JP2006264831A - Film separating method and film separating device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent deterioration of the quality of a base plate by preventing damage to the base plate due to vibration and deformation, when a film is separated from the base plate. <P>SOLUTION: When a tip of the base plate 1 reaches an initial separating means 50 on a conveying path, the base plate 1 is sandwiched by rollers 32 from a direction vertical to the conveying path and a front part of the base plate 1 is held by a clamp tool 21. By the initial separating means 50, a tip part of the film 3 attached on the surface of the base plate 1 is partially separated. The tip part of the film 3 partially separated by the initial separating means 50 is held by a main separating means 60, and is moved to the downstream side on the conveying path by the clamp tool 21 while the front part is held by the clamp tool 21. The base plate 1 is sandwiched by rollers 42 from a direction vertical to the conveying path to release holding of the front part by the clamp tool 21. After the clamp tool 21 is retreated, the film 3 is totally separated from the base plate 1 conveyed to the downstream side on the conveying path by the main separating means 60. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  In the present invention, the tip of the film affixed to the surface of the substrate conveyed on the conveying path is partially peeled off by the initial peeling means, and the film is peeled off entirely by the main peeling means from the partially peeled portion. The present invention relates to a film peeling method and a film peeling apparatus.

  As a conventional film peeling method, after the film is lifted from the resist film surface by an adhesive tape, the film is gripped by a film clamper (see Patent Document 1), or the front end of the substrate and the film A method of peeling the film entirely while preventing vibration of the substrate by providing a holding roller that sandwiches the substrate downstream of the spray nozzle in the substrate transport path in which the compressed gas is jetted in between to perform initial peeling (Patent Document 2) See).

JP-A-6-278936 JP 2000-203759 A

  In the former prior art in which the film is initially peeled off with an adhesive tape, when the substrate is thin and the film is attached to both sides of the substrate, a slight difference in the adhesive force between the substrate and the film or the adhesive tape Due to the difference in the position of sticking to the substrate, a difference in film peeling load is generated between the upper surface and the lower surface of the substrate, and the substrate may be deformed to the upper surface side or the lower surface side in the adhesive tape peeling direction.

  When the deformed substrate is transported downstream while peeling off the film, there is a problem that the substrate collides with the transport roller in the transport direction and is damaged.

  In the latter prior art in which gas is injected to perform initial peeling, there is a difference in the size of the gap formed by initial peeling of the film between the upper surface and the lower surface, or there is a difference in gas injection force between the upper and lower surfaces. In some cases, since the substrate is not sandwiched between the substrate vibration prevention rollers during gas injection, the substrate may be deformed or vibrated, causing the substrate to collide with the transfer roller and be damaged. there were.

  SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a film peeling method and a film peeling apparatus that do not impair the quality of the substrate without damaging the substrate in the stage of transporting the film while peeling from the substrate from the initial peeling stage of the film. There is.

  A feature of the film peeling method of the present invention that achieves the above-mentioned object is that the leading edge of the film attached to the surface of the substrate conveyed on the conveying path is partially peeled by the initial peeling means, and the film is partially peeled off. In the film peeling method in which the film is peeled entirely from the spot by the main peeling means, when the tip of the substrate reaches the initial peeling means in the conveyance path, the first roller is removed from the direction perpendicular to the conveyance path. And holding the front part of the substrate with a clamp, partially peeling the tip of the film attached to the surface of the substrate by the initial peeling means, and partially peeling by the initial peeling means Grasping the leading edge of the film with the main peeling means, moving the substrate downstream on the transport path with the clamp tool while gripping the front part with the clamp tool, and moving the substrate from the direction perpendicular to the transport path second The film is peeled entirely from the substrate transported downstream on the transport path by the main stripping means after the front end of the clamp tool is released by being clamped by a roller and the clamp tool is retracted. There is.

  Moreover, the place which characterizes the film peeling apparatus of this invention which achieves the said objective is that the initial peeling means which peels off the front-end | tip part of the film affixed on the surface of the board | substrate conveyed on a conveyance path partially, and its part In a film peeling apparatus having a main peeling means for peeling the film entirely from the peeled place, a first holding the substrate that has reached the initial peeling means in the transport path from a direction perpendicular to the transport path. A roller for holding the front part of the substrate and moving it downstream, then releasing the grip and retreating the substrate before the clamp device releases the grip. A second roller that is sandwiched between the main peeling means, and the main peeling means grips the leading edge of the film partially peeled by the initial peeling means while the substrate is conveyed downstream on the conveyance path. Strip film completely In that it is made as to.

