JPH05171495A - Vertical jet plating device - Google Patents

Vertical jet plating device

Info

Publication number
JPH05171495A
JPH05171495A JP33889991A JP33889991A JPH05171495A JP H05171495 A JPH05171495 A JP H05171495A JP 33889991 A JP33889991 A JP 33889991A JP 33889991 A JP33889991 A JP 33889991A JP H05171495 A JPH05171495 A JP H05171495A
Authority
JP
Japan
Prior art keywords
electrode
strip
pressure equalizing
electrolytic solution
vertical jet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP33889991A
Other languages
Japanese (ja)
Other versions
JP2588454B2 (en
Inventor
Kiyohide Tsuchiya
清秀 土屋
Michihiro Shimamura
美智広 嶋村
Shuji Masuda
修司 増田
Katsuaki Nakagawa
勝明 中川
Kazuhiro Marumo
和裕 丸茂
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Corp
Nippon Steel Plant Designing Corp
Original Assignee
Nittetsu Plant Designing Corp
Nippon Steel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nittetsu Plant Designing Corp, Nippon Steel Corp filed Critical Nittetsu Plant Designing Corp
Priority to JP33889991A priority Critical patent/JP2588454B2/en
Priority to US07/948,180 priority patent/US5236566A/en
Priority to EP92116194A priority patent/EP0534368B1/en
Priority to DE69218708T priority patent/DE69218708T2/en
Publication of JPH05171495A publication Critical patent/JPH05171495A/en
Application granted granted Critical
Publication of JP2588454B2 publication Critical patent/JP2588454B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PURPOSE:To eliminate a defective product by providing an electrolyte feed nozzle to the vertical jet plating device and a pressure equalizing chamber, an electrode box and a waste liq. box to an electrode and furnishing a sealing device for preventing the outflow of electrolyte. CONSTITUTION:A metallic strip is traveled between the electrodes opposed at a specified interval in the vertical jet electroplating device, and a nozzle for supplying an electrolyte between the electrodes and a side seal are provided on both ends of the electrode in the cross direction. Pressure equalizing chambers 7 band 7', an electrode box 13 pierced with many through-holes and a waste liq. box 12 for the electrolyte from between the electrodes are provided on the rear of the electrode, and a sealing device for preventing the outflow of electrolyte is furnished at the lowermost part of the device. Consequently, a strip is not vibrated, and a product, which is not bent or wrinkled, is obtained.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、金属ストリップ表面に
錫、クロム等を電解メッキする竪型噴流メッキ装置に関
するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vertical jet plating apparatus for electrolytically plating tin, chromium or the like on the surface of a metal strip.

【0002】[0002]

【従来の技術】ストリップに電解メッキを施す竪型電解
メッキ装置において、高い電流密度で電解メッキを行う
ための技術が数多く開示されている。例えば、特公平3
−35395号公報においては、図9に示す通り、スト
リップ2と電極18間に電解液を供給し、ストリップと
電解液との間に攪拌効果を与え、高い電流密度を得る方
法が提案されている。
2. Description of the Related Art A number of techniques have been disclosed for performing electrolytic plating at a high current density in a vertical electrolytic plating apparatus for electrolytically plating a strip. For example, Tokuhei 3
In JP-A-35395, as shown in FIG. 9, a method is proposed in which an electrolytic solution is supplied between the strip 2 and the electrode 18 to give a stirring effect between the strip and the electrolytic solution to obtain a high current density. ..

【0003】[0003]

【発明が解決しようとする課題】電解メッキ装置におい
て高電流密度で電解メッキを行うためには、メッキ界面
に金属イオンを効率よく供給し、かつ高電流密度電解に
よって生じる大量のガスを迅速に電極間から除去する必
要がある。しかしながら、従来技術で提案されている電
解メッキ装置では、次のような問題がある。
In order to carry out electrolytic plating at a high current density in an electrolytic plating apparatus, metal ions are efficiently supplied to the plating interface, and a large amount of gas generated by high current density electrolysis is rapidly fed to the electrode. It needs to be removed from the gap. However, the electrolytic plating apparatus proposed in the prior art has the following problems.

【0004】(1)電解液を電極へ給液する給液ノズル
部や電極間部等において、圧力変動が生じストリップが
電極と接触したり(短絡)、ストリップが振動(バタツ
キ現象)するため製品に疵や折れが生じる。特に、スト
リップの厚さが0.25mm以下の如き薄手サイズでは
その影響が顕著に見られる。 (2)上記(1)において、ストリップの走行速度が速
くなると、電解メッキによって生じるガスがストリップ
によって引きずられ、ガスが電極部から抜けきらずメッ
キ不良を生じる。
(1) In the liquid supply nozzle portion for supplying the electrolytic solution to the electrodes, the inter-electrode portion, etc., pressure fluctuations occur and the strip comes into contact with the electrodes (short circuit) or the strip vibrates (flutters). Defects and breakage occur. In particular, the influence is remarkable when the strip is thin and has a thickness of 0.25 mm or less. (2) In the above (1), when the traveling speed of the strip becomes high, the gas generated by the electrolytic plating is dragged by the strip, and the gas does not escape from the electrode portion, resulting in defective plating.

