JPH08277494A - High-efficiency vertical type electroplating device - Google Patents

Abstract

PURPOSE: To improve gas removability, to eliminate the pressure difference between both surfaces of a strip and to enhance the efficiency of plating by high-speed and stable passage of the strip by providing the electrode inlet side of a device with liquid feed nozzles and the outlet side with sealing plates and wringer rolls. CONSTITUTION: The electrode 3 inlet side is provided with the slit type plating liquid blow nozzles 8 and the flow of the plating liquid between the electrodes 3 is made uniform in both longitudinal and transverse directions, by which the gas removal is improved, the deterioration in quality by air bubbles is prevented and the reduction of an operation cost by the increased resistance of the liquid is attained. The electrode 3 outlet side is provided with the wringer rolls 5 and the sealing plates 6, by which the direction of the plating liquid flowing between the electrodes 3 is changed with the sealing plates 6 and the liquid is discharged in the direction lateral with the progressing direction of the strip 1. The pressure difference between both surfaces of the strip is controlled and the passage of the strip is stabilized by adjusting the angle. The wringer rolls 5 are capable of hermetically sealing the electrode 3 outlet side, thereby making a contribution to the reduction of the operation cost by a decrease in the amt. of the plating liquid to be carried over.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high-efficiency vertical electroplating apparatus for metal strips.

[0002]

2. Description of the Related Art As a method for obtaining high current density and high efficiency production in a vertical electroplating cell, there is, for example, Japanese Patent Laid-Open No.
The proposal described in Japanese Patent No. 239689 is given. this is,
As shown in FIG. 2, the primary liquid supply nozzle 9 and the secondary liquid supply nozzle communicating with the primary liquid supply nozzle 9 blow the plating liquid between the electrodes which are arranged facing each other at a predetermined interval, to reduce the dragout amount of the plating liquid. It is a method of obtaining a high current density by reducing the running cost and giving a stirring effect between the strip and the electrolytic solution while reducing the running cost.

Further, the proposal described in Japanese Patent Laid-Open No. 63-255391 is, as shown in FIG. 3, between a pair of electrodes opposed to each other with a predetermined gap, a plating solution reservoir and a spray installed above the electrodes. This is a method of obtaining a high current density while improving the airtightness of the electrode entrance side by blowing the plating solution from the injection nozzle to suppress the quality deterioration due to air entrainment and the increase in operating cost.

[0004]

However, in the above-mentioned conventional vertical electroplating apparatus, there is a path in which the plating solution blowing direction and the strip advancing direction are opposite to each other. In the figure,
Between both electrodes in FIG. 2 and between the electrodes on the right side in FIG. 3, there is convection of the plating solution between the blowing flow and the strip-associated flow, and stagnation due to the cancellation of the two flows. Occurs. Due to this convection and stagnation, the removal of the electrolytic gas generated during plating to the outside of the cell is hindered, and the gas is retained in the veil. As a result, there is a problem that plating failure due to poor current flow and increase in power cost due to increase in liquid resistance are caused.

These problems become more serious as the line speed increases and the current density increases and the amount of electrolysis gas increases, and in the future, as the plating efficiency increases, the line speed increases and the current density increases. As it advances, conventional vertical electroplating equipment will not be able to handle it.

Further, in the above-mentioned conventional vertical electroplating apparatus, a difference in outgoing liquid resistance due to a sink roll or the like occurs between the electrodes on both sides of the strip, and the resulting pressure difference between the two sides causes the strip to have a low pressure on the electrode surface. There is a problem in that the sticking phenomenon occurs, which hinders the stable passage of the strip. As a result, it has been extremely difficult to reduce the distance between the electrodes. This problem will become more serious as the line speed increases in the future, and the conventional vertical electroplating equipment cannot cope with it.

Therefore, the present invention has a good gas releasing property,
Moreover, it is an object of the present invention to provide a plating apparatus that enables stable strip passage even at a high speed without causing a pressure difference between both surfaces of the strip between electrodes.

[0008]

A feature of the present invention is a downward pass and an upward pass in which a strip 1 is run between electrodes 3 facing each other at a predetermined interval for electroplating. In a vertical electroplating device, a liquid supply nozzle that blows the plating solution from the electrode entrance side in the same direction as the strip advancing direction, a seal plate and a ringer roll on the electrode exit side, and the plating solution with respect to the advancing direction It is to discharge right and left.

Further, the angle between the seal plates on both sides of the strip is changed to change the resistance on the outlet side of the plating solution, thereby controlling the pressure between the both sides of the strip to further stabilize the threaded plate or to conduct the ringer roll to the conductor. It can also be used as a roll to shorten the distance between the conductor roll and the electrode and reduce the stripping resistance to reduce the plating power.

[0010]

The present invention will be described in detail below with reference to the drawings. FIG. 1 is a sectional view of a high efficiency vertical tin plating apparatus showing an embodiment of the present invention. The high-efficiency vertical electroplating apparatus of the present invention mainly comprises an electrode 3, a liquid injection nozzle 8, a seal plate 6, a ringer roll 5, and a conductor roll 4.