  According to the present invention, the substrate is sandwiched between rollers at the initial film peeling stage, and the front part of the substrate is held by the clamp tool, thereby preventing the deformation and vibration of the substrate that occurs during the initial film peeling, and the clamp tool while peeling the film. The movement of the film eliminates the collision of the substrate with the transfer roller, and the film can be peeled without impairing the quality of the substrate.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  1 and 2 are a plan view and a front view showing a schematic structure of a film peeling apparatus according to an embodiment of the present invention, and FIG. 3 shows a situation in which the substrate is restrained by a first roller mechanism in the embodiment shown in FIG. FIG. 4 and FIG. 5 are an enlarged front view and a partial perspective view showing a schematic structure of the substrate gripping mechanism in the embodiment shown in FIG.

  In the following description, since the film peeling apparatus shown in FIGS. 1 and 2 is designed to peel the film from the upper and lower surfaces of the substrate, it is positioned above the substrate on the transport path and on the upper surface side. Subscript A is added to the reference sign for those that peel off the film, and subscript B is added for those that peel the film on the lower surface side located below the substrate.

  The film peeling apparatus 100 shown in FIGS. 1 and 2 includes a transport roller 10, a substrate gripping mechanism 20, a first roller mechanism 30, a second roller mechanism 40, an initial peeling means 50, a film peeling and conveying means 60, and a film collection container 70. , Control device 80 and the like.

  A plurality of transfer rollers 10 are arranged horizontally to transfer the substrate 1 to form a transfer path for the substrate 1, and the substrate 1 is moved from the left side (input port) to the right side (discharge port) of the film peeling apparatus 100 as indicated by an arrow A. Transport toward the exit. Note that the transport roller 10 includes a pinch roller that moves toward the downstream with the substrate 1 interposed therebetween at an appropriate interval or stops the movement, but in order to simplify the drawing, The illustration is omitted, and is collectively referred to as a conveyance roller 10.

  A control device 80 is provided at the lower part on the discharge port side of the film peeling apparatus 100. The control device 80 is a temporary controller that relates to a CPU, an external storage device, an input / output device, an input / output control device, a ROM that stores a program, and the status of each unit. A computer including a RAM or the like for recording typical data.

  The control device 80 detects the control conditions and data given via the input / output device, sensors such as an optical sensor for detecting the substrate position installed in the transport path, and sensors and encoders that grasp the operating status of each part. The sequence control of the apparatus is performed in accordance with the program recorded in the ROM based on the value, etc., for driving each roller in the transport roller 1, the substrate gripping mechanism 20, the initial peeling means 50, the film peeling and conveying means 60, etc. for film peeling. Control commands are output to driving means such as motors and air cylinders.

  Note that the sequence control is as described in the following operation, and does not perform processing such as high-level calculations and determinations, so the flow is not shown.

  As shown in FIG. 4, a resist film 2 is bonded to the upper and lower surfaces of the substrate 1, and the resist film 2 is protected to protect the resist film 2 when the substrate 1 is processed in the manufacturing process. A film 3 is laminated and pasted. The resist film 2 is adhered to the surface of the substrate 1 by heat treatment, and the protective film 3 is attached to the resist film 2 with the adhesive property of the resist film 2 itself.

  The resist film 2 and the protective film 3 are shorter than the dimension of the substrate 1 in the longitudinal direction, which is the conveyance direction of the substrate 1, and the front end portion and the rear end portion of the substrate 1 are exposed, and the width is orthogonal to the conveyance direction of the substrate 1. The direction coincides with the dimension of the substrate 1.

  The substrate gripping mechanism 20, the initial peeling unit 50, and the film peeling / carrying unit 60 provided in the middle of the conveyance path of the substrate 1 composed of the plurality of conveyance rollers 10 are provided on both end sides in the width direction of the substrate 1.

  As shown in FIGS. 3 to 5, the substrate gripping mechanism 20 grips both ends in the width direction at the front end of the substrate 1, and an L-shaped clamp tool 21A on the upper surface of the substrate and an L-type clamp tool 21B on the lower surface of the substrate. Is connected to a cylinder 22 that moves in the vertical direction of the substrate surface.

  A movable portion 26 is coupled to a linear guide fixed portion 24 fixed to a fixed plate 23 of the film peeling apparatus 100 via a slide bush 25, and a cylinder 27 for moving the cylinder 22 up and down is provided on the movable portion 26. is there.

  A cylinder 28 is mounted on the fixed plate 22, and the output shaft of the cylinder 28 is coupled to the movable portion 26 of the linear guide. Accordingly, the clamp 21 is moved by the cylinder 27 in the vertical direction orthogonal to the substrate transport direction, and is moved by the cylinder 28 in the substrate transport direction.

