JP2006291220A5

JP2006291220A5 - Anisotropic conductive adhesive film

Info

Publication number: JP2006291220A5
Application number: JP2006155884A
Authority: JP
Filing date: 2006-06-05
Publication date: 2007-07-05
Anticipated expiration: 2024-07-08

Description

本発明は、異方導電性接着剤フィルムに関する。 The present invention relates to an anisotropic conductive adhesive film .

本発明は上記事情に鑑みてなされたものであり、その目的は、保存安定性および低温短時間の接続性に優れた異方導電性接着剤フィルムを提供することにある。 This invention is made | formed in view of the said situation, The objective is to provide the anisotropically conductive adhesive film excellent in the storage stability and the low-temperature short-time connectivity.

本発明によれば、
（ａ）エポキシ樹脂、
（ｂ）マイクロカプセル化イミダゾール誘導体エポキシ化合物、および
（ｃ）導電性粒子
を必須成分として含み、
前記（ｂ）マイクロカプセル化イミダゾール誘導体エポキシ化合物の平均粒径が０．１μｍ以上３μｍ以下であって、
樹脂フロー係数が１．５以上３．０以下であり、
３ＭＰａの加圧下、１０秒間で１７０℃まで昇温する加熱加圧条件下で圧着した際の反応率が７０％以上であり、
４０℃３日間放置後のタックが放置前のタックの７０％以上であり、
４０℃３日間放置後の樹脂フロー係数が放置前の樹脂フロー係数の７０％以上であることを特徴とする異方導電性接着剤フィルムが提供される。 According to the present invention,
(A) epoxy resin,
(B) a microencapsulated imidazole derivative epoxy compound, and (c) conductive particles as essential components,
(B) The average particle size of the microencapsulated imidazole derivative epoxy compound is 0.1 μm or more and 3 μm or less,
The resin flow coefficient is 1.5 or more and 3.0 or less,
Under a pressure of 3 MPa, the reaction rate is 70% or more when pressure-bonded under heating and pressurizing conditions where the temperature is raised to 170 ° C. in 10 seconds,
The tack after leaving at 40 ° C for 3 days is 70% or more of the tack before leaving ,
The anisotropic conductive adhesive film in which the resin flow coefficient after standing 40 ° C. 3 days, characterized in der Rukoto 70% of the resin flow coefficients before standing is provided.

本発明に係る異方導電性接着剤フィルムは、（ｂ）マイクロカプセル化イミダゾール誘導体エポキシ化合物の平均粒径が０．１μｍ以上３μｍ以下であって、樹脂フロー係数が１．５以上３．０以下であり、また、３ＭＰａの加圧下、１０秒間で１７０℃まで昇温するという加熱加圧条件においても反応率が７０％以上と充分に大きいため、低温で速やかに硬化する。また、４０℃３日間放置後のタックが放置前のタックの７０％以上と充分に大きく、また、４０℃３日間放置後の樹脂フロー係数が放置前の樹脂フロー係数の７０％以上と充分に大きく、保存安定性に優れる。このため、低温短時間硬化性および保存安定性にすぐれた構成となっている。 An anisotropic conductive adhesive film according to the present invention has the following: (b) The average particle size of the microencapsulated imidazole derivative epoxy compound is 0.1 μm or more and 3 μm or less, and the resin flow coefficient is 1.5 or more and 3.0 or less. der is, also, a pressure of 3 MPa, for even is sufficiently large and the 70% response rate in heat and pressure conditions that the temperature was raised to 170 ° C. for 10 seconds, quickly cured at low temperatures. Also, sufficiently large and 40 ° C. 3 days tack after standing at least 70% of the previous tack left, also, a sufficiently 40 ° C. 3 days resin flow coefficient after standing at least 70% of the resin flow coefficient before standing Large and excellent in storage stability. For this reason, it has a structure excellent in low-temperature short-time curability and storage stability.

本発明に係る異方導電性接着剤フィルムにおいて、（ｂ）マイクロカプセル化イミダゾール誘導体エポキシ化合物とトルエンとを混合した混合物を４０℃にて９０分間放置した後の粘度が、放置前の粘度の３倍以下であってもよい。こうすれば、保存による粘度上昇が、さらに充分に抑制されている。このため、（ｂ）マイクロカプセル化イミダゾール誘導体エポキシ化合物の耐溶剤性がさらに充分に確保されている。よって、低温短時間硬化性および保存安定性により一層すぐれた構成となっている。 In the anisotropic conductive adhesive film according to the present invention , ( b) the viscosity after leaving the mixture of the microencapsulated imidazole derivative epoxy compound and toluene at 40 ° C. for 90 minutes is a viscosity of 3 before leaving. It may be less than double . In this way, the increase in viscosity due to storage is further sufficiently suppressed. For this reason, the solvent resistance of the (b) microencapsulated imidazole derivative epoxy compound is further sufficiently secured. Therefore, it has become a more excellent structure to the low temperature short time curability and storage stability.

