in that a forward movement is stopped and the control apparatus for controlling back to the exposure start position.

請求項3に係るスキャン露光装置は、請求項2に記載のスキャン露光装置において、前記制御装置が、前記撮像手段で撮像された基準パターンのパターンエッジの画像にもとづき基板上の搬送方向とこれに直角な方向における基準位置を検出し、前記撮像された基準パターンが前記露光開始位置に移動された時に、前記搬送方向に直角な方向における基準位置にもとづいて前記マスクの搬送方向に直角な方向における位置調節を行うことを特徴としている。 Scanning exposure apparatus according to claim 3 is the scanning exposure apparatus according to claim 2, wherein the control device, and in which the conveying direction of the substrate based on the image of the pattern edge of the imaged reference pattern by the imaging means detecting the reference position in the perpendicular direction when the captured reference pattern is moved to the exposure start position, in a direction perpendicular to the conveying direction of the mask based on the reference position in the direction perpendicular to the transport direction It is characterized by performing the position adjustment.

請求項4に係るスキャン露光装置は、請求項2に記載のスキャン露光装置において、前記制御装置が、前記撮像手段で撮像された基準パターンのパターンエッジの画像にもとづき基板上の搬送方向とこれに直角な方向とにおける基準位置を検出し、前記撮像された基準パターンが前記露光開始位置に移動された時に、前記各基準位置の検出によって求めた基板の搬送方向に対する傾き角にもとづいて前記マスクの前記露光光学系の光路に垂直な平面内における旋回角の位置調節を行うことを特徴としている。 Scanning exposure apparatus according to claim 4 is the scanning exposure apparatus according to claim 2, wherein the control device, and in which the conveying direction of the substrate based on the image of the pattern edge of the imaged reference pattern by the imaging means detecting the reference position in the perpendicular direction when the captured reference pattern is moved to the exposure start position, the mask based on the inclination angle with respect to the transport direction of the substrate in which the determined by the detection of the reference position It is characterized by performing the position adjustment of the swivel angle in a plane perpendicular to the optical path of the exposure optical system.

請求項5に係るスキャン露光装置は、請求項4に記載のスキャン露光装置において、前記制御装置が、前記基板上の搬送方向に直角な方向における基準位置にもとづいて前記マスクの搬送方向に直角な方向における位置調節を行うことを特徴としている。 Scanning exposure apparatus according to claim 5, in the scanning exposure apparatus according to claim 4, wherein the control device is perpendicular to the conveying direction of the mask based on the reference position in the direction perpendicular to the conveying direction on the substrate It is characterized by performing the position adjustment in the direction.

本発明によれば、以下の優れた効果を奏する。 The present invention exhibits the following excellent effects.
請求項1に係るスキャン露光方法および請求項2に係るスキャン露光装置によれば、基板搬送手段によって基板を搬送しながらマスクの開口部の形状を連続的に転写して露光を行うことができるので、小さなマスクを使用する場合であっても、基板の間欠的なステップ移動による露光をする必要がなく、広い露光領域を有する基板に対する露光を効率的に行うことできる。 According to the scanning exposure apparatus according to the scanning exposure method and claim 2 according to claim 1, the shape of the opening of the mask while transporting the substrate by the substrate transfer means continuously transferred and can be exposed , even when using a small mask, it is not necessary to exposure by intermittent step movement of the substrate, it can be performed with exposure of the substrate having a wide exposure region efficiently.
また、基板に形成された基準パターンが露光開始位置に達すると、該露光開始位置から露光停止位置までマスクが基板と同期して移動され、この間に連続光源からの露光光がマスクの開口部を通して基板に照射されるので、基板に対して適切な露光時間を確保して安定した露光を行うことができる。 Moreover, the reference pattern formed on the substrate reaches the exposure starting position, is moved mask in synchronism with the substrate from the exposure start position to the exposure stop position, through the aperture exposure light mask from the continuous light source during this period since the irradiated on the substrate, it is possible to perform stable exposure to ensure adequate exposure time for the substrate.

請求項3に係るスキャン露光装置によれば、基板の搬送方向に直角な方向における位置ずれに合わせて、マスクの基板搬送方向に直角な方向における位置調節を確実に行うことができるので、露光中、基板が搬送方向に対して直角な方向に位置ずれを起こしても、その位置ずれに関わりなく、所定の露光予定領域の露光を正確に行うことができる。 According to the scanning exposure apparatus according to claim 3, in accordance with the positional deviation in the direction perpendicular to the conveying direction of the substrate, since the position adjustment in the direction perpendicular to the substrate conveying direction of the mask can be reliably performed, during exposure , even substrate misaligned in a direction perpendicular to the conveying direction, regardless of its positional deviation, it is possible to accurately perform the exposure of a predetermined exposure region where.
また、予め基板に形成された基準パターンを利用して基板の基準位置を検出して、該基準位置にもとづいて前記マスクの位置調節をすることができるので、前記マスクの位置調節のために、従来のように基板やマスクにアライメントマークを形成する必要がなく、それらの製造が容易である。 Further, by detecting the reference position of the substrate by using a reference pattern formed in advance substrate, it is possible on the basis of the reference position to the position adjustment of the mask, for position adjustment of the mask, conventionally it is not necessary to form the alignment marks on the substrate or the mask as, it is easy to their preparation.

請求項4に係るスキャン露光装置によれば、基板の搬送方向に対する傾き角に合わせて、マスクの旋回角の位置調節を確実に行うことができるので、露光中、基板が搬送方向に対して傾いた状態で移動することがあっても、その傾きに関わりなく、所定の露光予定領域の露光を正確に行うことができる。 According to the scanning exposure apparatus according to claim 4, in accordance with the inclination angle with respect to the transport direction of the substrate, since the position adjustment of the turning angle of the mask can be reliably performed during exposure, the substrate is inclined with respect to the transport direction even it is moved in a state, regardless of the inclination can be performed accurately exposure of predetermined expected exposure area. また、請求項3に係るスキャン露光装置と同様に前記マスクの位置調節のために、基板やマスクにアライメントマークを形成する必要がなく、それらの製造が容易である。 Also, for position adjustment of the mask like the scanning exposure apparatus according to claim 3, there is no need to form an alignment mark on the substrate or the mask, it is easy to their preparation.

請求項5に係るスキャン露光装置によれば、基板の搬送方向に直角な方向における位置ずれと基板の搬送方向に対する傾き角に合わせて、マスクの基板搬送方向に直角な方向における位置と旋回角の位置調節をそれぞれ確実に行うことができるので、露光中、基板の搬送状態における位置変化に関わりなく、所定の露光予定領域の露光を一層正確に行うことができる。 According to the scanning exposure apparatus according to claim 5, in accordance with the tilt angle with respect to the position deviation and the transport direction of the substrate in the direction perpendicular to the conveying direction of the substrate, the position and the turning angle in the direction perpendicular to the substrate conveying direction of the mask since it is possible to perform positional adjustment for reliably respectively, during the exposure, regardless of the position change in the conveyance state of the substrate, the exposure of a predetermined exposure region where it is possible to perform more accurately.