【0005】(3)電解液の流れがストリップ幅方向に
おいて不均一なために、メッキ厚さやメッキ品質が不均
一となる。 本発明は、このような従来技術の問題点を解消するため
に提案されたもので、その主な目的は、メッキの高品質
化、高能率化を図るため、電極内の電解液の流速を速く
し、かつストリップ表裏面および幅方向の流速を均一化
し、電流密度を高め、また電力消費量を極力少なくでき
るように、ストリップの振動(バタツキ現象)を僅少に
し、ストリップの電極への吸着現象を阻止できる竪型噴
流メッキ装置を提供することにある。
(3) Since the flow of the electrolytic solution is nonuniform in the strip width direction, the plating thickness and the plating quality are nonuniform. The present invention has been proposed in order to solve the problems of the prior art, and its main purpose is to improve the flow rate of the electrolyte solution in the electrode in order to improve the quality and efficiency of plating. The vibration of the strip (flapping phenomenon) is minimized so that the flow velocity in the front and back surfaces of the strip and in the width direction can be made uniform, the current density can be increased, and the power consumption can be minimized. It is to provide a vertical jet plating device capable of preventing the above.

【0006】[0006]

【課題を解決するための手段】上記課題を解決するため
の本発明の要旨とするところは下記のとおりである。 (1)所定の間隔を置いて対向して配設した電極間にス
トリップを走行させて電解メッキを行う竪型噴流メッキ
装置において、電極間へ電解液を供給する給液ノズル
と、電極幅方向の両端部にサイドシールを配設するとと
もに、電極の背面側に均圧室を設け、その均圧室へ導通
する多数の貫通穴を電極に設けた電極ボックスと、電極
間から排出される電解液を集積し排出する排液ボックス
を有する排液装置と、竪型噴流メッキ装置の最下部に設
けた電解液の流出を防止するシール装置とで構成したこ
とを特徴とする竪型噴流メッキ装置。
Means for Solving the Problems The gist of the present invention for solving the above problems is as follows. (1) In a vertical jet plating apparatus for performing electrolytic plating by running a strip between electrodes arranged facing each other with a predetermined gap, a liquid supply nozzle for supplying an electrolytic solution between electrodes and an electrode width direction. The side seals are provided at both ends of the electrode, the pressure equalizing chamber is provided on the back side of the electrode, and the electrode box is provided with a large number of through holes for conducting to the pressure equalizing chamber. A vertical jet plating apparatus comprising a drainage device having a drainage box for accumulating and discharging the liquid, and a seal device provided at the bottom of the vertical jet plating device for preventing the outflow of the electrolytic solution. ..

【0007】(2)電極ボックスの上部もしくは下部に
設けた給液ノズルを少なくとも2つ以上のノズル室に仕
切り壁で分割し、1次ノズル室の両側に給液口をそれぞ
れ設け、各ノズル室間の仕切り壁に中央から両側へ漸増
する隙間を有するスリットを設けたことを特徴とする前
項1記載の竪型噴流メッキ装置。 (3)電極ボックスの上部もしくは下部に設けた排液ボ
ックスと、排液口と、排液ボックスの内部に設けたスト
リップを包囲する隔壁と、その隔壁に多数の貫通穴を有
する排液装置を設けたことを特徴とする前項1記載の竪
型噴流メッキ装置。
(2) The liquid supply nozzle provided on the upper part or the lower part of the electrode box is divided into at least two or more nozzle chambers by partition walls, and liquid supply ports are provided on both sides of the primary nozzle chamber. The vertical jet plating apparatus according to item 1, wherein the partition wall is provided with a slit having a gap that gradually increases from the center to both sides. (3) A drainage box provided on the upper or lower part of the electrode box, a drainage port, a partition wall surrounding the strip provided inside the drainage box, and a drainage device having a large number of through holes in the partition wall. The vertical jet plating apparatus according to item 1 above, which is provided.

【0008】(4)電極背面側に各々設けた均圧室と、
その各々の均圧室とを導通する導通部を設けたことを特
徴とする前項1記載の竪型噴流メッキ装置。 (5)電極背面側に各々設けた均圧室に少量の電解液を
供給する均圧室電解液供給装置を設けたことを特徴とす
る前項1記載の竪型噴流メッキ装置。
(4) Pressure equalizing chambers provided on the back side of the electrodes,
The vertical jet plating apparatus according to the above item 1, further comprising a conducting portion that conducts with each of the pressure equalizing chambers. (5) The vertical jet plating apparatus according to item 1, wherein a pressure equalizing chamber electrolytic solution supply device for supplying a small amount of electrolytic solution is provided in each pressure equalizing chamber provided on the back side of the electrode.

