JP2006283041A - Edge mask device for vertical type electrolysis apparatus - Google Patents
Edge mask device for vertical type electrolysis apparatus Download PDFInfo
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- JP2006283041A JP2006283041A JP2005100387A JP2005100387A JP2006283041A JP 2006283041 A JP2006283041 A JP 2006283041A JP 2005100387 A JP2005100387 A JP 2005100387A JP 2005100387 A JP2005100387 A JP 2005100387A JP 2006283041 A JP2006283041 A JP 2006283041A
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Abstract
Description
本発明は、鋼帯を連続的に電解処理する竪型電解処理装置の電解処理タンクに設置されるエッジマスク装置に関する。 The present invention relates to an edge mask device installed in an electrolytic treatment tank of a vertical electrolytic treatment apparatus that continuously performs electrolytic treatment on a steel strip.
鋼帯の電解メッキにおいて、竪型電解メッキ装置の電解処理タンクの処理液に浸漬させて連続通板させる方法が知られている。 In the electroplating of steel strips, a method is known in which a plate is continuously immersed by being immersed in a treatment solution in an electrolytic treatment tank of a vertical electrolytic plating apparatus.
図3(a)は従来の竪型電解メッキ装置の概略断面図、(b)は同横断面図である。 3A is a schematic sectional view of a conventional vertical electrolytic plating apparatus, and FIG. 3B is a transverse sectional view thereof.
図3において、メッキ液を満たしたタンク1内にはシンクロール2が配置され、タンク1上部にはコンダクタロール3が配置され、タンク1内に対向した対となる電極4がそれぞれ配置されている。コンダクタロール3、シンクロール2を経て電極4間に鋼帯5を通過させて鋼帯表面をメッキ処理する。なお、電極4のそれぞれシンクロール側には、鋼帯5の走行により生じるメッキ液の随伴流を規制して鋼帯5の表側及び裏側の間に圧力差を発生させる対となる邪魔板6が鋼帯5を挟んで配置され、鋼帯5がシンクロール2に巻き付けられた際に発生する鋼帯5の変位を防止している(特許文献1参照)。
In FIG. 3, a
竪型電解メッキ装置において、鋼帯5の両縁部にはオーバーコートを防止するために、エッジマスク7が配設されている。図4はエッジマスクの一例を示す斜視図である。エッジマスク7には、鋼帯5の両端部から処理液の流入を容易にするため、上部から下部に亘り開口部8が等間隔で形成されている。鋼帯5が電極(放電面)近傍を高速で通板する際に発生する、鋼帯表裏の圧力差による変位を防止するために、電極表面には開口を設置し、表裏の圧力差の影響を少なくしている(特許文献2参照)。
エッジマスクが設置されているタンクでは、従来のエッジマスクでは電極両サイドからのメッキ液流の流れの障害となり、高速通板時は、鋼帯による随伴流により、低速通板時に比較して、放電面間のメッキ液量が不足、特に、吸着現象を起こそうとしている側のメッキ液量が不足により鋼帯の表裏での圧力差が顕著になるため、電極間のメッキ液流の安定化が十分に実現できない。 In the tank where the edge mask is installed, the conventional edge mask obstructs the flow of the plating solution flow from both sides of the electrode. Stabilization of plating solution flow between electrodes because the amount of plating solution between the discharge surfaces is insufficient, especially the pressure difference between the front and back of the steel strip becomes significant due to insufficient amount of plating solution on the side where the adsorption phenomenon is about to occur. Cannot be fully realized.
そこで、本発明は鋼帯の表側、裏側での圧力差を最小化して高速通板時のメッキ液流を安定化させて鋼帯と電極が接触することなく、高速域でも鋼帯を安定通板させることができる竪型電解処理装置のエッジマスク装置を提供するものである。 Therefore, the present invention minimizes the pressure difference between the front and back sides of the steel strip, stabilizes the plating solution flow during high-speed feeding, and prevents the steel strip and electrodes from contacting each other, allowing the steel strip to pass stably even at high speeds. The present invention provides an edge mask device for a saddle-type electrolytic processing apparatus that can be plated.
本発明はエッジマスクを備えた竪型電解処理装置において、放電面間の電解液流を安定化させるため、鋼帯のライン速度によって電解液の流路となる電極両サイドの開口面積を規定することにより、電極両サイドからの電解液流れを確保するものである。 In the vertical electrolytic processing apparatus having an edge mask, the present invention defines an opening area on both sides of an electrode serving as a flow path for an electrolytic solution by a line speed of a steel strip in order to stabilize an electrolytic flow between discharge surfaces. This ensures the electrolyte flow from both sides of the electrode.