以下、本発明の一実施の形態に係るスキャン露光装置について、図1、図2を参照して説明する。 DESCRIPTION scanning exposure apparatus according to an embodiment of the present invention will be described with reference to FIGS.
図1において、1は本発明の一実施の形態に係るスキャン露光装置を示す。 In Figure 1, 1 denotes a scanning exposure apparatus according to an embodiment of the present invention. このスキャン露光装置1は、露光ステーション(露光部)2に設置された露光光学系3と、該露光光学系3の下方において露光対象である基板4を搬送する基板搬送手段5と、前記基板4上の特定部位を撮像するの撮像手段6と、前記露光ステーション2において前記基板4を下方から照明する画像認識用光源7と、前記各装置部と接続されてそれらを制御する制御装置8とを備え、前記露光光学系3からの露光光を露光光学系3に設けた後述のマスク11の開口部11aを通して前記基板4に照射して、前記開口部11aの形状にもとづくパターンを前記基板4上に転写するようになっている。 The scanning exposure apparatus 1 includes an exposure station (exposure unit) 2 exposure optical system 3 installed in a substrate conveying means 5 for conveying the substrate 4 is exposed is below the said exposure optical system 3, the substrate 4 and imaging means 6 for imaging a specific part of the upper, the image recognition light source 7 which illuminates the substrate 4 from below in the exposure station 2, and a control unit 8 for controlling them are connected to the respective device portions wherein the exposure light from the exposure optical system 3 is irradiated on the substrate 4 through the opening 11a of the later of the mask 11 provided in the exposure optical system 3, a pattern based on the shape of the opening 11a the substrate 4 on It is adapted to transfer to.

前記露光光学系3は、超高圧水銀灯等からなるランプ(連続光源)9と、該ランプ9の下方に設置されランプ9からの露光光を下方に向けて平行に投光する照明用レンズ10と、該照明用レンズ10の下方に設置されたマスク11と、前記ランプ9と照明用レンズ10との間に設置されたシャッター12とを備え、その光軸(光路)Sは鉛直方向に設定され、前記マスク11が光軸Sに垂直な水平面内に位置されている。 The exposure optical system 3 includes a lamp (continuous light source) 9 made of ultra-high pressure mercury lamp or the like, an illumination lens 10 for projecting parallel toward the exposure light from the lamp 9 is disposed below the lamp 9 under , a mask 11 placed below the illumination lens 10, and a shutter 12 disposed between the illumination lens 10 and the lamp 9, the optical axis (optical path) S is set to the vertical direction the mask 11 is positioned perpendicular in a horizontal plane to the optical axis S. 前記ランプ9は一旦点灯すると消灯が指令されるまで連続的に露光光を照射し続けるものである。 The lamp 9 is intended to continue to irradiate continuously exposing light until command is turned off once turned.
また、前記マスク11は、図1において紙面に垂直なY軸方向(図2で左右方向)yに長辺を有し、Y軸方向yに直角なX軸方向(図1で左右方向、図2で上下方向)xに短辺を有する矩形状の平板からなり、Y軸方向yに沿って細長い矩形状の開口部11aが板面を貫通して設けられている。 Further, the mask 11 has a long side in y (horizontal direction in FIG. 2) Y-axis direction perpendicular to the paper surface in FIG. 1, the Y-axis perpendicular X-axis direction in the direction y (horizontal direction in FIG. 1, FIG. 2 consists rectangular flat plate having a short side in the vertical direction) x, elongated rectangular opening 11a along the Y axis direction y is provided through the plate surface.
なお、前記開口部11aのX軸方向xにおける幅Dは、例えば、基板4のピクセル18(後述)のX軸方向xにおける幅dよりやや大きく設定されており、マスク11の大きさは、前記開口部11aの大きさを設けるに必要かつ十分な面積があればよく、X軸方向xにおける幅が基板4のX軸方向xにおける長に比べて十分に小さなものとされ、Y軸方向yの長さが基板4のY軸方向yの幅より大きく設定されている(図2参照)。 The width D in the X-axis direction x of the opening 11a, for example, is slightly larger than the width d in the X-axis direction x of the substrate 4 pixels 18 (described later), the size of the mask 11, the may, if necessary and sufficient area to provide the size of the opening 11a, the width in the X axis direction x is small enough so than the length in the X axis direction x of the substrate 4, the Y axis direction y It is set larger than the width in the Y axis direction y of the substrate 4 length (see FIG. 2).

また、前記マスク11は、前記露光光学系3の光軸Sに垂直に設置されたマスクステージ13の上面に支持されており、前記マスクステージ13は、サーボモータ、リニアモータや所要の伝動機構等を有するマスク駆動手段14によって前記光軸Sに垂直な水平面内における前記マスク11のX軸方向xとY軸方向yへの移動、位置調節およびマスク11の中央を中心とする軸回りの旋回角の位置調節とを行うことができるようになっている。 Further, the mask 11, the is supported on the upper surface of the mask stage 13 installed perpendicular to the optical axis S of the exposure optical system 3, the mask stage 13, a servo motor, a linear motor and a required transmission mechanism, etc. X-axis direction x and the movement in the Y axis direction y, the turning angle of the axis about a central position adjustment and the mask 11 of the mask 11 in the perpendicular horizontal plane to the optical axis S by the mask driving unit 14 having a It has positional adjustment and to be able to perform. 前記マスク駆動手段14には、前記マスクステージ13のX,Y軸方向x,yへの移動位置と旋回角度を検出するエンコーダ、リニアセンサー等の位置センサーと角度センサー(いずれも図示せず)が設けられ、該位置センサーと角度センサーの検出値にもとづいて前記マスク駆動手段14の動作が前記制御装置8によってフィードバック制御されるようになっている。 The mask drive unit 14, X of the mask stage 13, Y-axis direction x, an encoder for detecting a moving position and the turning angle to the y, the position sensor and the angle sensor such as a linear sensor (both not shown) provided, the operation of the mask drive unit 14 based on the detected value of the position sensor and the angle sensor are fed back controlled by the control unit 8.

また、前記シャッター12は、例えば、Y軸方向yに沿って配置した一対のスリット板12a,12aを対向させ、それらの対向縁間に形成されるスリット12bを通して前記ランプ9からの露光光を前記レンズ10側に照射するもので、シャッター開閉手段12cによって一対のスリット板12a,12aをX軸方向xに動かして前記スリット12bを開閉するようになている。 Further, the shutter 12 is, for example, Y axes of a pair disposed along a direction y slit plate 12a, and 12a are opposed, the exposure light from the lamp 9 through the slit 12b formed between their opposed edges one that irradiates the lens 10 side, and such as to open and close the slit 12b by moving a pair of the slit plate 12a, and 12a in the X axis direction x by the shutter opening and closing means 12c.
前記基板搬送手段5は、前記露光ステーション2において前記露光光学系3の光軸Sに垂直な水平面に沿って配置され、前記基板4を水平面に平行に載置する基板ステージ15と、該基板ステージ15をX、Y軸方向x,yに沿って移動させるサーボモータ、リニアモータや所要の伝動機構等を有する基板駆動手段16とを備えている。 The substrate transfer unit 5, the disposed along the perpendicular horizontal plane to the optical axis S of the exposure optical system 3 in the exposure station 2, a substrate stage 15 in parallel to mounting the substrate 4 in the horizontal plane, the substrate stage 15 X, Y axis direction x, and a substrate drive unit 16 having a servo motor for moving along the y, a linear motor and a required transmission mechanism, and the like. 前記基板駆動手段16には、前記基板4(基板ステージ15)のX、Y軸方向x,yへの移動位置を検出するエンコーダ、リニアセンサー等の位置センサー(図示せず)が設けられ、該位置センサーの検出値にもとづいて基板駆動手段16の動作が前記制御装置8によってフィードバック制御されるようになっている。 Wherein the substrate drive means 16, X of the substrate 4 (the substrate stage 15), Y-axis direction x, an encoder for detecting the moving position of the y, the position sensor (not shown) such as a linear sensor is provided, the based on the detected value of the position sensor so that the operation of the substrate driving means 16 is feedback controlled by the control unit 8.