By blowing the plating solution from the electrode entrance side in the same direction as the strip advancing direction by the slit nozzle, the flow of the plating solution between the electrodes is made uniform in both the longitudinal direction and the width direction, so that no convection or stagnation occurs. It becomes possible to create a liquid flow and improve the gas release property. As a result, it is possible to prevent quality deterioration due to bubbles and reduce operating costs by increasing liquid resistance.

Further, by installing a seal plate and a ringer roll on the electrode output side, the plating solution flowing between the electrodes is
The flow direction is changed by the seal plate, and the strips are discharged in the left-right direction with respect to the traveling direction. That is, on the electrode output side, the same pressure is generated on both surfaces of the strip, and as a result, it is possible to prevent the sticking phenomenon in which the strip is displaced to the low pressure surface, and it is possible to shorten the distance between the electrodes. This has a great effect on reducing power costs.

Furthermore, when a pressure difference occurs between the strip surfaces due to some reason, the angle of the seal plate with respect to the strip is adjusted to change the liquid discharge resistance on both sides of the strip and control the pressure difference between the two surfaces. This makes it possible to stabilize the threaded plate.

The role of this seal plate is different from the application of the seal plate on the rear surface of the horizontal plating apparatus in the problem to be solved.
When applied to the horizontal type, the purpose is to prevent the strip from bending due to the pool of liquid on the upper surface of the strip, and to apply the present invention to the vertical type, to prevent the strip from sticking due to the pressure difference between the two surfaces of the strip.

Next, by installing a ringer roll, the electrode outlet side can be hermetically sealed, and the operating cost can be reduced by reducing the carry-out amount of the plating solution. An embodiment in which this ringer roll is also used as a conductor roll is shown in FIG. As a result, it is possible to shorten the distance between the conductor roll and the electrode, reduce the resistance due to the strip, and reduce the plating power. The vertical electroplating apparatus of the present invention can be used for any electroplating such as zinc plating and tin plating, and there is no limitation on the plate thickness and the plate width.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIG. The electrode length was 1500 mm, and the electrode-strip distance was 20 to 40 mm in the past. However, the configuration of the present invention shortens the length to 10 mm and the plating power is 20%.
Was reduced.

Next, the seal plate will be described. Since the sealing plate on the electrode output side is in contact with the Ringer roll, it is a vinyl chloride plate, and the width is the same as the roll width and the length is 25
It was set to 0 mm. The same ferrostan bath as the conventional one was used as the plating solution. The ringer roll diameter was 200 mm, and the material was polyurethane resin.

The diameter of the conductor roll is 600 mm. The plating solution discharged from the side surface of the outlet seal plate is
It is stored in the liquid receiving tank 2 and circulates to the liquid injection nozzle via the plating liquid circulation system. The structure of the present invention eliminates the sticking of the strip to the electrode, and the strip running speed is 1000 mpm.
It was possible to improve the appearance of the plating by improving the gas release.

Further, in the embodiment of FIG. 2 in which the ringer roll and the conductor roll are used in common, the conductor roll diameter is 200 mm. This combined use reduced the strip resistance to one-third of the conventional value and reduced the plating power by 50%.

[0020]

The high-efficiency vertical electroplating apparatus having the constitution of the present invention has the following effects. First, in a vertical electroplating apparatus, the plating solution flow can be made uniform and the gas release property can be improved to improve the plating appearance and reduce power consumption. In addition, by eliminating the pressure difference between the two surfaces of the strip, it is possible to perform stable strip-free plate passing, shorten the distance between the electrodes, and thereby reduce the power cost.

[Brief description of drawings]

FIG. 1 is a side sectional view showing an embodiment of the present invention.

FIG. 2 is a side sectional view showing another embodiment of the present invention.

FIG. 3 is a side sectional view of a conventional vertical electroplating apparatus.

FIG. 4 is a side sectional view of another conventional vertical electroplating apparatus.

[Explanation of symbols]

 1 Strip 2 Liquid Receiving Tank 3 Electrode 4 Conductor Roll 5 Ringer Roll 6 Seal Plate 7 Sink Roll 8 Liquid Injecting Nozzle 9 Primary Supply Nozzle 10 Liquid Seal 11 Side Seal 12 Relay Electrolyte Reservoir 12-1 Partition Wall 12-2 Liquid Reservoir 12-3 Communication pipe 12-4 Extraction nozzle 13 Secondary supply nozzle 13-1 Liquid receiver 13-2 Partition wall 14 Electrolyte discharge device 14-1 Discharge partition wall 14-2 Discharge seal 15 Nozzle header 16 Nozzle 17 Gap 18 Backup roll

Claims (3)

[Claims] 1. A vertical electroplating apparatus comprising a downward path and an upward path, in which a strip is run between electrodes arranged facing each other with a predetermined space, and the electroplating is performed on the electrode entrance side. A high-efficiency vertical electroplating apparatus characterized in that a liquid supply nozzle 8 for supplying a liquid in the strip advancing direction is arranged, and a seal plate 6 and a ringer roll 5 are provided on the electrode output side. 2. The high-efficiency vertical electroplating apparatus according to claim 1, wherein the ringer roll and the conductor roll can be used in common. 3. The high-efficiency vertical electroplating, wherein the seal plate according to claim 1 is movable, and the inclination of the plate is adjusted to control the differential pressure between the two surfaces of the strip to enable stable strip passage. apparatus.