JP2006276881A - Method for manufacturing plasma display panel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a plasma display panel capable of securing reliability against the flow of a high-current and concurrently coping with narrowed pitch of an electrode part for providing a high-definition panel. <P>SOLUTION: In mounting a flexible substrate to the plasma display panel, an electrode 2 formed on a glass substrate 1 and having unevenness on the surface, and an electrode 6 of the flexible substrate 5 are overlaid via an adhesive 3. By the heating and the pressing from the upper part of the flexible substrate, the unevenness of the surface of the electrode of the glass substrate bites into the electrode of the flexible substrate so that the joint is performed. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a plasma display panel, and more particularly to a method for manufacturing a plasma display panel in which an electrode of a flexible substrate is bonded to a thick film electrode on a glass substrate.

  Conventionally, as a technique for mounting a flexible substrate on a thick film electrode on a glass substrate, soldering is performed by pressing the electrode on the flexible substrate and the thick film electrode on the glass substrate with a heating and pressing tool as mounting on a plasma display panel. How to do is known. In FIG. 8, the electrode 6 of the flexible substrate 5 plated with solder in advance is aligned with the electrode 2 of the glass substrate 1 of the plasma display panel, and the heating and pressurizing tool 7 (see FIG. 1) is placed on the flexible substrate 5. A configuration is shown in which the solder 10 of the flexible substrate 5 is melted and soldered by pressing.

  In mounting a flexible substrate on such a plasma display panel, for example, the reliability of a high current flowing such that the inter-terminal voltage is about 250 V is ensured, and at the same time, electrodes for high definition of the panel are used. Narrow pitch is required. If the conventional soldering method is applied to narrow pitch electrodes, solder wettability or solder bridging will occur and the mounting quality, in other words, the joint quality will not be good. Therefore, there is a problem that it is difficult to cope with the narrow pitch of the electrodes.

  The object of the present invention is to eliminate the instability of the bonding quality, to cope with higher currents, and to cope with the narrower pitch of the electrodes, and can realize the plasma with high reliability. It is to provide a method for manufacturing a display panel.

  In order to solve this problem, the present invention in a plasma display panel is configured as follows.

  According to the first aspect of the present invention, the electrode formed on the glass substrate and having an uneven surface and the electrode of the flexible substrate are overlapped with an adhesive and heated and pressed from above the flexible substrate. Provided is a method for manufacturing a plasma display panel in which unevenness on the surface of an electrode of a glass substrate is bitten into the electrode of the flexible substrate and bonded.

According to another first aspect of the present invention, in the plasma display panel in which the electrode formed on the glass substrate and the electrode of the flexible substrate are bonded with an adhesive,
The boundary between the front substrate on which the electrodes of the glass substrate are formed and the glass substrate and the flexible substrate on the back side opposite to the front surface side of the glass substrate and the boundary between the glass substrate and the glass substrate and the flexible Provided is a plasma display panel characterized in that both ends of a bonded portion of a substrate are covered with an ultraviolet curable resin.

According to another second aspect of the present invention, in the plasma display panel in which the electrode formed on the glass substrate and the electrode of the flexible substrate are bonded with an adhesive,
The boundary between the front substrate on which the electrodes of the glass substrate are formed and the glass substrate and the flexible substrate on the back side opposite to the front surface side of the glass substrate and the boundary between the glass substrate and the glass substrate and the flexible Provided is a plasma display panel characterized in that both ends of a bonding portion of a substrate are covered with a silicone resin.

  According to another third aspect of the present invention, there is provided the plasma display panel according to the other first or second aspect of the present invention, wherein the electrode of the glass substrate is a silver electrode.

  The present invention in the electrode joining method of the plasma display panel is configured as follows.

According to the first aspect of the present invention, the thick film electrode formed on the glass substrate and the electrode of the flexible substrate are overlapped via the adhesive sheet in which the conductive particles are dispersed,
A plasma display panel characterized in that the adhesive sheet is cured by heating and pressing with a crimping tool from above the flexible substrate, and the electrode of the glass substrate and the electrode of the flexible substrate are made conductive. An electrode bonding method is provided.