なお、前記基板ステージ15は、その下方から前記画像認識用照明7の照明光を遮らないように枠型構造をしており、前記基板4をその周辺部で支持するようになっている。 Incidentally, the substrate stage 15 is made has a frame structure so as not to block the illumination light of the image recognition illumination 7 from below, the substrate 4 so as to support at its periphery.
前記基板4は、例えば、カラーフィルタ基板であって、図2(a)に示すように、ブラックマトリックスBMの中に基板4の搬送方向(X軸方向x)に直角なY軸方向yに直線状に複数整列した各着色層(赤R、緑G、青B)用の矩形状の開口であるピクセル(基準パターン)18を、X軸方向xに順に複数列配置して形成したものであり、前記露光ステーション2において表面が前記露光光学系3の光軸Sに垂直な水平面に沿って移動するようになっている。 The substrate 4 is, for example, a color filter substrate, as shown in FIG. 2 (a), straight line perpendicular Y axis direction y in the conveying direction of the substrate 4 (X-axis direction x) in the black matrix BM the colored layers in which a plurality of aligned Jo (red R, green G, blue B) is a rectangular opening pixels (reference pattern) 18 for, which is formed by a plurality of rows arranged in this order in the X axis direction x the surface in the exposure station 2 is adapted to move along a perpendicular horizontal plane to the optical axis S of the exposure optical system 3.
前記撮像手段6は、前記画像認識用照明7に対向して前記露光光学系3の内部において前記照明用レンズ10と前記マスク11との間に配置したハーフミラー19と、該ハーフミラー19によって反射された画像を撮像するリニアCCD20とを備えている。 The imaging unit 6 includes a half mirror 19 arranged between the illumination lens 10 in the interior of the exposure optical system 3 so as to face the image recognition illumination 7 and the mask 11, reflected by the half mirror 19 and a linear CCD20 for capturing an image.

前記リニアCCD20は、例えば、受光素子20aをY軸方向yに一直線状に前記基板4の幅(Y軸方向yの寸法)より大きい長さにわたって配列してなるものである。 The linear CCD20 are, for example, those formed by arranging across the width (Y-axis dimension of the direction y) greater than the length of the light receiving elements 20a Y axis direction y linearly on the substrate 4. 前記ハーフミラー19の光軸S1の位置(撮像位置)Fは、前記露光光学系3の光軸Sの位置(露光中心位置)Eから基板4の進行方向イに対して後側(図1で右側、図2下側)へ予め所定距離Lだけ離されて設定されており、前記リニアCCD20で前記基板4のピクセル18の前方エッジ(パターンエッジ)18e1(基板4の進行方向イにおける前方の縁部)を前記画像認識用照明7の照明光を介して撮像してから、所定時間経過後に、ピクセル18が前記マスク11の開口部11aのX軸方向xにおける中央位置(露光中心位置)Eに到達するようになっている。 Position (imaging position) F of the optical axis S1 of the half mirror 19, at the rear (FIG. 1 with respect to the traveling direction b of the substrate 4 from the position of the optical axis S of the exposure optical system 3 (exposure center position) E right, Figure are set been previously predetermined distance L apart to 2 lower), the front edge (pattern edge of the substrate 4 pixels 18 in the linear CCD 20) 18e1 (front edge in the moving direction b of the substrate 4 the parts) was imaged through the illumination light of the image recognition lighting 7, after a predetermined time elapses, the center position (exposure center position) E in the X axis direction x of the pixel 18 is the opening 11a of the mask 11 It is adapted to reach. さらに、前記リニアCCD20は、前記基板4のピクセル18のY軸方向yにおける側方エッジ(パターンエッジ)18e2を撮像するようになっている。 Furthermore, the linear CCD20 is adapted to image the lateral edges (pattern edge) 18E2 in the Y-axis direction y of the substrate 4 pixels 18.

前記制御装置8は、装置全体の動作を制御するものであり、前記リニアCCD20で前記基板4のピクセル18の前方エッジ18e1と側方エッジ18e2を撮像して得た画像データにもとづいて基板4のX軸方向xとY軸方向yにおける基準位置を検出する画像処理部21と、基板4のブラックマトリックスBMの設計データや前記基準位置に関するデータ等のデータ、装置全体の動作プログラム等を記憶する記憶部22と、前記撮像位置Fと露光中心位置Eとの間の距離Lと基板4の搬送速度とからピクセル18の前方エッジ18e1の位置が撮像位置Fから露光中心位置E、その距離hだけ手前の露光開始位置K、露光中心位置Eの後方の露光停止位置Jまでそれぞれ移動する時間を演算したり、前記画像処理部21で検出された前記 The control device 8 is for controlling the operation of the entire apparatus, the substrate 4 on the basis of the image data obtained by imaging the front edge 18e1 and side edge 18e2 of the substrate 4 pixels 18 in the linear CCD20 an image processing unit 21 for detecting the reference position in the X-axis direction x and the Y-axis direction y, the data of the data concerning the design data and the reference position of the black matrix BM of the substrate 4, a storage for storing an operation program of the entire system and parts 22, the imaging position F and the exposure center position E and the distance L and position the exposure center position E from the imaging position F of the front edge 18e1 of the conveying speed from the pixels 18 of the substrate 4 during, before only the distance h exposure start position K of, or calculates the time to move each to the rear of the exposure stop position J of the exposure center position E, which is detected by the image processing unit 21 the 方エッジ18e2にもとづく基板4のY軸方向yにおける基準位置(Y軸基準位置)と前記マスク11(開口部11a)のY軸方向yにおける標準位置との位置ずれ(基板4のY軸位置ずれ)や、X,Y軸を含む平面内における基板4の搬送方向(X軸方向x)に対するずれ角(傾斜角)θ等を演算する演算部23と、前記ランプ9を点灯、消灯させるランプ電源部24と、前記前方エッジ18e1にもとづく基板4のX軸方向xにおける基準位置(X軸基準位置)に従って、各ピクセル18が前記露光開始位置Kに達し時に前記シャッター12のスリット12bが開き、各ピクセル18が前記露光停止位置Jに達したときにシャッター12のスリット12bが閉じるように、前記シャッター開閉手段12cによるシャッター12の開閉を制 Reference position in the Y axis direction y of the substrate 4 based on square edge 18E2 (Y-axis reference position) and Y-axis position shift of (substrate 4 with the standard position in the Y axis direction y of the mask 11 (the opening 11a) ) and, X, a calculation unit 23 for calculating a shift angle (inclination angle) theta like for transportation direction of the substrate 4 (X-axis direction x) in a plane including the Y-axis, lights the lamp 9, the lamp power to be turned off and parts 24, according to the reference position in the X axis direction x of the substrate 4 based on the front edge 18e1 (X-axis reference position), opens the slit 12b of the shutter 12 at each pixel 18 reaches the exposure starting position K, the as the slit 12b of the shutter 12 is closed when the pixel 18 has reached the exposure stop position J, control the opening and closing of the shutter 12 by the shutter opening and closing means 12c 御するシャッターコントローラ25と、前記基板駆動手段16を作動させて前記基板ステージ15をX軸方向xに移動させる基板ステージコントローラ26と、前記マスク駆動手段14を作動させて、前記マスクステージ13のY軸方向yにおける位置を調節したり、マスクステージ13の水平面内における旋回角を調節するマスクステージコントローラ27と、前記画像処理部21、記憶部22、演算部23、ランプ電源部24、シャッターコントローラ25、基板ステージコントローラ26およびマスクステージコントローラ27に接続され、それらの動作を統合して制御する主制御部28とを備えている。 And Gosuru shutter controller 25, a substrate stage controller 26 to the actuates the substrate drive means 16 moves the substrate stage 15 in the X-axis direction x, by operating the mask drive unit 14, Y of the mask stage 13 or by adjusting the position in the axial direction y, a mask stage controller 27 to adjust the pivoting angle in the horizontal plane of the mask stage 13, the image processing unit 21, storage unit 22, arithmetic unit 23, the lamp power supply unit 24, the shutter controller 25 , connected to the substrate stage controller 26 and the mask stage controller 27 controls to integrate their operation and a main control unit 28.