【0009】[0009]

【作用】本発明は前記のように給液ノズルと、電極ボッ
クスと、排液装置と、下部シール装置で構成しているの
で、1組の竪型噴流メッキ装置に対して電解液の循環が
単独に制御できるので各々の竪型噴流メッキ装置の流速
制御が行いやすく、かつ従来の特公平3−35393号
公報に示すように下部排液側に回転シールを設けたもの
は排液量の調整が非常に難しく、適正な流速や流速分布
を得ることができなかったものが、本発明のように排液
装置を設けることにより排液量の調整が容易となり、適
正な流速や流速分布を得ることができるようになった。
Since the present invention is composed of the liquid supply nozzle, the electrode box, the drainage device, and the lower sealing device as described above, the circulation of the electrolytic solution can be performed with respect to one set of vertical jet plating devices. Since it can be controlled independently, it is easy to control the flow rate of each vertical jet plating device, and as shown in Japanese Patent Publication No. 3-35393 of the prior art, the one in which the rotary seal is provided on the lower drain side adjusts the amount of drainage. It was very difficult to obtain an appropriate flow velocity and flow velocity distribution, but by providing a drainage device as in the present invention, it becomes easy to adjust the drainage amount and obtain an appropriate flow velocity and flow velocity distribution. I was able to do it.

【0010】また、排液装置の下部および給液ノズルの
下部にシール装置を設けているので、電解液のリークが
なく電解液のリークによる流速分布不均一や電解液の液
受け槽への量を大幅に軽減できるようになった。そし
て、電極ボックスには電極幅方向の両端部にサイドシー
ルを配設するとともに、電極の背面側に均圧室を設け、
その均圧室へ導通する多数の貫通穴を電極に設け、かつ
その各々の均圧室とを導通する導通部を設けたので、ス
トリップの振動(バタツキ)およびストリップの電極へ
の吸着現象を阻止できるようになった。
Further, since the sealing device is provided in the lower part of the drainage device and the lower part of the liquid supply nozzle, there is no leakage of the electrolytic solution, the flow velocity distribution is non-uniform due to the leakage of the electrolytic solution, and the amount of the electrolytic solution into the liquid receiving tank. Can be significantly reduced. Then, the electrode box is provided with side seals at both ends in the electrode width direction, and a pressure equalizing chamber is provided on the back side of the electrode,
A large number of through holes are provided in the electrode for conduction to the pressure equalizing chamber, and a conducting portion is provided for conducting to each of the pressure equalizing chambers, so that vibration of the strip (flapping) and adsorption of the strip to the electrode are prevented. I can do it.

【0011】このストリップが振動(バタツキ現象)し
たり、電極への吸着現象を阻止できることを、本発明者
等は次のような実験を行い確認した。実験では、ストリ
ップと相対して電極を配置させ、電極内に水を吹き込
み、電極内の液圧変動およびストリップの振幅を計測し
た結果、表1の通りであった。
The present inventors have conducted the following experiments and confirmed that this strip can prevent vibration (flapping phenomenon) and adsorption phenomenon to the electrode. In the experiment, the electrode was arranged opposite to the strip, water was blown into the electrode, and the fluctuation of the hydraulic pressure in the electrode and the amplitude of the strip were measured.

【0012】[0012]

【表1】 [Table 1]

【0013】上記実験から、電極に穴がない場合(テス
トNo.1)は、電極内の圧力変動値が大きく、ストリ
ップの振幅も大きい。これに対し電極に穴をあけ、均圧
室を設けた場合(テストNo.2)はストリップの振幅
が極めて小さいことをつきとめた。即ち、テストNo.
1では、電極内の圧力変動がストリップに作用し、振動
を与えたものである。これに対し、テストNo.2で
は、圧力変動値が大きく減衰しており、ストリップの振
幅が極めて小さくなっている。このように、電極に多数
の貫通穴を設け、均圧室と導通させることにより、電極
内の圧力変動を均圧室側へ分散させることができた。
From the above experiment, when there is no hole in the electrode (Test No. 1), the pressure fluctuation value in the electrode is large and the amplitude of the strip is also large. On the other hand, when the electrode was perforated and a pressure equalizing chamber was provided (Test No. 2), it was found that the amplitude of the strip was extremely small. That is, the test No.
In No. 1, the pressure fluctuation in the electrode acts on the strip to give vibration. On the other hand, the test No. In No. 2, the pressure fluctuation value is greatly attenuated, and the amplitude of the strip is extremely small. In this way, by providing a large number of through holes in the electrode and conducting the pressure equalizing chamber, it was possible to disperse the pressure fluctuation in the electrode to the pressure equalizing chamber side.

【0014】次に、ストリップの電極への吸着現象につ
いては、上記ストリップの振動に加えて、電極に対し、
ストリップの表面をA室、裏面をB室とすれば、A室の
圧力(PA)とB室の圧力(PB)との圧力差が生じる
と発生する。例えば、PA>PBの場合はストリップは
B室側へ移行する。以上のような観点から、電極内の変
動圧を小さくさせ、かつ電極表裏の圧力差を小さくさせ
る方法として、電極背面に各々設けた均圧室を導通させ
る導通部を設けた。
Next, regarding the phenomenon of adsorption of the strip to the electrode, in addition to the vibration of the strip,
If the front surface of the strip is the chamber A and the back surface is the chamber B, it occurs when the pressure difference between the chamber pressure (PA) and the chamber pressure (PB) occurs. For example, when PA> PB, the strip moves to the B room side. From the above viewpoints, as a method of reducing the fluctuating pressure in the electrode and reducing the pressure difference between the front and back of the electrode, the conducting portion for conducting the pressure equalizing chambers provided on the back surface of the electrode is provided.