  According to such a configuration, since the electrodes on the glass substrate and the electrodes on the flexible substrate are made conductive without using solder, it is possible to ensure a good connection between both electrodes, that is, problems due to solder, that is, Due to the oxidation and corrosion of the solder, there is no problem in electrical continuity, solder wettability during soldering, solder bridges, and poor joint quality. Highly reliable joint quality that can cope with pitching can be realized.

  According to a second aspect of the present invention, there is provided the electrode joining method for a plasma display panel according to the first aspect, wherein the electrode of the glass substrate is a silver electrode, and the conductive particles of the adhesive sheet are nickel particles.

  According to a third aspect of the present invention, there is provided the electrode joining method for a plasma display panel according to the second aspect, wherein the conductive particles of the adhesive sheet are gold-plated nickel particles.

  According to the second and third aspects, even when the plasma display panel is exposed to a high temperature, the conductive particles are not oxidized, and electrical conduction hindrance can be prevented.

According to the fourth aspect of the present invention, the thick film electrode formed on the glass substrate and the electrode of the flexible substrate are overlapped via the adhesive sheet for temporary fixing,
The adhesive sheet is cured by heating and pressing with a crimping tool from above the flexible substrate so that the unevenness of the surface of the electrode of the glass substrate bites into the electrode of the flexible substrate so that both electrodes are made conductive. An electrode bonding method for a plasma display panel is provided.

  According to the fourth aspect, since the unevenness generated on the surface of the thick film electrode is used and the electrodes are electrically joined by biting into the surface of the opposing electrode, the conductive particles become unnecessary. For example, it is not necessary to arrange the conductive particles uniformly in the adhesive sheet. Furthermore, since the electrodes on the glass substrate and the electrodes on the flexible substrate are made conductive without using solder, it is possible to ensure a good connection between the two electrodes, and to prevent defects caused by solder, that is, oxidation and corrosion of the solder. For this reason, there is a problem in electrical continuity, solder wetness during soldering, solder bridges are generated, bonding quality does not deteriorate, and it is possible to cope with a narrow pitch of electrodes. Highly reliable joint quality can be realized.

According to the fifth aspect of the present invention, the portion where the electrode of the flexible substrate and the electrode of the glass substrate are joined is covered with a silicone resin,
The electrode bonding method for a plasma display panel according to any one of the first to fourth aspects, wherein the silicone resin is cured.

  According to the fifth aspect, it is possible to prevent water and corrosive gas from entering the joint portion of both electrodes, the electrode and conductive particles are not oxidized, and electrical conduction hindrance can be prevented.

  According to a sixth aspect of the present invention, there is provided the electrode joining method for a plasma display panel according to the fifth aspect, wherein the thickness of the silicone resin is about 0.3 μm to 2 mm.

  According to the seventh aspect of the present invention, the silicone resin covers both the front and back surfaces of the portion where the electrode of the flexible substrate and the electrode of the glass substrate are bonded, and the both sides of the front and back surfaces at the end of the bonded portion. The electrode bonding method for a plasma display panel according to the fifth or sixth aspect, wherein the silicone resin is integrally connected.

  According to the sixth and seventh aspects, it is possible to prevent water and corrosive gas from entering the joint portion of both electrodes, and the electrodes and conductive particles are not oxidized, thereby preventing electrical conduction inhibition.

According to the eighth aspect of the present invention, the portion where the electrode of the flexible substrate and the electrode of the glass substrate are joined is covered with an ultraviolet curable resin,
The electrode bonding method for a plasma display panel according to any one of the first to fourth aspects, wherein the ultraviolet curable resin is cured by irradiation with ultraviolet rays.

  According to the eighth aspect, in a short period of time, water or corrosive gas can be prevented from entering the joined portion of both electrodes, and the electrode and conductive particles can be prevented from being oxidized. It is possible to form a highly reliable joint quality.