本発明において、
（ａ）エポキシ樹脂、
（ｂ）マイクロカプセル化イミダゾール誘導体エポキシ化合物、および
（ｃ）導電性粒子
を必須成分として含み、加熱された前記（ｂ）マイクロカプセル化イミダゾール誘導体エポキシ化合物を含む異方導電性接着剤を用いてもよい。 Oite to the present invention,
(A) epoxy resin,
(B) microencapsulated imidazole derivative epoxy compounds, and include (c) conductive particles as an essential component, heated said (b) microencapsulated imidazole derivative epoxy compound with including anisotropic conductive adhesive Also good .

本発明における異方導電性接着剤では、加熱された前記（ｂ）マイクロカプセル化イミダゾール誘導体エポキシ化合物が用いられるため、保存安定性および低温短時間硬化性を確実に向上させることができる。 The anisotropic conductive adhesive that put the present invention, since the heated above (b) microencapsulated imidazole derivative epoxy compound is used, it is possible to reliably improve the storage stability and low-temperature short-time curability.

本発明においては、前記（ｂ）マイクロカプセル化イミダゾール誘導体エポキシ化合物の平均粒径が０．１μｍ以上３μｍ以下である。（ｂ）マイクロカプセル化イミダゾール誘導体エポキシ化合物の平均粒径（ｄ₅₀）を０．１μｍ以上とすることにより、保存安定性をさらに向上させることができる。また、平均粒径を３μｍ以下とすることにより、低温かつ短時間の加熱条件でエポキシ樹脂を確実に硬化させることができる。このため、低温短時間硬化性および保存安定性にさらに優れた構成とすることができる。 In the present invention, the average particle diameter of the (b) microencapsulated imidazole derivative epoxy compound Ru 3μm der less than 0.1 [mu] m. (B) The storage stability can be further improved by setting the average particle diameter (d ₅₀ ) of the microencapsulated imidazole derivative epoxy compound to 0.1 μm or more. Moreover, by setting the average particle size to 3 μm or less, the epoxy resin can be reliably cured under low-temperature and short-time heating conditions. For this reason, it can be set as the structure which was further excellent in low-temperature short-time curability and storage stability.

たとえば、本発明によれば、前記異方導電性接着剤フィルムを介して電子部品または電機部品の電気的な接合が行われたことを特徴とする電子機器が提供される。 For example, according to the present invention, there is provided an electronic apparatus characterized in that an electrical component or an electrical component is electrically joined via the anisotropic conductive adhesive film .

以上説明したように本発明によれば、（ａ）エポキシ樹脂、（ｂ）マイクロカプセル化イミダゾール誘導体エポキシ化合物、および（ｃ）導電性粒子を必須成分して含み、（ｂ）マイクロカプセル化イミダゾール誘導体エポキシ化合物の平均粒径が０．１μｍ以上３μｍ以下であって、樹脂フロー係数が１．５以上３．０以下であり、３ＭＰａの加圧下、１０秒間で１７０℃まで昇温する加熱加圧条件下で圧着した際の反応率が７０％以上であり、４０℃３日間放置後のタックが放置前のタックの７０％以上であり、４０℃３日間放置後の樹脂フロー係数が放置前の樹脂フロー係数の７０％以上である構成とすることにより、保存安定性および低温短時間の接続性に優れた異方導電性接着剤フィルムが実現される。 As described above, according to the present invention, (a) an epoxy resin, (b) a microencapsulated imidazole derivative epoxy compound, and (c) conductive particles are included as essential components, and (b) a microencapsulated imidazole derivative. The average particle size of the epoxy compound is 0.1 μm or more and 3 μm or less, the resin flow coefficient is 1.5 or more and 3.0 or less, and the heating and pressurizing condition for raising the temperature to 170 ° C. in 10 seconds under 3 MPa pressure and the reaction rate when crimped under 70% or more, 40 ° C. 3 after leaving day tack before standing der 70% of the tack is, after standing 40 ° C. 3 days resin flow coefficient before standing with der Ru configuration 70% of the resin flow coefficient, stability and anisotropic conductive adhesive film excellent in low-temperature short-time connectivity is achieved stored.

マイクロカプセル化イミダゾール誘導体エポキシ化合物の粒子の平均粒径は、０．１μｍ以上であり、好ましくは１μｍ以上とすることができる。こうすることにより、保存安定性を向上させることができる。また、粘度上昇を抑制し、マイクロカプセル化イミダゾール誘導体エポキシ化合物の安定的な作製が可能な構成とすることができる。 The average particle size of the microencapsulated imidazole derivative epoxy compound particles is 0 . And at 1 [mu] m or more, preferably be at least 1 [mu] m. By doing so, the storage stability can be improved. Moreover, it can be set as the structure which suppresses a viscosity raise and can produce stably the microencapsulated imidazole derivative epoxy compound.