【0015】次に、給液ノズルを少なくとも2つ以上の
ノズル室に仕切り壁で分割し、1次ノズル室の両側に給
液口をそれぞれ設け、各ノズル室間の仕切り壁に中央か
ら両側へ漸増する隙間を有するスリットを設けたので、
電解液の乱流を整流とし、電解液の流速をストリップの
幅方向は勿論のことストリップの表裏をも均一にでき、
メッキ厚さおよびメッキ品質を均一にできる。さらに、
電極ボックスの上部もしくは下部に設けた排液ボックス
と、排液口と、排液ボックスの内部に設けたストリップ
を包囲する隔壁と、その隔壁に多数の貫通穴を有する排
液装置を設けたので、排液の流速をストリップの幅方向
は勿論のことストリップの表裏をも均一にできる。
Next, the liquid supply nozzle is divided into at least two or more nozzle chambers by partition walls, liquid supply ports are provided on both sides of the primary nozzle chamber, and the partition walls between the nozzle chambers are arranged from the center to both sides. Since a slit with a gradually increasing gap is provided,
The turbulent flow of the electrolytic solution is rectified, and the flow rate of the electrolytic solution can be made uniform not only in the width direction of the strip but also on the front and back of the strip.
The plating thickness and plating quality can be made uniform. further,
Since a drainage box provided above or below the electrode box, a drainage port, a partition wall surrounding the strip provided inside the drainage box, and a drainage device having a large number of through holes in the partition wall are provided. It is possible to make the drainage flow velocity uniform not only in the width direction of the strip but also on the front and back of the strip.

【0016】そして、電極ボックスについて述べたと同
様に隔壁にも多数の貫通穴を設けているので、ストリッ
プの振動(バタツキ)およびストリップの電極への吸着
現象を排液装置の部分でも阻止できるようになった。ま
た、電極ボックスの電極背面側に各々設けた均圧室に少
量の電解液を供給する均圧室電解液供給装置を設けたの
で、均圧室の圧力変動がさらに僅少になることが本発明
者等の実験で確認できた。そして、均圧室の電解液を新
しい電解液に逐次交換することも可能となった。
Since a large number of through holes are provided in the partition wall as described for the electrode box, the strip vibration (flapping) and the adsorption phenomenon of the strip to the electrode can be prevented even in the drainage device. became. Further, since the pressure equalizing chamber electrolytic solution supply device for supplying a small amount of electrolytic solution is provided in the pressure equalizing chambers respectively provided on the electrode back side of the electrode box, it is possible that the pressure fluctuation in the pressure equalizing chamber is further reduced. It was confirmed by the experiment of the person. Then, it became possible to successively replace the electrolytic solution in the pressure equalizing chamber with a new electrolytic solution.

【0017】[0017]

【実施例】以下、本発明を図面に基づいて説明する。本
発明がこの実施例に限定されないことはいうまでもな
い。 (1)図1、図2および図3に示すように、ストリップ
2はコンダクターロール3、3′によって陰極に通電さ
れ、実線の矢印方向に走行する。給液ノズル4、4′
は、電極5、5′の長手方向のストリップ2の出口側に
配設し電解液を給液する。電極5、5′の背面側には均
圧室7、7′を設け、さらに均圧室7、7′へ向かって
多数の貫通穴を設けるとともに、均圧室7、7′のA室
とB室とを導通させる。
DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the drawings. Needless to say, the present invention is not limited to this embodiment. (1) As shown in FIGS. 1, 2 and 3, the strip 2 is energized to the cathode by the conductor rolls 3 and 3'and runs in the direction of the solid arrow. Liquid supply nozzle 4, 4 '
Is arranged on the outlet side of the strip 2 in the longitudinal direction of the electrodes 5 and 5'to supply the electrolytic solution. Pressure equalizing chambers 7 and 7'are provided on the back side of the electrodes 5 and 5 ', and a large number of through holes are provided toward the pressure equalizing chambers 7 and 7', and the pressure equalizing chambers 7 and 7'are connected to the chamber A. Conduct electrical connection with room B.

【0018】電極の貫通穴の大きさは電極面とストリッ
プ中心との距離(h)の1〜10倍とし、電極の穴の全
面積は電極の全面積の約5〜10%とするのが適当であ
る。穴のピッチは電極面とストリップ中心との距離
(h)の5〜20倍とし、電極面とストリップ中心との
距離(h)は15mmとした。電極間距離はその2倍の
距離(2h)30mmとなる。
The size of the through hole of the electrode is 1 to 10 times the distance (h) between the electrode surface and the center of the strip, and the total area of the electrode hole is about 5 to 10% of the total area of the electrode. Appropriate. The hole pitch was 5 to 20 times the distance (h) between the electrode surface and the strip center, and the distance (h) between the electrode surface and the strip center was 15 mm. The distance between the electrodes is 30 mm, which is twice the distance (2 h).