  According to the present invention, it is possible to secure a good connection between an electrode on a glass substrate and an electrode of a flexible substrate, to cope with a high current, and to cope with a narrow pitch of the electrode, with a highly reliable joining quality. The effect that a method is realizable is acquired.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

(First embodiment)
FIG. 1 shows an electrode joining method for a plasma display panel according to a first embodiment of the present invention, and shows a cross-sectional view after joining an electrode 2 on a glass substrate 1 and an electrode 6 on a flexible substrate 5 of the plasma display panel. Yes. FIG. 7 is a plan view of the electrodes 2 and 6 in a joined state. FIG. 13 is a flowchart of a method of bonding a flexible substrate to a glass substrate by the electrode bonding method of the plasma display panel according to the first embodiment. In this bonding method, nickel particles as an example of conductive particles 4 are dispersed in a thick film silver electrode 2 having a thickness of about 5 to 15 μm as an example of the thick film electrode formed on the glass substrate 1 in FIG. A process of attaching the adhesive sheet 3 (step S1 in FIG. 13) and a process of superposing the electrode 6 of the flexible substrate 5 on the electrode 2 on the glass substrate 1 through the adhesive sheet 3 (step S2 in FIG. 13). Then, the adhesive sheet 3 is cured by heating and pressing with the crimping tool 7 from above the flexible substrate 5, and the electrode 2 on the glass substrate 1 and the electrode 6 on the flexible substrate 5 are connected via the conductive particles 4. And the step of conducting (step S3 in FIG. 13). The crimping tool 7 has a heater 500 for heating the adhesive sheet at the lower end thereof, and an air cylinder (for example, “Bellofram cylinder” manufactured by Fujikura Rubber Industrial Co., Ltd.) 201 at the upper end thereof. Thus, the entire crimping tool 7 is moved up and down. After the crimping tool 7 is lowered by the motor 200 and comes into contact with the flexible substrate 5 on the glass substrate 1 on the cradle 202, air is supplied while being heated by the heater 500 to cure the adhesive sheet 3. When the air cylinder 201 is driven, the electrode 2 on the glass substrate 1 and the electrode 6 on the flexible substrate 5 are pressure-bonded, and the conductive particles 4 are bonded to the electrode 2 on the glass substrate 1 and the electrode 6 on the flexible substrate 5. Through. This heating and pressurizing apparatus can also be used in the following embodiments.

  The material of the adhesive sheet 3 is not particularly limited, but is preferably a thermosetting resin. The shape of the adhesive sheet 3 is not particularly limited, but the width is preferably 1 mm or more and the thickness is preferably 15 to 60 μm. If the width of the adhesive sheet 3 is less than 1 mm, it is not preferable because a current of 0.5 A or more cannot flow and the panel does not operate. Further, when the thickness of the adhesive sheet 3 is less than 15 μm, the adhesive strength is insufficient and the film is easily peeled off, and when the thickness exceeds 60 μm, conduction is not possible. The thickness of the adhesive sheet 3 is more preferably 35 to 40 μm corresponding to the thickness 5 to 15 μm of the thick film electrode 2. The reason is that the amount of protrusion of the adhesive sheet 3 is appropriate within this range, and if it exceeds this range, the adhesive sheet 3 adheres to the crimping tool 7, which is not preferable. The adhesion length of the adhesive sheet 3 is not particularly limited as long as it is longer than the width by which the glass substrate 1 and the flexible substrate 5 are pressure-bonded.

  The particle size of the conductive particles 4 dispersed in the adhesive sheet 3 is desirably 3 to 15 μm. If it is less than 3 μm, it is not preferable because a current of 0.5 A or more cannot be flown and the panel does not operate, and if it exceeds 15 μm, a short defect between the electrodes tends to occur.

  The adhesive sheet 3 is not limited to be attached to the glass substrate 1 side, and may be attached to the flexible substrate 5 side, and is not attached to either the glass substrate 1 or the flexible substrate 5. In addition, the two substrates 1 and 5 may be arranged so as to be positioned at a predetermined position when they are overlapped.

  The material of the glass substrate 1 or the flexible substrate 5 is not particularly limited. The thick film silver electrode 2 is formed by screen printing or a photolithography method and baked. The material of the electrode 2 is not particularly limited. The material of the electrode 6 of the flexible substrate 5 is not particularly limited, but preferably, the copper is nickel-plated and then gold-plated.