次に、上記のように構成されたスキャン露光装置1の作用と共に、本発明の一実施の形態に係るスキャン露光方法について図3、図4を参照しながら説明する。 Next, the structure of action of the scanning exposure apparatus 1 as described above, the scanning exposure method according to an embodiment of the present invention FIG. 3 will be described with reference to FIG.
先ず、前記制御装置8を動作状態としてスキャン露光装置1を作動させると、前記主制御部28の指令で前記画像認識用照明7が点灯されると共に、前記ランプ電源部24の作動でランプ9が点灯されて露光準備状態となる(ステップS1)。 First, when operating the scanning exposure apparatus 1 the control device 8 as the operation state, together with the image recognition illumination 7 by a command of the main control unit 28 is turned on, the lamp 9 by operation of the lamp power supply unit 24 It is turned on the exposure preparation state (step S1). このときは、図3(a)に示すように、前記シャッター12はスリット12bが閉じられており、前記マスクステージ13はマスク11の開口部11aを露光開始位置Kに位置させた状態(開口部11aのX軸方向xにおける中央が露光開始位置Kにあり、開口部11aのY軸方向yの位置が標準位置に位置された状態)で停止されている。 In this case, as shown in FIG. 3 (a), the shutter 12 is slit 12b is closed, the mask stage 13 while being positioned openings 11a of the mask 11 in the exposure start position K (the opening center in the X axis direction x of 11a is located at the exposure start position K, the position of the Y-axis direction y of the opening 11a is stopped in state) located in the standard position. 次いで、主制御部28の指令で前記基板ステージコントローラ26が作動して前記基板搬送手段5の基板駆動手段16が駆動され、前記基板4が基板ステージ15によって露光ステーション2を水平を保った状態として進行方向イへ搬送される(ステップS2)。 Then, the main board drive means 16 of the substrate transfer unit 5 the substrate stage controller 26 is operated by a command of the control unit 28 is driven, in a state where the substrate 4 is kept horizontal to the exposure station 2 by the substrate stage 15 It is conveyed to the traveling direction b (step S2). その間、前記リニアCCD20が、基板4の下側から前記画像認識用照明7によって照射され、前記基板4に形成されたピクセル18を通過した照明光を、前記ハーフミラー19を経て受光することにより、前記ピクセル18の画像データを取得する(ステップS3)。 Meanwhile, by the linear CCD20 is irradiated from the lower side of the substrate 4 by the image recognition illumination 7, the illumination light passing through the pixels 18 formed on the substrate 4, for receiving via the half mirror 19, acquiring image data of the pixel 18 (step S3).

前記リニアCCD20によって得られた画像データは、前記画像処理部21に送られて処理され、Y軸方向yに沿って整列する各ピクセル18の前方エッジ18e1の位置(X軸基準位置)と、X軸方向xに沿って整列する一列の各ピクセル18の側方エッジ18e2の位置(Y軸基準位置)を検出する(ステップS4)。 The resulting image data by linear CCD 20, the image processing unit 21 to which are processed sent, the position of the front edge 18e1 of each pixel 18 aligned along the Y axis direction y and (X-axis reference position), X detecting the position of the lateral edge 18e2 of a row of each pixel 18 aligned along the axial direction x of the (Y-axis reference position) (step S4). 前記基板4の進行方向イにおける最前列(着色層R)のピクセル18aのX軸基準位置とY軸基準位置とが検出されると、前記演算部23が、前記露光ステーション2における露光開始位置Kと前記撮像位置Fとの間の距離(L−h)および露光停止位置Jと撮像位置Fとの間の距離(L+h)と予め設定された基板4の搬送速度とから、前記最前列のピクセル18aの前記露光開始位置Kと露光停止位置Jへの各到達時間をそれぞれ演算すると共に、前記マスク11の開口部11aのY軸方向yにおける標準位置と前記基板4上のY軸基準位置との位置ずれ(基板4のY軸位置ずれ))を演算し、さらに、図2(b)に示すように、Y軸方向yに離れて整列している一対のピクセル18,18のX軸基準位置の変位量tと一対のピクセル1 When the X-axis reference position and the Y-axis reference position of the pixels 18a in the front row (the colored layer R) is detected in the traveling direction b of the substrate 4, the arithmetic unit 23, the exposure start position in the exposure station 2 K the distance between the imaging position F and (L-h) and from the exposure stop position J and the distance (L + h) and a preset transport speed of the substrate 4 between the imaging position F, the front row of pixels 18a the exposure start position K and the arrival time of the exposure stop position J of the well as operation respectively, the Y-axis reference position on the the standard position the substrate 4 in the Y axis direction y of the opening 11a of the mask 11 calculating a positional deviation (Y-axis positional deviation of the substrate 4)), further, as shown in FIG. 2 (b), X-axis reference position of the pair of pixels 18 and 18 are aligned apart in the Y axis direction y the displacement amount t and the pair of pixels 1 ,18間の距離uとから、基板4のX,Y軸を含む平面内におけるX、Y軸からのずれ角(基板4の搬送方向に対する傾斜角)θを演算する(ステップS5)。 , And a distance u between 18 calculates X of the substrate 4, X in the plane including the Y-axis, the deviation angle from the Y axis theta (angle of inclination with respect to the transport direction of the substrate 4) (step S5).

そして、前記主制御部28は、最前列(赤Rの着色層)のピクセル18aのX軸基準位置が検出された時に内蔵のタイマで前記各到達時間を計時しており、露光開始位置Kへの到達時間の計時が終了すると、前記演算部23で演算された基板4のY軸位置ずれと傾斜角θとに応じて、前記マスクステージコントローラ27に指令して前記マスク駆動手段14を作動させるので、前記マスク駆動手段14によって前記マスクステージ13のY軸方向yにおける位置と水平面内(露光光学系3の光軸Sに平行な軸回り)における旋回角が調節されて、マスク11の開口部11aの位置が前記基板4の露光予定領域に正しく合わせられる(ステップS6)。 Then, the main control unit 28 has timed the respective arrival time with the built-in timer when the X-axis reference position of the pixels 18a in the front row (colored layers of red R) is detected, the exposure start position K When measurement of the arrival time is completed, in accordance with the inclination angle θ and the Y-axis positional deviation of the substrate 4 which is computed by the computing unit 23, actuating the mask driving unit 14 instructs the mask stage controller 27 since, the mask drive unit 14 positions and a horizontal plane in the Y axis direction y of the mask stage 13 by pivot angle is adjusted in the (axis parallel to the optical axis S of the exposure optical system 3), the openings of the mask 11 position of 11a is aligned correctly expected exposure area of ​​the substrate 4 (step S6). これと同時に、図3(b)に示すように、前記シャッターコントローラ25が主制御部28の指令を受けてシャッター開閉手段12cを作動させるので、前記シャッター12のスリット12bが開放され(ステップS7)、また、前記マスクコントローラ27が主制御部28の指令を受けて動作し、前記基板ステージコントローラ26による基板駆動手段16の作動に同期させてマスク駆動手段14を作動させるので、前記マスクステージ13(マスク11)が前記基板ステージ15(基板4)と同期して同一の速度で基板4の進行方向イへ移動する。 At the same time, as shown in FIG. 3 (b), the so shutter controller 25 actuates the shutter opening and closing means 12c receives an instruction of the main controller 28, the slit 12b of the shutter 12 is opened (step S7) in addition, the mask controller 27 operates in response to a command from the main controller 28, so actuating the mask driving unit 14 in synchronism with the operation of the substrate driving means 16 by the substrate stage controller 26, the mask stage 13 ( mask 11) is moved synchronously with the substrate stage 15 (substrate 4) to the traveling direction b of the substrate 4 at the same speed.

