JP2006287181A - 基板処理装置及び基板処理方法 - Google Patents

基板処理装置及び基板処理方法 Download PDF

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Publication number
JP2006287181A
JP2006287181A JP2005332335A JP2005332335A JP2006287181A JP 2006287181 A JP2006287181 A JP 2006287181A JP 2005332335 A JP2005332335 A JP 2005332335A JP 2005332335 A JP2005332335 A JP 2005332335A JP 2006287181 A JP2006287181 A JP 2006287181A
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substrate
processed
chamber
wafer
processing
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Japanese (ja)
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JP2006287181A5 (enrdf_load_stackoverflow
Inventor
Hiroyuki Shinozaki
弘行 篠崎
Yasushi Kojima
靖 小島
Shiyunichi Aiyoshizawa
俊一 相吉澤
Kiwamu Tsukamoto
究 塚本
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E Beam Corp
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E Beam Corp
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Publication of JP2006287181A5 publication Critical patent/JP2006287181A5/ja
Withdrawn legal-status Critical Current

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2005332335A 2005-01-28 2005-11-17 基板処理装置及び基板処理方法 Withdrawn JP2006287181A (ja)

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JP2005332335A JP2006287181A (ja) 2005-01-28 2005-11-17 基板処理装置及び基板処理方法

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JP2005021098 2005-01-28
JP2005067572 2005-03-10
JP2005332335A JP2006287181A (ja) 2005-01-28 2005-11-17 基板処理装置及び基板処理方法

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JP2006287181A true JP2006287181A (ja) 2006-10-19
JP2006287181A5 JP2006287181A5 (enrdf_load_stackoverflow) 2008-12-18

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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008300578A (ja) * 2007-05-30 2008-12-11 Canon Inc 露光装置およびデバイス製造方法
CN102327839A (zh) * 2010-07-14 2012-01-25 鸿富锦精密工业（深圳）有限公司 滚筒式镀膜设备
JP2012064608A (ja) * 2010-09-14 2012-03-29 Hitachi High-Technologies Corp 検査装置
WO2014192379A1 (ja) * 2013-05-30 2014-12-04 株式会社 日立ハイテクノロジーズ 荷電粒子線装置
WO2022006313A1 (en) * 2020-06-30 2022-01-06 Brooks Automation, Inc. Automatic teach apparatus for robotic systems and method therefor
WO2022196120A1 (ja) * 2021-03-18 2022-09-22 株式会社Ｓｃｒｅｅｎホールディングス 基板塗布装置および基板塗布方法
JP2024522667A (ja) * 2021-10-21 2024-06-21 西安奕斯偉材料科技股▲ふん▼有限公司 ウエハｖ型切欠き中心の位置決め方法、システム及びコンピュータ記憶媒体
WO2025070112A1 (ja) * 2023-09-26 2025-04-03 東京エレクトロン株式会社 基板処理システム、接合装置及び接合方法

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008300578A (ja) * 2007-05-30 2008-12-11 Canon Inc 露光装置およびデバイス製造方法
CN102327839A (zh) * 2010-07-14 2012-01-25 鸿富锦精密工业（深圳）有限公司 滚筒式镀膜设备
JP2012064608A (ja) * 2010-09-14 2012-03-29 Hitachi High-Technologies Corp 検査装置
WO2014192379A1 (ja) * 2013-05-30 2014-12-04 株式会社 日立ハイテクノロジーズ 荷電粒子線装置
JPWO2014192379A1 (ja) * 2013-05-30 2017-02-23 株式会社日立ハイテクノロジーズ 荷電粒子線装置
KR101800105B1 (ko) * 2013-05-30 2017-11-21 가부시키가이샤 히다치 하이테크놀로지즈 하전 입자선 장치
US10290522B2 (en) 2013-05-30 2019-05-14 Hitachi High-Technologies Corporation Conductive interface system between vacuum chambers in a charged particle beam device
KR102787849B1 (ko) 2020-06-30 2025-04-01 브룩스 오토메이션 유에스, 엘엘씨 로봇 시스템용 자동 교습 장치 및 그 방법
WO2022006313A1 (en) * 2020-06-30 2022-01-06 Brooks Automation, Inc. Automatic teach apparatus for robotic systems and method therefor
KR20230031346A (ko) * 2020-06-30 2023-03-07 브룩스 오토메이션 유에스, 엘엘씨 로봇 시스템용 자동 교습 장치 및 그 방법
CN116097170A (zh) * 2020-06-30 2023-05-09 博鲁可斯自动化美国有限责任公司 用于机器人系统的自动示教装置及其方法
US11676845B2 (en) 2020-06-30 2023-06-13 Brooks Automation Us, Llc Automated teach apparatus for robotic systems and method therefor
WO2022196120A1 (ja) * 2021-03-18 2022-09-22 株式会社Ｓｃｒｅｅｎホールディングス 基板塗布装置および基板塗布方法
US12183616B2 (en) 2021-10-21 2024-12-31 Xi'an ESWIN Material Technology Co., Ltd. Method and system for positioning center of V-type notch of wafer, and computer storage medium
JP7614407B2 (ja) 2021-10-21 2025-01-15 西安奕斯偉材料科技股▲ふん▼有限公司 ウエハｖ型切欠き中心の位置決め方法、システム及びコンピュータ記憶媒体
JP2024522667A (ja) * 2021-10-21 2024-06-21 西安奕斯偉材料科技股▲ふん▼有限公司 ウエハｖ型切欠き中心の位置決め方法、システム及びコンピュータ記憶媒体
WO2025070112A1 (ja) * 2023-09-26 2025-04-03 東京エレクトロン株式会社 基板処理システム、接合装置及び接合方法

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