As an example of the pressure applied by the crimping tool 7, about 20 kg / cm ² is preferable.

  According to the first embodiment, since the electrode 2 on the glass substrate 1 and the electrode 6 of the flexible substrate 5 are made conductive without using solder, a good connection between the electrodes 2 and 6 can be secured. , Defects caused by solder, that is, due to oxidation and corrosion of the solder, it causes problems in electrical continuity, poor solder wetting during soldering, solder bridges, and poor joint quality In addition, it is possible to realize a highly reliable bonding quality that can cope with an increase in current and that can cope with a narrow pitch of electrodes, for example, a pitch of 0.3 mm or less.

(Second Embodiment)
FIG. 2 shows a cross-sectional view after joining the electrode 2 on the glass substrate 1 and the electrode 6 on the flexible substrate 5 in the electrode joining method of the plasma display panel according to the second embodiment of the present invention. FIG. 7 is a plan view of the joined state of both electrodes 2 and 6. The difference from the first embodiment is that, in FIG. 2, the conductive particles 4 dispersed in the adhesive sheet 3 are gold-plated on the surface of nickel particles having a particle diameter of 8 μm ± 2 μm.

  The thickness of the gold coated on the conductive particles 4 is not particularly limited. Also, the gold plating method and the like are not particularly limited. Regarding the material and shape of the adhesive sheet 3, the size of the conductive particles 4, the material of the glass substrate 1, the electrode 2 on the glass substrate 1, the flexible substrate 5, and the electrode 6 on the flexible substrate 5, and the formation method, This is the same as the embodiment.

  According to the second embodiment, in addition to the operational effects of the first embodiment, even when the plasma display panel is exposed to a high temperature, the conductive particles 4 are not oxidized, and electrical conduction inhibition can be prevented.

(Third embodiment)
FIG. 3 shows a cross-sectional view after joining the electrode 2 on the glass substrate 1 and the electrode 6 on the flexible substrate 5 in the electrode joining method of the plasma display panel in the third embodiment of the present invention. FIG. 7 is a plan view of the joined state of both electrodes 2 and 6. FIG. 14 is a flowchart of a method of bonding a flexible substrate to a glass substrate by the electrode bonding method of the plasma display panel according to the third embodiment. 3 differs from the first and second embodiments in FIG. 3 in that the silicone resin 8 is formed so as to cover the joint portion between the electrode 2 of the glass substrate 1 and the electrode 6 of the flexible substrate 5 including both ends of each electrode. It is the point (refer step S4 of FIG. 14) being apply | coated. The reason for applying the silicone resin 8 to the joint portion in this way is as follows. In general, since a high voltage of about 250 V is applied between terminals in a plasma display panel, if moisture and metal ions are present between electrodes, the high voltage causes a migration. Therefore, if the silicone resin 8 is applied so as to cover the joint, moisture can be reliably prevented from entering the joint between the electrodes, and migration can be effectively prevented. Thus, in order to prevent moisture from entering, the silicone resin 8 needs to have a thickness of at least 0.3 μm or more. When the thickness exceeds 2 mm, a considerable time is required for curing the silicone resin 8. This is a problem in practical use. Therefore, it is practical and preferable that the thickness of the silicone resin 8 is about 0.3 μm to 2 mm, preferably about 0.5 μm to 2 mm.