これにより、前記ランプ9からの露光光が前記照明用レンズ10によって平行光とされ、前記マスク11の開口部11aを通して基板4に照射され、開口部11aの形状が基板4上の所定の露光予定領域29に転写される露光が行われる(ステップS8)。 Thus, into a parallel light by the illumination lens 10 is the exposure light from the lamp 9, is irradiated to the substrate 4 through the opening 11a of the mask 11, a predetermined expected exposure shape on the substrate 4 of the opening 11a exposure is performed to be transferred to the region 29 (step S8).
続いて、前記基板4(マスク11)の進行方向イへの移動が継続され、前記主制御部28によって前記最前列のピクセル18aの露光停止位置Jへの到達時間の計時が終了すると、図3(c)に示すように、前記シャッターコントローラ25が主制御部28の指令を受けてシャッター開閉手段12cを作動させるので、前記シャッター12のスリット12bが閉鎖されて露光が停止される(ステップS9)と共に、前記マスクステージコントローラ27によるマスク駆動手段14の作動で前記マスク11の進行方向イへの移動が停止された後に、マスク11は直ちに後退方向ロへ移動されて元の露光開始位置(待機位置)Kに戻って最前列のピクセル18aに対する露光が終了する。 Then, the substrate 4 is moved to continue the traveling direction Yi (mask 11), wherein the measurement of the arrival time of the exposure stop position J of the front row of the pixel 18a is terminated by the main control unit 28, FIG. 3 (c), the so said shutter controller 25 actuates the shutter opening and closing means 12c receives an instruction of the main control unit 28, exposure slit 12b is closed in the shutter 12 is stopped (step S9) with progress after movement to Lee is stopped, the mask 11 original exposure start position is immediately moved to the retracted direction and Russia (standby position of the mask 11 by operation of the mask drive unit 14 by the mask stage controller 27 ) exposure to the front row of the pixel 18a is completed back to K. そして、図3(d)に示すように、基板4の進行方向イへの移動が継続されて、順次、着色層(赤)Rの各列のピクセル18が撮像位置FでリニアCCD20で撮像されると、前記露光操作が繰り返されて、順次各列の露光予定領域29への露光が行われる。 Then, as shown in FIG. 3 (d), moving in the traveling direction b of the substrate 4 is continued sequentially colored layer (red) each column of pixels of the R 18 is imaged by the linear CCD20 the imaging position F that when the exposure operation is repeated, sequentially exposed to expected exposure region 29 of each row is performed.

前記露光中は、前記基板4が進行方向イに一定速度で継続して搬送され、常に、前記リニアCCD20が各ピクセル18aの前方エッジ18e1と側方エッジ18e2を撮像することによって、基板4のX軸基準位置とY軸基準位置が検出されて、基板4のY軸位置ずれと搬送方向に対する傾斜角θに応じて前記マスク11のY軸方向yにおける位置と旋回角が位置調節されているので、前記マスク11の開口部11aによって基板4の所定の露光予定領域29に正確に露光することができる。 Wherein during exposure, the substrate 4 is transported continuously at a constant speed in the direction of travel b, always by the linear CCD20 is captured forward edge 18e1 and side edge 18e2 of each pixel 18a, X of the substrate 4 axial reference position and the Y-axis reference position is detected, since the turning angle and the position in the Y axis direction y of the mask 11 according to the inclination angle θ with respect to the Y-axis position deviation and the transport direction of the substrate 4 is adjusted position it can be accurately exposed to a predetermined exposure region where 29 of the substrate 4 by the opening 11a of the mask 11.
前記露光が進行して、基板4の進行方向イにおける着色層Rの最後列のピクセル18bのX軸基準位置が検出されると、該最後列のピクセル18bの露光停止位置Jへの到達時間後に、前記マスク11が露光開始位置に戻って停止すると共に基板4の移動が停止され、また、主制御部28からの指令でランプ電源部24の作動でランプ9が消灯され、前記シャッター12がシャッター開閉手段12cの作動で閉鎖され、基板4における着色層Rに対する一連の露光(プロキシ露光)が終了する。 The exposure progresses, the X-axis reference position of the last row of pixels 18b of the colored layer R in the traveling direction b of the substrate 4 is detected, after the arrival time of the exposure stop position J of the outermost rear row of pixels 18b , movement of the substrate 4 together with the mask 11 is stopped back to the exposure starting position is stopped, also the lamp 9 is turned off by operation of the lamp power supply unit 24 by a command from the main control unit 28, the shutter 12 the shutter It closed by operation of the opening and closing means 12c, a series of exposure to the colored layer R at the substrate 4 (proxy exposure) is completed.

前記所定の露光予定領域29は、前記マスク11の開口部11aの短辺方向の幅に見合った幅Dを有し、Y軸方向yに一直線状に整列したカラーフィルタの赤Rの着色層の幅dを有するピクセル18を囲んだ基板4におけるY軸方向yに細長い帯状の領域となる。 Said predetermined expected exposure region 29, the has a width D commensurate with the width in the short side direction of the opening 11a of the mask 11, Y-axis of the color filters aligned in a straight line in the direction y of the colored layers of red R the elongated band-like region in the Y axis direction y in the substrate 4 surrounding the pixel 18 having a width d.
なお、前記基板4のブラックマトリックスBMにおける他の着色層(緑G、青B)における領域に対する露光操作は、個別に設置した他の同様な露光ステーションに基板4を搬送して行う(図3(e)参照)。 Incidentally, the other colored layers in the black matrix BM of the substrate 4 (green G, and blue B) exposure operation for the region in is carried out by transporting the substrate 4 in addition to similar exposure station which is installed separately (FIG. 3 ( e) reference). また、前記露光操作に先立って前記基板4にはブラックマトリックBMの上に着色顔料が塗布されているので、前記露光によって露光された領域の着色顔料が硬化される。 Further, the substrate 4 prior to the exposure operation because the colored pigment on the black matrix BM is applied, color pigments areas exposed by said exposure is cured. そこで露光後の基板4を洗浄液で洗浄すると、露光されなかった領域の着色顔料が除去されて前記露光領域29に前記硬化された着色顔料によって各着色層R,G,Bのピクセル18が形成されることとなる。 Therefore when the substrate 4 after exposure to washing with a washing solution, the colored layers R by color pigments colored pigments of the unexposed region is the cure to the exposed region 29 is removed, G, B pixel 18 is formed The Rukoto.

前記のように、実施の形態に係るスキャン露光方法は、基板搬送手段5によって一定速度で一定方向に搬送されている状態の基板4に対して、露光ステーション2でrんぞく光源であるランプ9から露光光を露光光学系3の光軸S上に設けたマスク11の開口部11aを通して照射し、前記基板4上に前記開口部11aの像を転写するスキャン露光方法において、前記基板4に予め形成されたピクセル18を撮像手段6で撮像し、この撮像されたピクセル18が撮像位置Fから露光開始位置Kに移動した時に、前記マスク11を基板4の搬送に同期させて基板4の進行方向イへ前進移動を開始させると共に前記露光光の基板4への照射を前記シャッター12開いてを開始させ、前記ピクセル18が露光停止位置Jに移動した時に、露光光の基 As described above, the scanning exposure method according to the embodiment, the substrate 4 in a state of being transported in a predetermined direction at a constant speed by the substrate transfer means 5, a r Nzoku light source at the exposure station 2 lamps 9 exposure light is irradiated through the opening 11a of the mask 11 provided on the optical axis S of the exposure optical system 3 from the scanning exposure method for transferring an image of the opening 11a on the substrate 4, the substrate 4 imaging the pixels 18 which are pre-formed by the imaging unit 6, when the imaging pixel 18 has moved to the exposure start position K from the imaging position F, the traveling of the substrate 4 of the mask 11 in synchronization with the conveyance of the substrate 4 the irradiation of the substrate 4 of the exposure light with starting the forward movement in the direction b to start opening the shutter 12, when the pixel 18 is moved to the exposure stop position J, the exposure light groups 4への照射を前記シャッター12を閉じて停止させると共にマスク11の前進移動を停止させて露光開始位置Kに戻し、この動作を繰り返すことにより、前記基板4の搬送方向(X軸方向x)に直角なY軸方向yに沿った露光予定領域29を順次露光する構成とされている。 The irradiation of the 4 by closing the shutter 12 to stop the forward movement of the mask 11 along with stopping back at the exposure start position K, by repeating this operation, the conveying direction of the substrate 4 (X-axis direction x) It is configured to sequentially expose the expected exposure region 29 along the perpendicular Y-axis direction y.

