JP2006279066A5 - - Google Patents

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Publication number
JP2006279066A5
JP2006279066A5 JP2006157764A JP2006157764A JP2006279066A5 JP 2006279066 A5 JP2006279066 A5 JP 2006279066A5 JP 2006157764 A JP2006157764 A JP 2006157764A JP 2006157764 A JP2006157764 A JP 2006157764A JP 2006279066 A5 JP2006279066 A5 JP 2006279066A5
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JP
Japan
Prior art keywords
wiring board
resin
multilayer wiring
pad
conductor post
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006157764A
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Japanese (ja)
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JP2006279066A (en
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Publication date
Application filed filed Critical
Priority to JP2006157764A priority Critical patent/JP2006279066A/en
Priority claimed from JP2006157764A external-priority patent/JP2006279066A/en
Publication of JP2006279066A publication Critical patent/JP2006279066A/en
Publication of JP2006279066A5 publication Critical patent/JP2006279066A5/ja
Pending legal-status Critical Current

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Claims (9)

層間接続用の導体ポストと、該導体ポストと接続するためのパッドを有する配線パターンと、該導体ポストと該パッドとを接合するための接合用金属材料層と、層間に存在する絶縁層を具備した多層配線板であって、該絶縁層の少なくとも一部が、１つ以上のフェノール性水酸基を有する樹脂（Ａ）と、その硬化剤として作用する樹脂（Ｂ）とを含む金属接合接着剤からなり、層間接続が金属接合であることを特徴とする多層配線板。   A conductor post for interlayer connection, a wiring pattern having a pad for connecting to the conductor post, a bonding metal material layer for bonding the conductor post and the pad, and an insulating layer present between the layers A multi-layered wiring board, wherein at least a part of the insulating layer includes a resin (A) having one or more phenolic hydroxyl groups and a resin (B) that acts as a curing agent thereof. A multilayer wiring board characterized in that the interlayer connection is a metal junction. 接合用金属材料層が、半田からなることを特徴とする請求項１記載の多層配線板。   2. The multilayer wiring board according to claim 1, wherein the bonding metal material layer is made of solder. 導体ポストが、銅からなることを特徴とする請求項１または請求項２記載の多層配線板。   The multilayer wiring board according to claim 1, wherein the conductor post is made of copper. フェノール性水酸基を有する樹脂（Ａ）が、フェノールノボラック樹脂、アルキルフェノールノボラック樹脂、レゾール樹脂、クレゾールノボラック樹脂及び、ポリビニルフェノール樹脂から選ばれる、少なくとも１種であることを特徴とする、請求項１ないし３のいずれかに記載の多層配線板。   The resin (A) having a phenolic hydroxyl group is at least one selected from a phenol novolak resin, an alkylphenol novolak resin, a resole resin, a cresol novolak resin, and a polyvinyl phenol resin. A multilayer wiring board according to any one of the above. フェノール性水酸基を有する樹脂（Ａ）が、金属接合接着剤中に、２０ｗｔ％以上８０ｗｔ％以下で含むことを特徴とする、請求項１ないし４のいずれかに記載の多層配線板。   The multilayer wiring board according to any one of claims 1 to 4, wherein the resin (A) having a phenolic hydroxyl group is contained in the metal bonding adhesive in an amount of 20 wt% to 80 wt%. 金属接合接着剤が、エポキシ樹脂（Ｃ）と、イミダゾール環を有し且つエポキシ樹脂（Ｃ）の硬化剤として作用する化合物（Ｄ）とを、必須成分とすることを特徴とする請求項１ないし５のいずれかに記載の多層配線板。   The metal bonding adhesive comprises, as essential components, an epoxy resin (C) and a compound (D) having an imidazole ring and acting as a curing agent for the epoxy resin (C). The multilayer wiring board according to any one of 5. 硬化剤として作用する化合物（Ｄ）が、金属接合接着剤中に、１ｗｔ％以上１０ｗｔ％以下で含むことを特徴とする、請求項６記載の多層配線板。    The multilayer wiring board according to claim 6, wherein the compound (D) acting as a curing agent is contained in the metal bonding adhesive in an amount of 1 wt% to 10 wt%. 導体ポストを形成する工程と、前記導体ポストと接続するためのパッドを有する配線パターンを形成する工程と、前記導体ポストと前記パッドの少なくとも一方に接合用金属材料層を形成する工程と、絶縁層を形成する工程と、前記導体ポストが、前記絶縁層の少なくとも金属接合接着剤層部分を介して、前記接合用金属材料層により前記パッドと接合する工程、加熱により前記金属接合接着剤層を硬化させる工程、とを含んでなることを特徴とする多層配線板の製造方法。   A step of forming a conductor post, a step of forming a wiring pattern having a pad for connection to the conductor post, a step of forming a bonding metal material layer on at least one of the conductor post and the pad, and an insulating layer A step of bonding the pad to the pad by the bonding metal material layer through at least the metal bonding adhesive layer portion of the insulating layer, and curing the metal bonding adhesive layer by heating. And a process for producing the multilayer wiring board. 請求項８記載の製造方法により得られたことを特徴とする多層配線板。   A multilayer wiring board obtained by the manufacturing method according to claim 8.
JP2006157764A 2000-05-11 2006-06-06 Multilayer wiring board and producing method therefor Pending JP2006279066A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006157764A JP2006279066A (en) 2000-05-11 2006-06-06 Multilayer wiring board and producing method therefor

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000139090 2000-05-11
JP2006157764A JP2006279066A (en) 2000-05-11 2006-06-06 Multilayer wiring board and producing method therefor

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2001142308A Division JP2002033580A (en) 2000-05-11 2001-05-11 Multilayer wiring board and producing method therefor

Publications (2)

Publication Number Publication Date
JP2006279066A JP2006279066A (en) 2006-10-12
JP2006279066A5 true JP2006279066A5 (en) 2007-01-11

Family

ID=37213412

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006157764A Pending JP2006279066A (en) 2000-05-11 2006-06-06 Multilayer wiring board and producing method therefor

Country Status (1)

Country Link
JP (1) JP2006279066A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101109243B1 (en) * 2009-12-28 2012-01-30 삼성전기주식회사 Multi-layer circuit board and method of manufacturing the same
JP6754741B2 (en) * 2017-09-07 2020-09-16 信越化学工業株式会社 Semiconductor laminates, methods for manufacturing semiconductor laminates, and methods for manufacturing semiconductor devices
JP6800115B2 (en) 2017-09-07 2020-12-16 信越化学工業株式会社 Resin composition, resin film, semiconductor laminate, semiconductor laminate manufacturing method and semiconductor device manufacturing method

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