  Here, FIG. 9 is a partial perspective view showing a state in which the electrode of the glass substrate and the electrode of the flexible substrate of the plasma display panel are joined by the electrode joining method of the plasma display panel according to the third embodiment. 101a is a glass substrate on the front surface side, 101b is a glass substrate on the back surface side, and 103 is an ACF (anisotropic conductive sheet). FIG. 10 is a view showing a state in which a silicone resin is applied after the electrodes of the glass substrate and the flexible substrate of the plasma display panel are joined by the electrode joining method of the plasma display panel according to the third embodiment. It is a perspective view. Further, FIG. 11 shows that in FIG. 10, the silicone resin applied to both the front and back surfaces of the joined portion between the glass substrate electrode and the flexible substrate electrode of the plasma display panel forms a boundary at the end face of the joined portion. It is a partial expanded sectional view which shows the state (refer 8a) connected without being continuous and integrated. The silicone resin 8 may be any type of silicone resin, but is preferably a room temperature curable silicone resin. When such room temperature curable silicone resin 8 is used, it is only necessary to leave it at room temperature and dry naturally after application. The material of the silicone resin 8 is preferably a dealcohol-free or acetone-free silicone so that moisture or the like does not come into contact with the silver electrode 2 and corrode. The thickness of the silicone resin 8 is practically and preferably about 0.3 to 2 mm, preferably about 0.5 to 2 mm.

  When the room temperature curable silicone resin is applied in such a manner as to cover the joint between the electrode 2 of the glass substrate 1 and the electrode 6 of the flexible substrate 5 including both ends of each electrode, the following details are given. Do as follows. As shown in FIG. 15, using a dispenser, first, in the case of a rectangular plasma display panel as shown in FIG. 9, one of the front surface and the back surface at the joint portion of each of the four sides, For example, the room temperature curable silicone resin 8 is applied to the joint portion on the front side (step S4a in FIG. 15). Then, it is left to stand at room temperature and naturally dried (step S4b in FIG. 15). For example, after about 3 to 5 minutes, the room temperature curable silicone resin 8 does not drip even if the front and back are reversed. After that, the room temperature curable silicone resin 8 is applied to either the front surface or the back surface, for example, the joint on the back surface side (step S4c in FIG. 15). At this time, when the room temperature curable silicone resin 8 is not completely cured but in a semi-cured state, for example, between 5 minutes and 60 minutes after applying the room temperature curable silicone resin 8, By applying room temperature curable silicone resin 8 to the joint portion on the other surface, as shown in FIG. 10, room temperature curing of the portion of the single surface of electrode 5 that is about to reach the back surface side joint portion from the front surface side joint portion. As shown by 8a in FIGS. 10 and 11, the mold-type silicone resin 8 is mixed and integrated with the room temperature curable silicone resin 8 applied on the back surface side without forming a boundary surface. The joint can be covered. If a boundary is formed between the silicone resins 8 applied to both the front and back surfaces, it is not preferable because moisture may enter the bonded portion from the boundary.

  The kind of the conductive particles 4 dispersed in the adhesive sheet 3 is nickel particles or gold-plated nickel particles.

  Regarding the material and shape of the adhesive sheet 3, the size of the conductive particles 4, the material of the glass substrate 1, the electrode 2 on the glass substrate 1, the flexible substrate 5, and the electrode 6 on the flexible substrate 5, and the formation method thereof, It is the same.

  According to the third embodiment, in addition to the operational effects of the first embodiment, the silicone resin 8 can prevent water and corrosive gas from entering the joint between the electrodes 2 and 6, and the electrodes 2 and 6 can be prevented. In addition, oxidation of the conductive particles 4 does not occur, and electrical conduction hindrance can be prevented.

(Fourth embodiment)
FIG. 4 shows a cross-sectional view after joining the electrode 2 on the glass substrate 1 and the electrode 6 on the flexible substrate 5 in the electrode joining method of the plasma display panel according to the fourth embodiment of the present invention. FIG. 7 is a plan view of the joined state of both electrodes 2 and 6. FIG. 16 is a flowchart of a method of bonding a flexible substrate to a glass substrate by the electrode bonding method of the plasma display panel according to the fourth embodiment. The difference from the first to third embodiments is that, in FIG. 3, an ultraviolet curable resin 9 is applied so as to cover the joint between the electrode 2 on the glass substrate 1 and the electrode 6 of the flexible substrate 5. This is a point (step S14 in FIG. 16) and a point (step S15 in FIG. 16) where the ultraviolet curable resin 9 is irradiated with ultraviolet rays.

  The ultraviolet curable resin 9 may be any type of ultraviolet curable resin, but is preferably an epoxy acrylate resin having high curing strength and good moisture resistance.