また、前記実施の形態に係るスキャン露光装置1は、基板4を一定速度で一定方向に搬送する基板搬送手段5と、該基板搬送手段5によって搬送されている状態の基板4に対して、露光ステーション2で連続光源であるランプ9から露光光を光路上に設けたマスク11の開口部11aを通して照射して前記開口部11aの像を基板4上に転写する露光光学系3とを設けたスキャン露光装置であって、前記基板4に予め形成されたピクセル18を基板4の移動中に撮像する撮像手段6と、該撮像手段6で撮像されたピクセル18が撮像位置Fから露光開始位置Kに移動された時に、前記マスク11を基板4の搬送に同期させて基板4の進行方向イへ前進移動を開始させると共に前記シャッター12を開いて露光光の基板4への照射を開始させ、 Further, scanning exposure apparatus 1 according to the embodiment includes a substrate conveying means 5 for conveying in a certain direction of the substrate 4 at a constant speed, with respect to the substrate 4 in a state of being transported by the substrate transport unit 5, an exposure scan provided from lamp 9 and an exposure optical system 3 is irradiated through the opening portion 11a for transferring an image of the opening 11a on the substrate 4 of the mask 11 provided the exposure light on the optical path is a continuous light source at station 2 an exposure apparatus, the substrate 4 preformed pixels 18 and image pickup means 6 for picking up during the movement of the substrate 4, the pixel 18 taken by the image pickup means 6 is at the exposure start position K from the imaging position F when they are moved, the mask 11 to start irradiation of in synchronism with the conveyance of the substrate 4 to the substrate 4 of the shutter 12 to open the exposure light with starting the forward movement to the traveling direction b of the substrate 4, 記ピクセル18が露光停止位置Jに移動した時に、シャッター12を閉じて露光光の基板4への照射を停止させると共にマスク11の前進移動を停止させて前記露光開始位置Kに戻すように制御する制御装置8とを備えた構成とされている。 When serial pixel 18 has moved to the exposure stop position J, and controls so as to stop the forward movement of the mask 11 stops the irradiation of the substrate 4 of the shutter 12 to close the exposure light returned to the exposure start position K by It has a configuration in which a control unit 8.

したがって、前記実施の形態に係るスキャン露光方法およびスキャン露光装置1によれば、基板搬送手段5によって基板4を搬送しながらマスク11の開口部11aの形状を連続的に転写して露光を行うことができるので、小さなマスク11を使用する場合であっても、基板4の間欠的なステップ移動による露光をする必要がなく、広い露光領域を有する基板4に対する露光を効率的に行うことできる。 Therefore, according to the scanning exposure method and a scanning exposure apparatus 1 according to the embodiment, it is performed continuously transferred to expose the shape of the opening 11a of the mask 11 while transporting the substrate 4 by the substrate transfer means 5 since it is, even when using a small mask 11, it is not necessary to exposure by intermittent step movement of the substrate 4, it can be performed with exposure of the substrate 4 having a wide exposure region efficiently.
また、基板4に形成されたピクセル(基準パターン)18が露光開始位置Kに達すると、該露光開始位置Kから露光停止位置Jまでマスク11が基板4と同期して基板4の進行方向イに移動され、この間に連続光源であるランプ9からの露光光がマスク11を通して基板4に照射されるので、基板4に対して適切な露光時間を確保して安定した露光を行うことができる。 Further, when the pixels formed on the substrate 4 (reference pattern) 18 reaches the exposure starting position K, the mask 11 from the exposure start position K to the exposure stop position J in synchronization with the substrate 4 in the traveling direction b of the substrate 4 is moved, so that the exposure light from the lamp 9 is a continuous light source during this period is irradiated through the mask 11 to the substrate 4, it is possible to perform stable exposure to ensure adequate exposure time for the substrate 4.

また、前記スキャン露光装置1においては、前記制御装置8が、前記撮像手段6で撮像されたピクセル(基準パターン)18の前方エッジ18e1と側方エッジ18e2の画像にもとづき基板4上の搬送方向(X軸方向x)とこれに直角なY軸方向yにおける基準位置を検出し、前記撮像されたピクセル18が前記露光開始位置Kに移動された時に、前記Y軸方向yにおける基準位置にもとづいて前記マスク11のY軸方向yにおける位置調節を行うと共に、前記各基準位置の検出によって求めた基板4の搬送方向に対する傾き角θにもとづいて前記マスク11の露光光学系3の光軸Sに垂直な平面内における旋回角の位置調節を行う構成とされている。 Further, in the above scanning exposure apparatus 1, the control device 8, the imaging unit pixels (reference pattern) imaged at 6 18 forward edge 18e1 and side conveying direction of the substrate 4 on the basis of the image of the edge 18E2 ( it detects a reference position in the perpendicular Y-axis direction y X axis direction x) and, when the imaging pixel 18 has been moved to the exposure start position K, based on the reference position in the Y axis direction y performs position adjustment in the Y axis direction y of the mask 11, vertically above the optical axis S of the exposure optical system 3 of the mask 11 on the basis of the inclination angle θ with respect to the transport direction of the substrate 4 as determined by the detection of the reference position It is configured to perform positional adjustment of the swivel angle in such a plane.
したがって、基板4のY軸方向yにおける位置ずれと基板4の搬送方向に対する傾き角θに合わせて、マスク11のY軸方向yにおける位置と旋回角の位置調節とをそれぞれ確実に行うことができるので、露光中、基板4の搬送状態における位置変化に関わりなく、所定の露光予定領域29の露光を極めて正確に行うことができる。 Thus, in accordance with the inclination angle θ with respect to the transport direction of the positional displacement and the substrate 4 in the Y axis direction y of the substrate 4, the position adjustment of the position and the turning angle in the Y axis direction y of the mask 11 can surely be respectively since, during the exposure, regardless of the position change in the conveyance state of the substrate 4 can be carried out very accurately the exposure of a predetermined exposure region where 29.
しかも、予め基板4に形成されたピクセル(基準パターン)18を利用して基板4の基準位置を検出して、該基準位置にもとづいて前記マスク11の位置を調節することができるので、前記基板4の所定の露光予定領域29への露光を正確に行うことができると共に、前記マスク11の位置調節のために、従来のように基板4やマスク11にアライメントマークを形成する必要がなく、それらの製造が容易である。 Moreover, by detecting the reference position of the substrate 4 by using a previously substrate 4 to form pixels (reference pattern) 18, it is possible to adjust the position of the mask 11 on the basis of the reference position, the substrate with 4 of exposure to a predetermined exposure region where 29 can be accurately performed, for position adjustment of the mask 11, it is not necessary to form the alignment mark on the substrate 4 and the mask 11 as in the prior art, they of the production it is easy.