【0019】均圧室7、7′の奥行き距離(b)は20
〜60mmとし、電極面とストリップ中心との距離
(h)の約2〜4倍としている。さらに、均圧室7、
7′のA室とB室とは導通部Dを一対の電極の両側に設
けている。なお、図3では導通部を均圧室と共通のボッ
クスに収納しているが、導通部を配管等でつなぐ構成と
してもかまわない。
The depth distance (b) of the pressure equalizing chambers 7 and 7'is 20.
˜60 mm, which is about 2 to 4 times the distance (h) between the electrode surface and the center of the strip. Furthermore, the pressure equalizing chamber 7,
The chambers A and B of 7'are provided with conducting portions D on both sides of a pair of electrodes. Note that, in FIG. 3, the conducting portion is housed in the same box as the pressure equalizing chamber, but the conducting portion may be connected by a pipe or the like.

【0020】サイドシール6は電極幅方向の両端部に設
けられ、電極5、5′と均圧室7、7′とに仕切られ
る。均圧室7、7′の上部には、通気穴10を設け、均
圧室内のガスを大気へ放出させる。上部排液装置8は電
極5の上部に、また下部排液装置8′は電極5′の下部
に設けられ、これらの排液装置はストリップと対面して
多数の穴11を有する隔壁(8−1、8′−1)で仕切
られている。
The side seals 6 are provided at both ends in the electrode width direction and are divided into the electrodes 5 and 5'and the pressure equalizing chambers 7 and 7 '. Vent holes 10 are provided above the pressure equalizing chambers 7 and 7'to allow the gas in the pressure equalizing chambers to be released to the atmosphere. The upper drainage device 8 is provided above the electrode 5, and the lower drainage device 8'is provided below the electrode 5 ', and these drainage devices face the strip and have a partition wall (8- It is divided by 1, 8'-1).

【0021】シール装置9、9′は、給液ノズル4およ
び下部排液装置8′の下部に設けられており、ストリッ
プ1を挟持する回転自在なダムロール9−1とシール板
9−2で構成されている。なお、実施例ではダムロール
9−1とシール板9−2との組み合わせを提案したが、
例えばゴム状のシール板をストリップに直接押し当てる
(図示しない)等電解液を貯溜できるものであれば差し
支えない。
The sealing devices 9 and 9'are provided below the liquid supply nozzle 4 and the lower drainage device 8 ', and are composed of a rotatable dam roll 9-1 for sandwiching the strip 1 and a sealing plate 9-2. Has been done. Although the combination of the dam roll 9-1 and the seal plate 9-2 is proposed in the embodiment,
For example, a rubber-like seal plate may be directly pressed against the strip (not shown) as long as the electrolyte solution can be stored.

【0022】(2)なお、電解液の流れ方向とストリッ
プの進行方向との関係から、電解液をストリップ進行方
向と対向した向きに流すと、ストリップの表面を電解液
で攪拌する作用があり、電解液をストリップ進行方向と
同一方向に流すと、電解によって生じるガスがストリッ
プの進行に拘束されることがなく、排出を容易にする作
用がある。
(2) Because of the relationship between the flow direction of the electrolytic solution and the traveling direction of the strip, when the electrolytic solution is caused to flow in the direction opposite to the traveling direction of the strip, there is an action of stirring the surface of the strip with the electrolytic solution. When the electrolytic solution is caused to flow in the same direction as the direction of travel of the strip, the gas generated by electrolysis is not restricted by the progress of the strip and has the effect of facilitating discharge.

【0023】このため、前記の実施例ではストリップ2
の進行方向を図1の実線矢印で示したようにし、電解液
をストリップ進行方向と対向した向きに流すことで説明
したが、操業条件、装置構成、電解液供給および排液管
の配置上等の種々の条件から、図1の破線矢印で示すよ
うに、電解液の流れをストリップ進行方向と同一方向に
してもかまわないし、また図7、図8に示すように電解
液の流れをストリップ進行方向に対して対向する方向
と、ストリップ進行方向に対して同一方向の両方の組み
合わせを採用してもかまわない。
Therefore, in the above embodiment, the strip 2
1 is indicated by the solid line arrow in FIG. 1, and the electrolytic solution is caused to flow in the direction opposite to the strip advancing direction. However, in terms of operating conditions, device configuration, electrolytic solution supply and drain pipe arrangement, etc. Under various conditions, the flow of the electrolytic solution may be the same as the strip advancing direction as shown by the broken line arrow in FIG. 1, and the flow of the electrolytic solution may be strip advancing as shown in FIGS. 7 and 8. A combination of both the direction opposite to the direction and the same direction as the strip advancing direction may be adopted.

【0024】この図7および図8については、先ず図7
は給液ノズル4、4′の配置を電極下部のみとしたもの
であり、図8は給液ノズル4、4′の配置を電極上部の
みとしたものである。 (3)図4および図5に示すように、電解液は給液管よ
り給液口4−1に導入される。給液ノズル4、4は1次
ノズル室4−2と2次ノズル室4−3とに、仕切り壁4
−4により分離される。さらに、仕切り壁4−4の流路
をノズル中央(4−5)を端部(4−6)より狭くテー
パー状にする。スリットの寸法は中央部(4−5)で約
10mm、端部(4−6)で約30mmとするのが適当
である。電解液は噴流口4−7を通じて電極5、5へ給
液される。
Regarding FIGS. 7 and 8, first, FIG.
In FIG. 8, the liquid supply nozzles 4, 4'are arranged only under the electrodes, and in FIG. 8, the liquid supply nozzles 4, 4'are arranged only over the electrodes. (3) As shown in FIGS. 4 and 5, the electrolytic solution is introduced into the liquid supply port 4-1 from the liquid supply pipe. The liquid supply nozzles 4 and 4 are divided into a primary nozzle chamber 4-2 and a secondary nozzle chamber 4-3, and a partition wall 4
Separated by -4. Further, the flow path of the partition wall 4-4 is tapered so that the nozzle center (4-5) is narrower than the end portion (4-6). Suitably, the slit has a size of about 10 mm at the central portion (4-5) and about 30 mm at the end portion (4-6). The electrolytic solution is supplied to the electrodes 5 and 5 through the jet holes 4-7.