  The kind of the conductive particles 4 dispersed in the adhesive sheet 3 is nickel particles or gold-plated nickel particles.

  The material and shape of the adhesive sheet 3, the size of the conductive particles 4, the material of the glass substrate 1, the glass substrate upper electrode 2, the flexible substrate 5, and the flexible substrate electrode 6, and the formation method are the same as in the first embodiment. It is.

  According to the fourth embodiment, in addition to the operational effects of the first embodiment, the ultraviolet curable resin 9 prevents water and corrosive gas from entering the joint between the electrodes 2 and 6 in a short time. In addition, it is possible to form a coating that does not cause oxidation of the electrodes 2 and 6 and the conductive particles 4 and can prevent electrical conduction inhibition, thereby realizing a highly reliable bonding quality.

(Fifth embodiment)
5 and 6 show an electrode bonding method for a plasma display panel according to a fifth embodiment of the present invention. FIG. 7 is a plan view of the joined state of both electrodes 2 and 6. FIG. 17 is a flowchart of a method for bonding a flexible substrate to a glass substrate by the electrode bonding method for a plasma display panel according to the fifth embodiment. Unlike the first to fourth embodiments, the fifth embodiment shows a method of joining the electrodes 2 and 6 without including the conductive particles 4 in the adhesive sheet 3 (see step S23 in FIG. 17).

In this fifth embodiment, the thick surface electrode 2 of the glass substrate 1 is pressed against the electrode 6 such as the flexible substrate 5 via the adhesive sheet 3 containing no conductive particles, and heated, so that the surface roughness is increased. The unevenness originally formed on the surface of the thick film electrode 2 having a thickness of about 2 to 3 μm bites into the electrode (copper) 6 such as the flexible substrate 5 and the both electrodes 2 and 6 are electrically joined. Is done. In this case, the adhesive sheet 3 temporarily positions the electrodes 2 and 6 before finally bringing both electrodes into electrical contact by pressurization, and the silicone resin 8 is used in a later step. This is to prevent the electrode from entering between the two electrodes, and does not contain conductive particles. In this case, the applied pressure is preferably 40 to 50 kg / cm ² , and the heating temperature is preferably 180 ° C. or higher. As an example, the unevenness of the surface of the thick film electrode 2 is about ± 2 μm. It is practical that the joining width of both electrodes 2 and 6 is about 3 mm or more.

  The adhesive sheet 3 may be an anisotropic conductive sheet (ACF). The adhesive sheet 3 is not limited to this ACF, and as an adhesive sheet for arbitrary temporary fixing, for example, an epoxy resin that is less expensive than ACF. Can be used.

  According to the fifth embodiment, since the unevenness generated on the surface of the thick film electrode 2 is used and the unevenness bites into the surface of the opposing electrode 6, the electrodes 2 and 6 are electrically joined. The conductive particles become unnecessary, and it becomes unnecessary to arrange the conductive particles uniformly in the adhesive sheet 3, for example. Furthermore, according to the said 5th Embodiment, since the electrode 2 on the glass substrate 1 and the electrode 6 of the flexible substrate 5 are made conductive without using solder, it is possible to ensure a good connection between the electrodes 2 and 6. The failure of the solder, that is, due to the oxidation and corrosion of the solder, the electrical continuity is defective, the solder is poorly wet during soldering, the solder bridge is generated, and the joint quality is improved. It is possible to realize a highly reliable bonding quality that does not deteriorate, can cope with a high current, and can also cope with a narrow pitch of an electrode, for example, a pitch of 0.3 mm or less. .

  Also in the fifth embodiment, if the third and fourth embodiments are applied, the ultraviolet curable resin 9 or the silicone resin 8 allows water or corrosive gas to enter the joint between the electrodes 2 and 6. It is possible to prevent the electrodes 2 and 6 and the conductive particles 4 from being oxidized, thereby preventing electrical conduction inhibition. For example, FIG. 12 is a cross-sectional view showing a state in which a silicone resin is further applied after the state after joining in the joining method of FIG. 5 as a modification of the electrode joining method of the plasma display panel according to the fifth embodiment. is there.