なお、前記実施の形態に係るスキャン露光方法およびスキャン露光装置1においては、前記マスク11に開口部11aをY軸方向yに沿って一列だけ設け、各着色層R,G,Bを一列毎に露光するようにしたが、これに限らず、前記基板4の幅全長にわたる開口部11aをX軸方向xに各着色層毎のピッチ間隔と同じ間隔をあけて複数列設けてもよい。 Incidentally, in the scanning exposure method and a scanning exposure apparatus 1 according to the embodiment, the openings 11a in the mask 11 is provided by a line along the Y-axis direction y, the colored layers R, G, B of each one row was such that the exposure is not limited thereto, may be provided a plurality of rows at a same spacing as the pitch spacing of each colored layer openings 11a across the width length of the substrate 4 in the X axis direction x. この場合、各開口部11aの相互間の中間位置が前記露光開始位置Kと露光停止位置Jの間で往復移動し、基板4の各着色層間のピッチの中間位置が露光開始位置Kと露光停止位置Jに到達したときに、それぞれ露光の開始と停止を行うようにする。 In this case, an intermediate position reciprocates between the exposure start position K and the exposure stop position J, an intermediate position is exposure stops and the exposure starting position K of the pitch of the colored layers of the substrate 4 therebetween of each opening 11a when reaching the position J, respectively to perform the start and stop of exposure. このようにすると、露光停止位置Jで露光光の照射を停止して前記マスクステージ13が露光開始位置Kに戻り、次の露光光の照射を行うまでの時間的な余裕が生じ、前記シャッター12の開閉制御とマスクステージ13を前記基板ステージ15の移動に同期して前進移動させる制御とを円滑、容易に行うことができると共に、各着色層R,G,Bのピクセル18の複数列に対して同時に露光光を照射することができるので、基板4に対する露光を一層効率的に行うことができる。 In this way, the exposure at the stop position J stops irradiation of the exposure light the mask stage 13 is returned to the exposure start position K, resulting temporal margin until the irradiation of the next exposure light, the shutter 12 closing control and the mask stage 13 smoothly and control for advancing movement in synchronism with the movement of the substrate stage 15, it is possible to easily perform, the colored layers R, G, with respect to a plurality of rows of pixels 18 B can be irradiated with exposure light simultaneously Te, exposure of the substrate 4 can be carried out more efficiently.

また、前記実施の形態に係るスキャン露光方法およびスキャン露光装置1においては、前記マスク11に開口部11aをY軸方向yに沿って基板4の幅全長にわたって設け、各着色層R,G,Bを基板4の一回の進行方向イへの移動で露光を完了するようにしたが、これに限らず、前記開口部11aのY軸方向yの長さを基板4の幅の一部(例えば、半分)のピクセル18を包含する分とし、基板4の一回目の進行方向イへの移動で半数のピクセル18を含む露光予定領域29を露光し、この露光が終了した後に、基板ステージ15を搬送開始位置に後退させ、しかる後に、基板ステージ15をY軸方向yへ所定量シフトさせて、残りの露光予定領域の露光を再開するようにしてもよい。 Further, in the scanning exposure method and a scanning exposure apparatus 1 according to the embodiment, the openings 11a in the mask 11 is provided across the width the entire length of the substrate 4 along the Y-axis direction y, the colored layers R, G, B Although was to complete exposure with movement to one direction of travel b of the substrate 4 is not limited to this, the length of the Y-axis direction y of the opening 11a portion of the width of the substrate 4 (e.g. , and including partial pixels 18 of the half), to expose the expected exposure region 29 including a half pixel 18 in movement in the first round in the traveling direction b of the substrate 4, after the exposure is completed, the substrate stage 15 is retracted to the transport start position, and thereafter, the substrate stage 15 by a predetermined amount shifted in the Y axis direction y, may be resumed exposure of the remaining expected exposure region.
また、前記シャッターコントローラ25の作動でシャッター12の開閉を行って、ランプ9から照明用レンズ10側への露光光の投光を露光開始位置で開始して露光停止位置で停止させるようにしたが、前記シャッター12を設ける代わりに、前記主制御部28からの指令で前記ランプ電源部24の動作を制御することにより、前記基板4の露光開始位置でランプ9を点灯させ、露光停止位置でランプ9を消灯させるようにして露光光の照明用レンズ10側への投光のの開始、停止を行うようにしてもよい。 Also, the performs opening and closing of the shutter 12 in operation of the shutter controller 25, but the projection of the exposure light from the lamp 9 to the illumination lens 10 side so as to stop at the exposure stop position starting at the exposure start position instead of providing the shutter 12, by controlling the operation of the lamp power supply unit 24 by a command from the main control unit 28 turns on the lamp 9 at the exposure start position of the substrate 4, lamp exposure stop position 9 so as to turn off the start of the projection of the illumination lens 10 side of the exposure light, may be performed to stop.

また、前記照明用レンズ10の代わりに投影用レンズを前記ハーフミラー19の下側に基板ステージ15に近接して配置し、前記マスクステージ13をハーフミラー19の上側に配置して、投影露光方式により前記基板4を露光(投影露光)するようにしてもよい。 Further, it disposed close to the substrate stage 15 on the lower side of the half mirror 19 of the projection lens in place of the illumination lens 10, by placing the mask stage 13 in the upper half mirror 19, a projection exposure system the substrate 4 exposed may be (projection exposure), as by. この場合には、投影用レンズをマスク駆動手段13およびマスクステージコントローラ27と同様な手段を用いて動かし、マスク11を動かさずに、マスク11の開口部11aの基板4に対する転写位置を調節して、基板4の位置変化に対応させることができる。 In this case, it moves using means similar to projection lens and mask drive unit 13 and the mask stage controller 27, without moving the mask 11, by adjusting the transfer position with respect to the substrate 4 of the opening 11a of the mask 11 It may correspond to the position change of the substrate 4.
また、前記実施の形態に係るスキャン露光方法およびスキャン露光装置1においては、基板搬送手段5を基板4を載置する基板ステージ15とこれを搬送方向に移動させる基板駆動手段16と備えて構成したが、これに限らず、基板4としてフィルム状(シート状)の基材を使用する場合には、格納ロールに巻き付けられた前記基材を巻取ロールに巻き取ることによって、前記基材を露光ステーション2において露光光学系3の光軸Sに垂直な平面に沿って移動させる構成としてもよい。 Further, in the scanning exposure method and a scanning exposure apparatus 1 according to the embodiment, and the substrate transfer unit 5 configured to include a substrate driving means 16 for moving this substrate stage 15 for placing a substrate 4 in the conveying direction but not limited thereto, the substrate 4 as a film-like when using substrates (sheet) is, by winding the base material wound on storage roll to the winding roll, exposing said substrate it may be moved along a plane perpendicular to the optical axis S of the exposure optical system 3 in the station 2. このようにすると、単位基板に相当する露光領域を多数連続したシート状の基材(基板)を、各単位基板に相当する露光領域毎にステップ移動させて露光操作を間欠的に繰り返して行う必要がないので、多数の単位基板を極めて効率的に露光することができて、生産性を高めることができる。 In this way, the need to perform exposure region corresponding to the unit substrate numerous continuous sheet-shaped base material (substrate), and intermittently repeats the exposure operation is moved step for each of the exposure areas corresponding to the respective unit substrates since there is no, it can be very efficiently exposed a large number of unit substrates, the productivity can be enhanced.
さらに、前記実施の形態に係るスキャン露光方法およびスキャン露光装置1においては、カラーフィルタを製造するにあたり、ブラックマトリックスを形成した基板に着色層(R,G,B)を形成する場合に適用した例を示したが、本発明はこれに限らず、液晶パネルの透明薄膜電極を製造する場合や、その他半導体素子の製造、フォトマスクやレチクルの製造等の場合にも適用することができる。 Further, in the scanning exposure method and a scanning exposure apparatus 1 according to the embodiment, when manufacturing a color filter was applied to the case of forming the colored layer on the substrate formed with the black matrix (R, G, B) Example It showed that the present invention is not limited to this, and when manufacturing a transparent thin-film electrode of the liquid crystal panel, manufacturing of other semiconductor element, can be applied to a case such as the manufacture of a photomask or reticle.