【0025】本発明の給液ノズルを適用することによ
り、図6に示すようにストリップ幅に対する電解液の流
速分布が従来法に比べ、著しく向上していることが判
る。 (4)図1の23は均圧室へ少量の電解液を供給する均
圧室電解液供給装置で、給液ノズルから電極間に流す電
解液の約1/10〜1/50の流量を各均圧室へ供給す
る。
By applying the liquid supply nozzle of the present invention, it can be seen that the flow velocity distribution of the electrolytic solution with respect to the strip width is significantly improved as compared with the conventional method as shown in FIG. (4) Reference numeral 23 in FIG. 1 is a pressure equalizing chamber electrolytic solution supply device for supplying a small amount of electrolytic solution to the pressure equalizing chamber. Supply to each pressure equalizing chamber.

【0026】[0026]

【発明の効果】以上、実施例について説明したが、本発
明によれば次のような効果がある。第1に、狭い電極内
にメッキ液を強制的に供給する竪型噴流メッキ装置にお
いて、ストリップの振動を解消させ、折れや皺等が入ら
ない製品を得ることができる。特に、ストリップ厚さが
0.25mm以下の如き薄手サイズを走行させる場合
は、その効果は大きい。
Although the embodiments have been described above, the present invention has the following effects. First, in a vertical jet plating apparatus that forcibly supplies a plating solution into a narrow electrode, it is possible to eliminate vibration of the strip and obtain a product that is free from breakage or wrinkles. In particular, when running a thin size such as a strip thickness of 0.25 mm or less, the effect is great.

【0027】第2に、高い電極内流速を得ることが可能
となり、電流密度のアップに伴い、高能率のメッキがで
き、メッキ装置の数を大幅に低減させることができる。
第3に、ストリップの振動(バタツキ)や電極への吸い
付きという問題が解消できるため、電極間距離を従来の
100mm程度から20〜40mmと狭めることがで
き、電極間へ供給する電解液の流量を減じることができ
ると同時に、狭い電極間距離によるメッキ電力の削減が
可能となる。
Secondly, it becomes possible to obtain a high flow velocity in the electrode, and as the current density increases, highly efficient plating can be performed and the number of plating devices can be greatly reduced.
Thirdly, since the problems of vibration of the strip (fluttering) and sticking to the electrodes can be solved, the distance between the electrodes can be narrowed from about 100 mm to 20 to 40 mm, and the flow rate of the electrolytic solution supplied between the electrodes can be reduced. At the same time, it is possible to reduce the plating power due to the narrow distance between the electrodes.

【0028】第4に、電解液の流速が電極内で均一とな
ることにともない、メッキ厚さおよびメッキ品質を均一
にすることができる。
Fourth, since the flow rate of the electrolytic solution becomes uniform in the electrode, the plating thickness and plating quality can be made uniform.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の実施例を示す側部縦断面図である。FIG. 1 is a side vertical sectional view showing an embodiment of the present invention.

【図2】図1のA−A断面図である。FIG. 2 is a sectional view taken along line AA of FIG.

【図3】図1のB−B断面図である。FIG. 3 is a sectional view taken along line BB of FIG.

【図4】本発明の給液ノズルの縦断面図である。FIG. 4 is a vertical sectional view of a liquid supply nozzle of the present invention.

【図5】図4のC−C断面図である。5 is a sectional view taken along line CC of FIG.

【図6】ストリップ幅と流速の関係図である。FIG. 6 is a diagram showing the relationship between strip width and flow velocity.

【図7】給液ノズルを電極下部のみとした実施例を示す
側部縦断面図である。
FIG. 7 is a side vertical cross-sectional view showing an embodiment in which the liquid supply nozzle is provided only on the lower part of the electrode.

【図8】給液ノズルを電極上部のみとした実施例を示す
側部縦断面図である。
FIG. 8 is a vertical sectional side view showing an embodiment in which the liquid supply nozzle is provided only on the upper part of the electrode.

【図9】従来のメッキ装置の側部縦断面図である。FIG. 9 is a vertical sectional side view of a conventional plating apparatus.