  In the first to fourth embodiments, the material of the conductive particles 4 is not particularly limited. However, when the thick film electrode 2 is a silver electrode, the conductive particles 4 are nickel particles or gold plating from the viewpoint of preventing silver oxidation. Preferably, the particles are made of nickel particles or gold itself.

  The present invention is applicable to both DC type and AC type plasma display panels.

  Next, specific examples of the present invention will be described.

(Example 1)
This will be described with reference to FIG.

Nickel particles (particle size 5 μm) are dispersed as conductive particles 4 on a thick film silver electrode 2 (thickness 10 μm, 0.3 mm pitch) formed by screen printing and baking on glass 1 (thickness 3 mm). Adhesive sheet 3 (thermosetting epoxy resin, width 3 mm, thickness 40 μm) is pasted. At this time, the heating temperature is 100 ° C., the applied pressure is 10 kg / cm ² , and the pressurizing time is 5 seconds. Next, the electrode 6 of the flexible substrate 5 is attached so as to match the electrode 2 of the glass substrate 1. Next, the adhesive sheet 3 is cured by heating and pressing with the crimping tool 7 from above the flexible substrate 5, and the thick film silver electrode 2 and the electrode 6 of the flexible substrate 5 are made conductive on the glass substrate 1. At this time, the heating temperature is 170 ° C., the applied pressure is 20 kg / cm ² , and the pressurizing time is 20 seconds.

  In the above description, the material, size and thickness of the glass substrate, electrodes on the glass substrate, flexible substrate, flexible substrate electrode, adhesive sheet, conductive particles, etc., and the pressure, temperature, time in the process However, these are only examples and are not limited.

(Example 2)
What replaced the electroconductive particle 4 disperse | distributed in the adhesive agent sheet 3 in Example 1 by the gold plating nickel particle (particle diameter of 5 micrometers) was used. Gold plating was produced by flash plating.

  Other steps and conditions are the same as those in Example 1.

(Example 3)
In Example 1, the electrode 2 on the glass substrate 1 and the electrode 6 on the flexible substrate 5 are joined and made conductive, and the silicone resin 8 (dealcohol-free silicone resin, SE4486, Toray Industries Inc. (Manufactured by Dow Corning Silicone Co., Ltd.) was applied and cured (set at 25 ° C. for 3 hours to cure).

  Other steps and conditions are the same as those in Example 1.

(Example 4)
In Example 1, the ultraviolet curable resin 8 (epoxy acrylate-based resin, PSR-) is formed so as to cover the bonded portion of the electrode 2 on the glass substrate 1 and the electrode 6 of the flexible substrate 5 that are bonded and conductive. 310, manufactured by Kyodo Chemical Co., Ltd.) and applied to cure. (UV 365 nm, 1000 mJ / cm, 10 second irradiation curing).

  Other steps and conditions are the same as those in Example 1.

(Comparative example)
The flexible substrate 5 is solder-plated (plating thickness 15 μm) on a thick silver electrode 2 (thickness 10 μm, 0.3 mm pitch) formed on the glass 1 (thickness 3 mm) by screen printing and baking. The electrode 6 is aligned with the electrode 2 of the glass substrate 1, and then heated and pressed by the crimping tool 7 from above the flexible substrate 5 to melt the solder 10, and the thick film silver electrode 2 and the flexible film are formed on the glass substrate 1. The electrode 6 of the substrate 5 was made conductive. ^{(230 ℃, 2kg / cm 2} , 3 seconds pressurization).

  N = 50 samples of Examples 1 to 4 and Comparative Example were prepared, and the failure rate of continuity after various reliability tests and the failure rate of breakage of the substrate during IC component replacement were examined.

  Thus, it can be seen that the defect rate and the breakage rate can be reduced to 0 according to the present embodiment as compared with the comparative example.

  Although the present invention has been described with reference to an example applied to a plasma display panel, the present invention can also be applied to a display device that applies a high voltage between terminals in order to display information or data in addition to the plasma display panel.