本発明の一実施の形態に係るスキャン露光装置を示す系統図である。 It is a system diagram showing a scanning exposure apparatus according to an embodiment of the present invention. 同じくスキャン露光装置における基板と基板に対するマスクの位置調整の説明図である。 It is an explanatory view of a position adjustment of the mask relative to the substrate and the substrate in the same scanning exposure apparatus. 同じくスキャン露光装置の作用を示す説明図である。 Also is an explanatory diagram showing the operation of the scanning exposure apparatus. 同じくスキャン露光装置の作用を示すフローである。 Also is a flowchart showing an operation of the scanning exposure apparatus.

符号の説明 DESCRIPTION OF SYMBOLS

1 スキャン露光装置 2 露光ステーション(露光部) 1 scanning exposure apparatus 2 exposure station (exposure portion)
3 露光光学系 4 基板 5 基板搬送手段 6 撮像手段 8 制御装置 9 ランプ(連続光源) 3 exposure optical system 4 substrate 5 substrate conveying means 6 imaging means 8 controller 9 lamp (continuous light source)
10 照明用レンズ 11 マスク 11a 開口部 12 シャッター 13 マスクステージ 15 基板ステージ 18 ピクセル(基準パターン) 10 the illumination lens 11 mask 11a opening 12 shutter 13 mask stage 15 substrate stage 18 pixels (reference pattern)
18e1 前方エッジ(パターンエッジ) 18e1 front edge (pattern edge)
18e2 側方エッジ(パターンエッジ) 18e2 side edge (pattern edge)
20 リニアCCD 20 linear CCD
E 露中心光位置 F 撮像位置 J 露光停止位置 K 露光開始位置 S 光軸(光路) E exposure center beam position F imaging position J exposure stop position K exposure start position S optical axis (optical path)

Claims (5)

  1. 基板搬送手段によって一定速度で一定方向に搬送されている状態の基板に対して、露光部で連続光源からの露光光を露光光学系の光路上に設けたマスクの開口部を通して照射し、前記基板上に前記開口部の像を転写するスキャン露光方法において、 The substrate in a state of being transported in a predetermined direction at a constant speed by the substrate transfer means, the exposure light from the continuous light source in the exposure unit irradiates through the opening in the mask provided on the optical path of the exposure optical system, the substrate in scanning exposure method for transferring an image of the opening in the top,
    前記基板に予め形成された基準パターンを撮像手段で撮像し、この撮像された基準パターンが撮像位置から露光開始位置に移動した時に、前記マスクを基板の搬送に同期させて基板の進行方向へ前進移動を開始させると共に前記露光光の基板への照射を開始させ、前記基準パターンが露光停止位置に移動した時に、露光光の基板への照射を停止させると共にマスクの前進移動を停止させて前記露光開始位置に戻し、この動作を繰り返すことにより、前記基板の搬送方向に直角な方向に沿った露光予定領域を順次露光することを特徴とするスキャン露光方法。 The preformed reference pattern on the substrate and imaged by the imaging means, when the imaged reference pattern is moved to the exposure start position from the imaging position, advancing said mask in synchronization with the transportation of the substrate to the traveling direction of the substrate move to start irradiation of the substrate of the exposure light with to start, when the reference pattern is moved to the exposure stop position, the exposure to irradiation of the substrate as the exposure light to stop the forward movement of the mask with stops return to the starting position, by repeating this operation, the scanning exposure method characterized by sequentially exposing the expected exposure area along the direction perpendicular to the conveying direction of the substrate.
  2. 基板を一定速度で一定方向に搬送する基板搬送手段と、該基板搬送手段によって搬送されている状態の基板に対して、露光部で連続光源からの露光光を光路上に設けたマスクの開口部を通して照射して前記開口部の像を基板上に転写する露光光学系とを設けたスキャン露光装置であって、 A substrate conveying means for conveying in a certain direction of the substrate at a constant speed, with respect to the substrate in a state of being transported by the substrate transport means, the opening of the mask provided on the optical path of the exposure light from the continuous light source in the exposure unit an image of the opening portion by irradiating a scanning exposure apparatus provided with an exposure optical system for transferring onto a substrate through,
    前記基板に予め形成された基準パターンを基板の移動中に撮像する撮像手段と、該撮像手段で撮像された基準パターンが撮像位置から露光開始位置に移動された時に、前記マスクを基板の搬送に同期させて基板の進行方向へ前進移動を開始させると共に前記露光光の基板への照射を開始させ、前記基準パターンが露光停止位置に移動した時に、露光光の基板への照射を停止させると共にマスクの前進移動を停止させて前記露光開始位置に戻すように制御する制御装置とを備えていることを特徴とするスキャン露光装置。 Imaging means for imaging a preformed reference pattern on the substrate during movement of the substrate, when the imaged reference pattern is moved to the exposure start position from the imaging position in the imaging means, the mask for transporting the substrate is synchronized to start irradiation of the substrate of the exposure light with starting the forward movement to the traveling direction of the substrate, when the reference pattern is moved to the exposure stop position, the mask stops the irradiation of the substrate as the exposure light scan exposure apparatus the forward movement of the stops, characterized in that a control unit for controlling to return to the exposure start position.
  3. 前記制御装置は、前記撮像手段で撮像された基準パターンのパターンエッジの画像にもとづき基板上の搬送方向とこれに直角な方向とにおける基準位置を検出し、前記撮像された基準パターンが前記露光開始位置に移動された時に、前記搬送方向に直角な方向における基準位置にもとづいて前記マスクの前記搬送方向に直角な方向における位置調節を行うことを特徴とする請求項2に記載のスキャン露光装置。 The control unit detects the reference position in the conveying direction and the direction perpendicular thereto on a substrate based on the image of the pattern edge of the imaged reference pattern by the imaging means, the captured reference pattern the exposure start when it is moved to the position, the scanning exposure apparatus according to claim 2, characterized in that the position adjustment in the direction perpendicular to the transport direction of the mask based on the reference position in the direction perpendicular to the transport direction.
  4. 前記制御装置は、前記撮像手段で撮像された基準パターンのパターンエッジの画像にもとづき基板上の搬送方向とこれに直角な方向とにおける基準位置を検出し、前記撮像された基準パターンが前記露光開始位置に移動された時に、前記各基準位置の検出によって求めた基板の搬送方向に対する傾き角にもとづいて前記マスクの前記露光光学系の光路に垂直な平面内における旋回角の位置調節を行うことを特徴とする請求項2に記載のスキャン露光装置。 The control unit detects the reference position in the conveying direction and the direction perpendicular thereto on a substrate based on the image of the pattern edge of the imaged reference pattern by the imaging means, the captured reference pattern the exposure start when it is moved to a position, to carry out position adjustment of the swivel angle in the plane perpendicular to the optical path of the exposure optical system of the mask based on the inclination angle with respect to the transport direction of the substrate obtained by the detection of the reference position scanning exposure apparatus according to claim 2, characterized.
  5. 前記制御装置は、前記基板上の搬送方向に直角な方向における基準位置にもとづいて前記マスクの前記搬送方向に直角な方向における位置調節を行うことを特徴とする請求項4に記載のスキャン露光装置。 Wherein the control device, the scanning exposure apparatus according to claim 4, characterized in that the position adjustment in the direction perpendicular to the transport direction of the mask based on the reference position in the direction perpendicular to the conveying direction on the substrate .
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