【符号の説明】[Explanation of symbols]

1 液受け槽 2 ストリップ 3、3′ コンダクターロール 4、4′ 給液ノズル 4−1 給液口 4−2 給液ノズルの1次ノズル室 4−3 給液ノズルの2次ノズル室 4−4 給液ノズルの仕切り壁 4−5 中央スリット 4−6 端部スリット 4−7 給液ノズルの噴流口 5、5′ 電極 6、6′ サイドシール 7、7′ 均圧室 8 上部排液装置 8′ 下部排液装置 8−1 上部排液装置の隔壁 8′−1 下部排液装置の隔壁 9、9′ シール装置 9−1 シール装置のダムロール 9−2 シール装置のシール板 10 通気穴 11 隔壁貫通穴 12 排液ボックス 13 電極ボックス 14 排液口 15 給液口 16 給液管 17 給液ノズル 18 電極 19 ダムロール 20 連結体 21 回転シール 22 リップ 23 均圧室電解液供給装置 DESCRIPTION OF SYMBOLS 1 Liquid receiving tank 2 Strip 3, 3'conductor roll 4, 4 'Liquid supply nozzle 4-1 Liquid supply port 4-2 Primary nozzle chamber of liquid supply nozzle 4-3 Secondary nozzle chamber of liquid supply nozzle 4-4 Partition wall of liquid supply nozzle 4-5 Central slit 4-6 End slit 4-7 Jet port of liquid supply nozzle 5, 5'electrode 6, 6'side seal 7, 7'pressure equalizing chamber 8 upper drainage device 8 ′ Lower drainage device 8-1 Partition wall of upper drainage device 8′-1 Partition wall of lower drainage device 9, 9 ′ Seal device 9-1 Dam roll of sealing device 9-2 Seal plate of sealing device 10 Vent hole 11 Partition wall Through hole 12 Drain box 13 Electrode box 14 Drain port 15 Liquid feed port 16 Liquid feed pipe 17 Liquid feed nozzle 18 Electrode 19 Dam roll 20 Connector 21 Rotation seal 22 Lip 23 Equal pressure chamber Electrolyte supply device

───────────────────────────────────────────────────── フロントページの続き (72)発明者 増田 修司 福岡県北九州市戸畑区大字中原46番地の59 日鐵プラント設計株式会社内 (72)発明者 中川 勝明 福岡県北九州市戸畑区大字中原46番地の59 日鐵プラント設計株式会社内 (72)発明者 丸茂 和裕 福岡県北九州市戸畑区大字中原46番地の59 日鐵プラント設計株式会社内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Shuji Masuda 59 Nippon Steel Plant Design Co., Ltd., Nakahara 46, Tobata-ku, Kitakyushu, Fukuoka Prefecture (72) Inventor Katsuaki Nakagawa 46, Nakahara, Tobata-ku, Kitakyushu, Fukuoka 59 Nippon Steel Plant Design Co., Ltd. (72) Inventor Kazuhiro Marumugi 59 Nippon Steel Plant Design Co., Ltd. 46 Nakahara, Tobata-ku, Kitakyushu, Fukuoka Prefecture

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 所定の間隔を置いて対向して配設した電
極間にストリップを走行させて電解メッキを行う竪型噴
流メッキ装置において、電極間へ電解液を供給する給液
ノズルと、電極幅方向の両端部にサイドシールを配設す
るとともに、電極の背面側に均圧室を設け、その均圧室
へ導通する多数の貫通穴を電極に設けた電極ボックス
と、電極間から排出される電解液を集積し排出する排液
ボックスを有する排液装置と、竪型噴流メッキ装置の最
下部に設けた電解液の流出を防止するシール装置とで構
成したことを特徴とする竪型噴流メッキ装置。
1. A vertical jet plating apparatus for performing electrolytic plating by running a strip between electrodes arranged facing each other with a predetermined gap, and a liquid supply nozzle for supplying an electrolytic solution between the electrodes, and electrodes. Side seals are provided at both ends in the width direction, a pressure equalizing chamber is provided on the back side of the electrode, and a large number of through-holes are provided in the electrode to connect to the pressure equalizing chamber. A vertical jet stream comprising a drainage device having a drainage box for accumulating and discharging the electrolytic solution and a seal device provided at the bottom of the vertical jet plating device for preventing the outflow of the electrolytic solution. Plating equipment.
【請求項2】 電極ボックスの上部もしくは下部に設け
た給液ノズルを少なくとも2つ以上のノズル室に仕切り
壁で分割し、1次ノズル室の両側に給液口をそれぞれ設
け、各ノズル室間の仕切り壁に中央から両側へ漸増する
隙間を有するスリットを設けたことを特徴とする請求項
1記載の竪型噴流メッキ装置。
2. A liquid supply nozzle provided on an upper part or a lower part of an electrode box is divided into at least two or more nozzle chambers by a partition wall, and liquid supply ports are provided on both sides of the primary nozzle chamber, respectively. 2. The vertical jet plating apparatus according to claim 1, wherein the partition wall is provided with a slit having a gap that gradually increases from the center to both sides.
【請求項3】 電極ボックスの上部もしくは下部に設け
た排液ボックスと、排液口と、排液ボックスの内部に設
けたストリップを包囲する隔壁と、その隔壁に多数の貫
通穴を有する排液装置を設けたことを特徴とする請求項
1記載の竪型噴流メッキ装置。
3. A drainage box provided above or below the electrode box, a drainage port, a partition wall surrounding the strip provided inside the drainage box, and a drainage solution having a large number of through holes in the partition wall. The vertical jet plating apparatus according to claim 1, further comprising an apparatus.
【請求項4】 電極背面側に各々設けた均圧室と、その
各々の均圧室とを導通する導通部を設けたことを特徴と
する請求項1記載の竪型噴流メッキ装置。
4. The vertical jet plating apparatus according to claim 1, further comprising: a pressure equalizing chamber provided on the back side of the electrode and a conducting portion for conducting the respective pressure equalizing chambers.
【請求項5】 電極背面側に各々設けた均圧室に少量の
電解液を供給する均圧室電解液供給装置を設けたことを
特徴とする請求項1記載の竪型噴流メッキ装置。
5. The vertical jet plating apparatus according to claim 1, further comprising a pressure equalizing chamber electrolytic solution supply device for supplying a small amount of electrolytic solution to the pressure equalizing chambers respectively provided on the back surfaces of the electrodes.
JP33889991A 1991-09-24 1991-12-20 Vertical jet plating equipment Expired - Fee Related JP2588454B2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP33889991A JP2588454B2 (en) 1991-12-20 1991-12-20 Vertical jet plating equipment
US07/948,180 US5236566A (en) 1991-09-24 1992-09-21 Vertical type stream plating apparatus
EP92116194A EP0534368B1 (en) 1991-09-24 1992-09-22 Vertical type stream plating plating apparatus
DE69218708T DE69218708T2 (en) 1991-09-24 1992-09-22 Vertical flow plating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33889991A JP2588454B2 (en) 1991-12-20 1991-12-20 Vertical jet plating equipment