  The first roller mechanism 30 is provided on the upstream side of the substrate gripping mechanism 20, and includes a cylinder 31 provided at a fixed portion of the film peeling apparatus 100 and a pressure contact roller 32 provided at the tip of the output shaft.

  The second roller mechanism 40 is provided on the downstream side of the substrate gripping mechanism 20, and includes a cylinder 41 provided at a fixed portion of the film peeling apparatus 100 and a pressure roller 42 provided at the tip of the output shaft.

  By the operation of the cylinders 31 and 41, the upper and lower pressure contact rollers 32 and 42 move toward the upper and lower surfaces of the substrate 1 to sandwich the substrate 1, but rotate in accordance with the downstream movement of the substrate 1. It does not become a hindrance to transport to the downstream side.

  The pressure rollers 32B and 42B in the lower first roller mechanism 30B and the second roller mechanism 40B are simply used by using the conveying roller 10 and moving the upper pressure rollers 32A and 42A up and down by the cylinders 31A and 41A. Also good.

  As shown in FIG. 5, the dimension in the width direction of the pressure roller 42A in the upper second roller mechanism 40 is shorter than the pressure roller 42B in the lower second roller mechanism 40, but it may be the same length. .

  As shown in FIGS. 1 and 2, the initial peeling means 50 for the film attached to the upper and lower surfaces of the substrate is a total of four locations, including the upper and lower portions, facing two rows near the front end of the film 3 in the width direction. Provided.

  An example of the initial peeling mechanism is composed of a cylinder 51 provided at a fixed portion of the film peeling apparatus 100 and an adhesive roller 52 provided at the tip of the output shaft.

  As shown in FIGS. 1 and 2, the film peeling / conveying means 60 is provided in a total of four locations including the upper and lower portions inside the initial peeling means 50 in the width direction of the substrate 1.

  As an example, two endless belts are rotated in opposite directions at each location, and are transported by being sandwiched from the initial peeling portion of the protective film 3 peeled off by the initial peeling means 50 between the two endless belts moving in the same direction. It is like that.

  When the substrate 1 moves in the transport direction, the film peeling / conveying means 60 peels the entire protective film 3 from the substrate 1 from the front end and sends it to the film collection container 70 provided on the inlet side of the film peeling apparatus 100. .

Hereinafter, the operation of the apparatus configured as described above will be described.
The substrate 1 is conveyed toward the exit of the film peeling apparatus 100 by the conveying roller 10 from the inlet of the film peeling apparatus 100 in the direction of arrow A in FIGS.

  When the substrate 1 reaches a predetermined position of the initial peeling means 50, it is detected by an optical sensor (not shown), and the pressure roller 32 of the first roller mechanism 30 is moved in the direction of arrow B as shown in FIGS. It moves by the operation of the cylinder 31 to restrain the substrate 1.

  When the substrate 1 is constrained, as shown in FIGS. 4 and 5, the clamping tool 21 approaches toward the front end portion of the substrate 1 by the operation of the cylinders 27 and 28 of the substrate holding mechanism 20, and the operation of the cylinder 22 The clamping tool 21 moves in the direction of arrow C and grips the vicinity of the substrate end portions on both sides of the film front end in the width direction in the substrate 1.

  When the clamp tool 21 grips the vicinity of the substrate end on both sides of the front end of the film in the substrate width direction, the adhesive roller 52 is fixed by the cylinder 51 of the initial peeling means 50 while the substrate 1 is restrained by the pressure roller 32 of the first roller mechanism 30. Is adhered to the protective film 3 on each of the upper and lower surfaces on both sides of the front end of the film in the substrate width direction, and then the protective film 3 on each of the upper and lower surfaces is initially peeled by pulling back the cylinder 51.

  The portion where the protective film 3 is initially peeled is held by the film peeling / conveying means 60, and the substrate 1 is started to be conveyed while peeling the protective film 3.

  Simultaneously with the conveyance of the substrate 1 to the downstream side by the conveyance roller 10, the clamp tool 21 that grasps the substrate 1 with the cylinder 28 of the substrate grasping mechanism 20 is also moved synchronously in the direction of arrow D (FIGS. 4 and 5). When the front end portion of the substrate 1 reaches the pressure roller 42 of the second roller mechanism 40, the peeling of the protective film 3 and the conveyance of the substrate 1 are temporarily stopped, and the clamping tool 21 is reversed from the arrow C by the operation of the cylinder 22. The cylinder 28 is further operated in the direction of arrow D, and the clamp tool 21 is operated in the direction of arrow E by the cylinder 27 at a position where the clamp tool 21 does not contact the front end of the board 1. Then, the substrate gripping mechanism 20 is operated at a position higher than the substrate transport surface, and the clamp tool 21 is retracted from the transport path of the substrate 1.