本発明は、竪型電解処理装置の電解処理タンク内で鋼帯の両縁をエッジマスクで覆って電極間を走行させて鋼帯を連続的に電解処理する竪型電解処理装置のエッジマスク装置において、電解液の流路となる電極両サイドの開口面積/電極間断面積(ここで、電極間断面積:エッジマスクがない場合の電極両サイドからの電解液流入面積、開口面積:電極間断面積−エッジマスクで妨げられる電極両サイドからの電解液流入面積)で表す開口率Rがライン速度Vの関数として規定されていることを特徴とする。 The present invention relates to an edge mask device for a vertical electrolysis apparatus, in which both edges of a steel strip are covered with an edge mask in an electrolytic treatment tank of the vertical electrolysis apparatus, and the steel strip is continuously electrolyzed by running between the electrodes. The opening area on both sides of the electrode serving as the electrolyte flow path / cross-sectional area between the electrodes (where, the cross-sectional area between the electrodes: the area where the electrolyte flows from both sides when there is no edge mask, the opening area: the cross-sectional area between the electrodes− The aperture ratio R expressed by the electrolyte solution inflow area from both sides of the electrode obstructed by the edge mask is defined as a function of the line speed V.
上記構成において、エッジマスクに複数の開口を設け、また、電解タンク内に設置するシンクロールと前記電極との間に鋼帯の両面それぞれに電解液随伴流れ圧力を調整する邪魔板を鋼帯幅方向の位置調整可能に設け、鋼帯厚み方向からの電解液の流路となる電極面の開口率KをK=0.02〜0.35とし、エッジマスク部の開口率Rを規定する関数を、R≧0.0000007V2−0.00006V+0.4693とする。 In the above configuration, the edge mask is provided with a plurality of openings, and the baffle plate for adjusting the electrolyte-associated flow pressure on each side of the steel strip is provided between the sink roll installed in the electrolytic tank and the electrode. A function that regulates the opening ratio R of the edge mask portion with K = 0.02 to 0.35 as the opening ratio K of the electrode surface serving as the electrolyte flow path from the steel strip thickness direction. R ≧ 0.0000007V 2 −0.00006V + 0.4693.
本発明では、鋼帯のライン速度によって電解液の流路となる電極両サイドの開口面積を規定して放電面両サイドからメッキ液の流れを確保することにより放電面間の処理液流量を従来に増して増加させて高速通板時の放電面間の液流不足による鋼帯と電極の接触を防止させ、その結果、高速通板時でも鋼帯と電極が接触することなく鋼帯が安定的に通板ができる。 In the present invention, the flow rate of the treatment liquid between the discharge surfaces is conventionally determined by prescribing the opening area on both sides of the electrode that becomes the flow path of the electrolyte solution by the line speed of the steel strip and ensuring the flow of the plating solution from both sides of the discharge surface. In addition, the steel strip is prevented from coming into contact with the electrode due to insufficient liquid flow between the discharge surfaces during high-speed threading. As a result, the steel band is stable without contact between the steel strip and the electrode even during high-speed threading. Can be passed through.
表1は開口率Rとライン速度V(mpm)の関係において、鋼帯と電極の接触の有無についての試験結果を示す。試験は、電極の開孔率0.03で、電極下部には図3に示すように、邪魔板を設けた連続式の竪型電解装置により実施した。 Table 1 shows the test results regarding the presence or absence of contact between the steel strip and the electrode in the relationship between the aperture ratio R and the line speed V (mpm). The test was carried out with a continuous vertical electrolyzer having an electrode aperture ratio of 0.03 and a baffle plate provided at the lower part of the electrode as shown in FIG.
なお、開孔率Rは開口面積/電極間断面積で表される。ただし、開口面積/電極間断面積において、電極間断面積は、図1(a)のハッチングに示すように、電極間断面積S1はエッジマスクがない場合の電極両サイドからの電解液流入面積であり、開口面積S2は、図1(b)に示すように、電極間断面積−エッジマスク面積S3で、電極間への電解液流入面積である。ただし、エッジマスクに開口がある場合には、開口面積に開口の面積S4が加算され、エッジマスク面積は開孔部分の面積S4を除いた面積である。
表1から明らかなとおり、開孔率が小さくなっていくと、ライン速度が大きくなるにつれて鋼帯と電極が接触する傾向にある。 As is clear from Table 1, as the hole area ratio decreases, the steel strip and the electrode tend to come into contact with each other as the line speed increases.