Publications (2)

Publication Number Publication Date
JPH05171495A true JPH05171495A (en) 1993-07-09
JP2588454B2 JP2588454B2 (en) 1997-03-05

Family

ID=18322400

Family Applications (1)

Application Number Title Priority Date Filing Date
JP33889991A Expired - Fee Related JP2588454B2 (en) 1991-09-24 1991-12-20 Vertical jet plating equipment

Country Status (1)

Country Link
JP (1) JP2588454B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998014642A1 (en) * 1996-09-30 1998-04-09 Nippon Steel Corporation Electrolysis apparatus having liquid squeezer out of contact with strip
JP2009228023A (en) * 2008-03-19 2009-10-08 Nippon Steel Engineering Co Ltd Vertical jet-stream plating apparatus
JP2011219834A (en) * 2010-04-13 2011-11-04 Nippon Steel Engineering Co Ltd Vertical jet plating apparatus

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998014642A1 (en) * 1996-09-30 1998-04-09 Nippon Steel Corporation Electrolysis apparatus having liquid squeezer out of contact with strip
US6589399B1 (en) 1996-09-30 2003-07-08 Nippon Steel Corporation Electrolysis apparatus having liquid squeezer out of contact with strip
JP2009228023A (en) * 2008-03-19 2009-10-08 Nippon Steel Engineering Co Ltd Vertical jet-stream plating apparatus
JP2011219834A (en) * 2010-04-13 2011-11-04 Nippon Steel Engineering Co Ltd Vertical jet plating apparatus

Also Published As

Publication number Publication date
JP2588454B2 (en) 1997-03-05

Similar Documents

Publication Publication Date Title
US4310403A (en) Apparatus for electrolytically treating a metal strip
JPH1030198A (en) Electroplating device
EP0534368B1 (en) Vertical type stream plating plating apparatus
JPH05171495A (en) Vertical jet plating device
KR890003409B1 (en) Process and apparatus for the continuous electrolytic treatment of a metal strip using horizontal electrodes
EP0964080B1 (en) Electrolysis apparatus having liquid squeezer out of contact with strip
US1970975A (en) Method in the electrodeposition of metals, and cathode suited for such purpose
KR860000419A (en) Continuous Electrolytic Treatment of Metal Strips Using Insoluble Horizontal Electrodes
JPS6121319B2 (en)
JP3302170B2 (en) Vertical electrolytic treatment equipment
JP3402423B2 (en) Method and apparatus for preventing vibration of metal strip in electroplating tank
JP2009228023A (en) Vertical jet-stream plating apparatus
JPS59116398A (en) Horizontal type electroplating cell
JPH03191090A (en) Horizontal electroplating device
JPH036394A (en) Horizontal plating bath
JPS5915997B2 (en) Strip proximity electrolyzer
JP2500967B2 (en) Electrode box
JPS61183495A (en) Continuous plating apparatus
JPS5985892A (en) Electrolytic device for surface traeatment of strip
JPS5985890A (en) Method and device for horizontal electrolytic treatment of metallic strip supported by fluid
JPS61190095A (en) Electroplating installation
JPS6217491Y2 (en)
JPH036395A (en) Horizontal plating bath
JPH08277494A (en) High-efficiency vertical type electroplating device
JPS5943558B2 (en) Etzi bar coat prevention electroplating method and device

Legal Events

Date Code Title Description
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 19960827

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313122

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20081205

Year of fee payment: 12

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20081205

Year of fee payment: 12

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20091205

Year of fee payment: 13

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20101205

Year of fee payment: 14

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20101205

Year of fee payment: 14

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20111205

Year of fee payment: 15

LAPS Cancellation because of no payment of annual fees