  Thereafter, the cylinder 41 of the second roller mechanism 40 is operated in the direction of arrow F, and after the substrate 1 is pressed by the pressure roller 42, the film peeling and the substrate transport are resumed.

  The substrate 1 released from the substrate gripping mechanism 20 is sandwiched and conveyed between the pressure rollers 32 and 42 provided before and after the film peeling and conveying means 60, and the protective film 3 is removed from the substrate 1 by the film peeling and conveying means 60. It peels and it is conveyed in the board | substrate conveyance A direction.

  The protective film 3 peeled off by the film peeling / conveying means 60 is conveyed and discharged in the direction of arrow G and stored in the collection container 70.

  The substrate 1 from which the protective film 3 has been peeled is transported by a transport roller 10 to an apparatus for performing a cleaning process step provided at a subsequent stage of the film peeling apparatus 100.

  As described above, in the present embodiment, the substrate 1 is restrained by the pressure roller 32 and the front end of the substrate is clamped by the clamp tool 21 of the substrate gripping mechanism 20 in the initial peeling stage of the protective film 3 stuck on the substrate 1. The substrate 1 is gripped and conveyed, and the substrate 1 is sandwiched between the pressure rollers 42, whereby the film peeling load is received by the pressure rollers 32 and 42 on the upstream side and the downstream side in the substrate conveyance direction, and the substrate 1 is deformed. And preventing the substrate 10 from colliding with the transfer roller 10 when the substrate 1 is transferred, thereby preventing the substrate 10 from being damaged and allowing the film to be peeled off in a high quality state.

  In particular, in the case of a thin substrate, it is possible to prevent deformation at the time of film peeling caused by a difference in adhesion between the substrate and the film, a difference in position where the adhesive tape adheres to the film attached to the substrate surface, and the like.

  Since the substrate itself is small and the rigidity of the thin substrate is small, the flexure of the substrate increases, and the space between the transfer rollers 10 increases to secure a place for installing the peeling means of the lower protective film 3. In this embodiment, the substrate 1 can be transported and the protective film 1 can be peeled off while the press rollers 32 and 42 prevent the substrate 1 from being bent and prevent the substrate 1 from colliding with the transport roller 10.

  When the protective film 3 is peeled off from the thin substrate 1 by injecting compressed air or the like onto the end surface in the substrate width direction, the difference between the wind force, the injection angle difference, the substrate width direction position difference, etc. However, in this embodiment, the substrate 1 is restrained by the pressure rollers 32 and 42 and the front end of the substrate is clamped by the clamp 21 of the substrate gripping mechanism. By gripping the substrate, vibration and deformation of the substrate can be prevented and reliable initial peeling can be obtained.

Another embodiment of the present invention will be described with reference to schematic perspective views of main parts of FIGS.
In each figure, the same reference numerals are given to the same functional members as those in the embodiment shown in FIGS. 1 to 5, and the description thereof is omitted.

  In the embodiment of FIG. 6, the substrate gripping mechanism 20 is provided in the vicinity of the center front end in the substrate width direction, and the pressure roller 42 of the second roller mechanism 40 is provided on both sides of the clamp 21 of the substrate gripping mechanism 20. This embodiment is convenient when a means for initially peeling the protective film 3 from the substrate 1 is installed at the front end corner in the substrate width direction.

  In the embodiment of FIG. 7, the clamp tool 21 of the substrate gripping mechanism 20 divided into a plurality of parts is provided at the front end of the substrate in the substrate width direction, and the pressure roller 42 of the second roller mechanism 40 is interposed between the clamp tools 21. Is provided. This embodiment is convenient when the substrate 1 is thin because there are many places where the substrate 1 is gripped by the clamps 21 and held by the pressure roller 42.

  In the embodiment of FIG. 8, the clamp tool 21 of the substrate gripping mechanism 20 that grips the full width of the front end of the substrate 1 is used, and the cylinder 44 is mounted on the fixture 43 of the film peeling apparatus 100 as the second roller mechanism 40. A pressure contact roller 46 is provided on a roller support bracket 45 connected to 44.