It is a partial cross section figure which shows the joining state in the joining process of the joining method of the flexible substrate to the glass substrate by the electrode joining method of the plasma display panel concerning 1st Embodiment of this invention. It is sectional drawing which shows the joining state in the joining process of the joining method of the flexible substrate to the glass substrate by the electrode joining method of the plasma display panel concerning 2nd Embodiment of this invention. It is sectional drawing which shows the joining state in the joining process of the joining method of the flexible substrate to the glass substrate by the electrode joining method of the plasma display panel concerning 3rd Embodiment of this invention. It is sectional drawing which shows the joining state in the joining process of the joining method of the flexible substrate to the glass substrate by the electrode joining method of the plasma display panel concerning 4th Embodiment of this invention. It is sectional drawing which shows the joining state in the joining process of the joining method of the flexible substrate to the glass substrate by the electrode joining method of the plasma display panel concerning 5th Embodiment of this invention. It is sectional drawing which shows the state after joining by the joining method of FIG. It is a top view which shows the said joining state. It is sectional drawing which shows the joining state in the joining process of the mounting method of the flexible substrate to the conventional glass substrate. It is a fragmentary perspective view which shows the state which joins the electrode of the glass substrate of a plasma display panel, and the electrode of a flexible substrate with the electrode joining method of the plasma display panel concerning the said 3rd Embodiment of this invention. FIG. 6 is a partial perspective view showing a state in which a silicon resin is applied after the electrodes of the glass substrate and the flexible substrate of the plasma display panel are joined by the electrode joining method of the plasma display panel according to the third embodiment of the present invention. is there. In FIG. 10, the silicone resin applied to both the front and back surfaces of the joint portion between the glass substrate electrode and the flexible substrate electrode of the plasma display panel is continuously and integrally formed without forming a boundary at the end face of the joint portion. It is a partial expanded sectional view which shows the state connected in general. It is sectional drawing which shows the state which applied the silicone resin after the state after the joining by the joining method of FIG. 5 as a modification of the electrode joining method of the plasma display panel concerning 5th Embodiment of this invention. It is a flowchart of the bonding method of the flexible substrate to the glass substrate by the electrode bonding method of the plasma display panel concerning 1st Embodiment of this invention. It is a flowchart of the joining method of the flexible substrate to the glass substrate by the electrode joining method of the plasma display panel concerning 3rd Embodiment of this invention. It is a more detailed flowchart of the bonding method of the flexible substrate to the glass substrate by the electrode bonding method of the plasma display panel concerning 3rd Embodiment of this invention. It is a flowchart of the bonding method of the flexible substrate to the glass substrate by the electrode bonding method of the plasma display panel concerning 4th Embodiment of this invention. It is a flowchart of the joining method of the flexible substrate to the glass substrate by the electrode joining method of the plasma display panel concerning 5th Embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Glass substrate 2 Electrode on glass substrate 3 Adhesive sheet 4 Conductive particle 5 Flexible substrate 6 Flexible substrate electrode 7 Crimping tool 8 Silicone resin 9 UV curable resin 10 Solder

Claims (4)

  An electrode having irregularities on the surface formed on the glass substrate and an electrode of the flexible substrate are overlapped with an adhesive in which conductive particles are dispersed, and the adhesive is cured to form the electrode of the glass substrate and the flexible substrate. A method for manufacturing a plasma display panel, comprising: bonding an electrode; and forming a resin so as to cover a bonding portion between the electrode of the glass substrate and the electrode of the flexible substrate.   The method for manufacturing a plasma display panel according to claim 1, wherein the adhesive is continuous with a plurality of flexible substrates.   3. The method of manufacturing a plasma display panel according to claim 2, wherein the resin is formed so as to continuously cover a joint portion between the electrode of the glass substrate and the electrode of the plurality of flexible substrates. The boundary between the flexible substrate and the glass substrate on the surface side where the electrode of the glass substrate is formed, and the boundary between the flexible substrate and the glass substrate on the back side opposite to the surface side of the glass substrate, and the glass substrate 4. The method of manufacturing a plasma display panel according to claim 1, wherein the resin is formed so as to cover both end portions of the joint portion of the flexible substrate. 5.

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