また、マイクロカプセル化イミダゾール誘導体エポキシ化合物粒子の平均粒径は、３μｍ以下であり、好ましくは２μｍ以下とすることができる。こうすることにより、潜在性硬化剤と樹脂との反応点の増加により硬化反応性を高め、低温でかつ短時間での接続が可能となる。また、反応点を充分に確保し、低温短時間で確実に硬化させることが可能となる。 The average particle size of the microencapsulated imidazole derivative epoxy compound particles is 3 μm or less, and preferably 2 μm or less. By doing so, the curing reactivity is increased by increasing the reaction point between the latent curing agent and the resin, and connection at a low temperature and in a short time becomes possible. In addition, it is possible to secure sufficient reaction points and to reliably cure at a low temperature in a short time.

本発明に係る異方導電性接着剤フィルムは、低温短時間硬化性（Ａ）および保存安定性（Ｂ）の指標として、（Ａ１）、（Ａ２）、（Ｂ１）および（Ｂ２）の条件をともに満たす。
（Ａ１）樹脂フロー係数が１．５以上３．０以下である、
（Ａ２）３ＭＰａにて１０秒間で１７０℃まで昇温する加熱加圧条件下で圧着した際の反応率が７０％以上である、
（Ｂ１）４０℃３日間放置後のタックが放置前のタックの７０％以下である、
（Ｂ２）４０℃で３日間放置後の樹脂フロー係数が放置前の樹脂フロー係数の７０％以上である。
また、異方導電性接着剤フィルムが、保存安定性（Ｂ）の指標として、さらに（Ｂ３）の条件を満たすようにしてもよい。
（Ｂ３）マイクロカプセル化イミダゾール誘導体エポキシ化合物とトルエンとを混合した混合物を４０℃にて９０分間放置した後の粘度が、放置前の粘度の３倍以下である。 The anisotropic conductive adhesive film according to the present invention, as an index of low-temperature short-time curability (A) and storage stability (B), (A1), condition (A2), (B1) and (B 2) Satisfy both.
(A1) The resin flow coefficient is 1.5 or more and 3.0 or less,
(A2) The reaction rate is 70% or more when pressure-bonded under a heating and pressurizing condition in which the temperature is increased to 170 ° C. for 10 seconds at 3 MPa.
(B1) The tack after leaving at 40 ° C. for 3 days is 70% or less of the tack before leaving,
(B2) The resin flow coefficient after standing for 3 days at 40 ° C. is 70% or more of the resin flow coefficient before standing.
Moreover, you may make it an anisotropically conductive adhesive film satisfy | fill the conditions of (B3) further as a parameter | index of storage stability (B).
(B3) The viscosity of the mixture obtained by mixing the microencapsulated imidazole derivative epoxy compound and toluene at 40 ° C. for 90 minutes is not more than 3 times the viscosity before standing.

Claims

(A) epoxy resin,
(B) a microencapsulated imidazole derivative epoxy compound, and (c) conductive particles as essential components,
(B) The average particle size of the microencapsulated imidazole derivative epoxy compound is 0.1 μm or more and 3 μm or less,
The resin flow coefficient is 1.5 or more and 3.0 or less,
Under a pressure of 3 MPa, the reaction rate is 70% or more when pressure-bonded under heating and pressurizing conditions where the temperature is raised to 170 ° C. in 10 seconds,
The tack after leaving at 40 ° C. for 3 days is 70% or more of the tack before leaving ,
The anisotropic conductive adhesive film in which the resin flow coefficient after standing 40 ° C. 3 days, characterized in der Rukoto 70% of the resin flow coefficient before standing.

In the anisotropic conductive adhesive film according to claim 1,
The anisotropic conductivity characterized in that the viscosity after leaving the mixture of (b) the microencapsulated imidazole derivative epoxy compound and toluene for 90 minutes at 40 ° C. is not more than 3 times the viscosity before leaving. Adhesive film.

3. The anisotropic conductive adhesive film according to claim 1, wherein the microcapsule wall material film of the (b) microencapsulated imidazole derivative epoxy compound has a thickness of 0.001 μm to 0.3 μm. An anisotropic conductive adhesive film characterized.

In the anisotropic conductive adhesive film according to any one of claims 1 to 3 ,
(D) An anisotropic conductive adhesive film further comprising an elastomer having a nitrile group and an epoxy group.

In the anisotropic conductive adhesive film according to any one of claims 1 to 4, wherein (a) an epoxy resin, an anisotropic conductive adhesive film which comprises an epoxy resin having a naphthalene skeleton.

In the anisotropic conductive adhesive film according to any one of claims 1 to 5, to include the which has been heated more than 2 days at a temperature of 35 ° C. or higher 60 ° C. or less (b) microencapsulated imidazole derivative epoxy compound An anisotropic conductive adhesive film characterized by