図2は開口率Rとライン速度V(mpm)の関係をグラフ化したものである。曲線の式はR=0.0000007V2−0.00006V+0.4693である。設定された開口率において、曲線より下の領域のライン速度では鋼帯と電極が接触することになるので、鋼帯と電極の接触を防止するためには、曲線より上の領域にする必要、即ち、R≧0.0000007V2−0.00006V+0.4693を満たす必要がある。この式を満たすことにより、鋼帯5の表側、裏側での圧力差を最小化して鋼帯と電極の接触を防止することができる。
FIG. 2 is a graph showing the relationship between the aperture ratio R and the line speed V (mpm). The equation of the curve is R = 0.0000007V 2 −0.00006V + 0.4693. At the set aperture ratio, the steel strip and the electrode are in contact at the line speed in the region below the curve, so to prevent contact between the steel strip and the electrode, it is necessary to make the region above the curve, That is, it is necessary to satisfy R ≧ 0.0000007V 2 −0.00006V + 0.4693. By satisfying this equation, the pressure difference between the front side and the back side of the
したがって、開口率Rをライン速度Vの関数として規定することにより、鋼帯と電極が接触することのないライン速度を定めることができ、鋼帯を安定通板させることが可能となる。 Therefore, by defining the aperture ratio R as a function of the line speed V, it is possible to determine a line speed at which the steel strip does not come into contact with the electrode, and it is possible to stably feed the steel strip.
1:タンク
2:シンクロール
3:コンダクタロール
4:電極
5:鋼帯
6:邪魔板
7:エッジマスク
8:開口部
1: Tank 2: Sink roll 3: Conductor roll 4: Electrode 5: Steel strip 6: Baffle plate 7: Edge mask 8: Opening
Claims (4)
電解液の流路となる電極両サイドの開口面積/電極間断面積(ここで、電極間断面積:エッジマスクがない場合の電極両サイドからの電解液流入面積、開口面積:電極間断面積−エッジマスクで妨げられる電極両サイドからの電解液流入面積)で表す開口率Rがライン速度Vの関数として規定されていることを特徴とする連続式竪型電解処理設備のエッジマスク装置。 In the edge mask device of the vertical electrolysis apparatus that continuously electrolyzes the steel strip by covering both edges of the steel strip with an edge mask in the electrolytic treatment tank of the vertical electrolysis apparatus and running between the electrodes,
Open area on both sides of electrode serving as electrolyte flow path / cross-sectional area between electrodes (here, cross-sectional area between electrodes: electrolyte inflow area from both sides when no edge mask is provided, open area: cross-sectional area between electrodes-edge mask) An edge mask device for a continuous vertical electrolytic treatment facility, characterized in that an aperture ratio R expressed by an electrolytic solution inflow area from both sides of the electrode) is defined as a function of the line speed V.
R≧0.0000007V2−0.00006V+0.4693
であることを特徴とする請求項1、2又は3記載の連続式竪型電解処理設備のエッジマスク装置。 The function of the aperture ratio R is
R ≧ 0.0000007V 2 −0.00006V + 0.4693
The edge mask device for a continuous vertical electrolytic treatment facility according to claim 1, 2, or 3.
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WO2016093460A1 (en) * | 2014-12-12 | 2016-06-16 | 주식회사 포스코 | Edge mask of horizontal cell electroplating apparatus and horizontal cell electroplating apparatus comprising same |
Citations (6)
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JPH0325566A (en) * | 1989-06-23 | 1991-02-04 | Hitachi Ltd | Inquiry transaction method for undescribed data in automatic teller machine system |
JPH0325566U (en) * | 1989-07-18 | 1991-03-15 | ||
JPH0397895A (en) * | 1989-09-11 | 1991-04-23 | Nippon Steel Corp | Vertical type electrolytic treating device |
JPH07278885A (en) * | 1994-04-14 | 1995-10-24 | Kawasaki Steel Corp | Edge mask of horizontal type continuous electrolytic treatment device |
JPH11323596A (en) * | 1998-05-18 | 1999-11-26 | Sumitomo Metal Ind Ltd | Continuous electroplating method and continuous electroplating apparatus |
JP2002294494A (en) * | 2001-04-03 | 2002-10-09 | Nippon Steel Corp | Vertical electrolysis apparatus |
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Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH0325566A (en) * | 1989-06-23 | 1991-02-04 | Hitachi Ltd | Inquiry transaction method for undescribed data in automatic teller machine system |
JPH0325566U (en) * | 1989-07-18 | 1991-03-15 | ||
JPH0397895A (en) * | 1989-09-11 | 1991-04-23 | Nippon Steel Corp | Vertical type electrolytic treating device |
JPH07278885A (en) * | 1994-04-14 | 1995-10-24 | Kawasaki Steel Corp | Edge mask of horizontal type continuous electrolytic treatment device |
JPH11323596A (en) * | 1998-05-18 | 1999-11-26 | Sumitomo Metal Ind Ltd | Continuous electroplating method and continuous electroplating apparatus |
JP2002294494A (en) * | 2001-04-03 | 2002-10-09 | Nippon Steel Corp | Vertical electrolysis apparatus |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2016093460A1 (en) * | 2014-12-12 | 2016-06-16 | 주식회사 포스코 | Edge mask of horizontal cell electroplating apparatus and horizontal cell electroplating apparatus comprising same |
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