  The pressure roller 46 is lowered by the cylinder 44. When the substrate 2 reaches the pressure roller 46, the cylinder 44 operates in the direction of the arrow H, and the pressure roller 46 is lifted to bring the substrate 1 downward. The pressure roller 42 is lowered by the cylinder 41 and the substrate 1 is sandwiched between the pressure roller 46. This embodiment is preferably applied to the case where the protective film 3 is peeled from the substrate 1 having a small substrate width.

The present invention is not limited to the above embodiment, and may be implemented as follows.
(1) The clamp tool 21 may hold the front end portion instead of the front end portion of the substrate 1.
(2) The clamp tool 21 may be driven by a servo motor or the like instead of the cylinder.
(3) The drive unit of the substrate gripping mechanism 20 may be disposed below the transport path.
(4) A plurality of pressure contact rollers 46 in FIG. 8 may be installed as substrate support rollers for preventing the substrate 1 from bending.
(5) About the initial peeling means 50 and the film peeling conveyance means 60, you may employ | adopt the thing of a gas injection system.
(6) The film pasted on one side of the upper surface or the lower surface of the substrate 1 may be peeled off.
(7) The substrate 1 may be a substrate such as glass, ceramic, resin, or semiconductor.
(8) The film peeled from the substrate may not be a resist film protective film.

It is a top view which shows schematic structure of the film peeling apparatus which becomes one Embodiment of this invention. It is a front view which shows schematic structure of the film peeling apparatus shown in FIG. It is a principal part perspective view which shows the condition which restrains a board | substrate with the 1st roller mechanism in embodiment of FIG. It is a principal part front view which shows the condition which hold | grips a board | substrate with a board | substrate holding | grip mechanism in embodiment of FIG. It is a principal part perspective view which shows the condition which hold | grips a board | substrate with a board | substrate holding | grip mechanism in embodiment of FIG. It is a principal part perspective view which shows the board | substrate holding | grip mechanism and 1st roller mechanism in the film peeling apparatus which becomes other embodiment of this invention. It is a principal part perspective view which shows the board | substrate holding | grip mechanism and 1st roller mechanism in the film peeling apparatus which becomes other embodiment of this invention. It is a principal part perspective view which shows the board | substrate holding | grip mechanism and 1st roller mechanism in the film peeling apparatus which becomes other embodiment of this invention.

Explanation of symbols

1 ... Board
2 ... Resist film
3 ... Protective film
10 ... Conveying roller
20 ... Substrate gripping mechanism
21 ... Clamp tool
30 ... First roller mechanism
32 ... Pressure contact roller
40. Second roller mechanism
42. Pressure welding roller
50. Initial peeling means
60. Film peeling and conveying means
70 ... Film collection container
80 ... Control device
100 ... Film peeling device

Claims (4)

Film peeling that partially peels off the tip of the film affixed to the surface of the substrate transported on the transport path with the initial peeling means, and peels the film entirely with the main peeling means from the partially peeled portion In the method
When the leading edge of the substrate reaches the initial peeling means in the conveyance path, the substrate is clamped by a first roller from a direction perpendicular to the conveyance path, and the front portion of the substrate is held by a clamp tool, and the initial peeling means To partially peel off the tip of the film attached to the surface of the substrate, hold the tip of the film partially peeled off by the initial peeling means with the main peeling means, and While holding the substrate, the substrate is moved downstream on the conveyance path by the clamp tool, the substrate is clamped by a second roller from a direction perpendicular to the conveyance path, and the front part is grasped by the clamp tool. A film peeling method characterized in that after the clamping tool is retracted, the main peeling means peels the film entirely from the substrate conveyed downstream on the conveyance path. Film peeling having an initial peeling means for partially peeling the tip of the film affixed to the surface of the substrate conveyed on the conveyance path and a main peeling means for peeling the film from the partially peeled portion In the device
The first roller that holds the substrate that has reached the initial peeling means in the transport path from the direction perpendicular to the transport path, and grips the front part of the substrate and moves it to the downstream side before the grip And a second roller for clamping the substrate from a direction perpendicular to the transport path before the clamping device releases the grip, and the main peeling means is the initial peeling means. A film peeling apparatus characterized in that the film is peeled completely while gripping the leading edge of the film partially peeled in step (b) and the substrate is transported downstream on the transport path.   The film peeling apparatus according to claim 2, wherein the clamping tool is configured to grip a tip portion of the substrate or both edge portions in the substrate width direction. In the film peeling apparatus of Claim 2,
A sensor for detecting the position of the substrate in the transport path, a sensor for detecting respective operation states of the initial peeling means, the main peeling means, the clamp, the first roller and the second roller, and the sensors A film peeling apparatus characterized in that a control means for sequentially operating each member provided with each sensor based on the detection result is provided.

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